JP2665275B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device which can be used as a liquid crystal driving device suitable for downsizing a liquid crystal display device.

[0002]

2. Description of the Related Art Conventionally, in a liquid crystal display device, the mounting area of a liquid crystal driving device disposed adjacent to a liquid crystal display is reduced in order to reduce the size of the entire device while securing a wide area of the liquid crystal display surface. It is desired.

To reduce the mounting area, TC
A method has been proposed in which a slit is formed in P (tape carrier package) and the TCP is mounted in a bent state.

FIG. 3 schematically shows an example of the TCP used in such a method.

In FIG. 3, TCP 11 is a tape substrate 12.
(Integrated circuit) chip mounted on a tape substrate 12
13 and.

The IC chip 13 includes a control circuit 14, a plurality of liquid crystal drive circuits 15 arranged in a plurality, and the like. The liquid crystal drive circuit 15 includes a wiring pattern provided on the tape substrate 12.
The liquid crystal display is connected to a display electrode of a liquid crystal display (not shown) via 17 and is driven under the control of the control circuit 14. The IC chip 13 generally has a substantially square planar shape, and a pad for electrical connection between the wiring pattern 17 and the liquid crystal drive circuit 15, that is, a drive signal output pad 16 is provided along a predetermined circumference. A plurality are arranged at the arrangement pitch.

[0007] The tape substrate 12 is provided with slits 18 and 19, and the TCP 11 is bent by these slits 18 and 19 when mounted on a liquid crystal display device.

FIG. 4 schematically shows the TCP 11 thus bent together with the liquid crystal display.

In FIG. 4, a liquid crystal display 21 has a liquid crystal layer 22.
And glass substrates 23 and 24.

As described above, since the TCP 11 constituting the liquid crystal driving device is mounted by being bent by the slits 18 and 19, the mounting area of the TCP 11 can be reduced, and the area of the liquid crystal display surface 23a can be reduced. It is possible to reduce the size of the entire device while securing a relatively large space.

On the other hand, a case where TCP is mounted on a liquid crystal display device without bending will be examined here.

In FIG. 5, the TCP 31 is connected to the liquid crystal display 21 without being bent. Where T
IC chip 33 mounted on tape substrate 32 of CP 31
In addition, the above-described IC chip 13 shown in FIG. 3 has a planar shape that is generally almost square. Therefore, when considering the same plane area, the peripheral length of the IC chip 33 is shorter than, for example, a chip having a virtually rectangular planar shape. As a result, the TC arranged adjacent to the liquid crystal display
In order to effectively reduce the mounting area of P31, if the TCP31 is to be configured to be long in the direction along one side of the opposed liquid crystal display and short in the direction perpendicular to this in the planar shape, the periphery of such a short length Therefore, it is necessary to narrow the arrangement pitch of the signal output pads of the IC chip 33 along the distance. For this reason, in practice, the routing area of the wiring pattern on the TCP 31 becomes large, and it is difficult to form the TCP 31 into an elongated shape. That is, it is difficult to reduce the mounting area of the TCP 31 in the liquid crystal display device. It was difficult.

[0013]

Generally, as a method of mounting a semiconductor device such as a TCP, a method which can be mounted more easily is desired.

However, in the above-described conventional method of bending TCP and mounting it on a liquid crystal display device, it is necessary to form a slit in the TCP, so that the number of steps related to bending at the time of mounting increases, and the TCP material cost also decreases. Increased costs were inevitable.

On the other hand, in the above-mentioned conventional method of mounting TCP on a liquid crystal display without bending, it is easy to mount TCP on a liquid crystal display, but it is necessary to form TCP into an elongated flat shape. There is naturally a limit, and it is difficult to reduce the mounting area of the TCP.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a semiconductor device which can be used as a liquid crystal driving device suitable for downsizing a liquid crystal display device and which can be easily mounted. As an issue.

[0017]

SUMMARY OF THE INVENTION The above-mentioned problem is solved by changing the display surface.
Around the display surface to drive the liquid crystal display having
Tape substrate and IC chip disposed adjacent to the liquid crystal display
In the semiconductor device having:
It has a substantially rectangular shape, and is provided at the edge of one long side.
Extending in a direction intersecting the longitudinal direction, and
Switches and multiple input patterns
Provided at the edge, in a direction intersecting the longitudinal direction.
Extending at a second pitch narrower than the first pitch
A plurality of output patterns arranged and the plurality of input patterns;
A fine pattern provided between the turn and the plurality of output patterns.
And a long rectangular chip mounting area.
The loop has a shape corresponding to the chip mounting area.
Provided at the edge of the longer side of the plurality of input patterns.
Input pads arranged for each of the
And at the edge of the other long side, the output pattern
Output pads arranged for each of the
And the one between the input pad and the output pad
And is connected to the input pad.
A control circuit, between the output pattern and the control circuit
Are arranged in parallel along the longitudinal direction of the chip,
Each of them extends in a direction intersecting the longitudinal direction and
A plurality of driving circuits connected to one of the output pads.
And a semiconductor device according to the present invention.
Is resolved . Further, the above-described problem is solved by a semiconductor device including a tape substrate and an IC chip arranged adjacent to the liquid crystal display around the display surface to drive the liquid crystal display having the display surface, wherein the tape substrate is Having a substantially rectangular shape, provided at an edge of one of the long sides, extending in a direction intersecting the longitudinal direction with a first pattern width, and having a plurality of inputs arranged at a first pitch. A second pattern having a second pattern width narrower than the first pattern width and extending in a direction intersecting the longitudinal direction and having a second pattern width narrower than the first pitch. A plurality of output patterns arranged at a pitch of 2 and an elongated rectangular chip mounting area provided between the plurality of input patterns and the plurality of output patterns;
The C chip has a shape corresponding to the chip mounting area, is provided at one long edge, and has a plurality of input pads arranged corresponding to each of the plurality of input patterns. A plurality of output pads arranged on the edge of the long side and arranged in correspondence with each of the output patterns, and provided on the one long side between the input pad and the output pad. And a long control circuit connected to the input pad, and arranged in parallel along the longitudinal direction of the chip between the output pattern and the control circuit, each of which is the second control circuit. The semiconductor device according to the present invention, further comprising a plurality of drive circuits having a width smaller than the pitch, extending in a direction intersecting the longitudinal direction, and being connected to one of the output pads. Will be resolved.

[0018]

In the semiconductor device of the present invention, the tape substrate has a longitudinal shape extending along one side of the display surface, and a plurality of wiring patterns are formed on the substrate so as to extend in a direction intersecting the longitudinal direction of the substrate. They are arranged and are electrically connected at one end to a liquid crystal display. Here, a liquid crystal driving IC having a longitudinal shape extending in the longitudinal direction of the substrate on the surface of the substrate
The chip has drive signal output pads arranged along the longitudinal direction of the substrate and electrically connected to the other end of the wiring pattern. A plurality of liquid crystal drive circuits are provided along the longitudinal direction of the IC chip. Are arranged. For this reason, the liquid crystal driving IC chip that can be electrically connected to the liquid crystal display via the wiring pattern can be configured to have a shape that is elongated in the longitudinal direction of the substrate while increasing the wiring pitch of the driving signal output pads. it can. As a result, the tape substrate can be formed in an elongated shape extending in the longitudinal direction without increasing the wiring area of the wiring pattern on the substrate. Further, on a substantially rectangular tape substrate, a plurality of input patterns are provided on one long side edge, and a plurality of output patterns are provided on the other long side edge at a pitch smaller than the input pattern. A plurality of input pads and a plurality of output pads are provided on the IC chip mounted on the chip mounting area in correspondence with the input pattern and the output pattern, respectively. A control circuit having a scale shape is provided, and a plurality of drive circuits each having a width smaller than the pitch of the output pad and extending in a direction intersecting with the longitudinal direction are arranged in parallel on the output pad side along the longitudinal direction. The liquid crystal driving I
The C chip and the tape substrate can be formed in an elongated shape extending in the longitudinal direction without increasing the wiring area of the wiring pattern on the substrate. Therefore, when the semiconductor device of the present invention is used as a driving device of a liquid crystal display device, the mounting area of the liquid crystal driving device around the display surface can be reduced, and the device can be relatively widened on the liquid crystal display surface. The overall size can be reduced. Further, the tape substrate can be easily mounted without requiring the bending of the tape substrate as in the above-described conventional example, and the cost can be reduced.

The following examples of the present invention will further clarify such effects of the present invention, and further clarify other effects of the present invention.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic plan view showing a TCP which is a semiconductor device according to an embodiment of the present invention.

In FIG. 1, the TCP 41 includes a tape substrate 42 made of polyimide or the like as an example of the substrate, and a liquid crystal driving IC chip 43 mounted on the tape substrate 42.

The IC chip 43 includes a control circuit 44 and a plurality of liquid crystal drive circuits 45 arranged. The liquid crystal drive circuit 45 includes a wiring pattern 47 provided on the tape substrate 42.
a is connected to a display electrode of a liquid crystal display (not shown). The control circuit 44 is connected to a wiring pattern 47b for inputting an image signal. The wiring pattern 47b is connected to an image signal supply device (not shown) and the like. Control
The control circuit 44 controls the liquid crystal drive circuit 45 in accordance with the image signal input via the wiring pattern 47b. In response, the liquid crystal driving circuit 45 drives the liquid crystal of the liquid crystal display via the wiring pattern 47a. As can be seen from FIG. 1, a plurality of wiring patterns 47a are arranged so as to extend in a direction intersecting the longitudinal direction of the tape substrate 42.

A wiring pattern is provided along the periphery of the IC chip 43.
A plurality of drive signal output pads 46a for electrically connecting the circuit 47a and the liquid crystal drive circuit 45 are arranged at a predetermined arrangement pitch, and an image signal for electrically connecting the wiring pattern 47b and the control circuit 44 is provided. A plurality of input pads 46b are arranged at a predetermined arrangement pitch.

FIG. 2 schematically shows a state in which the TCP 41 thus configured is mounted on a liquid crystal display device.

In FIG. 2, a liquid crystal display 51 has a liquid crystal layer 52.
And glass substrates 53 and 54. Liquid crystal layer 52
Is sealed in a predetermined cell by a seal member 55. The liquid crystal display 51 also includes an alignment film (not shown), a display electrode, a dielectric film, and the like. The TCP 41 is disposed adjacent to the liquid crystal display 51 around the liquid crystal display surface 53a of the liquid crystal display 51, and the display electrode of the liquid crystal display 51 is
It is electrically connected to the wiring pattern 47a of the TCP 41 by wireless bonding technology or the like.

Here, as can be seen from FIGS. 1 and 2,
In particular, the IC chip 43, when mounted on a liquid crystal display device, is formed into an elongated rectangle that is long in a direction along one side of the liquid crystal display body 51 that is opposed and short in a direction perpendicular to the one side. . Here, in order to make the IC chip 43 slender, the liquid crystal drive circuit 45 has a
The chips 43 are arranged along the longitudinal direction. Also, I
By using a multilayer metal wiring as the internal wiring of the C chip 43, the IC chip 43 can be further elongated.

At the same time, the TCP 41 has a planar shape along one side of the opposed liquid crystal display 51, that is, the IC chip 43.
Are arranged long along the longitudinal direction and short in a direction perpendicular thereto.

Here, the perimeter of the IC chip 43 having a rectangular planar shape is longer than the ICs 13 and 33 having a square planar shape according to the above-described conventional example, when they are considered in the same plane area. As a result, the signal output pads 46a are arranged at a relatively wide pitch along the periphery of such a relatively long length. In this embodiment, in particular, the arrangement pitch of the signal output pads 46a is set to be substantially the same as the pitch of the terminal portions of the wiring pattern 47a.
The wiring area of the upper wiring pattern 47a can be made as small as possible.

As described above, according to this embodiment, the TCP
As shown in FIG. 2, the mounting area of the liquid crystal display device 41 can be reduced because the display device 41 has an elongated shape. Can be reduced in size.

In the above embodiments, the semiconductor device is used as a driving device for a liquid crystal display device to reduce its size. However, a driving device for an EL (electroluminescence) display device and various portable electronic devices are used. By applying this embodiment to a semiconductor device to be mounted in a limited specific plane area inside the device, the size can be reduced at a relatively low cost.

[0032]

As described above in detail, according to the present invention, a liquid crystal driving IC chip which can be electrically connected to a liquid crystal display via a wiring pattern is provided with a driving signal output pad arrangement pitch. Can be formed in a shape elongated in the longitudinal direction of the substrate, and the substrate can be formed in a shape elongated in the longitudinal direction without increasing the wiring area of the wiring pattern on the substrate. it can.
Therefore, when the semiconductor device of the present invention is used as a driving device of a liquid crystal display device, the mounting area of the liquid crystal driving device around the liquid crystal display surface can be reduced, and the area of the liquid crystal display surface can be relatively widened. The size of the entire device can be reduced. In addition, it can be easily mounted without requiring bending as in the above-described conventional example, and the cost can be reduced. As a result, by using the semiconductor device of the present invention, a small-sized liquid crystal display device having a large screen can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of a TCP which is a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a schematic sectional view of a liquid crystal display device on which the TCP of FIG. 1 is mounted.

FIG. 3 is a schematic plan view of a conventional folded and mounted TCP.

FIG. 4 is a schematic sectional view of a liquid crystal display device equipped with the TCP of FIG. 3;

FIG. 5 is a schematic cross-sectional view of a conventional liquid crystal display device having a TCP mounted without bending.

[Description of Signs] 41 TCP 42 Tape substrate 43 IC chip 44 Control circuit 45 Liquid crystal drive circuit 46a Drive signal output pad 46b Image signal input pad 47a, 47b Wiring pattern 51 Liquid crystal display 52 Liquid crystal layer 53, 54 glass substrate

Claims (2)

(57) [Claims] 1. A method for driving a liquid crystal display having a display surface.
It is arranged adjacent to the liquid crystal display body around the display surface.
Semiconductor device with tape substrate and IC chip
The tape substrate has a substantially rectangular shape, and has one long side.
Provided at the edge of the side, in the direction that intersects the longitudinal direction
A plurality of input patterns extending and arranged at a first pitch;
And an edge of the other long side.
Extending in the direction intersecting with the first pitch
A plurality of output patterns arranged at a narrow second pitch
And the plurality of input patterns and the plurality of output patterns
And an elongated rectangular chip mounting area provided between
Wherein the shape the IC chip corresponding to the chip mounting area
And provided at the edge of one of the long sides.
A number arranged for each of the number input patterns
Input pad and the other long side edge,
Plurality arranged corresponding to each of the output patterns
Output pad, and the input pad and the output pad
The input pad provided on the one long side of the input pad
A control circuit connected to the output pattern and the control
Arranged in parallel with the circuit along the longitudinal direction of the chip
And each direction intersects the longitudinal direction
And is connected to one of the output pads
A semiconductor device, comprising: a plurality of driving circuits. 2. A semiconductor device comprising: a tape substrate and an IC chip disposed adjacent to the liquid crystal display around the display surface to drive the liquid crystal display having the display surface; A plurality of input patterns having a rectangular shape, being provided at an edge of one long side, extending in a direction intersecting the longitudinal direction with a first pattern width, and arranged at a first pitch; A second pattern width smaller than the first pitch, the second pattern width being smaller than the first pitch, and extending in a direction intersecting the longitudinal direction with a second pattern width smaller than the first pattern width. A plurality of output patterns arranged at a pitch, and an elongated rectangular chip mounting area provided between the plurality of input patterns and the plurality of output patterns. Area vs A plurality of input pads arranged corresponding to each of the plurality of input patterns, and provided on an edge of the other long side. ,
A plurality of output pads arranged corresponding to each of the output patterns, and a long shape provided on the one long side between the input pad and the output pad and connected to the input pad Control circuit, and arranged in parallel along the longitudinal direction of the chip between the output pattern and the control circuit, each having a width smaller than the second pitch, the longitudinal direction and A plurality of drive circuits extending in a direction intersecting and connected to one of the output pads.