CN113589893A - Chip on film and display device - Google Patents

Chip on film and display device Download PDF

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Publication number
CN113589893A
CN113589893A CN202110856993.2A CN202110856993A CN113589893A CN 113589893 A CN113589893 A CN 113589893A CN 202110856993 A CN202110856993 A CN 202110856993A CN 113589893 A CN113589893 A CN 113589893A
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CN
China
Prior art keywords
chip
substrate
film
terminals
binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110856993.2A
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Chinese (zh)
Inventor
李文芳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
TCL Huaxing Photoelectric Technology Co Ltd
Original Assignee
TCL Huaxing Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL Huaxing Photoelectric Technology Co Ltd filed Critical TCL Huaxing Photoelectric Technology Co Ltd
Priority to CN202110856993.2A priority Critical patent/CN113589893A/en
Publication of CN113589893A publication Critical patent/CN113589893A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1601Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays

Abstract

The application provides a chip on film and display device, includes: a first substrate; a first chip provided on the first substrate; the second substrate is arranged on one surface, close to the first chip, of the first substrate; and the second chip is arranged on the second substrate, and the orthographic projection of the first chip on the first substrate and the orthographic projection of the second chip on the first substrate are arranged at intervals. The utility model provides a through set up first chip on first substrate, set up the second chip on the second substrate, and first substrate and the setting of second substrate stromatolite, so that the orthographic projection of first chip on first substrate with the second chip is in orthographic projection interval on the first substrate sets up, thereby realizes setting up a plurality of chips in same cover brilliant film, thereby improves cover brilliant film's space utilization, thereby can improve the driving force of whole chip under the prerequisite that does not reduce the interval between the brilliant film of covering a brilliant, and then be favorable to improving the resolution ratio of display.

Description

Chip on film and display device
Technical Field
The present application relates to the field of display device technologies, and in particular, to a chip on film and a display device.
Background
At present, due to the increasingly high requirements of the market On the refresh rate and resolution of the display, more and more source driver chips are required to be used, resulting in more and more Chip On Film (COF) numbers for carrying the source driver chips.
However, because only one driving chip is carried on one flip chip, and the size of the display is limited, such as an 8K resolution 120HZ display, if the number of flip chips is to be increased, the width of the corresponding flip chip becomes smaller when the distance between the flip chips is constant, but the charging is insufficient when the width of the flip chip is small, and if the distance between the flip chips is shortened to achieve the use of more driving chips, the distance between the flip chips also becomes a large limitation, so that the space utilization rate of the flip chip is not high at present, which causes great difficulty in increasing the resolution of the display.
Disclosure of Invention
The application provides a chip on film and a display device, which are used for solving the problem of low space utilization rate of the chip on film.
In one aspect, the present application provides a chip on film, including:
a first substrate;
a first chip provided on the first substrate;
the second substrate is arranged on one surface, close to the first chip, of the first substrate;
and the second chip is arranged on the second substrate, and the orthographic projection of the first chip on the first substrate and the orthographic projection of the second chip on the first substrate are arranged at intervals.
In a possible implementation manner of the present application, the first chip and the second chip are disposed along a first direction or a second direction in a staggered manner, and the first direction and the second direction intersect each other.
In one possible implementation manner of the present application, the chip on film further includes:
the plurality of first binding terminals are arranged on the first substrate, two adjacent first binding terminals are arranged at intervals, and the first binding terminals are connected with the first chip;
and the plurality of second binding terminals are arranged on the second substrate, two adjacent second binding terminals are arranged at intervals, and the first binding terminals are connected with the first chip.
In one possible implementation manner of the present application, the chip on film further includes:
the plurality of first wires are arranged on the first substrate, one end of each first wire is connected with one first binding terminal, and the other end of each first wire is connected with the first chip;
and the second wires are arranged on the second substrate, one end of each second wire is connected with one second binding terminal, and the other end of each second wire is connected with the second chip.
In a possible implementation manner of the present application, each of the first binding terminals is provided with a via hole, the via hole is formed by the first binding terminal penetrating through the second substrate, and the first routing line is exposed at the via hole.
In a possible implementation manner of the present application, two adjacent first binding terminals are arranged at intervals along the first direction, and two adjacent second binding terminals are arranged at intervals along the first direction.
In a possible implementation manner of the present application, an orthogonal projection of each first binding terminal on the first substrate and an orthogonal projection of each first binding terminal on the first substrate at least partially overlap, and one first binding terminal is disposed between two adjacent second binding terminals.
In one possible implementation of the present application, the first substrate and the second substrate have a width in the range of 7-12 mm.
In a possible implementation manner of the present application, the first binding terminal and the second binding terminal are both made of copper, and the first binding terminal is covered with an insulating layer.
In another aspect, the present application further provides a display device including the above chip on film.
The application provides a chip on film and display device, through set up first chip on first substrate, set up the second chip on the second substrate, and first substrate and second substrate stromatolite set up, so that the orthographic projection of first chip on first substrate with the second chip is in orthographic projection interval on the first substrate sets up to realize setting up a plurality of chips in same chip on film, thereby improve the space utilization of chip on film, thereby can be under the prerequisite that does not reduce the interval between the chip on film, under the prerequisite that does not compress the distance between the adjacent chip on film, realize the increase of chip on film quantity promptly, with this drive capability that improves whole chip, and then be favorable to improving the resolution ratio of display.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a chip on film according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a chip on film according to another embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of a flip chip film according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1-3, an embodiment of the present invention provides a chip on film, which includes a first substrate 10, a first chip 20, a second substrate 30 and a second chip 40.
A first chip 20 is disposed on the first substrate 10; the second substrate 30 is disposed on a side of the first substrate 10 close to the first chip 20.
The second chip 40 is disposed on the second substrate 30, and an orthographic projection of the first chip 20 on the first substrate 10 and an orthographic projection of the second chip 40 on the first substrate 10 are spaced apart.
It can be understood that at least two chips in the embodiment of the present application may be provided, for example, the number of the chips may also be three, four, and the like, that is, correspondingly, a third chip may be correspondingly provided by providing a third substrate on the second substrate 30, and details are not described herein again.
The embodiment of the application provides a chip on film, by arranging a first chip 20 on a first substrate 10, a second chip 40 is arranged on a second substrate 30, and the first substrate 10 and the second substrate 30 are stacked, so that the orthographic projection of the first chip 20 on the first substrate 10 and the orthographic projection of the second chip 40 on the first substrate 10 are arranged at intervals, thereby realizing the arrangement of a plurality of chips in the same chip on film, improving the space utilization rate of the chip on film, and realizing the increase of the number of the chip on films on the premise of not reducing the distance between the adjacent chip on films, namely, not compressing the distance between the adjacent chip on films, thereby improving the driving capability of the whole chip, and further being beneficial to improving the resolution of a display.
In some embodiments, the first chip 20 and the second chip 40 are disposed along the first direction X or the second direction Y in a staggered manner, wherein when the first chip 20 and the second chip 40 are disposed in a staggered manner, the first chip 20 and the second chip 40 may be partially overlapped and may be completely spaced. Wherein the first direction X and the second direction Y intersect. In this embodiment, taking the flip chip as a rectangular structure as an example for explanation, the first direction X and the second direction Y are perpendicular to each other, specifically, the first direction X is a length direction of the flip chip, and the second direction Y is a width direction of the flip chip, specifically, as shown in fig. 1, the first chip 20 and the second chip 40 may be disposed in parallel, that is, disposed at intervals in the second direction Y of the first substrate 10, and by disposing the first chip 20 and the second chip 40 in parallel, the arrangement of a plurality of chips on the flip chip may be realized without increasing the first substrate 10 or the second substrate 30, so that the arrangement of a greater number of chips may be realized by disposing a greater number of flip chips, which is more beneficial to improving the resolution of the display.
Of course, as shown in fig. 2, the first chip 20 and the second chip 40 may be laterally spaced along the length of the first substrate 10, and in addition, the first chip 20 and the second chip 40 may also be disposed in a staggered manner, for example, spaced in both the first direction X and the second direction Y of the first substrate 10, which is not limited herein.
In some embodiments, the chip on film further includes a plurality of first bonding terminals 50 and a plurality of second bonding terminals 60. A plurality of first bonding terminals 50 are disposed on the first substrate 10, and a space is disposed between two adjacent first bonding terminals 50, and the first bonding terminals 50 are connected to the first chip 20. A plurality of second bonding terminals 60 are disposed on the second substrate 30, and two adjacent second bonding terminals 60 are spaced apart from each other, and the first bonding terminal 50 is connected to the first chip 20. The bonding connection between the display panel and the chip in the chip on film can be realized by the arrangement of the first bonding terminal 50 and the second bonding terminal 60.
In some embodiments, two adjacent first binding terminals 50 are spaced apart along the first direction X, two adjacent second binding terminals 60 are spaced apart along the first direction X, and the first binding terminals 50 and the second binding terminals 60 are offset along the second direction Y, so that the layout of the binding terminals is more reasonable.
In some embodiments, an orthogonal projection of each of the first binding terminals 50 on the first substrate 10 and an orthogonal projection of each of the first binding terminals 50 on the first substrate 10 at least partially overlap, and one of the first binding terminals 50 is disposed between two adjacent second binding terminals 60, thereby facilitating to save layout space of the first substrate 10 and the second substrate 30.
In some embodiments, the chip on film further includes a plurality of first traces 70 and a plurality of second traces 80.
A plurality of first traces 70 are disposed on the first substrate 10, one end of each of the first traces 70 is connected to one of the first bonding terminals 50, and the other end is connected to the first chip 20. The plurality of second wires 80 are disposed on the second substrate 30, one end of each of the second wires 80 is connected to one of the second bonding terminals 60, and the other end is connected to the second chip 40, so that the first chip 20 and the second chip 40 can be realized by disposing the first wire 70 and the second wire 80.
In some embodiments, each of the first binding terminals 50 is provided with a via 51, the via 51 is penetrated through the second substrate 30 by the first binding terminal 50, and the first trace 70 is exposed at the via 51. Since the first chip 20 and the first trace 70 are disposed on the first substrate 10, and the second substrate 30 covers the first trace 70, the first trace 70 is exposed in the via 51 by disposing the via 51 penetrating through the first substrate 10 and the first binding terminal 50, so that the first trace 70 can be connected to an external device (for example, a display panel) through the via 51, and the function of the first chip 20 is realized.
In some embodiments, the width of the first substrate 10 and the second substrate 30 ranges from 7-12 mm. Illustratively, the width of the first substrate 10 and the second substrate 30 may be 8mm, 10mm, or 12 mm. Since at least two chips can be disposed on one chip on film in the embodiment of the present application, the widths of the first substrate 10 and the second substrate 30 may be the same or different, and the final width of the chip on film is determined by the substrate with the large width, which is not limited herein. When the width of the first substrate 10 or the second substrate 30 is larger, the flip-chip mounting is easier, for example, the machine can grab the flip-chip more easily, which is beneficial to improving the yield of the final product, but if the width of the flip-chip is too large, the utilization space of the substrate of the flip-chip is wasted; when the width of the first substrate 10 or the second substrate 30 is smaller, the number of the flip-chip films may be set more when the length of the external device (for example, the display panel) is fixed, so as to facilitate setting more chips, thereby improving the resolution of the display.
In some embodiments, the first binding terminal 50 and the second binding terminal 60 are both made of copper, and particularly, the first binding terminal 50 and the second binding terminal 60 are both made of copper foil. As shown in fig. 3, the first binding terminal 50 is covered with an insulating layer 90, and the insulating layer 90 is an organic insulating layer 90, so that the first trace 70 can be protected and can be prevented from being electrically connected and shorted with the second trace 80 through the via hole 51.
In order to better implement the chip on film of the present application, please refer to fig. 4, an embodiment of the present application further provides a display device including the chip on film 100. Specifically, the display includes: display panel 200, cover brilliant film 100 and circuit board 300, the circuit board set up in display panel's one side, cover brilliant film 100 connect in display panel 200 with between the circuit board 300, cover brilliant film 100's quantity is a plurality of, adjacent two the interval sets up between the cover brilliant film, wherein, circuit board 300 includes photoelectricity board (Xbaard) 310 and control panel (Controlboard)320, photoelectricity board with connect through flexible printed circuit board (FPC)400 between the control panel. Specifically, one end of the flip chip is connected to the display panel 200, and the other end is connected to the optoelectronic board 310.
The display device is provided with the flip chip film. Therefore, all the same advantages are achieved, and the detailed description of the application is omitted. The embodiment of the application is not specifically limited to the application of the display device, and the display device can be any product or part with a display function, such as a television, a notebook computer, a tablet computer, wearable display equipment (such as an intelligent bracelet, an intelligent watch and the like), a mobile phone, virtual reality equipment, augmented reality equipment, vehicle-mounted display, an advertising lamp box and the like.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In a specific implementation, each unit or structure may be implemented as an independent entity, or may be combined arbitrarily to be implemented as one or several entities, and the specific implementation of each unit or structure may refer to the foregoing method embodiment, which is not described herein again.
The foregoing detailed description is directed to a chip on film and a display device provided in the embodiments of the present application, and specific examples are applied in the detailed description to explain the principles and embodiments of the present application, and the description of the foregoing embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims (10)

1. A chip on film, comprising:
a first substrate;
a first chip provided on the first substrate;
the second substrate is arranged on one surface, close to the first chip, of the first substrate;
and the second chip is arranged on the second substrate, and the orthographic projection of the first chip on the first substrate and the orthographic projection of the second chip on the first substrate are arranged at intervals.
2. The chip on film of claim 1, wherein the first chip and the second chip are disposed along a first direction or a second direction, and the first direction and the second direction are crossed.
3. The chip on film of claim 1, further comprising:
the plurality of first binding terminals are arranged on the first substrate, two adjacent first binding terminals are arranged at intervals, and the first binding terminals are connected with the first chip;
and the plurality of second binding terminals are arranged on the second substrate, two adjacent second binding terminals are arranged at intervals, and the second binding terminals are connected with the second chip.
4. The chip on film of claim 3, further comprising:
the plurality of first wires are arranged on the first substrate, one end of each first wire is connected with one first binding terminal, and the other end of each first wire is connected with the first chip;
and the second wires are arranged on the second substrate, one end of each second wire is connected with one second binding terminal, and the other end of each second wire is connected with the second chip.
5. The chip on film of claim 4, wherein each of the first bonding terminals has a via hole formed thereon, the via hole is formed through the second substrate by the first bonding terminal, and the first trace is exposed through the via hole.
6. The chip on film of claim 3, wherein two adjacent first bonding terminals are spaced apart along the first direction, and two adjacent second bonding terminals are spaced apart along the first direction.
7. The chip on film according to claim 6, wherein an orthogonal projection of each of the first bonding terminals on the first substrate and an orthogonal projection of each of the first bonding terminals on the first substrate at least partially overlap, and one of the first bonding terminals is disposed between two adjacent second bonding terminals.
8. The chip on film of claim 3, wherein the first bonding terminal and the second bonding terminal are made of copper, and the first bonding terminal is covered with an insulating layer.
9. The chip on film of any one of claims 1-8, wherein the first and second substrates have a width in the range of 7-12 mm.
10. A display device comprising the flip-chip film according to any one of claims 1 to 9.
CN202110856993.2A 2021-07-28 2021-07-28 Chip on film and display device Pending CN113589893A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110856993.2A CN113589893A (en) 2021-07-28 2021-07-28 Chip on film and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110856993.2A CN113589893A (en) 2021-07-28 2021-07-28 Chip on film and display device

Publications (1)

Publication Number Publication Date
CN113589893A true CN113589893A (en) 2021-11-02

Family

ID=78251336

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110856993.2A Pending CN113589893A (en) 2021-07-28 2021-07-28 Chip on film and display device

Country Status (1)

Country Link
CN (1) CN113589893A (en)

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