CN220235062U - Earphone bonding pad wiring structure - Google Patents
Earphone bonding pad wiring structure Download PDFInfo
- Publication number
- CN220235062U CN220235062U CN202321406711.XU CN202321406711U CN220235062U CN 220235062 U CN220235062 U CN 220235062U CN 202321406711 U CN202321406711 U CN 202321406711U CN 220235062 U CN220235062 U CN 220235062U
- Authority
- CN
- China
- Prior art keywords
- pad
- bonding pad
- earphone
- earpiece
- routing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims abstract description 19
- 239000002344 surface layer Substances 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005336 cracking Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of earphone welding, in particular to an earphone bonding pad wiring structure, which comprises a surface bonding pad, an inner copper sheet and an earphone signal wiring, wherein N through holes are formed in the surface bonding pad, and the N through holes are used for realizing connection between the surface bonding pad and the inner copper sheet; and the earphone signal wire is connected to the pin pad, and N is a positive integer. According to the utility model, more through holes are added at the surface bonding pad, so that the surface bonding pad is connected with the inner copper sheet, the adhesive force of the bonding pad is increased, and the cracking problem is solved; and secondly, the earphone signal wiring is connected to the pin pad at the inner layer, double insurance is realized, and even if the surface layer pad is broken, the earphone device can be connected through the pin pad, so that normal use of functions is ensured, and the reliability of products is improved.
Description
Technical Field
The utility model relates to the technical field of earphone welding, in particular to an earphone bonding pad wiring structure.
Background
Because the earphone spring leg is in long-time pressure contact with the earphone spring sheet, and the product moves in the use process of a user and is stressed, the copper sheet on the surface layer of the bonding pad is cracked, the signal wiring of the connecting bonding pad is broken, and the product cannot be used. The utility model increases the via hole on the bonding pad to connect with the adjacent layer below, increases the adhesive force of the bonding pad copper sheet, and connects to the pin bonding pad through the inner layer earphone signal wiring, thus solving the problem that the product cannot be used due to wiring disconnection after the bonding pad is cracked.
In the prior art, as shown in fig. 1, in the prior art, a bonding pad and a receiver signal are connected through a wiring and a via hole, and are subjected to external force of a receiver spring piece, and the surface layer of the bonding pad and a dielectric layer of a PCB are cracked, so that the wiring is broken and opened, and a receiver silent product cannot be used.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present utility model is to provide an intelligent heat dissipation system for electronic devices, which is used for solving the problems of pad cracking and poor receiver function, and improving product reliability.
To achieve the above and other related objects, the present application provides an earpiece bonding pad routing structure, including a surface layer bonding pad, an inner layer copper sheet, and an earpiece signal routing;
the surface layer bonding pad is provided with N through holes, and the N through holes are used for realizing connection between the surface layer bonding pad and the inner layer copper sheet;
and the earphone signal wire is connected to the pin pad, and N is a positive integer.
Still further, the surface pads include a Land side and a Pad side.
Still further, the Land side is a two-dimensional surface feature for surface mountable components.
Still further, the Pad side is a three-dimensional feature for assembling the pluggable components.
Further, the via hole is a hole for connecting and conducting the surface layer bonding pad bilayer or the middle layer and the layer of the multilayer.
Further, the surface layer pad is composed of a PCB substrate and a copper foil.
Further, the copper foil is attached to the PCB substrate, and the copper foil is coated with solder paste.
Further, the copper foil electrically connects and fixes the electronic components to the PCB substrate through solder paste.
Still further, the pin pad includes a PCB substrate and pin holes.
Further, the pin holes are formed in the PCB substrate, and copper foil is attached around the pin holes.
As described above, in the earphone bonding pad wiring structure, compared with the existing welding technology design, more through holes are added at the surface bonding pad, so that the surface bonding pad is connected with the inner copper sheet, the adhesive force of the bonding pad is increased, and the cracking problem is solved; and secondly, the earphone signal wiring is connected to the pin pad at the inner layer, double insurance is realized, and even if the surface layer pad is broken, the earphone device can be connected through the pin pad, so that normal use of functions is ensured, and the reliability of products is improved.
Drawings
Fig. 1 is a schematic diagram of a conventional scheme of the present application, in which a pad and an earpiece signal are connected by a trace and a via;
FIG. 2 is a schematic diagram of a surface pad plus via in an embodiment of the present application;
fig. 3 is a schematic diagram of an inner layer signal trace connection pin pad according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms "upper", "lower", "left", "right", "middle" and "first", "second" are used herein for descriptive purposes only and are not intended to limit the scope of the utility model for which the utility model may be practiced, but rather the relative relationships thereof may be altered or modified without materially altering the technical context.
In one embodiment, the application provides an earpiece bonding pad routing structure, including a surface layer bonding pad, an inner layer copper sheet, and an earpiece signal routing; the surface layer bonding pad is provided with N through holes, and the N through holes are used for realizing connection between the surface layer bonding pad and the inner layer copper sheet; and the earphone signal wire is connected to the pin pad, and N is a positive integer.
As a preference of this embodiment, the surface pads include a Land side and a Pad side. The Land surface is a two-dimensional surface feature for surface-mountable components. The Pad side is a three-dimensional feature used to assemble the pluggable components.
The via hole in this embodiment is a hole for connecting and conducting between the two layers or between the middle layers of the surface layer bonding pad.
The surface layer pad of this embodiment is composed of a PCB substrate and copper foil. The copper foil is attached to the PCB base material, and solder paste is coated on the copper foil. The copper foil electrically connects and fixes the electronic components on the PCB substrate through the solder paste.
The pin pad of this embodiment includes a PCB substrate and pin holes. The pin holes are arranged on the PCB base material, and copper foils are attached around the pin holes.
In this example, PCB (Printed Circuit Board), the chinese name printed circuit board, also called printed circuit board, printed wiring board, is an important electronic component, is a support for electronic components, and is a provider of electrical connections for electronic components.
In this example, in order to fix and electrically connect electronic components to a PCB, copper foil is typically attached to a PCB substrate as a bonding pad, then a solder paste is applied to the copper foil, the electronic components are electrically connected and fixed to the PCB by the solder paste, and some bonding pads of pin devices are typically formed with holes of a certain size in the PCB so that pins can be inserted, and then copper foil is attached around the holes as bonding pads.
In this example, green oil (liquid photo solder resist) is a protective layer that is applied to circuits and substrates of printed circuit boards that do not require soldering or is used as a solder resist. The purpose is to protect the formed circuit pattern for a long period of time.
In the example, the pin device is convenient to assemble and maintain, and the pin of the device has a certain telescopic function and is directly contacted with the bonding pad on the surface of the PCB so as to ensure reliable connection of electrical performance.
In this example, currently, PCBs such as mobile phones and digital products are preferably selected from pin ejection devices (e.g. earphone/SIM card holder/earphone holder) for mass production.
Referring to fig. 2, more through holes are added at the surface layer bonding pad, so that the surface layer bonding pad is connected with the inner layer copper sheet, the adhesive force of the bonding pad is increased, and the cracking problem is solved; and secondly, referring to fig. 3, the earphone signal wires are connected to the pin pads at the inner layer, so that double insurance is realized, and even if the surface layer pad is broken, the earphone device can be connected through the pin pads, so that normal use of functions is ensured.
In summary, after stress cracking and circuit breaking are carried out on the receiver bonding pad in the prior art, the main board is scrapped, and the loss is large; the novel technology solves the problems of pad cracking and poor receiver function in two processing modes, and improves the reliability of products.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present application, and are intended to be included within the scope of the present application.
Claims (10)
1. The earphone bonding pad wiring structure is characterized by comprising a surface bonding pad, an inner copper sheet and an earphone signal wiring;
the surface layer bonding pad is provided with N through holes, and the N through holes are used for realizing connection between the surface layer bonding pad and the inner layer copper sheet;
and the earphone signal wire is connected to the pin pad, and N is a positive integer.
2. The earpiece Pad routing structure of claim 1, wherein the skin Pad includes a Land side and a Pad side.
3. The earpiece pad routing structure of claim 2, wherein the Land face is a two-dimensional surface feature for surface mountable components.
4. The earpiece Pad routing structure of claim 2, wherein the Pad face is a three-dimensional feature for assembling pluggable components.
5. The earpiece bonding pad routing structure of claim 1, wherein the via is a via for connection between the surface bonding pad bilayer or layer to layer.
6. The earpiece pad routing structure of claim 1, wherein the skin pad is comprised of a PCB substrate and copper foil.
7. The earpiece pad routing structure of claim 6, wherein the copper foil is mounted on the PCB substrate and the copper foil is coated with solder paste.
8. The earpiece pad routing structure of claim 7, wherein the copper foil electrically connects and secures the electronic component to the PCB substrate via solder paste.
9. The earpiece pad routing structure of claim 1, wherein the pin pad includes a PCB substrate and pin holes.
10. The earpiece pad routing structure of claim 9, wherein the pin holes are disposed on the PCB substrate and a copper foil is attached around the pin holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321406711.XU CN220235062U (en) | 2023-06-05 | 2023-06-05 | Earphone bonding pad wiring structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321406711.XU CN220235062U (en) | 2023-06-05 | 2023-06-05 | Earphone bonding pad wiring structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220235062U true CN220235062U (en) | 2023-12-22 |
Family
ID=89176374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321406711.XU Active CN220235062U (en) | 2023-06-05 | 2023-06-05 | Earphone bonding pad wiring structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220235062U (en) |
-
2023
- 2023-06-05 CN CN202321406711.XU patent/CN220235062U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |