CN111007685A

CN111007685A - Liquid crystal display panel and side bonding method thereof

Info

Publication number: CN111007685A
Application number: CN201911196620.6A
Authority: CN
Inventors: 尹炳坤
Original assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-04-14

Abstract

The application discloses a liquid crystal display panel and a side bonding method thereof. The side bonding method comprises the following steps: providing a liquid crystal display panel which completes the box forming process; providing a substrate base layer and forming conductive terminals on the substrate base layer; connecting bonding terminals of the driving circuit chip with the conductive terminals in a one-to-one correspondence manner; adhering the substrate base layer to the side surface of the liquid crystal display panel, wherein the bonding terminals on the side surface of the liquid crystal display panel correspond to the conductive terminals one to one; and correspondingly welding the bonding terminals on the side surface of the liquid crystal display panel and the conductive terminals one to one. Therefore, the method and the device can be beneficial to reducing the process difficulty of forming the bonding terminal and the bonding driving circuit chip on the side face of the liquid crystal display panel and improving the product yield.

Description

Liquid crystal display panel and side bonding method thereof

Technical Field

The present disclosure relates to the field of electronic devices and display screens, and more particularly, to a liquid crystal display panel and a method for bonding a side surface thereof.

Background

With the development of Display technology, flat panel Display devices such as Liquid Crystal Displays (LCDs) have advantages of high image quality, power saving, and wide application range, and thus are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, and become the mainstream of Display devices.

Most of the existing liquid crystal displays in the market are Backlight liquid crystal displays (lcds), which include a liquid crystal display panel and a Backlight module (Backlight module). The Liquid Crystal display panel generally includes a Color Filter (CF) Substrate, a Thin Film Transistor Array (TFT Array Substrate), and a Liquid Crystal Layer (Liquid Crystal Layer) disposed between the two substrates, and the Liquid Crystal display panel operates by applying a driving voltage to the two substrates and controlling an orientation of Liquid Crystal molecules in the Liquid Crystal Layer by an electric field generated between the two substrates, so as to refract light of the backlight module to generate a picture.

Currently, one development direction of the lcd panel is high screen occupation ratio, which undoubtedly requires the frame of the lcd panel to be smaller, and narrow frame (Bezel less) technology is generally adopted for this purpose. The mainstream of realizing the narrow frame is a side bonding technology, and specifically, an Integrated Circuit (IC) Chip or a Chip On Film (COF) is bonded to the side of the liquid crystal display panel, so as to reduce the area of the non-display region. However, since the area of the side surface of the liquid crystal display panel is small, the process difficulty of forming a bonding Pad (bonding Pad) on the side surface of the liquid crystal display panel and bonding an IC chip or COF is high, which affects the yield of products.

Disclosure of Invention

In view of this, the present disclosure provides a liquid crystal display panel and a side bonding method thereof, so as to solve the problems of the prior art that the process difficulty of forming a bonding terminal and bonding a driving circuit chip on a side of the liquid crystal display panel is high and the product yield is low.

The application provides a side bonding method of a liquid crystal display panel, which comprises the following steps:

providing a liquid crystal display panel which completes the box forming process;

providing a substrate base layer and forming conductive terminals on the substrate base layer;

connecting bonding terminals of the driving circuit chip with the conductive terminals in a one-to-one correspondence manner;

adhering the substrate base layer to the side surface of the liquid crystal display panel, wherein the bonding terminals on the side surface of the liquid crystal display panel correspond to the conductive terminals one to one;

and correspondingly welding the bonding terminals on the side surface of the liquid crystal display panel with the conductive terminals one to one.

Optionally, the step of forming a conductive terminal on the substrate base layer includes:

forming a conductive layer and a photoresist layer covering the conductive layer on the substrate base layer;

exposing the photoresist layer by using a photomask to obtain a photoresist layer with a preset pattern, wherein the photoresist layer with the preset pattern exposes the part to be etched of the conductive layer;

etching to remove the part of the conducting layer which is not covered by the photoresist layer with the preset pattern;

and removing the photoresist layer with the preset pattern to obtain the conductive terminal.

Optionally, before forming the conductive terminal on the substrate base layer, the method comprises:

setting a bonding mark on the substrate base layer for identifying a bonding area;

forming a conductive layer and a photoresist layer covering the conductive layer on the substrate base layer, including:

and forming a conductive layer and a light resistance layer covering the conductive layer in the bonding area of the substrate base layer.

Optionally, the step of connecting the bonding terminals of the driving circuit chip to the conductive terminals in a one-to-one correspondence includes:

coating conductive adhesive between the driving circuit chip and the substrate base layer, wherein the conductive adhesive comprises a gel main body and conductive particles distributed in the gel main body;

and pressing and curing the gel body, so that the conductive particles provide an electric conduction path between the aligned bonding terminals of the driving circuit chip and the conductive terminals.

Optionally, while performing the step of pressing and curing the gel body, the method comprises:

applying an electric field such that the conductive particles in the gel body are disposed only between the aligned bonding terminals of the driving circuit chip and the conductive terminals.

Optionally, the providing a substrate base layer comprises: the substrate base layer is prepared from a transparent material.

Optionally, the main material of the substrate base layer is polyimide.

The application provides a pair of liquid crystal display panel, including drive circuit chip and the various membrane base plate and the array substrate that relative interval set up, liquid crystal display panel still includes the substrate basic unit, the substrate basic unit paste in array substrate's side, be provided with conductive terminal in the substrate basic unit, drive circuit chip's nation decides the terminal with conductive terminal one-to-one is connected, conductive terminal with the nation decides the terminal one-to-one welding of array substrate side.

Optionally, the substrate base layer is a transparent base layer.

Optionally, the main material of the substrate base layer is polyimide.

According to the liquid crystal display panel and the side bonding method thereof, the conductive terminals are manufactured on the substrate base layer, the bonding of the driving circuit chip is completed, and then the conductive terminals on the substrate base layer and the bonding terminals on the side surface of the liquid crystal display panel are bonded in a pasting and welding mode, so that on one hand, the driving circuit chip is led out to the side surface of the liquid crystal display panel and is bonded, and the side bonding technology is adopted, so that the narrow frame design requirement can be met; on the other hand, the preparation of the conductive terminals and the bonding of the driving circuit chip are completed on the planar substrate base layer, the side bonding is substantially converted into the planar bonding and the side pasting, and the process difficulty of the two operations of the planar bonding and the side pasting is low, so that the process difficulty of forming the bonding terminals and bonding the driving circuit chip on the side surface of the liquid crystal display panel can be reduced, and the product yield can be improved; in addition, the conductive terminals can be simultaneously prepared on the substrate base layer in a large quantity, and the manufacturing efficiency can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a flowchart illustrating a method for side bonding a liquid crystal display panel according to an embodiment of the present application;

FIG. 2 is a schematic cross-sectional view illustrating a structure of a liquid crystal display panel according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a structure of the substrate base layer with conductive terminals bonded to a driving circuit chip according to an embodiment of the present application;

FIG. 4 is a schematic view of a manufacturing scenario of a conductive terminal according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a bonding driving circuit chip of the liquid crystal display panel shown in fig. 2.

Detailed Description

The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. The following embodiments and their technical features may be combined with each other without conflict.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present application. In addition, structural elements having the same or similar characteristics may be identified by the same or different reference numerals. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, the word "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the invention. In the following description, various details are set forth for the purpose of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes are not shown in detail to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

The conventional side bonding technology is that conductive terminals are directly prepared on the side face of a liquid crystal display panel, and bonding terminals of a driving circuit chip are correspondingly connected with the conductive terminals one to one on the side face of the liquid crystal display panel. To solve this problem, the present application provides a side bonding method of a liquid crystal display panel according to an embodiment. Referring to fig. 1 to 5, the method for bonding the side of the liquid crystal display panel includes:

s11: a liquid crystal display panel is provided in which a cell forming process is completed.

Referring to fig. 2, the liquid crystal display panel 20 includes an array substrate 21 and a color filter substrate 22 which are oppositely disposed at an interval, and liquid crystal molecules (not shown) sandwiched between the array substrate 21 and the color filter substrate 22, wherein a sealant 23 is coated between the array substrate 21 and the color filter substrate 22, and the liquid crystal molecules are stacked to form a liquid crystal cell, and the liquid crystal molecules are located in the liquid crystal cell.

The method for manufacturing the liquid crystal display panel 20 includes: forming each layer of structural members, such as a Thin Film Transistor (TFT), a Passivation (PV) layer, a pixel electrode, and the like, on the lower substrate by using processes such as Film formation, exposure, development, etching, and the like, thereby completing the fabrication of the array substrate 21; performing processes such as coating, exposure, development, curing and the like on the upper substrate to form various structural members, such as color groups, black matrixes and the like, and thus completing the manufacture of the color film substrate 22; and completing a cell (cell) manufacturing process through processes of alignment, frame glue coating, One Drop Filling (ODF), cutting, polarizer attaching and the like.

It should be understood that the present application is not limited to the specific structure and type of the lcd panel 20, and that the structure and manufacturing method of a specific type can refer to the prior art and will not be described herein.

The liquid crystal display panel 20 after the box forming process has a plurality of bonding terminals 211 disposed on a side surface thereof, and the bonding terminals 211 are exposed from the sealant 23 for electrically connecting to the driving circuit chip. The exposed ends of the bonding terminals 211 may be cut and ground, for example, the ends may be aligned with the side of the array substrate 21.

S12: a substrate base layer is provided and conductive terminals are formed on the substrate base layer.

Referring to fig. 3, the substrate base layer 30 may be a film made of a polymer material, which may be referred to as a polymer film 30, such as a film made of a material such as poly-p-phenylene terephthalate (PET), Cyclic Olefin Polymer (COP), or Polyimide (PI).

In order to facilitate the alignment of the conductive terminals 311 with the bonding terminals 211 on the side surface 20 of the lcd panel and the adhesion of the substrate 30 in the subsequent steps, the substrate 30 may be made of a transparent and flexible material.

The conductive terminals 311 can be formed on the substrate base layer 30 by film forming, exposing, developing and etching processes in the embodiment of the present application. As shown in fig. 4, specifically:

first, a conductive layer 31 and a photoresist layer 32 covering the conductive layer 31 are formed on a substrate base layer 30. The material of the conductive layer 31 may be the same as the material of the bonding terminal 211 on the side of the liquid crystal display panel 20, and a material having better conductivity and corrosion resistance may be used, such as a metal material, including but not limited to molybdenum, nickel, palladium, cobalt, tungsten, rhodium, titanium, chromium, gold, silver, platinum, etc. Of course, in order to further improve the conductivity, the conductive layer 31 may adopt a multilayer metal stacked structure, such as a three-layer metal structure of molybdenum, aluminum, and molybdenum, or a three-layer metal structure of nickel, copper, and nickel, or a three-layer metal structure of molybdenum, copper, and molybdenum, or a three-layer metal structure of nickel, aluminum, and nickel. By providing the three-layered metal conductive structure, not only the conductivity of the conductive layer 31 and the conductive terminal 311 formed by the conductive layer can be improved, but also the corrosion resistance can be improved.

Then, the photoresist layer 32 is exposed by using a mask 40 to obtain a photoresist layer 321 with a predetermined pattern, wherein the photoresist layer 321 with the predetermined pattern exposes a portion to be etched of the conductive layer 31. Specifically, the mask 40 has a light-transmitting region 41, during the exposure process, the mask 40 is disposed above the photoresist layer 32, the pattern of the light-transmitting region 41 is consistent with the pattern of the conductive terminal 311 to be finally formed, light passes through the light-transmitting region 41 and irradiates the photoresist layer 32 for exposure, the exposed portion of the photoresist layer 32 is removed by the developing solution, and the unexposed portion of the photoresist layer 32 cannot be removed by the developing solution and is finally retained, so that, in a state of overlooking the substrate base layer 30, the photoresist layer 32 is converted into a photoresist layer 321 having a predetermined pattern, wherein the portion of the photoresist layer 32 removed by the developing solution exposes the portion to be etched of the conductive layer 31.

Then, the portion of the conductive layer 31 that is not covered by the photoresist layer 321 with the predetermined pattern is removed by etching. In this embodiment, a dry etching process or a wet etching process may be used to remove the portion of the conductive layer 31 that is not covered by the photoresist layer 321. In terms of the wet etching process, the portion of the conductive layer 31 covered by the photoresist layer 321 is fully contacted with the etching solution and is completely removed by dissolution reaction, while the portion uncovered by the photoresist layer 321 is not contacted with the etching solution and is finally retained, and finally, the conductive layer 31 is etched and converted into the conductive terminal 311.

Finally, ashing is performed to remove the photoresist layer 321, so as to obtain the conductive terminal 311.

As shown in fig. 3 and fig. 4, in an embodiment, before forming the conductive layer 31 and the photoresist layer 32 on the substrate 30, a bonding mark 33, such as a cross, may be disposed on the substrate 30 to identify a bonding area, and the bonding area may be completely overlapped with the bonding area on the side of the liquid crystal display panel 20, so that the subsequent operations of forming the conductive terminal 311 may be performed in the bonding area identified by the bonding mark 33, such as forming the conductive layer 31 and the photoresist layer 32 covering the conductive layer 31 in the bonding area of the substrate 30.

S13: and connecting the bonding terminals of the driving circuit chip with the conductive terminals in a one-to-one correspondence manner.

Referring to fig. 5, the driving circuit chip 50 may be an IC chip or a COF chip.

An embodiment of the present application may use a conductive adhesive to bond the driving circuit chip 50. Specifically, a Conductive adhesive, such as an ACF (Anisotropic Conductive Film), is coated between the driving circuit chip 50 and the substrate base layer 30, where the Conductive adhesive includes a gel body and Conductive particles distributed in the gel body, and bonding terminals of the driving circuit chip 50 and the Conductive terminals 311 on the substrate base layer 30 are aligned one by one, and then the driving circuit chip 50 and the substrate base layer 30 are pressed together, and the gel body flows to enable the Conductive particles originally between the two terminals to be squeezed between the two aligned terminals, and when the gel body returns to normal temperature, the gel body returns to a solid state, the positions of the Conductive particles do not change, and the Conductive particles provide an electrical conduction path between the bonding terminals of the aligned driving circuit chip 50 and the Conductive terminals 311.

While the gel body is pressed and cured, an electric field may be applied to make the conductive particles in the gel body only disposed between the bonding terminal of the driving circuit chip 50 and the conductive terminal 311 aligned with each other, that is, there is only conductive particles between each corresponding conductive terminal 311 and the bonding terminal of the driving circuit chip 50, so as to avoid that no conductive particles exist between any two adjacent terminals (including the adjacent bonding terminal and the conductive terminal 311, the adjacent bonding terminal, and the adjacent conductive terminal 311), thereby avoiding a short circuit caused by electrical connection between any two other adjacent terminals while achieving electrical connection between the bonding terminal of the driving circuit chip 50 and the conductive terminal 311 aligned with each other.

S14: and adhering the substrate base layer to the side surface of the liquid crystal display panel, wherein the bonding terminals on the side surface of the liquid crystal display panel correspond to the conductive terminals one to one.

As shown in fig. 5, the substrate base layer 30 can be adhered to the side of the array substrate 21 by a non-conductive adhesive, and after the adhesion, the conductive terminals 311 on the substrate base layer 30 are aligned with the bonding terminals 211 on the side of the liquid crystal display panel 20.

S15: and correspondingly welding the bonding terminals on the side surface of the liquid crystal display panel and the conductive terminals one to one.

In the embodiment of the present application, the bonding terminals 211 on the side surface of the liquid crystal display panel 20 and the conductive terminals 311 on the substrate base layer 30 may be welded in a one-to-one correspondence manner through a laser welding process, so that the driving circuit chip 50 and the side surface of the liquid crystal display panel 20 are bonded.

Based on the manufacturing method, in the embodiment of the application, the conductive terminal 311 is manufactured on the substrate base layer 30, the bonding of the driving circuit chip 50 is completed, and then the conductive terminal 311 on the substrate base layer 30 is bonded with the bonding terminal 211 on the side surface of the liquid crystal display panel 20 in a sticking and welding manner, so that on one hand, the driving circuit chip 50 is led out to the side surface of the liquid crystal display panel 20 and is bonded, and the side surface binding technology is adopted, so that the narrow frame design requirement can be met; on the other hand, the conductive terminals 311 are fabricated on the planar substrate base 30, and the driving circuit chip 50 is used for terminal bonding on the planar substrate base 30, so that the side bonding is substantially changed into plane bonding and side bonding, and the process difficulty of the two operations of plane bonding and side bonding is low, thereby being beneficial to reducing the process difficulty of forming bonding terminals and bonding the driving circuit chip on the side surface of the liquid crystal display panel 20 and improving the product yield.

On the basis, in the embodiment of the present application, a large number of conductive terminals 311 can be simultaneously prepared on the same substrate base layer 30, and then the side binding with various liquid crystal display panels 20 of the same type or different types can be realized by cutting, so that the manufacturing efficiency can be improved.

The present application further provides a liquid crystal display panel of an embodiment, including a driving circuit chip, a substrate base layer, a color film substrate and an array substrate that are arranged at an interval, and a liquid crystal layer that is arranged between the color film substrate and the array substrate. Wherein, the substrate base layer is pasted in array substrate's side, be provided with conductive terminal on the substrate base layer, drive circuit chip's bonding terminal is connected with conductive terminal one-to-one to conductive terminal and the bonding terminal one-to-one welding of array substrate side, that is to say, realize the corresponding electric connection between drive circuit chip's bonding terminal and the bonding terminal of array substrate side through conductive terminal. The structure and the manufacturing method of the liquid crystal display panel can refer to the description of the foregoing embodiments, for example, the substrate base layer may be a transparent base layer, and the main material of the substrate base layer may be polyimide, so that the liquid crystal display panel has the same beneficial effects as described above, and details are not repeated here.

Although the application has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art based upon a reading and understanding of this specification and the annexed drawings. This application is intended to embrace all such modifications and variations and is limited only by the scope of the appended claims. In particular regard to the various functions performed by the above described components, the terms used to describe such components are intended to correspond, unless otherwise indicated, to any component which performs the specified function of the described component (e.g., that is functionally equivalent), even though not structurally equivalent to the disclosed structure which performs the function in the herein illustrated exemplary implementations of the specification.

That is, the above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all equivalent structures or equivalent flow transformations made by using the contents of the specification and the drawings, such as mutual combination of technical features between various embodiments, or direct or indirect application to other related technical fields, are included in the scope of the present application.

In addition, while a particular feature of the specification may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for a given or particular application.

Claims

1. A side bonding method of a liquid crystal display panel is characterized by comprising the following steps:

2. A method for bonding side surfaces of a liquid crystal display panel according to claim 1, wherein said step of forming conductive terminals on said substrate base layer comprises:

3. A method for side bonding a liquid crystal display panel according to claim 2, wherein before forming conductive terminals on the substrate base layer, the method comprises:

4. The method for bonding the side of the liquid crystal display panel according to claim 1, wherein the step of connecting the bonding terminals of the driving circuit chip to the conductive terminals in a one-to-one correspondence includes:

5. The method of claim 4, wherein the pressing and curing the gel body are performed while the method comprises:

6. The method of claim 1, wherein said providing a substrate base layer comprises: and preparing the substrate base layer by adopting a transparent material.

7. A side bonding method of LCD panel according to claim 6, characterized in that the main material of the substrate base layer is polyimide.

8. The utility model provides a liquid crystal display panel, includes drive circuit chip and various membrane base plate and the array substrate that relative interval set up, a serial communication port, liquid crystal display panel still includes the substrate basic unit, the substrate basic unit paste in array substrate's side, be provided with conductive terminal on the substrate basic unit, drive circuit chip's nation decides the terminal with conductive terminal one-to-one is connected, conductive terminal with the nation decides the terminal one-to-one welding of array substrate side.

9. The liquid crystal display panel according to claim 8, wherein the substrate base layer is a transparent base layer.

10. The liquid crystal display panel according to claim 9, wherein a main material of the substrate base layer is polyimide.