JP3560177B2 - LCD module - Google Patents

LCD module Download PDF

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Publication number
JP3560177B2
JP3560177B2 JP19226594A JP19226594A JP3560177B2 JP 3560177 B2 JP3560177 B2 JP 3560177B2 JP 19226594 A JP19226594 A JP 19226594A JP 19226594 A JP19226594 A JP 19226594A JP 3560177 B2 JP3560177 B2 JP 3560177B2
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Japan
Prior art keywords
liquid crystal
crystal display
display module
display panel
dummy
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Expired - Fee Related
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JP19226594A
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JPH0836189A (en
Inventor
剛 梅澤
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Casio Computer Co Ltd
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Casio Computer Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Liquid Crystal (AREA)

Description

【０００１】
【産業上の利用分野】
この発明は液晶表示モジュールに関する。
【０００２】
【従来の技術】
図４は従来の液晶表示モジュールの一例を示したものである。この液晶表示モジュールでは、液晶表示パネル１、４つの半導体チップ２〜５、フレキシブル配線基板６、制御回路用回路基板７等を備えている。このうち液晶表示パネル１はガラス等からなる２枚の透明基板８、９間に液晶（図示せず）が封入されたものからなっている。上側の透明基板８の一端部は下側の透明基板９の外側に突出され、この突出部の下面には所定の３つの半導体チップ２〜４が搭載されている。また、下側の透明基板９の一端部は上側の透明基板８の外側に突出され、この突出部の上面には残りの１つの半導体チップ５が搭載されている。
【０００３】
フレキシブル配線基板６は、方形状の本体部分６ａと、この本体部分６ａから分岐され且つ途中で１８０度折り曲げられたほぼＬ字状の分岐部分６ｂとからなっている。本体部分６ａの上面には複数本で１組の入力配線１０が３組設けられ、分岐部分６ｂおよびその近傍の本体部分６ａの上面には複数本で１組の入力配線１１が設けられている。そして、３組の入力配線１０の一端部は上側の透明基板８の突出部の下面に設けられ且つ各半導体チップ２〜４と導電接続された３組の入力側接続端子（図示せず）に異方導電性接着剤（図示せず）を介して導電接続され、他端部は回路基板７の一端部下面に設けられた３組の接続端子（図示せず）に異方導電性接着剤（図示せず）を介して導電接続されている。また、残りの１組の入力配線１１の一端部は下側の透明基板９の突出部の上面に設けられ且つ半導体チップ５と導電接続された１組の入力側接続端子（図示せず）に異方導電性接着剤（図示せず）を介して導電接続され、他端部は回路基板７の一端部下面に設けられた１組の接続端子（図示せず）に異方導電性接着剤（図示せず）を介して導電接続されている。
【０００４】
【発明が解決しようとする課題】
しかしながら、従来のこのような液晶表示モジュールでは、液晶表示パネル１とフレキシブル配線基板６との導電接続部分や液晶表示パネル１の半導体チップ２〜５が搭載されている付近に静電気が帯電した場合、半導体チップ２〜５が静電破壊されることがあるという問題があった。
この発明の目的は、液晶表示パネルに帯電した静電気を除電することができる液晶表示モジュールを提供することにある。
【０００５】
【課題を解決するための手段】
この発明は、液晶表示パネルと回路基板とをフレキシブル配線基板を介して導電接続した液晶表示モジュールにおいて、前記液晶表示パネルには、少なくとも一つの半導体チップが搭載され、前記フレキシブル配線基板には、該半導体チップに導電接続される少なくとも一組の入力配線及びダミー配線を設け、該ダミー配線が前記入力配線の両側に設けられ、前記回路基板に接地端子を設け、前記ダミー配線の一端部を前記液晶表示パネルに接続するとともに、他端部を前記回路基板の接地端子に導電接続したものである。
【０００６】
【作用】
この発明によれば、液晶表示パネルがフレキシブル配線基板のダミー配線を介して接地されているので、液晶表示パネルに帯電した静電気を速やかに除電することができる。したがって、液晶表示パネルに搭載された半導体チップの静電破壊を防止することができる。
【０００７】
【実施例】
図１はこの発明による液晶表示モジュールの一実施例を示したものである。この図において、図４と同一部分には同一の符号を付し、その説明を適宜省略する。この液晶表示モジュールでは、フレキシブル配線基板６の３組の入力配線１０の各両側にダミー配線２１が設けられ、また残りの１組の入力配線１１の両側にもダミー配線２２が設けられている。回路基板７の一端部下面には、図示していないが各ダミー配線２１、２２に対応して他端部側が接地された接地端子が設けられている。そして、３組の入力配線１０の各両側のダミー配線２１の一端部は上側の透明基板８の突出部の下面に異方導電性接着剤（図示せず）を介して接続され、他端部は回路基板７の対応する接地端子に異方導電性接着剤（図示せず）を介して導電接続されている。残りの１組の入力配線１１の両側のダミー配線２２の一端部は下側の透明基板９の突出部の上面に異方導電性接着剤（図示せず）を介して接続され、他端部は回路基板７の対応する接地端子に異方導電性接着剤（図示せず）を介して導電接続されている。
【０００８】
このように、フレキシブル配線基板６の各半導体チップ２〜５に対応した４組の入力配線１０、１１の各両側にダミー配線２１、２２が設けられ、液晶表示パネル１の各半導体チップ２〜５の両側の近傍部分が各ダミー配線２１、２２を介して接地されているので、液晶表示パネル１の各半導体チップ２〜５の両側の近傍部分に帯電した静電気は各ダミー配線２１、２２を介して速やかに流れ去り、効果的に除電することができ、この結果各半導体チップ２〜５の静電破壊を防止することができる。
【０００９】
なお、例えば、図２に示すように、フレキシブル配線基板６の本体部分６ａの左端部に位置するダミー配線２１の一端部を２つに分け、他端部を３つに分けるようにしてもよい。この場合、ダミー配線２１の接着面積が広くなるので、液晶表示パネル１や回路基板７との接着力が向上し剥離しにくくなる。但し、ダミー配線２１の少なくとも一方の端部を複数に分ければよく、ダミー配線２１の一端部を２つに分け、他端部を３つに分けることに限定されない。また、フレキシブル配線基板６の本体部分６ａにおける左端部以外の部分に位置するダミー配線２１や分岐部分６ｂに位置する両ダミー配線２２についても同様に、その端部を複数に分けるようにしてもよい。
また、例えば、図３に示すように、上側の透明基板８の突出部の下面の半導体チップ２の両側であって、ダミー配線２１に対応する部分に半導体チップ２の近傍に延びるほぼ平面六角形状のＩＴＯ薄膜（導電性薄膜）２３を設け、各ＩＴＯ薄膜２３にダミー配線２１の一端部を異方導電性接着剤（図示せず）を介して導電接続するようにしてもよい。この場合、両ＩＴＯ薄膜２３が半導体チップ２の近傍まで延びているので、上側の透明基板８の突出部の下面の半導体チップ２の近傍の静電気をより一層効果的に除電することができ、半導体チップ２の静電破壊をより一層防止することができる。
【００１０】
【発明の効果】
以上説明したように、この発明によれば、半導体チップが搭載された液晶表示パネルがフレキシブル配線基板のダミー配線を介して接地されているので、液晶表示パネルに帯電した静電気を、ダミー配線を介して効果的に除電することができる。したがって、液晶表示パネルに搭載された半導体チップの静電破壊を防止することができる。また、請求項３記載の発明によれば、液晶表示パネルのダミー配線に対応する部分に導電性薄膜を設け、この導電性薄膜にダミー配線を導電接続しているので、液晶表示パネルのダミー配線に対応する部分の静電気をより一層効果的に除電することができる。したがって、液晶表示パネルに搭載された半導体チップの静電破壊をより一層防止することができる。さらに、請求項５記載の発明によれば、フレキシブル配線基板のダミー配線の少なくとも一端部が複数に分かれているので、例えば液晶表示パネルとの接着力が向上し剥離しにくいようにすることができる。
【図面の簡単な説明】
【図１】この発明による液晶表示モジュールの一実施例の平面図。
【図２】この発明による液晶表示モジュールの他の実施例の要部を示す平面図。
【図３】この発明による液晶表示モジュールの別の他の実施例の要部を示す平面図。
【図４】従来の液晶表示モジュールの平面図。
【符号の説明】
１ 液晶表示パネル
２〜５ 半導体チップ
６ フレキシブル配線基板
７ 回路基板
２１、２２ ダミー配線
２３ ＩＴＯ薄膜（導電性薄膜）[0001]
[Industrial applications]
The present invention relates to a liquid crystal display module.
[0002]
[Prior art]
FIG. 4 shows an example of a conventional liquid crystal display module. This liquid crystal display module includes a liquid crystal display panel 1, four semiconductor chips 2 to 5, a flexible wiring board 6, a control circuit circuit board 7, and the like. The liquid crystal display panel 1 has a liquid crystal (not shown) sealed between two transparent substrates 8 and 9 made of glass or the like. One end of the upper transparent substrate 8 protrudes outside the lower transparent substrate 9, and predetermined three semiconductor chips 2 to 4 are mounted on the lower surface of the protruding portion. One end of the lower transparent substrate 9 protrudes outside the upper transparent substrate 8, and the remaining one semiconductor chip 5 is mounted on the upper surface of this protruding portion.
[0003]
The flexible wiring board 6 includes a rectangular main body portion 6a and a substantially L-shaped branch portion 6b branched from the main body portion 6a and bent 180 degrees in the middle. A plurality of one set of input wirings 10 are provided on the upper surface of the main body part 6a, and a plurality of one set of input wirings 11 are provided on the upper surface of the branch part 6b and the vicinity of the main body part 6a. . One end of each of the three sets of input wirings 10 is provided on the lower surface of the projecting portion of the upper transparent substrate 8 and is connected to three sets of input side connection terminals (not shown) conductively connected to each of the semiconductor chips 2 to 4. Conductive connection is made via an anisotropic conductive adhesive (not shown), and the other end is connected to three sets of connection terminals (not shown) provided on the lower surface of one end of the circuit board 7. (Not shown). One end of the remaining set of input wirings 11 is provided on the upper surface of the projecting portion of the lower transparent substrate 9 and is connected to a set of input-side connection terminals (not shown) conductively connected to the semiconductor chip 5. Conductive connection is made via an anisotropic conductive adhesive (not shown), and the other end is connected to a set of connection terminals (not shown) provided on the lower surface of one end of the circuit board 7. (Not shown).
[0004]
[Problems to be solved by the invention]
However, in such a conventional liquid crystal display module, when static electricity is charged in the conductive connection portion between the liquid crystal display panel 1 and the flexible wiring board 6 or in the vicinity where the semiconductor chips 2 to 5 of the liquid crystal display panel 1 are mounted, There is a problem that the semiconductor chips 2 to 5 may be electrostatically damaged.
An object of the present invention is to provide a liquid crystal display module capable of removing static electricity charged on a liquid crystal display panel.
[0005]
[Means for Solving the Problems]
The present invention, a liquid crystal display panel and the circuit board in a liquid crystal display module which is conductively connected via a flexible wiring board, the liquid crystal display panel, at least one semiconductor chip is mounted, the flexible printed circuit board, the At least one set of input wiring and dummy wiring that are conductively connected to the semiconductor chip are provided , the dummy wiring is provided on both sides of the input wiring , a ground terminal is provided on the circuit board, and one end of the dummy wiring is connected to the liquid crystal. It is connected to a display panel and the other end is conductively connected to a ground terminal of the circuit board.
[0006]
[Action]
According to the present invention, since the liquid crystal display panel is grounded via the dummy wiring of the flexible wiring board, static electricity charged on the liquid crystal display panel can be quickly eliminated. Therefore, it is possible to prevent electrostatic breakdown of the semiconductor chip mounted on the liquid crystal display panel.
[0007]
【Example】
FIG. 1 shows an embodiment of the liquid crystal display module according to the present invention. In this figure, the same parts as those in FIG. In this liquid crystal display module, dummy wirings 21 are provided on both sides of the three sets of input wirings 10 of the flexible wiring board 6, and dummy wirings 22 are provided on both sides of the remaining set of input wirings 11. Although not shown, a ground terminal whose other end is grounded is provided on the lower surface of one end of the circuit board 7 in correspondence with each of the dummy wirings 21 and 22. One end of each of the dummy wirings 21 on both sides of the three sets of input wirings 10 is connected to the lower surface of the protruding portion of the upper transparent substrate 8 via an anisotropic conductive adhesive (not shown), and the other end. Are electrically connected to corresponding ground terminals of the circuit board 7 via an anisotropic conductive adhesive (not shown). One end of the dummy wiring 22 on both sides of the remaining set of input wirings 11 is connected to the upper surface of the projecting portion of the lower transparent substrate 9 via an anisotropic conductive adhesive (not shown), and the other end. Are electrically connected to corresponding ground terminals of the circuit board 7 via an anisotropic conductive adhesive (not shown).
[0008]
As described above, the dummy wirings 21 and 22 are provided on both sides of the four sets of input wirings 10 and 11 corresponding to the semiconductor chips 2 to 5 of the flexible wiring board 6, respectively. Are grounded via the dummy wirings 21 and 22, so that the static electricity charged on the both sides of the semiconductor chips 2 to 5 of the liquid crystal display panel 1 is charged via the dummy wirings 21 and 22. As a result, the semiconductor chips 2 to 5 can be prevented from electrostatic destruction.
[0009]
For example, as shown in FIG. 2, one end of the dummy wiring 21 located at the left end of the main body portion 6a of the flexible wiring board 6 may be divided into two, and the other end may be divided into three. . In this case, since the bonding area of the dummy wiring 21 is increased, the bonding strength with the liquid crystal display panel 1 or the circuit board 7 is improved, and the dummy wiring 21 is hardly peeled off. However, at least one end of the dummy wiring 21 may be divided into a plurality, and it is not limited to dividing one end of the dummy wiring 21 into two and dividing the other end into three. Similarly, the ends of the dummy wiring 21 located at a part other than the left end of the main body part 6a of the flexible wiring board 6 and the two dummy wirings 22 located at the branch part 6b may be divided into a plurality. .
Also, for example, as shown in FIG. 3, a substantially planar hexagonal shape extending near the semiconductor chip 2 on both sides of the semiconductor chip 2 on the lower surface of the protrusion of the upper transparent substrate 8 and corresponding to the dummy wiring 21. The ITO thin film (conductive thin film) 23 may be provided, and one end of the dummy wiring 21 may be conductively connected to each ITO thin film 23 via an anisotropic conductive adhesive (not shown). In this case, since both ITO thin films 23 extend to the vicinity of the semiconductor chip 2, static electricity in the vicinity of the semiconductor chip 2 on the lower surface of the protruding portion of the upper transparent substrate 8 can be more effectively eliminated. The electrostatic breakdown of the chip 2 can be further prevented.
[0010]
【The invention's effect】
As described above, according to the present invention, since the liquid crystal display panel on which the semiconductor chip is mounted is grounded via the dummy wiring of the flexible wiring board, the static electricity charged on the liquid crystal display panel is transferred via the dummy wiring. It is possible to effectively eliminate static electricity. Therefore, it is possible to prevent electrostatic breakdown of the semiconductor chip mounted on the liquid crystal display panel. According to the third aspect of the present invention, a conductive thin film is provided in a portion corresponding to the dummy wiring of the liquid crystal display panel, and the dummy wiring is conductively connected to the conductive thin film. The static electricity in the portion corresponding to the above can be more effectively removed. Therefore, the electrostatic breakdown of the semiconductor chip mounted on the liquid crystal display panel can be further prevented. Furthermore, according to the fifth aspect of the present invention, at least one end of the dummy wiring of the flexible wiring board is divided into a plurality of parts, so that, for example, the adhesive strength with the liquid crystal display panel can be improved and the flexible wiring board can be prevented from peeling off. .
[Brief description of the drawings]
FIG. 1 is a plan view of one embodiment of a liquid crystal display module according to the present invention.
FIG. 2 is a plan view showing a main part of another embodiment of the liquid crystal display module according to the present invention.
FIG. 3 is a plan view showing a main part of another embodiment of the liquid crystal display module according to the present invention.
FIG. 4 is a plan view of a conventional liquid crystal display module.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 2-5 Semiconductor chip 6 Flexible wiring board 7 Circuit board 21, 22 Dummy wiring 23 ITO thin film (conductive thin film)

Claims (5)

液晶表示パネルと回路基板とをフレキシブル配線基板を介して導電接続した液晶表示モジュールにおいて、
前記液晶表示パネルには、少なくとも一つの半導体チップが搭載され、前記フレキシブル配線基板には、該半導体チップに導電接続される少なくとも一組の入力配線及びダミー配線を設け、該ダミー配線が前記入力配線の両側に設けられ、前記回路基板に接地端子を設け、前記ダミー配線の一端部を前記液晶表示パネルに接続するとともに、他端部を前記回路基板の接地端子に導電接続したことを特徴とする液晶表示モジュール。In a liquid crystal display module in which a liquid crystal display panel and a circuit board are conductively connected via a flexible wiring board,
The liquid crystal display panel has at least one semiconductor chip mounted thereon, and the flexible wiring board has at least one set of input wiring and dummy wiring conductively connected to the semiconductor chip , and the dummy wiring is the input wiring. provided on both sides, the ground terminal is provided on the circuit board, thereby connecting one end of the dummy wire into the liquid crystal display panel, characterized in that the other end portion is electrically conductive connected to the ground terminal of the circuit board Liquid crystal display module. 前記半導体チップは、前記液晶表示パネルに複数搭載され、前記フレキシブル配線基板に設けられる前記入力配線は該複数の半導体チップに導電接続される複数組の前記入力配線からなり、前記ダミー配線は、これら複数組の前記入力配線の各両側に設けられていることを特徴とする請求項１記載の液晶表示モジュール。 The semiconductor chip, a plurality of mounted on the liquid crystal display panel, wherein the input line provided on the flexible wiring board includes a plurality of sets of the input lines that will be electrically connected to the plurality of semiconductor chips, the dummy wiring these 2. The liquid crystal display module according to claim 1 , wherein said liquid crystal display module is provided on each side of a plurality of sets of said input wirings . 前記液晶表示パネルにおける前記フレキシブル配線基板の前記ダミー配線に対応する部分には導電性薄膜が設けられ、該導電性薄膜に前記ダミー配線が導電接続されていることを特徴とする請求項１または２記載の液晶表示モジュール。Wherein in the liquid crystal display panel flexible wiring in the portion corresponding to the dummy wiring board conductive thin film is provided, according to claim, characterized in that said dummy wires on the conductive thin film is electrically conductive connection 1 or 2 Liquid crystal display module as described. 前記導電性薄膜が前記半導体チップの近傍まで延びていることを特徴とする請求項３記載の液晶表示モジュール。4. The liquid crystal display module according to claim 3, wherein the conductive thin film extends to the vicinity of the semiconductor chip. 前記ダミー配線の少なくとも一端部が複数に分かれていることを特徴とする請求項１〜４記載の液晶表示モジュール。The liquid crystal display module according to claim 1-4, wherein the at least one end portion of the dummy wiring is divided into a plurality.
JP19226594A 1994-07-25 1994-07-25 LCD module Expired - Fee Related JP3560177B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19226594A JP3560177B2 (en) 1994-07-25 1994-07-25 LCD module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19226594A JP3560177B2 (en) 1994-07-25 1994-07-25 LCD module

Publications (2)

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JPH0836189A JPH0836189A (en) 1996-02-06
JP3560177B2 true JP3560177B2 (en) 2004-09-02

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JP19226594A Expired - Fee Related JP3560177B2 (en) 1994-07-25 1994-07-25 LCD module

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2730572B2 (en) * 1996-03-21 1998-03-25 日本電気株式会社 Liquid crystal display device and method of manufacturing the same
KR100287169B1 (en) * 1996-10-05 2001-04-16 윤종용 Liquid crystal display
CN1181383C (en) 1999-03-08 2004-12-22 松下电器产业株式会社 Liquid crystal display and its inspecting method
JP3695307B2 (en) * 2000-10-25 2005-09-14 セイコーエプソン株式会社 Wiring board, display device, semiconductor chip and electronic device
KR100749482B1 (en) * 2004-06-17 2007-08-14 삼성에스디아이 주식회사 Liquid crystal display having electrostatic shielding structure
KR100646970B1 (en) * 2005-06-29 2006-11-23 삼성에스디아이 주식회사 Flat panel display device
KR101274939B1 (en) * 2006-06-30 2013-06-18 엘지디스플레이 주식회사 Drive-IC and LC module
JP4371136B2 (en) 2006-09-15 2009-11-25 エプソンイメージングデバイス株式会社 Display device
JP2010015114A (en) * 2008-07-07 2010-01-21 Toshiba Mobile Display Co Ltd Display
JP6289163B2 (en) 2014-02-27 2018-03-07 三菱電機株式会社 Liquid crystal display

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