CN109041418B - Circuit board structure and electronic equipment - Google Patents
Circuit board structure and electronic equipment Download PDFInfo
- Publication number
- CN109041418B CN109041418B CN201811150119.1A CN201811150119A CN109041418B CN 109041418 B CN109041418 B CN 109041418B CN 201811150119 A CN201811150119 A CN 201811150119A CN 109041418 B CN109041418 B CN 109041418B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- component
- pin
- circuit
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a circuit board structure and electronic equipment, wherein the circuit board structure comprises a first circuit board and a second circuit board, and at least one first component is arranged between the first circuit board and the second circuit board; each first component is provided with a first pin and a second pin; the first circuit board is provided with a first bonding pad corresponding to the first pin, the second circuit board is provided with a second bonding pad corresponding to the second pin, the first pin is welded on the first bonding pad, the second pin is welded on the second bonding pad, and the first component electrically connects the first circuit board and the second circuit board. According to the circuit board structure provided by the embodiment of the invention, the first component is used for electrically connecting the circuits on the first circuit board and the second circuit board, so that the lengths of the circuits on the first circuit board and the second circuit board can be shortened, and the electric conductivity between the first circuit board and the second circuit board is improved.
Description
Technical Field
The invention relates to the field of circuit design, in particular to a circuit board structure and electronic equipment.
Background
With the rapid development of electronic technology, electronic devices such as smart phones and tablet computers are becoming more and more popular and become indispensable tools in people's daily life. In order to meet the requirements of people on electronic equipment, the electronic equipment realizes more and more functions through the improvement of component performance and the addition of components.
Due to the increasing number of components in electronic devices, the components need to occupy more and more bearing area on a Printed Circuit Board (PCB). In the prior art, there is a stacking method of "sandwich" to increase the carrying area of the device, that is, as shown in fig. 1, two carrying circuit boards for carrying the device are stacked on each other, and another connecting circuit board is welded between the two carrying circuit boards, and the carrying circuit board is generally arranged around the device between the two carrying circuit boards, and the two carrying circuit boards are supported and electrically connected by the connecting circuit board. However, since the length of the connection line between the two carrier boards is increased by the connection of the connection boards, the electrical continuity between the two carrier boards is deteriorated, especially when the number of the connection lines between the two carrier boards is large.
It is seen that there is a problem in that the electrical conductivity between two carrier boards is reduced due to an increase in the length of a connection line between the two carrier boards caused by the connection of the circuit boards.
Disclosure of Invention
The embodiment of the invention provides a circuit board structure and electronic equipment, and aims to solve the problem that the electrical conductivity between two bearing circuit boards is reduced due to the fact that the length of a connecting line between the two bearing circuit boards is increased due to the fact that the circuit boards are connected at present.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a circuit board structure, including a first circuit board and a second circuit board:
at least one first component is arranged between the first circuit board and the second circuit board;
each first component is provided with a first pin and a second pin;
the first circuit board is provided with a first bonding pad corresponding to the first pin, the second circuit board is provided with a second bonding pad corresponding to the second pin, the first pin is welded on the first bonding pad, the second pin is welded on the second bonding pad, and the first component is electrically connected with the second circuit board.
In a second aspect, an embodiment of the present invention further provides an electronic device, including the circuit board structure.
In the embodiment of the invention, the circuit board structure comprises a first circuit board and a second circuit board, wherein at least one first component is arranged between the first circuit board and the second circuit board; each first component is provided with a first pin and a second pin; the first circuit board is provided with a first bonding pad corresponding to the first pin, the second circuit board is provided with a second bonding pad corresponding to the second pin, the first pin is welded on the first bonding pad, the second pin is welded on the second bonding pad, and the first component electrically connects the first circuit board and the second circuit board. Therefore, the first circuit board and the second circuit board are electrically connected through the first component, the length of the circuit on the first circuit board and the length of the circuit on the second circuit board can be shortened, and the electric conduction performance between the first circuit board and the second circuit board is improved.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
FIG. 4 is a fourth schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
fig. 5 is a fifth schematic structural diagram of a circuit board structure according to an embodiment of the present invention;
fig. 6 is a sixth schematic structural diagram of a circuit board structure according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board structure according to an embodiment of the present invention, and as shown in fig. 1, the circuit board structure includes a first circuit board 10 and a second circuit board 20, and is characterized in that:
at least one first component 30 is arranged between the first circuit board 10 and the second circuit board 20;
each first component 30 is provided with a first pin 31 and a second pin 32;
the first circuit board 10 is provided with a first pad 11 corresponding to the first pin 31, the second circuit board 20 is provided with a second pad 21 corresponding to the second pin 32, the first pin 31 is welded to the first pad 11, the second pin 32 is welded to the second pad 21, and the first component 30 electrically connects the first circuit board 10 and the second circuit board 20.
Here, since the first component 30 is a component carried between the first circuit board 10 and the second circuit board 20, the first component 30 may be disposed near a center position of a carrying area on the first circuit board 10 and the second circuit board 20, and the carrying area is used for carrying the component, so that the first component 30 electrically connects the lines on the first circuit board 10 and the second circuit board 20, and the lengths of the lines on the first circuit board 10 and the second circuit board 20 may be shortened, thereby improving the electrical continuity between the first circuit board 10 and the second circuit board 20.
It should be noted that the first circuit board 10 and the second circuit board 20 may be any circuit board capable of carrying the components 30, and may be a single-layer circuit board, a double-layer circuit board, or a three-layer or more circuit board, for example: the first circuit board 10 and the second circuit board 20 may be single-layer circuit boards; or one of the first circuit board 10 and the second circuit board 20 is a single-layer circuit board and the other is a double-layer circuit board, etc., and is not limited herein.
In addition, since the length of the components between the first circuit board 10 and the second circuit board 20 may be long in the direction from the first circuit board 10 to the second circuit board 20, the overall thickness of the circuit board structure may be caused to be thick.
In the embodiment of the present invention, an opening may be formed on one side surface of any one of the first circuit board 10 and the second circuit board 20, so that a higher component on the other circuit board passes through the side surface through the opening, and thus the component on one circuit board may partially extend into or pass through the other circuit board, thereby reducing the overall thickness of the circuit board structure.
The opening can be a recessed area or a hollow area on the circuit board, and can be set according to the height of the component opposite to the opening. For example: as shown in fig. 2, in the case that the component a on the second circuit board 20 is slightly higher, a first opening 101 of a recessed area may be formed on the first circuit board 10, and the component a on the second circuit board 20 opposite to the first opening 101 may partially extend into the first opening 101, that is, the component a does not penetrate through the first circuit board 10; when the component B on the first circuit board 10 is far higher than the component a, a second opening 201 of the hollow area may be formed on the second circuit board 20, and the component B on the first circuit board 10 opposite to the second opening 201 may penetrate through the second circuit board 20 through the second opening 201.
In an embodiment of the present invention, the at least one first component 30 may be a part or all of components disposed between the first circuit board 10 and the second circuit board 20, for example: when the number of components between the first circuit board 10 and the second circuit board 20 is small and the heights of the components are uniform, all the components between the first circuit board 10 and the second circuit board 20 may be used as the first component 30.
The functional pins of the component are usually only welded on the first circuit board 10 or the second circuit board 20, and the component is electrically connected to the circuit board where the component is located through the functional pins, so as to realize the normal operation of the component.
The first pin 31 or the second pin 32 on the first component 30 may be a functional pin of the first component 30, and when the first component 30 electrically connects the first circuit board 10 and the second circuit board 20, the first pin 31 or the second pin 32 may still implement the normal operation of the first component 30; alternatively, the first pin 31 and the second pin 32 may be newly added pins different from the functional pins of the first component 30.
In addition, in the case where the first pins 31 are soldered to the first pads 11 and the second pins 32 are soldered to the second pads 21, the first circuit board 10 and the second circuit board 20 can be electrically connected through the first component 30, and thus the first pins 31 and the second pins 32 need to be electrically connected.
It should be noted that, each of the first components 30 may be provided with only one first pin 31 and one second pin 32, so as to achieve the conduction of one line between the first circuit board 10 and the second circuit board 20; of course, each of the first components 30 may also be provided with a plurality of first pins 31 and a plurality of second pins 32, and the plurality of lines between the first circuit board 10 and the second circuit board 20 are conducted through the plurality of second pins 31 and the plurality of second pins 32.
The first pin 31 and the second pin 32 may be formed by etching a circuit on the surface of the first component 30, and the first pin 31 and the second pin 32 may be electrically connected by the etched circuit, but the invention is not limited thereto.
In the embodiment of the present invention, the first circuit board 10 and the second circuit board 20 may be supported and electrically connected only by the at least one first component 30, at this time, the at least one first component 30 may conduct all lines that need to be electrically connected between the first circuit board 10 and the second circuit board 20, and the at least one first component 30 may provide sufficient supporting force for the first circuit board 10 and the second circuit board 20, so as to function as a support.
Alternatively, as shown in fig. 3, the first circuit board 10 and the second circuit board 20 are provided with a carrying area (not shown) for soldering components, and the at least one first component 30 is located in the carrying area; the circuit board structure further comprises a third circuit board 40, wherein the third circuit board 40 is clamped between the first circuit board 10 and the second circuit board 20, and the third circuit board 40 is arranged around the bearing area; the first circuit board 10 and the second circuit board 20 are also electrically connected through a third circuit board 40.
Here, the third circuit board 40 is sandwiched between the first circuit board 10 and the second circuit board 20, and can support the first circuit board 10 and the second circuit board 20, so as to improve the firmness of the circuit board structure; moreover, the first circuit board 10 and the second circuit board 20 are electrically connected through the third circuit board 40, so that the routing manner of the connection lines between the first circuit board 10 and the second circuit board 20 can be flexibly set, and further the length of the connection lines between the first circuit board 10 and the second circuit board 20 can be further shortened.
The third circuit board 40 may be any circuit board capable of supporting the first circuit board 10 and the second circuit board 20 and electrically connecting the first circuit board 10 and the second circuit board 20, and may be a single-layer circuit board or a multi-layer circuit board; and the third circuit board 40 may be a single integrated circuit board or may be composed of a plurality of circuit boards, which is not limited herein.
In addition, since the third circuit board 40 is disposed around the carrying region, at least one first component 30 is disposed in the carrying region, and the first circuit board 10 and the second circuit board 20 can be electrically connected to each first component 30 through the third circuit board 40, respectively, the length of the connection line between the first circuit board 10 and the second circuit board 20 can be effectively shortened by selecting a suitable connection mode.
Optionally, a first circuit is disposed on the first circuit board 10, a second circuit is disposed on the second circuit board 20, and the first circuit and the second circuit are electrically connected through at least one first component 30, wherein a sum of distances between the first circuit and the second circuit and the at least one first component 30 is smaller than a sum of distances between the first circuit and the third circuit and between the second circuit and the third circuit board 40, and since the sum of distances between the first circuit and the first component 30 is closer to the sum of distances between the second circuit and the first component 30, the first circuit and the second circuit are electrically connected through the first component 30, so that a length of a connection line between the first circuit board 10 and the second circuit board 20 can be further shortened.
Since the first circuit board 10 and the second circuit board 20 can be simultaneously supported by at least one of the first component 30 and the third circuit board 40, at least the first component 30 and the third circuit board 40 are soldered between the first circuit board 10 and the second circuit board 20. Alternatively, the height of the first component 30 is equal to the height of the third circuit board 40 in the direction from the first circuit board 10 to the second circuit board 20, so that it is easy to solder at least one of the first component 30 and the third circuit board 40 between the first circuit board 10 and the second circuit board 20, and at the same time, the soldering stability of the circuit board structure is improved.
Of course, the first component 30 and the third circuit board 40 may have a certain height difference in the direction from the first circuit board 10 to the second circuit board 20, and the height difference may be compensated by a soldering agent such as solder during soldering.
It should be noted that the at least one first component 30 is disposed in the carrying region, and the at least one first component 30 may be disposed at any position in the carrying region. Optionally, at least one first component 30 is a first component 30, and one first component 30 is disposed in the central position of the carrying region; the at least one first component 30 includes a plurality of first components 30, and the plurality of first components 30 are uniformly distributed in the carrying area, so that the supporting capability of the at least one first component 30 on the first circuit board 10 and the second circuit board 20 can be increased, and the length of the connection line between the first circuit board 10 and the second circuit board 20 can be further shortened.
As above, the circuit board structure may include only one first component 30, or may include a plurality of first components 30, and in the case that the circuit board structure includes a plurality of first components 30, in order to improve the support balance performance of each first component 30 between the first circuit board 10 and the second circuit board, optionally, the circuit board structure includes a plurality of first components 30, and in the direction from the first circuit board 10 to the second circuit board 20, the height difference between the plurality of first components 30 is smaller than or equal to the preset height difference.
In an embodiment of the present invention, the first component 30 may also be a component formed by stacking at least two components, and the at least two components may be electrically connected to each other, for example: as shown in fig. 4, the first component 30 is formed by stacking a component C and a component D, the component C and the component D are soldered together, the component C is soldered on the first circuit board 10, and the component D is soldered on the second circuit board.
Optionally, as shown in fig. 5, a third pin 33 is disposed on the first component 30, a third pad 12 corresponding to the third pin 33 is disposed on the first circuit board 10, and the third pin 33 is soldered on the third pad 12;
the circuit board structure further includes a second component 50, the second component 50 is disposed on a side surface of the first circuit board 10 away from the second circuit board 20, the second component 50 is provided with a fourth pin 51, the first circuit board 10 is provided with a fourth pad 13 corresponding to the fourth pin 51, the fourth pin 51 is welded on the fourth pad 13, and the fourth pin 51 is electrically connected to the third pin 33 through the first circuit board 10.
Here, the fourth pin 51 on the second component 50 is electrically connected to the third pin 33 on the first component 30 through the first circuit board 10, so that the first component 30 and the second component 50 can be electrically connected, and when the first component 30 and the second component 50 are stackable components, compared with the stacking manner, the first component 30 and the second component 50 are disposed on two sides of the first circuit board 10, so that the height of the circuit board structure can be effectively reduced, especially when the first component 30 and the second component 50 are stacked higher.
The third pin 33 may be a pin different from the first pin 31 on the first component 30, so that the first component 30 can be electrically connected to not only the second component 50 on the first circuit board 10, but also other circuits or components on the first circuit board 10; alternatively, the third pin 33 may be the first pin 31, so that the first component 30 is electrically connected to the second component 50 only.
In addition, the fourth pin 51 is electrically connected to the third pin 33 through the first circuit board 10, and the first circuit board 10 is provided with a connection line for connecting the fourth pin 51 and the third pin 33. Optionally, the third pad 12 and the fourth pad 13 are disposed opposite to two side surfaces of the first circuit board 10, and the first circuit board 10 is provided with a connection line extending from the third pad 12 to the fourth pad 13, and the third pad 12 and the fourth pad 13 are electrically connected through the connection line, so that the connection line between the third pin 33 and the fourth pin 51 is shortest, and the electrical connectivity of the circuit board structure is further improved.
Of course, a component electrically connected to the first component 30 may also be disposed on the second circuit board 10, which is not described herein again.
It should be noted that, the circuit board structure may include other components besides the above components, for example: as shown in fig. 6, the circuit board structure may further include a shielding element 60, the shielding element 60 is disposed on a side surface of the first circuit board 10 away from the second circuit board 20, the shielding element 60 and the first circuit board 10 enclose an accommodating space 70, and components on a side surface of the first circuit board 10 away from the second circuit board 20 are all accommodated in the accommodating space 70, and the shielding element 60 may shield the components located in the accommodating space 70 from the outside; similarly, the shielding element 60 may be disposed on a side of the second circuit board 20 away from the first circuit board 10, which is not described herein.
In the embodiment of the invention, the circuit board structure comprises a first circuit board and a second circuit board, wherein at least one first component is arranged between the first circuit board and the second circuit board; each first component is provided with a first pin and a second pin; the first circuit board is provided with a first bonding pad corresponding to the first pin, the second circuit board is provided with a second bonding pad corresponding to the second pin, the first pin is welded on the first bonding pad, the second pin is welded on the second bonding pad, and the first component electrically connects the first circuit board and the second circuit board. Therefore, the first circuit board and the second circuit board are electrically connected through the first component, the length of the circuit on the first circuit board and the length of the circuit on the second circuit board can be shortened, and the electric conduction performance between the first circuit board and the second circuit board is improved.
Optionally, in an implementation of the present invention, the first component is a component of a package structure. The pins can be pins led out from the packaging main body, and can also be welding points on the surface of the packaging main body and used for welding with a circuit board patch.
Based on the circuit board structure, an embodiment of the invention further provides an electronic device, which comprises the circuit board structure.
Since the structure of the electronic device body is the prior art, and the structure of the circuit board has been described in detail in the above embodiments, the detailed description of the structure of the electronic device in this embodiment is omitted.
In this embodiment of the present invention, the electronic device may be a mobile terminal, for example: a Mobile phone, a tablet personal Computer (tablet personal Computer), a Laptop Computer (Laptop Computer), a Personal Digital Assistant (PDA), a Mobile Internet Device (MID), a Wearable Device (Wearable Device), and the like, and may also be other electronic devices, such as a digital camera, an electronic book, a navigator, and the like.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A circuit board structure, includes first circuit board and second circuit board, its characterized in that:
at least one first component is arranged between the first circuit board and the second circuit board;
each first component is provided with a first pin and a second pin;
the first circuit board is provided with a first bonding pad corresponding to the first pin, the second circuit board is provided with a second bonding pad corresponding to the second pin, the first pin is welded on the first bonding pad, the second pin is welded on the second bonding pad, and the first component electrically connects the first circuit board and the second circuit board;
the first circuit board and the second circuit board are provided with bearing areas, the bearing areas are used for welding components, and the at least one first component is located in the bearing areas;
the circuit board structure further comprises a third circuit board, the third circuit board is clamped between the first circuit board and the second circuit board, and the third circuit board is arranged around the bearing area; the first circuit board and the second circuit board are also electrically connected through the third circuit board;
a first circuit is arranged on the first circuit board, a second circuit is arranged on the second circuit board, and the first circuit and the second circuit are electrically connected through the at least one first component, wherein the sum of the distances between the first circuit and the at least one first component and the distances between the second circuit and the at least one first component are smaller than the sum of the distances between the first circuit and the third circuit and the distances between the second circuit and the third circuit board;
an opening is formed in one side face of any one of the first circuit board and the second circuit board, and components of the other circuit board penetrate through the side face through the opening.
2. The circuit board structure according to claim 1, wherein:
a third pin is arranged on the first component, a third bonding pad corresponding to the third pin is arranged on the first circuit board, and the third pin is welded on the third bonding pad;
the circuit board structure further comprises a second element, the second element is arranged on the side face of the second circuit board far away from the first circuit board, the second element is provided with a fourth pin, a fourth bonding pad corresponding to the fourth pin is arranged on the first circuit board, the fourth pin is welded on the fourth bonding pad, and the fourth pin passes through the first circuit board and is electrically connected with the third pin.
3. The circuit board structure according to claim 2, wherein:
the third pin is the first pin.
4. A circuit-board structure according to claim 2 or 3, characterized in that:
the third pad with the fourth pad just right set up in the both sides face of first circuit board, just be equipped with on the first circuit board by the third pad to the interconnecting link that the fourth pad extends, the third pad with the fourth pad passes through the interconnecting link electricity is connected.
5. The circuit board structure according to claim 1, wherein:
the height of the first component is equal to the height of the third circuit board in the direction from the first circuit board to the second circuit board.
6. The circuit board structure according to claim 1, wherein:
the at least one first component is a first component which is arranged in the center of the bearing area;
the at least one first component comprises a plurality of first components, and the plurality of first components are uniformly distributed in the bearing area.
7. The circuit board structure according to claim 1, wherein:
the circuit board structure comprises a plurality of first components, and in the direction of the first circuit board towards the second circuit board, the height difference between the first components is smaller than or equal to a preset height difference.
8. An electronic device, characterized in that the electronic device comprises a circuit board structure according to any one of claims 1 to 7.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150119.1A CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
| PCT/CN2019/107755 WO2020063645A1 (en) | 2018-09-29 | 2019-09-25 | Circuit board structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811150119.1A CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109041418A CN109041418A (en) | 2018-12-18 |
| CN109041418B true CN109041418B (en) | 2020-08-11 |
Family
ID=64615065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811150119.1A Active CN109041418B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109041418B (en) |
| WO (1) | WO2020063645A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109041418B (en) * | 2018-09-29 | 2020-08-11 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| WO2021244530A1 (en) * | 2020-06-02 | 2021-12-09 | 苏州旭创科技有限公司 | Circuit board assembly, assembling method, and optical module |
| CN113692116A (en) * | 2021-07-16 | 2021-11-23 | 苏州浪潮智能科技有限公司 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
| TWI824318B (en) | 2021-10-14 | 2023-12-01 | 欣興電子股份有限公司 | Circuit board connection structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730060A (en) * | 1993-07-12 | 1995-01-31 | Rohm Co Ltd | Structure of both-sided hybrid integrated circuit device |
| CN1652663A (en) * | 2004-02-02 | 2005-08-10 | 松下电器产业株式会社 | Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| CN100442491C (en) * | 2004-08-11 | 2008-12-10 | 索尼株式会社 | Electronic circuit device |
| CN108353500A (en) * | 2015-11-27 | 2018-07-31 | 索尼公司 | Board device and the method for manufacturing board device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040089943A1 (en) * | 2002-11-07 | 2004-05-13 | Masato Kirigaya | Electronic control device and method for manufacturing the same |
| JP2006024900A (en) * | 2004-06-09 | 2006-01-26 | Nippon Dempa Kogyo Co Ltd | Structure with multiple substrates, manufacturing method therefor, and crystal oscillator using the structure |
| CN204046940U (en) * | 2014-08-26 | 2014-12-24 | 安捷利电子科技（苏州）有限公司 | The encapsulating structure of novel embedded type component and circuit board |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN105516407B (en) * | 2015-12-21 | 2018-11-13 | 惠州Tcl移动通信有限公司 | Mobile terminal and its circuit board assemblies |
| CN109041418B (en) * | 2018-09-29 | 2020-08-11 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
-
2018
- 2018-09-29 CN CN201811150119.1A patent/CN109041418B/en active Active
-
2019
- 2019-09-25 WO PCT/CN2019/107755 patent/WO2020063645A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730060A (en) * | 1993-07-12 | 1995-01-31 | Rohm Co Ltd | Structure of both-sided hybrid integrated circuit device |
| CN1652663A (en) * | 2004-02-02 | 2005-08-10 | 松下电器产业株式会社 | Stereoscopic electronic circuit device, and relay board and relay frame used therein |
| CN100442491C (en) * | 2004-08-11 | 2008-12-10 | 索尼株式会社 | Electronic circuit device |
| CN108353500A (en) * | 2015-11-27 | 2018-07-31 | 索尼公司 | Board device and the method for manufacturing board device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109041418A (en) | 2018-12-18 |
| WO2020063645A1 (en) | 2020-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109041418B (en) | Circuit board structure and electronic equipment | |
| CN109121285B (en) | Circuit board structure and electronic equipment | |
| CN110337178B (en) | Circuit board assembly and electronic equipment | |
| KR100904710B1 (en) | Flexible printed circuit board, junction method thereof and battery pack using the same | |
| US11641072B2 (en) | PCB-pinout based packaged module and method for preparing PCB-pinout based packaged module | |
| CA3143077C (en) | Printed circuit board assembly and terminal | |
| AU2017403198B2 (en) | Mainboard for consumer electronic product, and terminal | |
| CN213694596U (en) | Circuit board structure and electronic equipment | |
| CN110730561A (en) | Circuit board structure and electronic equipment | |
| CN107197595B (en) | Printed circuit board and welding design thereof | |
| CN114206000B (en) | Circuit board assembly and electronic equipment | |
| JP5609451B2 (en) | Connector, optical transmission device and connector connection method | |
| US20070238324A1 (en) | Electrical connector | |
| JP2019145766A (en) | Printed circuit board | |
| CN212519571U (en) | Printed circuit board assembly and terminal | |
| CN209747758U (en) | PCB connector, PCB, electronic equipment and mobile terminal | |
| US10660218B2 (en) | Method of manufacturing multilayer circuit board | |
| CN219068491U (en) | Nested printed circuit board | |
| CN220235062U (en) | Earphone bonding pad wiring structure | |
| CN111787690A (en) | Circuit board | |
| JP2016046338A (en) | Flexible printed circuit board | |
| CN216057633U (en) | Binding structure of circuit board, circuit board and electric device | |
| CN111954375B (en) | Communication structure and manufacturing method thereof | |
| CN221598227U (en) | Soft board subassembly and battery protection shield | |
| CN217884022U (en) | Circuit board stacking structure and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |