JP2572134Y2 - Substrate wiring structure - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring structure of a substrate in electronic equipment such as a liquid crystal display.

[0002]

2. Description of the Related Art For example, a liquid crystal display device includes a liquid crystal display panel, a semiconductor chip for a driving circuit for driving the liquid crystal display panel, a circuit board for a control circuit for controlling the semiconductor chip, and the like. Is mounted on a liquid crystal display panel, the semiconductor chip and the circuit board are electrically connected by a flexible wiring board.

FIG. 5 shows an example of such a conventional liquid crystal display device. In this liquid crystal display device, a liquid crystal display panel 1, three semiconductor chips 2 to 4, a circuit board 5,
Three flexible wiring boards 6 to 8 and the like are provided. In the liquid crystal display panel 1, liquid crystal is sealed between upper and lower transparent substrates 11 and 12 made of glass or the like, and one end of a lower transparent substrate 12 is projected outside the upper transparent substrate 11. A plurality of transparent electrodes 13 (see FIG. 7) and three connection wires 14 are provided on the upper surface of one end of the lower transparent substrate 12, and one end of the upper transparent substrate 11 is It has a structure in which a plurality of transparent electrodes 15 and three connection wires 16 are provided on the lower surface of one end of the protruding upper transparent substrate 11 so as to protrude outside the transparent substrate 12. The predetermined two semiconductor chips 2 and 3 are mounted on the upper surface of one end of the lower transparent substrate 12, and a plurality of output-side bump electrodes and three input-side bump electrodes (not shown) are connected to the transparent electrode 13 and the connection wiring 14. Each is electrically connected. The three connection wirings 14 are electrically connected to the wiring 17 provided on the upper surface of the circuit board 5 via two predetermined flexible wiring boards 6 and 7. The remaining one semiconductor chip 4 is the upper transparent substrate 1
A plurality of output-side bump electrodes and three input-side bump electrodes (not shown) are mounted on the lower surface of one end of the transparent electrode 1.
5 and the connection wiring 16 are electrically connected to each other. The three connection wirings 16 are electrically connected to wirings (not shown) provided on the lower surface of the circuit board 5 via the remaining one flexible wiring board 8. In addition,
For example, the wiring 17 on the upper surface side of the circuit board 5 has a part of wiring provided on the lower surface of the circuit board 5 as shown by a dotted line because of the common wiring for the two predetermined semiconductor chips 2 and 3, The structure is such that the through hole connection 18 connects the wiring on the upper surface side of the circuit board 5.

However, in such a conventional liquid crystal display device, two predetermined semiconductor chips 2 and 3 are electrically connected to the wiring 17 on the upper surface of the circuit board 5 via the flexible wiring boards 6 and 7. Since the connection is made, the number of connection points of the flexible wiring boards 6 and 7 is not only as large as four in total, but also the area occupied by the flexible wiring boards 6 and 7 and the circuit board 5 is increased. The common wiring consisting of the wiring 17 is a through-hole connection 18.
Due to the structure, there is a problem that the structure of the circuit board 5 is complicated. This is more remarkable as the number of semiconductor chips increases.

FIGS. 6 and 7 show an example of a conventional liquid crystal display device which has solved the above problems. In these drawings, the same reference numerals are given to the same components as those in FIG. 5, and the description thereof will be omitted as appropriate. In this liquid crystal display device, the connection wiring 14 provided on the upper surface of one end of the lower transparent substrate 12 is shared by two predetermined semiconductor chips 2 and 3, and the connection wiring 14 at the intersection is provided. For example, as shown in FIG. 8, a structure in which an insulating layer 14b is provided on a lower connecting wire 14a and an upper connecting wire 14c is provided on the insulating layer 14b, 3 is electrically connected to wiring (not shown) on the upper surface side of the circuit board 5 via one flexible wiring board 6. As described above, in this liquid crystal display device, the predetermined two semiconductor chips 2 and 3 are electrically connected to the wiring on the upper surface side of the circuit board 5 via the one flexible wiring board 6, so that the flexible wiring board 6 can be reduced to two places, the area occupied by the flexible wiring board 6 and the circuit board 5 can be reduced, and the wiring on the upper surface side of the circuit board 5 needs to be shared. In addition, the structure of the circuit board 5 can be simplified. This is true even when the number of semiconductor chips increases.

[0006]

However, in such a conventional liquid crystal display device, the structure of the intersecting portion of the connection wiring 14 provided on the upper surface of one end of the lower transparent substrate 12 is complicated, and this structure is complicated. Therefore, there is a problem that the number of manufacturing steps of the liquid crystal display panel 1 increases. The purpose of this idea is
An object of the present invention is to provide a wiring structure of a substrate that can prevent common wirings from intersecting on the same plane.

[0007]

According to the present invention, a plurality of semiconductor chip mounting areas are provided on a substrate surface and connected to a plurality of input electrodes of each semiconductor chip mounted on each of these semiconductor chip mounting areas. A plurality of input-side connection terminals and a plurality of output-side connection terminals respectively connected to a plurality of output-side electrodes of each semiconductor chip, the wiring structure of a substrate provided in or near the semiconductor chip mounting area, An input-side connection terminal and a plurality of output-side connection terminals are provided in a portion except a part around the semiconductor chip mounting area, and one end of each of the plurality of output side connection terminals is provided from outside the one semiconductor chip mounting area. The other end is connected to the input side connection terminal, and the other end is moved from a part around the other semiconductor chip mounting area to the inside of the other semiconductor chip mounting area. It can wound with those provided so as not to intersect with each other on the substrate surface a plurality of connecting wires connected to the plurality of input connection terminals of the other semiconductor chip mounting area.

[0008]

According to this invention, the other end of each of the plurality of connection wirings is routed from a part of the periphery of the other semiconductor chip mounting area to the inside of the other semiconductor chip mounting area, thereby forming the other semiconductor chip. Since the plurality of input-side connection terminals in the mounting area are connected to each other, even if a plurality of connection wirings are provided only on the substrate surface, they can be prevented from intersecting each other.

[0009]

FIG. 1 shows a main part of a liquid crystal display device to which one embodiment of the present invention is applied. In this figure, the same reference numerals are given to the same names as those in FIG. 7, and the description thereof will be omitted as appropriate. In this liquid crystal display device, the lower transparent substrate 1
Two rectangular semiconductor chip mounting areas 21 and 22 are provided on the upper surface of one end of the semiconductor chip. The semiconductor chip mounting areas 21 and 22 are basically provided with a plurality of output side connection terminals 2 just inside one long side and inside both short sides.
3 and 24 are provided, three input-side connection terminals 25 and 26 are provided immediately inside the right half of the other long side, and blank portions 27 and 28 are provided in the left half of the other long side. Are also provided with blank portions 29 and 30 at the center of the. The transparent electrodes 13 and 15 are connected to the output-side connection terminals 23 and 24, respectively. Three input-side connection terminals 25 of the semiconductor chip mounting area 21 on the left side
, One end of each of three internal connection wirings 31 provided on the upper surface of one end of the lower transparent substrate 12 is connected to the outside of the semiconductor chip mounting area 21 on the left. The three internal connection wirings 31 are parallel to each other, and the other end of each of the three wirings passes through the blank half 28 on the left half of the other long side of the semiconductor chip mounting area 22 on the right side and is drawn to the blank half 30 in the center. Turned, right semiconductor chip mounting area 2
2 and three input side connection terminals 26 respectively. The three input connection terminals 26 of the right semiconductor chip mounting area 22 are connected to one end of three external connection wires 32 provided on the upper surface of one end of the lower transparent substrate 12 by the right semiconductor chip. Each of them is connected from outside the mounting area 22. The three external connection wires 32 are parallel to each other, and the other ends thereof are respectively connected to three external connection terminals 33 provided at the upper end of one end of the lower transparent substrate 12. . As shown in FIGS. 2 and 3, a plurality of output-side bump electrodes 34 and three input-side bump electrodes 34 are provided on a portion except for a part around the lower surface, corresponding to the structure of the semiconductor chip mounting areas 21 and 22. The semiconductor chip 36 provided with each of the semiconductor chip mounting areas 21 and 2
2 respectively. In this case, the semiconductor chip 36
The output side bump electrodes 34 and the three input side bump electrodes 35 are connected to the output side connection terminals 23, 24 and the input side connection terminals 25, 26 of the semiconductor chip mounting areas 21, 22 via an anisotropic conductive adhesive or the like. Respectively.

As described above, in this liquid crystal display device, three internal connection wires 31 and three external connection wires 32
Are parallel to each other, it is possible to prevent a common wiring composed of three internal connection wirings 31 and three external connection wirings 32 from intersecting in the same plane,
Therefore, the internal connection wiring 31 and the external connection wiring 32
Can be formed simultaneously with the transparent electrodes 13, 15 and the like, and the number of manufacturing steps of the liquid crystal display panel 1 can be prevented from increasing.

In the above embodiment, the lower transparent substrate 1
2, two semiconductor chips 36 are mounted on the upper surface of one end,
Although the case where the input side connection wiring of the two semiconductor chips 36 is shared and the two semiconductor chips 36 are electrically connected to the circuit board via one flexible wiring board has been described, the invention is not limited to this. For example, as shown in FIG. 4, three semiconductor chips 3 are provided on the upper surface of one end of the lower transparent substrate 12.
6, share the input side connection wiring of the three semiconductor chips 36, electrically connect to the circuit board 5 via one flexible wiring board 6, and connect one end of the upper transparent substrate 11. Two semiconductor chips 36 may be mounted on the lower surface, the input side connection wiring of the two semiconductor chips 36 may be shared, and the two semiconductor chips 36 may be electrically connected to the circuit board 5 via one flexible wiring board 8. . Further, the present invention is not limited to the liquid crystal display device, and it is needless to say that the present invention can be applied to other electronic devices having a substrate having a similar wiring structure.

[0012]

As described above, according to the present invention, the other end of each of the plurality of connection wirings is moved from a part around the other semiconductor chip mounting area to the inside of the other semiconductor chip mounting area. Since it is connected to a plurality of input side connection terminals of the other semiconductor chip mounting area,
Even if a plurality of connection wirings are provided only on the substrate surface, they can be prevented from intersecting with each other, so that a plurality of connection wirings can be formed simultaneously with other electrodes provided on the substrate surface. In addition, the number of manufacturing steps of the substrate can be prevented from increasing.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a liquid crystal display device to which an embodiment of the present invention is applied.

FIG. 2 is a bottom view of a semiconductor chip used in the liquid crystal display device.

FIG. 3 is a side view of the semiconductor chip.

FIG. 4 is a plan view of a liquid crystal display device to which another embodiment of the present invention is applied.

FIG. 5 is a plan view of an example of a conventional liquid crystal display device.

FIG. 6 is a plan view of another example of the conventional liquid crystal display device.

FIG. 7 is an enlarged plan view of a part of a liquid crystal display device of another example.

FIG. 8 is a sectional view taken along the line AA of FIG. 7;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 11, 12 Transparent substrate 13, 15 Transparent electrode 21, 22 Semiconductor chip mounting area 23, 24 Output side connection terminal 25, 26 Input side connection terminal 27, 28, 29, 30 Blank part 31 Internal connection wiring 32 External connection wiring 33 External connection terminal

Claims (1)

(57) [Scope of request for utility model registration] A plurality of semiconductor chip mounting areas are provided on a substrate surface, and a plurality of input side connection terminals respectively connected to a plurality of input side electrodes of each semiconductor chip mounted on each of the semiconductor chip mounting areas; A plurality of output side connection terminals respectively connected to a plurality of output side electrodes of each of the semiconductor chips is a wiring structure of a substrate provided in or near the semiconductor chip mounting area, wherein the plurality of input side connection terminals and The plurality of output-side connection terminals are provided in a portion except a part around the semiconductor chip mounting area, and one end of each of the plurality of output side connection terminals is provided from outside the one semiconductor chip mounting area of the plurality of semiconductor chip mounting areas. Each of the plurality of input side connection terminals of the chip mounting area is connected to each of the plurality of input side connection terminals. A plurality of connection wirings routed inside the other semiconductor chip mounting area and connected to the plurality of input side connection terminals of the other semiconductor chip mounting area are provided so as not to cross each other on the substrate surface. A wiring structure of a substrate, characterized in that: