JP3570165B2 - Display device - Google Patents

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JP3570165B2
JP3570165B2 JP20099397A JP20099397A JP3570165B2 JP 3570165 B2 JP3570165 B2 JP 3570165B2 JP 20099397 A JP20099397 A JP 20099397A JP 20099397 A JP20099397 A JP 20099397A JP 3570165 B2 JP3570165 B2 JP 3570165B2
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semiconductor chip
input
connection terminals
output
side connection
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JPH1131717A (en
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克己 渡辺
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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Description

【０００１】
【発明の属する技術分野】
この発明は、矩形状の半導体チップ及びそれを基板に直接搭載した表示装置に関する。
【０００２】
【従来の技術】
例えば液晶表示装置には、液晶表示パネルを駆動するためのＬＳＩチップ等からなる半導体チップを液晶表示パネルのガラス等からなる透明基板に直接搭載したものがある。図７は従来のこのような液晶表示装置の一例の平面図を示し、図８はその液晶表示パネルを示したものである。この液晶表示装置は、液晶表示パネル１及び半導体チップ１１を備えている。このうち液晶表示パネル１は、ガラス等からなる２枚の透明基板２、３間に液晶（図示せず）が封入されたものからなっている。この場合、下側の透明基板２の図中での下辺は上側の透明基板３の下辺から突出されている。この突出部２ａの上面の所定の箇所は、図８において一点鎖線で示すように、矩形状の半導体チップ搭載エリア４となっている。すなわち、半導体チップ１１を下側の透明基板２に直接搭載するＣＯＧ（ｃｈｉｐ ｏｎ ｇｌａｓｓ）実装方式が採用されている。半導体チップ搭載エリア４内の幅方向下端部には複数の入力側接続端子５が設けられ、幅方向上端部及び長手方向両端部には複数の出力側接続端子６が設けられている。下側の透明基板２の突出部２ａの突出端部上面で、半導体チップ搭載エリア４より基板両サイド側へそれぞれ寄った位置には、複数の外部接続端子７が設けられている。そして、突出部２ａの上面において半導体チップ搭載エリア４の外側における各所定の箇所には、入力側接続端子５と外部接続端子７とを接続する複数の入力側引き回し線８及び出力側接続端子６から延びる複数の出力側引き回し線９（一部図示せず）が設けられている。
【０００３】
半導体チップ１１は、一般的にスリムチップと呼ばれるものからなり、図９に示すように、矩形状の半導体チップ本体１２の下面の幅方向下端部に複数の入力側バンプ電極１３が設けられ、幅方向上端部及び長手方向両端部に複数の出力側バンプ電極１４が設けられた構造となっている。そして、半導体チップ１１の入力側バンプ電極１３及び出力側バンプ電極１４が下側の透明基板２の突出部２ａの入力側接続端子５及び出力側接続端子６に異方性導電接着剤２１を介して接合されていることにより、半導体チップ１１は突出部２ａの半導体チップ搭載エリア４上に搭載されている。
【０００４】
【発明が解決しようとする課題】
しかしながら、従来のこのような液晶表示装置では、半導体チップ本体１２の下面の幅方向下端部に複数の入力側バンプ電極１３を設けているのに対応して、半導体チップ搭載エリア４内の幅方向下端部に複数の入力側接続端子５を設け、また半導体チップ本体１２の下面の長手方向両端部に複数の出力側バンプ電極１４を設けているのに対応して、半導体チップ搭載エリア４内の長手方向両端部に複数の出力側接続端子６を設けているので、複数の入力側引き回し線８をショートしないように引き回すには、半導体チップ搭載エリア４の幅方向下端縁と突出部２ａの突出端縁との間に複数の入力側引き回し線８を配置することとなり、このため突出部２ａの突出長Ｌが大きくなってしまう。また、半導体チップ本体１２の下面の幅方向上端部に複数の出力側バンプ電極１４を設けているのに対応して、半導体チップ搭載エリア４内の幅方向上端部に複数の出力側接続端子６を設けているので、複数の出力側引き回し線９の配置スペースを考慮すると、半導体チップ搭載エリア４の幅方向上端縁と突出部２ａの基端縁（上側の透明基板３の下辺）との間にある程度のスペースを必要とし、このためこれまた突出部２ａの突出長Ｌが大きくなってしまう。このように、突出部２ａの突出長Ｌが大きくなるということは、表示領域を囲む周辺非表示領域部分つまり所謂額縁部分の面積が大きくなることであり、液晶表示パネル１全体に対する表示領域の占める割合が低下し、結果的に液晶表示パネル１が大型化してしまうという問題があった。
この発明の課題は、表示パネルの額縁部分の面積を小さくすることである。
【０００５】
【課題を解決するための手段】
この発明は、対向配置された２枚の透明基板のうちの一方の透明基板に設けられた突出部に、その縁に沿って配列された複数の入力側接続端子と、この入力側接続端子の列から離れて複数配列された出力側接続端子と、前記突出部の縁に沿って配置された複数の外部接続端子と、前記複数の入力側接続端子と外部接続端子とを前記入力側接続端子の列と前記出力側接続端子の列の間を通って接続する入力側引き回し線と、前記出力側接続端子から伸びる複数の出力側引き回し線とが設けられた液晶表示パネルと、
矩形状の半導体チップ本体の表面に、前記矩形の長手方向両端部を除いた長手方向の縁に沿って配置され、前記入力側接続端子にそれぞれ対応させて設けられた複数の入力側バンプ電極と、前記矩形の幅方向中央部に配置され、前記出力側接続端子にそれぞれ対応させて設けられた複数の出力側バンプ電極とを備え、前記液晶表示パネルの突出部に搭載して、前記複数の入力側接続端子にそれぞれ入力側バンプ電極を接続し、かつ前記複数の出力側接続端子に前記複数の出力側バンプ電極をそれぞれ接続した半導体チップとからなることを特徴とするものである。
【０００６】
この発明によれば、矩形状の半導体チップ本体の表面に、前記矩形の長手方向両端部をに入力側バンプ電極と出力側バンプ電極とが配置されたおらず、入力側引き回し線は前記入力側接続端子の列と前記出力側接続端子の列の間を通って配線されているので、表示パネルの半導体チップ搭載エリア内に引き回し線を配置することができ、この結果表示領域を囲む額縁部分の面積を小さくし、表示パネルの小型化を促進することができる。
【０００７】
【発明の実施の形態】
図１は第 1 の参考例における液晶表示装置の平面図を示し、図２はその液晶表示パネルの平面図を示し、図３はその半導体チップの平面図を示したものである。これらの図において、図７〜図９と同一名称部分には同一の符合を付し、その説明を適宜省略する。まず、図３に示すように、半導体チップ１１は、矩形状の半導体チップ本体１２の下面の幅方向の少なくとも一端部を除く部分にバンプ電極１３、１４が設けられている。ここで、半導体チップ本体１２の幅方向端部とは、幅方向端からバンプ電極１個分の幅だけ入り込んだ領域をいう。この参考例では、半導体チップ本体１２の下面の幅方向中央部の下方側に複数の入力側バンプ電極１３が設けられ、上方側に複数の出力側バンプ電極１４が設けられた構造となっている。
【０００８】
次に、図２に示すように、液晶表示パネル１の下側の透明基板２の突出部２ａの上面の矩形状の半導体チップ搭載エリア４内の幅方向中央部の下方側には複数の入力側接続端子５が設けられ、上方側には複数の出力側接続端子６が設けられている。半導体チップ搭載エリア４の長手方向両外側における突出部２ａの突出端部上面には複数の外部接続端子７が設けられている。そして、突出部２ａの上面において半導体チップ搭載エリア４の内外における各所定の箇所には、入力側接続端子５と外部接続端子７とを接続する複数の入力側引き回し線８及び出力側接続端子６から延びる複数の出力側引き回し線９が設けられている。
【０００９】
すなわち、入力側接続端子５から延びる入力側引き回し線８は、半導体チップ搭載エリア４内のほぼ下半分において引き回された後、半導体チップ搭載エリア４の長手方向両端縁から半導体チップ搭載エリア４外に引き回されて外部接続端子７に接続されている。一方、出力側接続端子６から延びる出力側引き回し線９は、半導体チップ搭載エリア４内のほぼ上半分において引き回された後、半導体チップ搭載エリア４の長手方向両端縁及び幅方向上端縁から半導体チップ搭載エリア４外に引き回されている。
【００１０】
そして、図１に示すように、半導体チップ１１の入力側バンプ電極１３及び出力側バンプ電極１４が下側の透明基板２の突出部２ａの入力側接続端子５及び出力側接続端子６に異方性導電接着剤２１を介して接合されていることにより、半導体チップ１１は突出部２ａの半導体チップ搭載エリア４上に直接搭載つまりＣＯＧ搭載されている。この場合、半導体チップ本体１２の下面の幅方向中央部に複数の入力側バンプ電極１３と複数の出力側バンプ電極１４とを２列に設けているので、異方性導電接着剤２１の幅は半導体チップ１１の幅よりも小さく、長さは半導体チップ１１の長さよりも大きくなっている。
【００１１】
このように、この液晶表示装置では、半導体チップ本体１２の下面の幅方向中央部の下方側に複数の入力側バンプ電極１３を設けているのに対応して、半導体チップ搭載エリア４内の幅方向中央部の下方側に複数の入力側接続端子５を設け、半導体チップ搭載エリア４内の幅方向下端部及び長手方向両端部（ただし、長手方向両端部の幅方向中央部を除く。）に接続端子を設けていないので、半導体チップ搭載エリア４内のほぼ下半分に入力側引き回し線８を配置することができる。すなわち、上述したように、入力側接続端子５から延びる入力側引き回し線８を、半導体チップ搭載エリア４内のほぼ下半分において引き回した後、半導体チップ搭載エリア４の長手方向両端縁から半導体チップ搭載エリア４外に引き回して外部接続端子７に接続することができる。この結果、半導体チップ搭載エリア４の幅方向下端縁と突出部２ａの突出端縁との間に入力側引き回し線８を配置する必要はなく、この間の間隔を可及的に小さくすることができ、したがってその分だけ突出部２ａの突出長Ｌを小さくすることができ、ひいては額縁部分の面積を小さくし、液晶表示パネル１の小型化を促進することができる。
【００１２】
また、半導体チップ本体１２の下面の幅方向中央部の上方側に複数の出力側バンプ電極１４を設けているのに対応して、半導体チップ搭載エリア４内の幅方向中央部の上方側に複数の出力側接続端子６を設け、半導体チップ搭載エリア４内の幅方向上端部及び長手方向両端部（ただし、長手方向両端部の幅方向中央部を除く。）に接続端子を設けていないので、半導体チップ搭載エリア４内のほぼ上半分に出力側引き回し線９を配置することができる。すなわち、上述したように、出力側接続端子６から延びる出力側引き回し線９を、半導体チップ搭載エリア４内のほぼ上半分において引き回した後、半導体チップ搭載エリア４の長手方向両端縁及び幅方向上端部から半導体チップ搭載エリア４外に引き回すことができる。この結果、複数の出力側引き回し線９の配置スペースを考慮しても、半導体チップ搭載エリア４の幅方向上端縁と突出部２ａの基端縁（上側の透明基板３の下辺）との間の間隔を可及的に小さくすることができ、したがってその分だけ突出部２ａの突出長Ｌを小さくして額縁部分の面積を小さくすることができ、ひいてはこれまた液晶表示パネル１の小型化を促進することができる。
【００１３】
加えて、この液晶表示装置では、半導体チップ本体１２の下面の幅方向中央部にバンプ電極１３、１４を設けているので、外部からのノイズの影響を比較的受けにくいようにすることができる。また、半導体チップ本体１２の下面の幅方向中央部にバンプ電極１３、１４を集中させて設けているので、バンプ電極１３、１４を金等の電解メッキによって形成するとき、金メッキの堆積にばらつきが生じにくいようにすることができ、ひいてはバンプ電極１３、１４の高さにばらつきが生じにくいようにすることができる。また、半導体チップ１１を半導体チップ搭載エリア４上に搭載（ボンディング）するとき、図４に示すように、下側の透明基板２の突出部２ａの上面に異方性導電接着剤２１を介して半導体チップ１１を載置し、次いで熱圧着ヘッド２２にて熱圧着することとなるが、半導体チップ本体１２の下面の幅方向中央部のみにバンプ電極１３、１４を設けているので、熱圧着ヘッド２２の熱圧着面２２ａの平行度等が多少悪くても、良好にボンディングすることができる。さらに、異方性導電接着剤２１の幅を半導体チップ１１の幅より小さくしても、バンプ電極１３、１４を接続端子５、６に接続することができるので、異方性導電接着剤２１の使用量を少なくすることができる。
【００１４】
次に、図５はこの発明の実施形態における液晶表示装置の平面図を示したものである。この図において、図１と同一名称部分には同一の符合を付し、その説明を適宜省略する。この実施形態において上記参考例と異なる点は、半導体チップ１１の入力側バンプ電極１３を半導体チップ本体１２の下面の幅方向下端部に設けるとともに、液晶表示パネル１の入力側接続端子５を半導体チップ搭載エリア４内の幅方向下端部に設けた点である。このようにしても、入力側接続端子５から延びる入力側引き回し線８を、半導体チップ搭載エリア４内のほぼ下半分において引き回した後、半導体チップ搭載エリア４の長手方向両端縁から半導体チップ搭載エリア４外に引き回して外部接続端子７に接続することができる。したがって、この場合も、半導体チップ搭載エリア４の幅方向下端縁と突出部２ａの突出端縁との間に入力側引き回し線８を配置する必要がなく、この間の間隔を可及的に小さくすることができ、したがってその分だけ突出部２ａの突出長Ｌを小さくして額縁部分を小さくすることができ、ひいては液晶表示パネル１の小型化を促進することができる。
【００１５】
なお、半導体チップ１１のバンプ電極１３、１４の数が少ない場合には、図６に示す第２の参考例のように、半導体チップ本体１２の下面の幅方向中央部にバンプ電極１３、１４を１列に配置するとともに、半導体チップ搭載エリア４内の幅方向中央部に接続端子５、６を１列に配置するようにしてもよい。この場合、例えば半導体チップ本体１２の下面の長手方向両側に入力側バンプ電極１３を配置し、中央部に出力側バンプ電極１４を配置するようにしてもよい
【００１６】
【発明の効果】
以上説明したように、この発明によれば、この発明によれば、矩形状の半導体チップ本体の表面に、前記矩形の長手方向両端部をに入力側バンプ電極と出力側バンプ電極とが配置されたおらず、入力側引き回し線は前記入力側接続端子の列と前記出力側接続端子の列の間を通って配線されているので、このバンプ電極を設けていない部分に対応する表示パネルの半導体チップ搭載エリア内に引き回し線を配置することができ、この結果表示パネルを小型化することができる。
【図面の簡単な説明】
【図１】この第１の参考例における液晶表示装置の平面図。
【図２】図１に示す液晶表示パネルの平面図。
【図３】図１に示す半導体チップの平面図。
【図４】図１に示す液晶表示装置において半導体チップを液晶表示パネル上に搭載する場合を説明するために示す断面図。
【図５】この発明の実施形態における液晶表示装置の平面図。
【図６】この発明の第２の参考例における液晶表示装置の平面図。
【図７】従来の液晶表示装置の一例の平面図。
【図８】図７に示す液晶表示パネルの平面図。
【図９】図７に示す半導体チップの平面図。
【符号の説明】
１ 液晶表示パネル
４ 半導体チップ搭載エリア
５ 入力側接続端子
６ 出力側接続端子
７ 外部接続端子
８ 入力側引き回し線
９ 出力側引き回し線
１１ 半導体チップ
１２ 半導体チップ本体
１３ 入力側バンプ電極
１４ 出力側バンプ電極
２１ 異方性導電接着剤[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a rectangular semiconductor chip and a display device having the semiconductor chip mounted directly on a substrate.
[0002]
[Prior art]
For example, there is a liquid crystal display device in which a semiconductor chip such as an LSI chip for driving a liquid crystal display panel is directly mounted on a transparent substrate made of glass or the like of the liquid crystal display panel. FIG. 7 shows a plan view of an example of such a conventional liquid crystal display device, and FIG. 8 shows the liquid crystal display panel. This liquid crystal display device includes a liquid crystal display panel 1 and a semiconductor chip 11. The liquid crystal display panel 1 has a liquid crystal (not shown) sealed between two transparent substrates 2 and 3 made of glass or the like. In this case, the lower side of the lower transparent substrate 2 in the drawing protrudes from the lower side of the upper transparent substrate 3. A predetermined portion on the upper surface of the protruding portion 2a is a rectangular semiconductor chip mounting area 4 as shown by a dashed line in FIG. That is, a COG (chip on glass) mounting method in which the semiconductor chip 11 is directly mounted on the lower transparent substrate 2 is adopted. A plurality of input-side connection terminals 5 are provided at the lower end in the width direction in the semiconductor chip mounting area 4, and a plurality of output-side connection terminals 6 are provided at the upper end in the width direction and both ends in the longitudinal direction. A plurality of external connection terminals 7 are provided on the upper surface of the protruding end of the protruding portion 2 a of the lower transparent substrate 2, at positions closer to both sides of the substrate than the semiconductor chip mounting area 4. A plurality of input-side lead wires 8 and output-side connection terminals 6 for connecting the input-side connection terminals 5 and the external connection terminals 7 are provided at predetermined positions outside the semiconductor chip mounting area 4 on the upper surface of the protrusion 2a. A plurality of output-side lead-out lines 9 (partially not shown) are provided.
[0003]
The semiconductor chip 11 is generally formed of a slim chip. As shown in FIG. 9, a plurality of input-side bump electrodes 13 are provided at the lower end in the width direction of the lower surface of the rectangular semiconductor chip body 12. A plurality of output-side bump electrodes 14 are provided at the upper end in the direction and both ends in the longitudinal direction. Then, the input-side bump electrode 13 and the output-side bump electrode 14 of the semiconductor chip 11 are connected to the input-side connection terminal 5 and the output-side connection terminal 6 of the protruding portion 2 a of the lower transparent substrate 2 via the anisotropic conductive adhesive 21. As a result, the semiconductor chip 11 is mounted on the semiconductor chip mounting area 4 of the protrusion 2a.
[0004]
[Problems to be solved by the invention]
However, in such a conventional liquid crystal display device, the plurality of input-side bump electrodes 13 are provided at the lower end of the lower surface of the semiconductor chip body 12 in the width direction. A plurality of input-side connection terminals 5 are provided at the lower end, and a plurality of output-side bump electrodes 14 are provided at both longitudinal ends of the lower surface of the semiconductor chip body 12. Since a plurality of output-side connection terminals 6 are provided at both ends in the longitudinal direction, the plurality of input-side lead wires 8 can be routed so as not to be short-circuited. A plurality of input-side lead-out lines 8 are arranged between the edge and the edge, so that the protruding length L of the protruding portion 2a increases. In response to the provision of the plurality of output-side bump electrodes 14 at the upper end in the width direction of the lower surface of the semiconductor chip body 12, the plurality of output-side connection terminals 6 are provided at the upper end in the width direction within the semiconductor chip mounting area 4. In consideration of the arrangement space of the plurality of output-side lead-out lines 9, the space between the upper edge of the semiconductor chip mounting area 4 in the width direction and the base edge of the protrusion 2 a (the lower side of the upper transparent substrate 3) is provided. Requires a certain amount of space, which also increases the protruding length L of the protruding portion 2a. As described above, an increase in the protruding length L of the protruding portion 2a means that the area of the peripheral non-display area surrounding the display area, that is, the so-called frame area increases, and the display area occupies the entire liquid crystal display panel 1. There is a problem that the ratio decreases and the liquid crystal display panel 1 becomes large as a result.
An object of the present invention is to reduce the area of a frame portion of a display panel.
[0005]
[Means for Solving the Problems]
According to the present invention, a plurality of input-side connection terminals arranged along an edge of a protrusion provided on one of the two transparent substrates opposed to each other, A plurality of output-side connection terminals arranged apart from a row, a plurality of external connection terminals arranged along an edge of the protruding portion, and the plurality of input-side connection terminals and the external connection terminal are connected to the input-side connection terminal. And a liquid crystal display panel provided with a plurality of output-side wiring lines extending from the output-side connection terminals, and an input-side wiring line connected between the rows of the output-side connection terminals.
A plurality of input-side bump electrodes provided on the surface of the rectangular semiconductor chip body along the longitudinal edge excluding both ends of the rectangular shape in the longitudinal direction, and provided in correspondence with the input-side connection terminals, respectively. A plurality of output-side bump electrodes arranged at the center in the width direction of the rectangle and provided in correspondence with the output-side connection terminals, respectively, mounted on a protruding portion of the liquid crystal display panel, and A semiconductor chip in which input-side bump electrodes are connected to input-side connection terminals, respectively, and the plurality of output-side bump electrodes are connected to the plurality of output-side connection terminals, respectively .
[0006]
According to the present invention, the input-side bump electrode and the output-side bump electrode are not disposed on the surface of the rectangular semiconductor chip body at both ends in the longitudinal direction of the rectangle, and the input-side lead-out line is not provided on the input-side side. Since the wiring is provided between the row of the connection terminals and the row of the output-side connection terminals, it is possible to arrange the wiring lines in the semiconductor chip mounting area of the display panel. The area can be reduced and the size of the display panel can be reduced.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Figure 1 shows a plan view of a liquid crystal display device in the first reference example, FIG. 2 is a plan view of the liquid crystal display panel, FIG 3 shows a plan view of the semiconductor chip. In these figures, the same reference numerals are given to the same names as those in FIGS. 7 to 9, and the description thereof will be omitted as appropriate. First, as shown in FIG. 3, the semiconductor chip 11 is provided with bump electrodes 13 and 14 on a portion of the lower surface of the rectangular semiconductor chip body 12 except at least one end in the width direction. Here, the width direction end portion of the semiconductor chip body 12 refers to a region that enters from the width direction end by the width of one bump electrode. In this reference example , a plurality of input-side bump electrodes 13 are provided below a central portion in the width direction of the lower surface of the semiconductor chip body 12, and a plurality of output-side bump electrodes 14 are provided above. .
[0008]
Next, as shown in FIG. 2, a plurality of input signals are provided below the central portion in the width direction in the rectangular semiconductor chip mounting area 4 on the upper surface of the projecting portion 2a of the transparent substrate 2 below the liquid crystal display panel 1. Side connection terminals 5 are provided, and a plurality of output side connection terminals 6 are provided on the upper side. A plurality of external connection terminals 7 are provided on the upper surface of the protruding end portion of the protruding portion 2 a on both outer sides in the longitudinal direction of the semiconductor chip mounting area 4. A plurality of input-side lead wires 8 and output-side connection terminals 6 for connecting the input-side connection terminals 5 and the external connection terminals 7 are provided at predetermined positions inside and outside the semiconductor chip mounting area 4 on the upper surface of the protrusion 2a. A plurality of output routing lines 9 are provided.
[0009]
That is, the input-side lead-out line 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor chip mounting area 4, and then extends from both longitudinal edges of the semiconductor chip mounting area 4 to the outside of the semiconductor chip mounting area 4. And is connected to the external connection terminal 7. On the other hand, the output-side lead-out line 9 extending from the output-side connection terminal 6 is routed in substantially the upper half of the semiconductor chip mounting area 4, and then extends from the both ends in the longitudinal direction and the upper end in the width direction of the semiconductor chip mounting area 4. It is routed outside the chip mounting area 4.
[0010]
As shown in FIG. 1, the input-side bump electrode 13 and the output-side bump electrode 14 of the semiconductor chip 11 are anisotropically connected to the input-side connection terminal 5 and the output-side connection terminal 6 of the protruding portion 2a of the lower transparent substrate 2. The semiconductor chip 11 is directly mounted on the semiconductor chip mounting area 4 of the protruding portion 2a, that is, COG mounted by being joined via the conductive adhesive 21. In this case, since the plurality of input-side bump electrodes 13 and the plurality of output-side bump electrodes 14 are provided in two rows at the center in the width direction of the lower surface of the semiconductor chip body 12, the width of the anisotropic conductive adhesive 21 is The width is smaller than the width of the semiconductor chip 11, and the length is larger than the length of the semiconductor chip 11.
[0011]
As described above, in this liquid crystal display device, the width of the semiconductor chip mounting area 4 corresponds to the provision of the plurality of input-side bump electrodes 13 below the center of the lower surface of the semiconductor chip body 12 in the width direction. A plurality of input-side connection terminals 5 are provided below the central portion in the direction, and are provided at the lower end in the width direction and both ends in the longitudinal direction (excluding the central portions in the width direction at both ends in the longitudinal direction) in the semiconductor chip mounting area 4. Since the connection terminal is not provided, the input-side lead-out line 8 can be arranged in substantially the lower half in the semiconductor chip mounting area 4. That is, as described above, after the input-side lead wire 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor chip mounting area 4, the semiconductor chip mounting line 4 is extended from both longitudinal edges of the semiconductor chip mounting area 4. It can be routed outside the area 4 and connected to the external connection terminal 7. As a result, it is not necessary to arrange the input-side lead-out line 8 between the widthwise lower edge of the semiconductor chip mounting area 4 and the protruding edge of the protruding portion 2a, and the interval therebetween can be made as small as possible. Therefore, the protruding length L of the protruding portion 2a can be reduced accordingly, and the area of the frame portion can be reduced, and the miniaturization of the liquid crystal display panel 1 can be promoted.
[0012]
In addition, a plurality of output-side bump electrodes 14 are provided above the widthwise central portion of the lower surface of the semiconductor chip body 12, and a plurality of output-side bump electrodes 14 are provided above the widthwise central portion in the semiconductor chip mounting area 4. Are provided at the upper end in the width direction and both ends in the longitudinal direction (excluding the center portions in the width direction of both ends in the longitudinal direction) in the semiconductor chip mounting area 4. The output-side lead-out line 9 can be arranged substantially in the upper half of the semiconductor chip mounting area 4. That is, as described above, after the output-side lead wire 9 extending from the output-side connection terminal 6 is routed in substantially the upper half of the semiconductor chip mounting area 4, both ends in the longitudinal direction and the upper end in the width direction of the semiconductor chip mounting area 4 are formed. Portion can be routed outside the semiconductor chip mounting area 4. As a result, even when the arrangement space of the plurality of output-side lead-out lines 9 is taken into consideration, the gap between the upper edge of the semiconductor chip mounting area 4 in the width direction and the base edge of the protruding portion 2a (lower side of the upper transparent substrate 3). The interval can be made as small as possible, so that the projecting length L of the projecting portion 2a can be reduced by that much, so that the area of the frame portion can be reduced, which further promotes the miniaturization of the liquid crystal display panel 1. can do.
[0013]
In addition, in this liquid crystal display device, since the bump electrodes 13 and 14 are provided at the center in the width direction on the lower surface of the semiconductor chip body 12, it is relatively hard to be affected by external noise. In addition, since the bump electrodes 13 and 14 are provided in a central portion in the width direction of the lower surface of the semiconductor chip body 12, when the bump electrodes 13 and 14 are formed by electroplating of gold or the like, variations in the deposition of gold plating occur. Thus, it is possible to prevent the bump electrodes 13 and 14 from having a variation in height. When the semiconductor chip 11 is mounted (bonded) on the semiconductor chip mounting area 4, as shown in FIG. 4, the upper surface of the projecting portion 2 a of the lower transparent substrate 2 is interposed via the anisotropic conductive adhesive 21. The semiconductor chip 11 is placed and then thermocompression-bonded by the thermocompression bonding head 22. Since the bump electrodes 13 and 14 are provided only at the center of the lower surface of the semiconductor chip body 12 in the width direction, the thermocompression bonding head is used. Even if the degree of parallelism of the thermocompression bonding surface 22a of 22 is somewhat poor, good bonding can be achieved. Further, even if the width of the anisotropic conductive adhesive 21 is smaller than the width of the semiconductor chip 11, the bump electrodes 13 and 14 can be connected to the connection terminals 5 and 6, so that the anisotropic conductive adhesive 21 The amount used can be reduced.
[0014]
Next, FIG. 5 shows a plan view of a liquid crystal display device in the implementation form of the present invention. In this figure, the same parts as those in FIG. Reference Example differs in the implementation form of this, provided with an input-side bump electrodes 13 of the semiconductor chip 11 in the width direction lower end portion of the lower surface of the semiconductor chip body 12, an input-side connection terminals 5 of the liquid crystal display panel 1 This is a point provided at the lower end in the width direction in the semiconductor chip mounting area 4. Also in this case, after the input-side lead-out line 8 extending from the input-side connection terminal 5 is routed in substantially the lower half of the semiconductor chip mounting area 4, the semiconductor chip mounting area 4 extends from both longitudinal edges of the semiconductor chip mounting area 4. 4 and can be connected to the external connection terminal 7 by being routed outside. Therefore, also in this case, it is not necessary to arrange the input-side lead-out line 8 between the widthwise lower edge of the semiconductor chip mounting area 4 and the protruding edge of the protruding portion 2a, and the interval therebetween is made as small as possible. Therefore, the projection length L of the projection 2a can be reduced by that amount, so that the frame portion can be reduced, and the size of the liquid crystal display panel 1 can be further reduced.
[0015]
In the case where the number of the bump electrodes 13 and 14 of the semiconductor chip 11 is small, the bump electrodes 13 and 14 are formed at the center in the width direction on the lower surface of the semiconductor chip body 12 as in the second reference example shown in FIG. The connection terminals 5 and 6 may be arranged in one row at the center in the width direction in the semiconductor chip mounting area 4 while being arranged in one row. In this case, for example, the input-side bump electrodes 13 may be arranged on both sides in the longitudinal direction of the lower surface of the semiconductor chip body 12, and the output-side bump electrodes 14 may be arranged at the center.
【The invention's effect】
As described above , according to the present invention, according to the present invention, the input-side bump electrode and the output-side bump electrode are arranged on the surface of the rectangular semiconductor chip body at both ends in the longitudinal direction of the rectangle. Since the input-side wiring is routed between the row of the input-side connection terminals and the row of the output-side connection terminals, the semiconductor of the display panel corresponding to the portion where the bump electrode is not provided is provided. The routing lines can be arranged in the chip mounting area, and as a result, the size of the display panel can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of a liquid crystal display device according to a first reference example .
FIG. 2 is a plan view of the liquid crystal display panel shown in FIG.
FIG. 3 is a plan view of the semiconductor chip shown in FIG. 1;
4 is a cross-sectional view for explaining a case where a semiconductor chip is mounted on a liquid crystal display panel in the liquid crystal display device shown in FIG.
FIG. 5 is a plan view of a liquid crystal display device in the implementation form of the present invention.
FIG. 6 is a plan view of a liquid crystal display device according to a second reference example of the present invention.
FIG. 7 is a plan view of an example of a conventional liquid crystal display device.
8 is a plan view of the liquid crystal display panel shown in FIG.
FIG. 9 is a plan view of the semiconductor chip shown in FIG. 7;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 4 Semiconductor chip mounting area 5 Input side connection terminal 6 Output side connection terminal 7 External connection terminal 8 Input side lead wire 9 Output side lead wire 11 Semiconductor chip 12 Semiconductor chip body 13 Input side bump electrode 14 Output side bump electrode 21 Anisotropic conductive adhesive

Claims (1)

対向配置された２枚の透明基板のうちの一方の透明基板に設けられた突出部に、その縁に沿って配列された複数の入力側接続端子と、この入力側接続端子の列から離れて複数配列された出力側接続端子と、前記突出部の縁に沿って配置された複数の外部接続端子と、前記複数の入力側接続端子と外部接続端子とを前記入力側接続端子の列と前記出力側接続端子の列の間を通って接続する入力側引き回し線と、前記出力側接続端子から伸びる複数の出力側引き回し線とが設けられた液晶表示パネルと、
矩形状の半導体チップ本体の表面に、前記矩形の長手方向両端部を除いた長手方向の縁に沿って配置され、前記入力側接続端子にそれぞれ対応させて設けられた複数の入力側バンプ電極と、前記矩形の幅方向中央部に配置され、前記出力側接続端子にそれぞれ対応させて設けられた複数の出力側バンプ電極とを備え、前記液晶表示パネルの突出部に搭載して、前記複数の入力側接続端子にそれぞれ入力側バンプ電極を接続し、かつ前記複数の出力側接続端子に前記複数の出力側バンプ電極をそれぞれ接続した半導体チップとからなることを特徴とする表示装置。 A plurality of input-side connection terminals arranged along the edge of the protrusion provided on one of the two transparent substrates disposed opposite to each other, and a distance from the row of the input-side connection terminals A plurality of arranged output-side connection terminals, a plurality of external connection terminals arranged along the edge of the protruding portion, the plurality of input-side connection terminals and the external connection terminals, A liquid crystal display panel provided with an input-side lead line connected between the columns of the output-side connection terminals and a plurality of output-side lead lines extending from the output-side connection terminal;
A plurality of input-side bump electrodes provided on the surface of the rectangular semiconductor chip body along the longitudinal edge excluding both ends of the rectangular shape in the longitudinal direction, and provided in correspondence with the input-side connection terminals, respectively. A plurality of output-side bump electrodes arranged at the center in the width direction of the rectangle and provided in correspondence with the output-side connection terminals, respectively, mounted on a protruding portion of the liquid crystal display panel, and A display device comprising: a semiconductor chip having input-side connection terminals connected to input-side bump electrodes, and a plurality of output-side connection terminals connected to the plurality of output-side bump electrodes, respectively .
JP20099397A 1997-07-11 1997-07-11 Display device Expired - Fee Related JP3570165B2 (en)

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JP5010070B2 (en) * 2001-05-30 2012-08-29 株式会社ジャパンディスプレイセントラル Liquid crystal display
KR100598032B1 (en) * 2003-12-03 2006-07-07 삼성전자주식회사 Tape circuit substrate, semiconductor chip package using thereof, and Display Panel Assembly using thereof
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KR20070106151A (en) * 2006-04-28 2007-11-01 엘지전자 주식회사 Display device
US8421979B2 (en) 2008-07-28 2013-04-16 Sharp Kabushiki Kaisha Display panel and display device including the same
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