JP3026896B2 - Liquid crystal device - Google Patents
Liquid crystal deviceInfo
- Publication number
- JP3026896B2 JP3026896B2 JP4359312A JP35931292A JP3026896B2 JP 3026896 B2 JP3026896 B2 JP 3026896B2 JP 4359312 A JP4359312 A JP 4359312A JP 35931292 A JP35931292 A JP 35931292A JP 3026896 B2 JP3026896 B2 JP 3026896B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal device
- terminal
- flexible wiring
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液晶を用いて情報を表
示する表示装置を有する液晶装置に係り、詳しくは、ユ
ニット基板にフレキシブル配線基板を接続する際に加え
られる圧力が均一に付加される様にしたユニット基板に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device having a display device for displaying information using liquid crystal, and more particularly, to a device in which a pressure applied when a flexible wiring board is connected to a unit substrate is applied uniformly. And a unit substrate.
【０００２】[0002]
【従来の技術】従来、表示装置は外付けの駆動回路（駆
動回路ユニット）等により駆動されている。図５はこの
様子を示す模式図で、３は駆動回路であり、また４はプ
リント基板（ユニット基板）で駆動回路２に電源及び信
号を供給している。そして、これらがフレキシブル配線
基板であるＴＡＢ２により電気的・機械的に接続されて
いる。特に、ＴＡＢ２とプリント基板４との接続は、Ｔ
ＡＢ２の端子とプリント基板４の端子との一方又は両方
に被着された半田を加熱ヘッドにより熱圧着することに
より行われている。2. Description of the Related Art Conventionally, a display device is driven by an external drive circuit (drive circuit unit) or the like. FIG. 5 is a schematic view showing this state. Reference numeral 3 denotes a drive circuit, and reference numeral 4 denotes a printed circuit board (unit substrate) which supplies power and signals to the drive circuit 2. These are electrically and mechanically connected by TAB2 which is a flexible wiring board. In particular, the connection between TAB 2 and printed circuit board 4 is T
This is performed by thermocompression-bonding the solder applied to one or both of the terminals of AB2 and the terminals of the printed circuit board 4 with a heating head.
【０００３】なお、ＴＡＢ２の端子及びプリント基板４
の端子の端子ピッチが、表示装置１の表示情報密度を多
くしたい等の要求から狭ピッチ化が望まれ、０．５ｍｍ
以下の接続が必要とされている。この要求に応えるべ
く、プリント基板４も多層板を使用してサイズを小さく
することが行われている。The terminals of the TAB 2 and the printed circuit board 4
The terminal pitch of the terminal is required to be narrower in order to increase the display information density of the display device 1 or the like, and the terminal pitch is 0.5 mm.
The following connections are required: In order to meet this demand, the size of the printed circuit board 4 is also reduced by using a multilayer board.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、多層板
のプリント基板４を使用する場合、プリント基板４の複
数の端子位置に対応した裏面部に、配線パターン（配線
情報パターン）及び部品名などのシルク印刷パターン
（配線情報パターン）が有る部分と無い部分が生じてし
まうことがある。このとき、ＴＡＢ２の端子とプリント
基板４の端子とを加熱ヘッドにより熱圧着する場合、プ
リント基板４の裏面部配線パターン及びシルク印刷パタ
ーンが有る部分と無い部分では、加圧ヘッドを押しつけ
る際の加圧力に不均一性が生じ、特に接続ピッチが微細
化が要求されている時に深刻な問題となっている。即
ち、接続ピッチが微細化した場合、半田の供給量を少な
くしないと、熱圧着時に食み出した半田により隣接する
端子部で短絡が発生してしまう。このため、半田の供給
量を少なくする必要があるが、半田の供給量を少なくす
ると加圧力に不均一な部分があると十分に接続されない
ところが生じ、信頼性が低下するためである。However, when a multi-layer printed circuit board 4 is used, the back side of the printed circuit board 4 corresponding to a plurality of terminal positions has a wiring pattern (wiring information pattern) and a silk screen such as a part name. There may be a portion having a print pattern (wiring information pattern) and a portion having no print pattern. At this time, when the terminals of the TAB 2 and the terminals of the printed circuit board 4 are thermocompression-bonded by the heating head, the pressure applied to the pressing head is pressed in the portions where the wiring pattern and the silk print pattern on the back surface of the printed circuit board 4 are and are not present. Non-uniformity in pressure occurs, which is a serious problem particularly when a finer connection pitch is required. That is, when the connection pitch is reduced, unless the supply amount of the solder is reduced, a short circuit occurs at an adjacent terminal portion due to the solder that has protruded during thermocompression bonding. For this reason, it is necessary to reduce the supply amount of the solder. However, if the supply amount of the solder is reduced, if there is a portion where the pressing force is not uniform, a portion may not be sufficiently connected and reliability may be reduced.
【０００５】そこで、本発明は、加圧ヘッドによる加圧
力が端子全体に均一に付加される様にして信頼性の高い
液晶装置を提供することを目的とする。Accordingly, an object of the present invention is to provide a highly reliable liquid crystal device in which the pressing force of the pressure head is uniformly applied to the entire terminal.
【０００６】[0006]
【課題を解決するための手段】本発明は、上述事情に鑑
みなされたものであって、駆動回路ユニットを搭載した
フレキシブル配線基板によってユニット基板と表示装置
とを接続し、該ユニット基板から前記駆動回路ユニット
を介して前記表示装置に電源及び信号を供給することに
より該表示装置にて情報を表示する液晶装置において、
前記ユニット基板は、前記フレキシブル配線基板に対向
する一側の面に形成されて該フレキシブル配線基板に接
続される端子部と、他側の面であって少なくとも前記端
子部が形成された部分に対応する部分のほぼ全てに形成
される配線情報パターンと、を有し、かつ、前記フレキ
シブル配線基板と前記端子部との接続が、絶縁性接着剤
中に導電性微粒子が分散された異方性導電接着剤によっ
てなされる、ことを特徴とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and is directed to a method of connecting a unit substrate and a display device by a flexible wiring substrate having a driving circuit unit mounted thereon, and the driving circuit from the unit substrate. A liquid crystal device that displays information on the display device by supplying power and a signal to the display device via a circuit unit,
The unit substrate is formed on one surface facing the flexible wiring substrate and connected to a terminal portion connected to the flexible wiring substrate, and corresponds to a portion on the other surface where at least the terminal portion is formed. And a wiring information pattern formed on almost all of the portions to be connected, and the connection between the flexible wiring board and the terminal portion is performed by anisotropic conductive material in which conductive fine particles are dispersed in an insulating adhesive. It is made with an adhesive.
【０００７】この場合、前記配線情報パターンが、配線
パターンと、部品名等を示すシルク印刷パターンとから
なる、ようにするとよい。In this case, it is preferable that the wiring information pattern includes a wiring pattern and a silk print pattern indicating a part name and the like.
【０００８】また、前記導電性微粒子の粒径が０．０１
μm 〜１μmである、ようにするとよい。The conductive fine particles have a particle size of 0.01.
It is preferable that the thickness be from 1 μm to 1 μm.
【０００９】[0009]
【００１０】[0010]
【作用】以上構成に基づき、前記ユニット基板における
他側の面であって少なくとも前記端子部が形成された部
分に対応する部分のほぼ全てに前記配線情報パターンを
形成することにより、該部分の厚みを均一にし、前記端
子部と前記フレキシブル配線基板とを接続する際に加圧
ヘッドを用いて加圧する場合、その加圧力を均一なもの
とする。According to the above construction, the wiring information pattern is formed on almost the entire surface of the unit substrate corresponding to at least the portion on which the terminal portion is formed, so that the thickness of the portion is reduced. In the case where pressure is applied using a pressure head when connecting the terminal portion and the flexible wiring board, the pressing force is made uniform.
【００１１】[0011]
＜実施例１＞本発明の実施例を図に沿って説明する。図
１は、表示装置１に駆動回路２を接続した状態を示す模
式図である。表示装置１の周辺部にフィルムキャリヤ方
式による駆動用半導体チップからなる駆動回路３を搭載
したＴＡＢ２が接続されている。また、このＴＡＢ２は
プリント基板４に接続されて、駆動回路３に制御信号及
び電源を供給している。<Embodiment 1> An embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram illustrating a state in which a drive circuit 2 is connected to a display device 1. A TAB 2 mounted with a drive circuit 3 composed of a drive semiconductor chip of a film carrier type is connected to a peripheral portion of the display device 1. The TAB 2 is connected to the printed circuit board 4 and supplies a control signal and power to the drive circuit 3.
【００１２】図２は、図１におけるＡ−Ａ′部の断面図
であり、本発明では、多層のプリント基板４（内層部の
配線は省略してある）には表面部には端子５が、また裏
面部には配線パターン６及びシルク印刷パターン８が設
けられて端子５部の厚みが常に一定になる様に構成され
ている。なお、ＴＡＢ２の端子７とプリント基板４の端
子５とは半田１０を介して接続されている。この半田の
接続は、ＴＡＢ２の端子７とプリント基板４の端子５と
の一方又は両方に被着された半田を加熱ヘッドにより熱
圧着することにより行われている。FIG. 2 is a cross-sectional view taken along the line AA 'in FIG. 1. In the present invention, terminals 5 are provided on the surface of the multilayer printed circuit board 4 (the wiring of the inner layer is omitted). In addition, a wiring pattern 6 and a silk print pattern 8 are provided on the back surface so that the thickness of the terminal 5 is always constant. Note that the terminal 7 of the TAB 2 and the terminal 5 of the printed circuit board 4 are connected via solder 10. This connection of the solder is performed by thermocompression bonding of the solder applied to one or both of the terminal 7 of the TAB 2 and the terminal 5 of the printed circuit board 4 by a heating head.
【００１３】図３(a) は端子５の上視図であり、図３
(b) は端子５の位置に対応したプリント基板４の裏面の
位置に設けられた配線パターン６を示す透視図であり、
図３(c) はプリント基板４の端子５の位置に対向した裏
面の位置に設けられたシルク印刷パターン８の透視図で
ある。 ＜実施例２＞本発明の実施例２を図に沿って説明する。
なお、液晶装置の構成は実施例１と略同じなので説明を
省略し相違点のみを説明する。FIG. 3A is a top view of the terminal 5, and FIG.
(b) is a perspective view showing a wiring pattern 6 provided at a position on the back surface of the printed circuit board 4 corresponding to the position of the terminal 5,
FIG. 3C is a perspective view of the silk print pattern 8 provided on the back surface of the printed circuit board 4 opposite to the terminal 5. <Embodiment 2> Embodiment 2 of the present invention will be described with reference to the drawings.
Since the configuration of the liquid crystal device is substantially the same as that of the first embodiment, description thereof will be omitted, and only different points will be described.
【００１４】本実施例２では、図４に示すように、ＴＡ
Ｂ２の端子７とプリント基板４の端子５との接続を、絶
縁性接着剤中に導電性微粒子１４を分散した異方性導電
接着剤１３を用いて行っている。In the second embodiment, as shown in FIG.
The connection between the terminal 7 of B2 and the terminal 5 of the printed circuit board 4 is performed using an anisotropic conductive adhesive 13 in which conductive fine particles 14 are dispersed in an insulating adhesive.
【００１５】なお、導電性微粒子１４としては、粒径が
０．０１μm 〜１μm がよい。The conductive fine particles 14 preferably have a particle size of 0.01 μm to 1 μm.
【００１６】[0016]
【発明の効果】以上説明したように、本発明によれば、
前記ユニット基板における他側の面であって少なくとも
前記端子部が形成された部分に対応する部分のほぼ全て
に前記配線情報パターンを形成することにより、その部
分の厚みを均一にし、前記端子部と前記フレキシブル配
線基板とを接続する際に加圧ヘッドを用いて加圧する場
合、その加圧力を均一なものとする。その結果、接続に
半田を用いた場合はもちろん、異方性導電接着剤を用い
た場合においてもその接続を良好にできる。As described above, according to the present invention,
By forming the wiring information pattern on almost the entire surface of the unit substrate corresponding to at least the portion where the terminal portion is formed, the thickness of the portion is made uniform, and the terminal portion and When pressurizing using a pressurizing head when connecting to the flexible wiring board, the pressing force is made uniform. As a result, the connection can be made excellent not only when solder is used for connection but also when anisotropic conductive adhesive is used.
【００１７】従って、これらにより、液晶装置の信頼性
が高まった。Accordingly, the reliability of the liquid crystal device has been improved.
【図１】本発明の実施例１の説明に適用されるプリント
基板、フレキシブル配線基板及び表示装置の配置を示す
図。FIG. 1 is a diagram showing an arrangement of a printed circuit board, a flexible wiring board, and a display device applied to the description of a first embodiment of the present invention.
【図２】本発明の実施例１の説明に適用されるプリント
基板の端子部を示す断面図。FIG. 2 is a sectional view showing a terminal portion of the printed circuit board applied to the description of the first embodiment of the present invention.
【図３】本発明の実施例１の説明に適用されるプリント
基板の図で、(a) は端子部、(b) は配線パターン、(c)
はシルク印刷パターンを示す図。FIGS. 3A and 3B are diagrams of a printed circuit board applied to the description of the first embodiment of the present invention, wherein FIG. 3A is a terminal portion, FIG. 3B is a wiring pattern, and FIG.
The figure which shows a silk printing pattern.
【図４】本発明の実施例２の説明に適用される異方性導
電接着剤接続を示す図。FIG. 4 is a diagram showing an anisotropic conductive adhesive connection applied to the description of Embodiment 2 of the present invention.
【図５】従来の技術の説明に適用されるプリント基板、
フレキシブル配線基板及び表示装置の配置を示す図。FIG. 5 is a printed circuit board applied to the description of the related art;
The figure which shows arrangement | positioning of a flexible wiring board and a display apparatus.
１ 表示装置 ２ ＴＡＢ（フレキシブル配線基板） ３ 駆動回路（駆動回路ユニット） ４ プリント基板（ユニット基板） ５ 端子（端子部） ６ 配線パターン（配線情報パターン） ８ シルク印刷パターン（配線情報パターン） １３ 異方性導電接着剤 １４ 導電性微粒子 DESCRIPTION OF SYMBOLS 1 Display apparatus 2 TAB (flexible wiring board) 3 Drive circuit (drive circuit unit) 4 Printed circuit board (unit board) 5 Terminal (terminal part) 6 Wiring pattern (wiring information pattern) 8 Silk printing pattern (wiring information pattern) 13 Anisotropic conductive adhesive 14 Conductive fine particles
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) G02F 1/1345 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) G02F 1/1345
Claims (3)
ル配線基板によってユニット基板と表示装置とを接続
し、該ユニット基板から前記駆動回路ユニットを介して
前記表示装置に電源及び信号を供給することにより該表
示装置にて情報を表示する液晶装置において、 前記ユニット基板は、前記フレキシブル配線基板に対向
する一側の面に形成されて該フレキシブル配線基板に接
続される端子部と、他側の面であって少なくとも前記端
子部が形成された部分に対応する部分のほぼ全てに形成
される配線情報パターンと、を有し、かつ、 前記フレキシブル配線基板と前記端子部との接続が、絶
縁性接着剤中に導電性微粒子が分散された異方性導電接
着剤によってなされる、 ことを特徴とする液晶装置。1. A display according to claim 1, wherein the unit substrate and the display device are connected by a flexible wiring board on which a drive circuit unit is mounted, and power and signals are supplied from the unit substrate to the display device via the drive circuit unit. In a liquid crystal device that displays information in a device, the unit substrate is a terminal portion formed on one surface facing the flexible wiring substrate and connected to the flexible wiring substrate, and a surface on the other side. A wiring information pattern formed on at least substantially all of the portion corresponding to the portion where the terminal portion is formed, and wherein the connection between the flexible wiring board and the terminal portion is performed in an insulating adhesive. A liquid crystal device characterized by being made by an anisotropic conductive adhesive in which conductive fine particles are dispersed.
と、部品名等を示すシルク印刷パターンとからなる、 ことを特徴とする請求項１に記載の液晶装置。2. The liquid crystal device according to claim 1, wherein the wiring information pattern includes a wiring pattern and a silk print pattern indicating a part name or the like.
〜１μmである、 ことを特徴とする請求項１又は２に記載の液晶装置。3. The conductive fine particles have a particle size of 0.01 μm.
The liquid crystal device according to claim 1, wherein the liquid crystal device has a thickness of 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4359312A JP3026896B2 (en) | 1992-12-26 | 1992-12-26 | Liquid crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4359312A JP3026896B2 (en) | 1992-12-26 | 1992-12-26 | Liquid crystal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06202133A JPH06202133A (en) | 1994-07-22 |
| JP3026896B2 true JP3026896B2 (en) | 2000-03-27 |
Family
ID=18463860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4359312A Expired - Fee Related JP3026896B2 (en) | 1992-12-26 | 1992-12-26 | Liquid crystal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3026896B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4485708B2 (en) * | 2001-05-21 | 2010-06-23 | シャープ株式会社 | Peripheral circuit board for liquid crystal display device and liquid crystal display device including the same |
| JP3914732B2 (en) * | 2001-10-02 | 2007-05-16 | 鹿児島日本電気株式会社 | Circuit board connection structure, liquid crystal display device having the connection structure, and method of mounting liquid crystal display device |
-
1992
- 1992-12-26 JP JP4359312A patent/JP3026896B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06202133A (en) | 1994-07-22 |
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