JPH04283722A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH04283722A JPH04283722A JP4786991A JP4786991A JPH04283722A JP H04283722 A JPH04283722 A JP H04283722A JP 4786991 A JP4786991 A JP 4786991A JP 4786991 A JP4786991 A JP 4786991A JP H04283722 A JPH04283722 A JP H04283722A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- circuit board
- flexible substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 9
- 239000002356 single layer Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、液晶表示装置の駆動回
路部を小型化し、液晶表示装置全体の小型化、表示画面
の大型化に適するようにした液晶表示装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device in which the driving circuit portion of the liquid crystal display device is miniaturized, making it suitable for miniaturizing the entire liquid crystal display device and increasing the size of the display screen.
【０００２】0002
【従来の技術】液晶表示素子に直接接続されて走査電極
や信号電極を駆動し、液晶表示素子の画面に表示を行な
わせるためのＬＳＩなどを含む回路部品は、通常、液晶
表示素子と共に其の周囲や裏面に配置され、これらが同
一ケース内に収納されて一つの液晶表示装置を構成する
ようになっている。[Prior Art] Circuit components including LSIs that are directly connected to a liquid crystal display element to drive scanning electrodes and signal electrodes to display on the screen of the liquid crystal display element are usually connected together with the liquid crystal display element. They are arranged around the periphery and on the back surface, and are housed in the same case to form one liquid crystal display device.
【０００３】近年、液晶表示素子の表示面が大きくなり
、複雑な表示を行なわせるようになるのに伴って、上記
回路部品の数量も多くなり、液晶表示装置の表示画面以
外の額縁に相当する部分に広い面積が必要となり、液晶
表示装置の小型化が困難になって来た。一方、半導体素
子を用いて効率よく量産的に電子機器を製造するために
、以前から、ＬＳＩなどの半導体素子チップを、其の接
続用リードパターンなどを形成させてある映画フィルム
状のフレキシブルテープ（フレキシブル基板）上に予め
搭載して用いること（ＴＡＢ方式）が行なわれて来た。
この方式ではフレキシブル基板に搭載する半導体素子は
パッケージの無い所謂チップであって、１個ずつパッケ
ージに封入した場合に比べて小型化には非常に有利であ
る。フレキシブル基板上で、半導体素子チップ側の端子
間距離は非常に短いが、フレキシブル基板上の接続用リ
ードパターンによって、他の回路と接続する箇所では通
常のパッケージに封入した半導体素子の端子の場合と同
程度に広くなっている。液晶表示装置の駆動回路に、小
型化のために上記のようなフレキシブル基板上に装着し
た半導体素子を利用することは、勿論従来から行なわれ
ていたが、ただフレキシブル基板方式を利用するだけで
は、上記液晶表示装置の小型化のためには不十分であっ
た。[0003] In recent years, as the display surface of liquid crystal display elements has become larger and more complex displays have become possible, the number of the above-mentioned circuit components has also increased, and the number of circuit components other than the display screen of the liquid crystal display device has increased. This requires a large area, making it difficult to downsize liquid crystal display devices. On the other hand, in order to efficiently mass-produce electronic devices using semiconductor devices, flexible tape (like a movie film), on which lead patterns for connecting semiconductor device chips such as LSIs are formed, has been used for some time. The TAB method has been used by pre-mounting the device on a flexible substrate (TAB method). In this method, the semiconductor elements mounted on the flexible substrate are so-called chips without a package, which is very advantageous for miniaturization compared to the case where each semiconductor element is sealed in a package. On the flexible substrate, the distance between the terminals on the semiconductor element chip side is very short, but due to the connection lead pattern on the flexible substrate, the distance between the terminals of the semiconductor element sealed in a normal package is different from that of the terminals of the semiconductor element sealed in a normal package, due to the connection lead pattern on the flexible substrate. It is equally wide. Of course, the use of semiconductor elements mounted on flexible substrates as described above has been used in the drive circuits of liquid crystal display devices for miniaturization, but simply using a flexible substrate method is not enough. This was insufficient for downsizing the liquid crystal display device.
【０００４】このため、液晶表示装置の小型化のために
種々の提案が行なわれており、例えば、実開昭６１−１
５５８８０号公報には、図４に示すように、上記フレキ
シブル基板を折り曲げて実装し、表示画面の周囲の額縁
部分を狭くすることが開示されている。但し、図４の中
で、１は単層の通常の回路基板、２はフレキシブル基板
、３は液晶表示素子である。[0004] For this reason, various proposals have been made to reduce the size of liquid crystal display devices.
As shown in FIG. 4, Japanese Patent No. 55880 discloses that the flexible substrate is folded and mounted to narrow the frame portion around the display screen. However, in FIG. 4, 1 is a single-layer ordinary circuit board, 2 is a flexible substrate, and 3 is a liquid crystal display element.
【０００５】[0005]
【発明が解決しようとする課題】上記従来の小型化技術
では、複数のフレキシブル基板上の接続用リードパター
ンの端子同士を接続して信号を仲介させる回路基板とし
て、基板の表裏に銅箔配線による回路を形成させ、必要
に応じて半導体素子も搭載した単層基板が使用されてお
り、この単層回路基板に、信号線、電源線など多数の配
線を配置するためには１０〜１５ｍｍの幅が必要で、上
記表示画面の周囲外部の額縁が広くなっていた。[Problems to be Solved by the Invention] In the above-mentioned conventional miniaturization technology, as a circuit board that connects the terminals of connection lead patterns on a plurality of flexible boards and mediates signals, copper foil wiring is used on the front and back of the board. A single-layer board is used on which a circuit is formed and semiconductor elements are mounted if necessary.In order to arrange a large number of wiring such as signal lines and power supply lines on this single-layer circuit board, a width of 10 to 15 mm is required. , and the external frame around the display screen was wide.
【０００６】本発明は上記表示画面周囲の額縁部分の幅
を狭くした液晶表示装置を提供することを目的とする。An object of the present invention is to provide a liquid crystal display device in which the width of the frame portion around the display screen is narrowed.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明においては、液晶表示素子と此れを駆動するた
めのＬＳＩが搭載された複数のフレキシブル基板、及び
これらのフレキシブル基板同士の間を電気的に接続する
回路基板を備えた液晶表示装置において、前記回路基板
として、従来の単層基板の代りに、多層基板を用いるこ
とにした。[Means for Solving the Problems] In order to achieve the above object, the present invention provides a plurality of flexible substrates on which a liquid crystal display element and an LSI for driving the same are mounted, and a plurality of flexible substrates that are arranged between these flexible substrates. In a liquid crystal display device equipped with a circuit board for electrically connecting the circuit board, a multilayer board is used instead of the conventional single-layer board.
【０００８】[0008]
【作用】フレキシブル基板の入力信号線を４〜１０本ず
つに分割し、それぞれ多層回路基板の各層に配置する。
１本の信号線の幅を０．１〜０．３ｍｍとし、各線の間
の間隔を０．１ｍｍ以上としても、上記多層回路基板の
幅を５ｍｍ以下にすることが出来る。[Operation] The input signal lines of the flexible board are divided into 4 to 10 lines, and each line is placed on each layer of the multilayer circuit board. Even if the width of one signal line is 0.1 to 0.3 mm and the interval between each line is 0.1 mm or more, the width of the multilayer circuit board can be 5 mm or less.
【０００９】[0009]
【実施例】図１は本発明を反射形液晶表示装置に適用し
た実施例の平面図である。液晶表示素子３のガラス基板
の周囲の接続端子に、駆動用ＬＳＩを搭載したフレキシ
ブル基板２を異方性導電膜により接続し、フレキシブル
基板２を多層回路基板１ａに半田付けにより接続する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of an embodiment in which the present invention is applied to a reflective liquid crystal display device. A flexible substrate 2 on which a driving LSI is mounted is connected to the connection terminals around the glass substrate of the liquid crystal display element 3 through an anisotropic conductive film, and the flexible substrate 2 is connected to the multilayer circuit board 1a by soldering.
【００１０】図２は図１中に示すＡ−Ａ’線による多層
回路基板１ａの断面図である。また、図５は多層基板内
部の接続を示す構造図である。絶縁性基板５の両面に銅
箔４を形成し、所定の信号線をエッチング加工により形
成したのち接着剤６で張り合わせ、スルーホール９を形
成して多層信号線間の接続を行ない、フレキシブル基板
の入力信号と対応する回路基板１ａ上の信号線を接続す
る。本実施例では、多層回路基板１ａの一方の表面には
、フレキシブル基板の入力信号のパッドを配置し、他の
面には表示データ線、制御信号線を配置し、内層には、
電源およびバイアス電圧線を配置した。内層に電源線、
バイアス電圧線を設けることにより、これらの線幅を広
くすることが可能となり、スルーホール９が貫通するク
リアランス１０を設けることも容易になり有効である。FIG. 2 is a sectional view of the multilayer circuit board 1a taken along the line AA' shown in FIG. Further, FIG. 5 is a structural diagram showing connections inside the multilayer board. Copper foil 4 is formed on both sides of an insulating substrate 5, predetermined signal lines are formed by etching, and then bonded with adhesive 6, through holes 9 are formed to connect multilayer signal lines, and the flexible substrate is formed. The signal line on the circuit board 1a corresponding to the input signal is connected. In this embodiment, pads for input signals of the flexible board are arranged on one surface of the multilayer circuit board 1a, display data lines and control signal lines are arranged on the other surface, and on the inner layer,
Power supply and bias voltage lines were placed. Power line on the inner layer,
By providing bias voltage lines, it is possible to increase the width of these lines, and it is also easy and effective to provide a clearance 10 through which the through hole 9 passes.
【００１１】図３は本発明を透過形液晶表示装置に適用
した実施例の断面図である。透過形液晶表示素子３ａに
、駆動用ＬＳＩを搭載したフレキシブル基板２を異方性
導電膜で接続し、前記フレキシブル基板２に回路基板１
ａを半田付けで接続し、背面にバックライト７を実装し
、ケース８で固定することにより薄型、軽量で、明るく
見易い液晶表示装置が得られる。FIG. 3 is a sectional view of an embodiment in which the present invention is applied to a transmission type liquid crystal display device. A flexible substrate 2 on which a driving LSI is mounted is connected to the transmission type liquid crystal display element 3a through an anisotropic conductive film, and a circuit board 1 is connected to the flexible substrate 2.
A is connected by soldering, a backlight 7 is mounted on the back surface, and a case 8 is used to fix the display device, thereby obtaining a thin, lightweight, bright and easy-to-read liquid crystal display device.
【００１２】0012
【発明の効果】以上説明したように本発明によれば、回
路基板を従来の単層から多層に変えることにより基板の
幅を狭くすることが可能となり、液晶表示装置の表示画
面周囲の額縁部分の幅を狭くでき、表示画面は大きく、
その割には表示装置の外形は小さく、軽量、薄型の液晶
表示装置が得られる。As explained above, according to the present invention, by changing the circuit board from a conventional single layer to a multilayer, the width of the circuit board can be reduced, and the frame area around the display screen of a liquid crystal display device can be reduced. The width of the screen can be narrowed, the display screen can be made larger,
In comparison, the external size of the display device is small, and a lightweight, thin liquid crystal display device can be obtained.
【図１】本発明を反射形液晶表示装置に適用した実施例
の平面図である。FIG. 1 is a plan view of an embodiment in which the present invention is applied to a reflective liquid crystal display device.
【図２】同実施例に用いた多層回路基板の断面図である
。FIG. 2 is a cross-sectional view of a multilayer circuit board used in the same example.
【図３】本発明を透過形液晶表示装置に適用した実施例
の断面図である。FIG. 3 is a sectional view of an embodiment in which the present invention is applied to a transmissive liquid crystal display device.
【図４】フレキシブル基板を折り曲げて使用した従来の
液晶表示装置の断面図である。FIG. 4 is a cross-sectional view of a conventional liquid crystal display device using a bent flexible substrate.
【図５】多層基板内部の接続を示す構造図である。FIG. 5 is a structural diagram showing connections inside the multilayer board.
【符合の説明】１…（単層）回路基板 １ａ…多層回路基板 ２…フレキシブル基板 ３…反射形液晶表示素子 ３ａ…透過形液晶表示素子 ４…銅箔 ５…絶縁性基板 ６…接着剤 ７…バックライト ８…ケース ９…スルーホール １０…クリアランス[Explanation of symbols] 1... (single layer) circuit board 1a...Multilayer circuit board 2...Flexible board 3...Reflective liquid crystal display element 3a... Transmissive liquid crystal display element 4...Copper foil 5...Insulating substrate 6...Adhesive 7...Backlight 8...Case 9...Through hole 10...Clearance
Claims (1)
Ｉが搭載されている複数のフレキシブル基板、及びこれ
らのフレキシブル基板同士の間を電気的に接続する回路
基板を備えた液晶表示装置において、前記回路基板とし
て多層基板を用いたことを特徴とする液晶表示装置。Claim 1: A liquid crystal display element and an LS for driving it.
A liquid crystal display device equipped with a plurality of flexible substrates mounted with I and a circuit board for electrically connecting the flexible substrates, characterized in that a multilayer substrate is used as the circuit board. Display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3047869A JP2920843B2 (en) | 1991-03-13 | 1991-03-13 | Liquid crystal display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3047869A JP2920843B2 (en) | 1991-03-13 | 1991-03-13 | Liquid crystal display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04283722A true JPH04283722A (en) | 1992-10-08 |
| JP2920843B2 JP2920843B2 (en) | 1999-07-19 |
Family
ID=12787384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3047869A Expired - Lifetime JP2920843B2 (en) | 1991-03-13 | 1991-03-13 | Liquid crystal display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2920843B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0587144A3 (en) * | 1992-09-08 | 1994-06-08 | Seiko Epson Corp | Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| EP0765053A2 (en) * | 1995-09-21 | 1997-03-26 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| KR100246086B1 (en) * | 1995-10-26 | 2000-03-15 | 나시모토 류조 | Liquid crystal display device |
| KR100706738B1 (en) * | 2000-09-08 | 2007-04-11 | 삼성전자주식회사 | Display unit for a flat panel display apparatus |
-
1991
- 1991-03-13 JP JP3047869A patent/JP2920843B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0587144A3 (en) * | 1992-09-08 | 1994-06-08 | Seiko Epson Corp | Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| US5737272A (en) * | 1992-09-08 | 1998-04-07 | Seiko Epson Corporation | Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| EP0867942A3 (en) * | 1992-09-08 | 1998-12-16 | Seiko Epson Corporation | Liquid crystal display apparatus |
| US5986342A (en) * | 1992-09-08 | 1999-11-16 | Seiko Epson Corporation | Liquid crystal display apparatus structure for mounting semiconductor device |
| US6128063A (en) * | 1992-09-08 | 2000-10-03 | Seiko Epson Corporation | Liquid crystal display apparatus having multi-layer substrate |
| EP0765053A2 (en) * | 1995-09-21 | 1997-03-26 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| EP0765053A3 (en) * | 1995-09-21 | 1998-04-08 | Mitsubishi Denki Kabushiki Kaisha | Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| KR100246086B1 (en) * | 1995-10-26 | 2000-03-15 | 나시모토 류조 | Liquid crystal display device |
| KR100706738B1 (en) * | 2000-09-08 | 2007-04-11 | 삼성전자주식회사 | Display unit for a flat panel display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2920843B2 (en) | 1999-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7599193B2 (en) | Tape circuit substrate with reduced size of base film | |
| US6456353B1 (en) | Display driver integrated circuit module | |
| KR100321883B1 (en) | Structure and method of mounting semiconductor device and liquid crystal display device | |
| JP2614260B2 (en) | Liquid crystal display | |
| US6111629A (en) | Display device | |
| JP3202525B2 (en) | Electric circuit board and display device having the same | |
| JP2730536B2 (en) | Liquid crystal display | |
| JPH04216589A (en) | Connecting structure of electronic circuit | |
| JP2920843B2 (en) | Liquid crystal display | |
| JP2877621B2 (en) | Liquid crystal display | |
| JP3199579B2 (en) | Liquid crystal display | |
| JP2000199914A (en) | Liquid crystal panel-drive integrated circuit package and liquid crystal panel module | |
| JPH06242462A (en) | Liquid crystal display device | |
| JPH07254760A (en) | Connecting structure of substrate and ic unit | |
| JPH0675240A (en) | Liquid crystal display device | |
| JPH04304427A (en) | Liquid crystal display device | |
| JPH05142556A (en) | Driving circuit mounting structure in liquid crystal display device or the like | |
| JPH04281431A (en) | Liquid crystal display device | |
| JP3298345B2 (en) | Semiconductor device | |
| JPH0828395B2 (en) | Flexible circuit board and liquid crystal display device | |
| JP3261002B2 (en) | Liquid crystal display | |
| JPH05175274A (en) | Chip component | |
| JPH11305255A (en) | Liquid crystal display device | |
| JPH07255025A (en) | Liquid crystal display module | |
| JPH09120078A (en) | Liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090430 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090430 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100430 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110430 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110430 Year of fee payment: 12 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313121 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110430 Year of fee payment: 12 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110430 Year of fee payment: 12 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |