CN217740805U - Flexible circuit board connecting structure and electronic equipment - Google Patents
Flexible circuit board connecting structure and electronic equipment Download PDFInfo
- Publication number
- CN217740805U CN217740805U CN202220202001.4U CN202220202001U CN217740805U CN 217740805 U CN217740805 U CN 217740805U CN 202220202001 U CN202220202001 U CN 202220202001U CN 217740805 U CN217740805 U CN 217740805U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- connection structure
- bonding pad
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model relates to a flexible circuit board connection structure and electronic equipment, include: the display module comprises a first flexible circuit board, a second flexible circuit board and a display module, wherein the first flexible circuit board is provided with a first bonding pad; a backlight assembly including a second flexible circuit board having a second pad; and a conductive adhesive film is arranged between the first bonding pad and the second bonding pad and used for realizing the electric connection of the first flexible circuit board and the second flexible circuit board. The utility model discloses a method that ACF is connected to FPC and module FPC in a poor light together can save to occupy main FPC components and parts area greatly to attached more components and parts alleviate the corresponding empty design degree of difficulty of keeping away of mobile phone motherboard simultaneously.
Description
Technical Field
The utility model relates to an electronic product field especially relates to a flexible circuit connection structure and electronic equipment.
Background
At present, a display screen of a mobile phone is generally connected with a backlight FPC and a main FPC of a display module by a welding method, and backlight is controlled by the main FPC. The area of the backlight welding area is large, and the backlight welding area occupies a large proportion of the FPC component area. Along with the rise of 5G, cell-phone complete machine and display module assembly needs the components and parts more and more, can keep away the sky on the cell-phone mainboard and be used for placing the region of components and parts for module FPC also more and more littleer. The traditional welding connection method becomes a factor which restricts the placing space of the components.
At present, in a conventional method for connecting the backlight FPC and the module main FPC together through soldering tin, due to the fluidity of the soldering tin, the requirement on the area of a welding area is large, and a welding pad requires a large transverse size, which is usually 1.4mm.
Disclosure of Invention
For solving the technical problem who exists among the prior art, the utility model provides a occupy less space FPC in a poor light and display module assembly main FPC's connected mode.
The utility model provides a following technical scheme:
a flexible circuit board connection structure comprising:
the display module comprises a first flexible circuit board, and the first flexible circuit board is provided with a first welding disc;
a backlight assembly including a second flexible circuit board having a second pad;
and a conductive adhesive film is arranged between the first bonding pad and the second bonding pad and used for realizing the electric connection of the first flexible circuit board and the second flexible circuit board.
As a preferred technical scheme, the conductive adhesive film is an anisotropic conductive adhesive film.
As a preferable technical scheme, the transverse width of the electric connection area of the first flexible circuit board and the second flexible circuit board is 0.12mm.
As a preferable technical solution, the cross-sectional area of the pad of the first flexible circuit board is smaller than the cross-sectional area of the pad of the second flexible circuit board.
As a preferable technical scheme, the viscosity of the anisotropic conductive adhesive film is 7N/cm.
As a preferred technical solution, the anisotropic conductive film comprises a plurality of conductive particles, and the diameter of the conductive particles is 3.2 micrometers.
As the preferred technical scheme, the first flexible circuit board is provided with a plurality of circular through holes.
As a preferred technical scheme, the circular through hole has three.
As a preferred technical scheme, a plurality of rectangular through hole are arranged in the pad area of the second flexible circuit board.
As a preferred technical scheme, the number of the rectangular through holes is three.
The application also provides an electronic device comprising the flexible circuit board connecting structure.
The utility model discloses a technical scheme beneficial effect that can reach: the backlight FPC and the module main FPC are connected together through the ACF, the requirement on the area of a welding area is small, the transverse size is less than one tenth of that of a conventional design, the area of main FPC components can be greatly saved, more components can be attached conveniently, and meanwhile, the design difficulty of corresponding clearance avoidance of a mobile phone mainboard is reduced.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the description of the embodiments are briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof of the present invention explain the present invention and do not constitute an undue limitation on the present invention. In the drawings:
fig. 1 is a schematic view of a connection structure of a flexible printed circuit board disclosed in embodiment 1 of the present invention;
fig. 2 is a schematic view of a connection structure of a flexible printed circuit board disclosed in embodiment 1 of the present invention.
Description of the reference numerals:
a first flexible circuit board 10; a conductive adhesive film 20; a second flexible circuit board 30.
Detailed Description
To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. In the description of the present invention, it is noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Example 1
This embodiment 1 provides a flexible circuit connection structure, according to fig. 1-2, comprising:
the display module comprises a first flexible circuit board 10, a second flexible circuit board and a display module, wherein the first flexible circuit board is provided with a first welding disc;
a backlight assembly including a second flexible circuit board 30 having a second pad;
a conductive adhesive film 20 is arranged between the first bonding pad and the second bonding pad, and the conductive adhesive film 20 is used for electrically connecting the first flexible circuit board 10 and the second flexible circuit board 30.
According to fig. 1, the embodiment adopts the FOF process, the backlight FPC and the module main FPC are connected together through the ACF, the requirement on the area of the soldering region is small, and the small width of the pad can be satisfied.
Preferably, the transverse width of the electrical connection region of the first flexible circuit board 10 and the second flexible circuit board 30 is 0.12mm. The transverse size is less than one tenth of the conventional design, the area of the main FPC component can be greatly saved, more components can be attached conveniently, and the design difficulty of corresponding clearance of the mobile phone mainboard is reduced.
Preferably, the land cross-sectional area of the first flexible circuit board 10 is smaller than the land cross-sectional area of the second flexible circuit board 30.
FOF, english full name Film on Film, through ACF bonding, under certain temperature, pressure and time hot pressing to realize the first flexible circuit board 10 and the second flexible circuit board 30 connection and electric conduction one processing method.
Preferably, the FOF process uses an anisotropic conductive film 20, which in this embodiment is a DiRui-Hei PAF705D-10AJ.
Anisotropic Conductive Film 20 (also called ACF Conductive Film) is a flexible printed circuit board with high reliability and excellent performance, which is made of polyimide or polyester Film as the base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property.
The anisotropic conductive film 20 mainly comprises two parts, i.e., conductive particles and an insulating material, and a protective film is disposed on the top and bottom to protect the main components. When the flexible printed circuit board is used, the upper film is torn off, the anisotropic conductive adhesive film 20 is attached to the bonding pad of the first flexible printed circuit board 10, the other layer of bottom film is torn off, an upper object and a lower board are pressed after accurate alignment, the insulating adhesive material is cured after heating and pressurizing for a period of time, and finally, a stable structure with vertical conduction and transverse insulation is formed.
The ACF conductive adhesive is mainly characterized in that the z-axis electrical conduction direction and the resistance characteristics of the xy insulation plane have obvious difference, a hot pressing jig is used for pressurizing, conductive particles wrapped in the ACF are broken and connected with electrodes between the first flexible circuit board 10 and the second flexible circuit board 30, and the conduction in the z-axis direction is realized while the conduction between two adjacent electrodes is avoided.
Preferably, the anisotropic conductive film 20 electrically connects the first flexible circuit board 10 and the second flexible circuit board 30 by thermocompression bonding.
Preferably, the first flexible circuit board 10 is provided with a plurality of circular through holes.
Preferably, the circular through-hole has three.
Preferably, the pad area of the second flexible circuit board 30 is provided with a plurality of rectangular through holes.
Preferably, there are three rectangular through-holes.
Preferably, a plurality of components are attached to the surface of the first flexible circuit board 10.
Example 2
This embodiment 2 provides a process for preparing a FOF, including:
the basic process of the FOF process is as follows:
cleaning the bonding pad to-be-bonded areas of the first flexible circuit board 10 and the second flexible circuit board 30;
the upper layer film of the anisotropic conductive adhesive film 20 is torn off and then attached to the pad area of the first flexible circuit board 10, the lower layer film is torn off, the upper object and the lower board are pressed after accurate alignment, the insulating adhesive material is solidified after heating and pressurizing for a period of time, and finally a stable structure with vertical conduction and transverse insulation is formed.
Preferably, the temperature is 170 ℃, the pressure is 4.5MPa, and the time is 5s.
Example 3
The application also provides electronic equipment, which comprises the flexible circuit board connecting structure provided by the embodiment 1-2, and can greatly save the area of the main FPC component, so that more components can be attached, and the design difficulty of corresponding clearance avoidance of the electronic equipment is reduced.
The flexible circuit board connection structure and the electronic device according to the embodiment of the present application are described in detail, and a specific example is applied to illustrate the principle and the embodiment of the present application, and the description of the embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (11)
1. A flexible circuit board connection structure, comprising:
the display module comprises a first flexible circuit board, a second flexible circuit board and a display module, wherein the first flexible circuit board is provided with a first bonding pad;
a backlight assembly including a second flexible circuit board having a second pad;
and a conductive adhesive film is arranged between the first bonding pad and the second bonding pad and used for realizing the electric connection of the first flexible circuit board and the second flexible circuit board.
2. The flexible circuit board connection structure of claim 1, wherein the conductive adhesive film is an anisotropic conductive adhesive film.
3. The flexible circuit board connection structure according to claim 1, wherein a lateral width of the first flexible circuit board and the second flexible circuit board electrical connection region is 0.12mm.
4. The flexible circuit board connection structure according to claim 1, wherein a land cross-sectional area of the first flexible circuit board is smaller than a land cross-sectional area of the second flexible circuit board.
5. The flexible circuit board connection structure of claim 2, wherein the anisotropic conductive film has a viscosity of 7N/cm.
6. The flexible circuit board connection structure of claim 2, wherein the anisotropic conductive film comprises a plurality of conductive particles, and the diameter of the conductive particles is 3.2 μm.
7. The flexible circuit board connection structure according to any one of claims 1 to 6, wherein the first flexible circuit board is provided with a plurality of circular through-holes.
8. The flexible circuit board connection structure according to claim 7, wherein the circular through hole has three.
9. The flexible circuit board connection structure according to any one of claims 1 to 6, wherein the land area of the second flexible circuit board is provided with a plurality of rectangular through-hole.
10. The flexible circuit board connection structure according to claim 9, wherein the rectangular through-hole has three.
11. An electronic device characterized by comprising the flexible circuit board connection structure of any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220202001.4U CN217740805U (en) | 2022-01-25 | 2022-01-25 | Flexible circuit board connecting structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220202001.4U CN217740805U (en) | 2022-01-25 | 2022-01-25 | Flexible circuit board connecting structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217740805U true CN217740805U (en) | 2022-11-04 |
Family
ID=83810635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220202001.4U Active CN217740805U (en) | 2022-01-25 | 2022-01-25 | Flexible circuit board connecting structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217740805U (en) |
-
2022
- 2022-01-25 CN CN202220202001.4U patent/CN217740805U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100511121B1 (en) | Connection structure and method of semiconductor element, liquid crystal display device using the structure and electronic device using the same | |
| CN111463228A (en) | Display panel and display device | |
| CN100370603C (en) | Mounting structure of semiconductor chip, liquid crystal device, and electronic equipment | |
| US7501584B2 (en) | Circuit board device and method for board-to-board connection | |
| CN111796463A (en) | Display module | |
| CN113133198A (en) | Circuit board assembly and electronic device | |
| CN217740805U (en) | Flexible circuit board connecting structure and electronic equipment | |
| JP3904058B2 (en) | Semiconductor device and manufacturing method thereof, circuit board, and electronic apparatus | |
| JPH0425523B2 (en) | ||
| CN209748899U (en) | Circuit board | |
| EP3701773B1 (en) | Flex on board anisotropic conductive adhesive interconnection | |
| CN100480786C (en) | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass | |
| KR100946597B1 (en) | Conductive ball with easily pressed down, method of mamufacturing thereof and anisotropic conductive film using the same | |
| CN217405123U (en) | High-density anisotropic conductive film structure | |
| JPH10261852A (en) | Heat-sealed connector and flexible wiring board | |
| TW201643897A (en) | Anisotropic conductive film using core layer technology | |
| KR100613026B1 (en) | Conductive ball, method of mamufacturing thereof and anisotropic conductive film using the same | |
| CN220457652U (en) | Take elastic PCB board and display module assembly | |
| CN220511319U (en) | Soft and hard base composite connection circuit board | |
| CN220235062U (en) | Earphone bonding pad wiring structure | |
| CN214800010U (en) | Circuit board and electronic equipment | |
| CN221283415U (en) | Circuit board assembly and battery | |
| CN217405124U (en) | Novel anisotropic conductive film | |
| CN112448151B (en) | Antenna stack structure and manufacturing method thereof | |
| CN218868429U (en) | Printed circuit board and circuit board assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |