CN113692116A - Integrated circuit board assembly, manufacturing method thereof and electronic equipment - Google Patents
Integrated circuit board assembly, manufacturing method thereof and electronic equipment Download PDFInfo
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- CN113692116A CN113692116A CN202110806673.6A CN202110806673A CN113692116A CN 113692116 A CN113692116 A CN 113692116A CN 202110806673 A CN202110806673 A CN 202110806673A CN 113692116 A CN113692116 A CN 113692116A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000003466 welding Methods 0.000 claims abstract description 48
- 238000005476 soldering Methods 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 22
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000011324 bead Substances 0.000 claims description 4
- 239000011152 fibreglass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000013461 design Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000010354 integration Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
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- 230000000750 progressive effect Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
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Abstract
An integrated circuit board assembly includes a plurality of circuit boards arranged in a vertical direction; the full-terminal device is positioned between two adjacent circuit boards, the upper surface and the lower surface of the full-terminal device are both welding surfaces, and the full-terminal device is connected with the circuit boards through the welding surfaces; a first device on the top surface of the top circuit board. The upper surface and the lower surface of full terminal device are the face of weld, arrange full terminal device in this application between two adjacent circuit boards and be connected with the circuit board, play the effect of support to the circuit board, realize the signal interconnection of two adjacent circuit boards simultaneously, and full terminal device can also play necessary circuit function, need not to introduce other materials in the integrated circuit board subassembly, the layout area of circuit board not only is saved, thereby reduce the area of integrated circuit board subassembly, and can promote the density of the effective device of circuit board unit area, this application still provides an integrated circuit board subassembly manufacturing approach and electronic equipment who has above-mentioned advantage.
Description
Technical Field
The present disclosure relates to circuit board technologies, and in particular, to an integrated circuit board assembly, a manufacturing method thereof, and an electronic device.
Background
With the development of technology, electronic devices are gradually miniaturized to meet the requirements of people on portability. The circuit board is an important part occupying the plane area of the electronic equipment, and the high integration circuit board becomes the key point of miniaturization of the electronic equipment.
At present, in order to increase the number of devices on a circuit board per unit area and increase the integration level of the circuit board, the circuit board is designed to be stacked, and the devices are disposed on the circuit board. The circuit boards are supported by the frame plate between two adjacent circuit boards in the vertical direction, and meanwhile, the surfaces of the frame plate, which are in contact with the upper circuit board and the lower circuit board, are provided with independent welding pads, so that independent welding spots are formed through reflow soldering, and further, the input and output signals of the upper circuit board and the lower circuit board are interconnected. Due to the addition of the frame plate, the material cost of the integrated circuit board is increased, and meanwhile, the process welding difficulty is high, so that the processing cost is high; and the frame plate only has the functions of supporting and interconnecting, has no practical effect on signals, reduces the density of effective devices and ensures that the integration level is still not high enough.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The present application provides an integrated circuit board assembly, a method for manufacturing the same, and an electronic device, so as to increase the effective device density on a circuit board and reduce the area of the integrated circuit board assembly.
In order to solve the above technical problem, the present application provides an integrated circuit board assembly, including:
a plurality of circuit boards arranged in a vertical direction;
the full-terminal device is positioned between two adjacent circuit boards, the upper surface and the lower surface of the full-terminal device are both welding surfaces, and the full-terminal device is connected with the circuit boards through the welding surfaces;
and the first device is positioned on the upper surface of the circuit board at the top layer.
Optionally, the number of the full-terminal devices between two adjacent circuit boards is one.
Optionally, when the number of the full-terminal devices between two adjacent circuit boards is multiple, and multiple full-terminal devices are distributed along the outer edge of the circuit board, the method further includes:
a chip on the circuit board.
Optionally, the method further includes:
and the second device is positioned on the lower surface of the circuit board and is within the range of the full-terminal devices, and the height of the second device is smaller than that of the full-terminal devices.
Optionally, the full-terminal device is any one or any combination of a capacitor, a resistor, a magnetic bead, and an inductor.
Optionally, the circuit board is a glass fiber hard circuit board.
The application also provides a manufacturing method of the integrated circuit board assembly, which comprises the following steps:
obtaining a first device, a full-terminal device, and a plurality of circuit boards;
soldering the first device to an upper surface of the circuit board at a top layer;
and respectively and successively welding the welding surfaces of the full-terminal device with the surfaces of the circuit board on the top layer, which are opposite to the upper surface, and the surfaces of the rest circuit boards to obtain an integrated circuit board assembly, wherein the welding surfaces are the upper surface and the lower surface of the full-terminal device.
Optionally, when the number of the circuit boards is greater than or equal to three and the number of the full-terminal devices between two adjacent circuit boards is one, the successively welding the welding surfaces of the full-terminal devices with the surfaces of the circuit board on the top layer, which are opposite to the upper surface, and the surfaces of the other circuit boards respectively comprises:
step S1: welding the upper surface of the full-terminal device with the lower surface of the circuit board on the top layer, wherein the lower surface is opposite to the upper surface;
step S2: soldering an upper surface of the circuit board adjacent to the circuit board at the top layer to a lower surface of the full-terminal device;
step S3: and taking the circuit board adjacent to the circuit board at the top layer as a new circuit board at the top layer, and returning to the step S1 until all the circuit boards and all the full-terminal devices are welded.
Optionally, when the number of the circuit boards is two and the number of the full-terminal devices between two adjacent circuit boards is one, the soldering the first device to the upper surface of the circuit board on the top layer includes:
soldering a plurality of the first devices to an upper surface of a plurality of the circuit boards at a top level of a splice;
correspondingly, the soldering the full-terminal device between the surface of the circuit board on the top layer opposite to the upper surface and the rest of the circuit boards comprises:
respectively welding the full-terminal devices on the surfaces, opposite to the upper surface, of the plurality of spliced circuit boards on the top layer;
dividing a plurality of spliced circuit boards on the top layer to obtain a single circuit board welded with the first device and the full-terminal device;
soldering full-terminal devices on the single circuit board to the circuit board at the lowermost layer.
The present application further provides an electronic device comprising any of the above integrated circuit board assemblies.
The application provides an integrated circuit board assembly, includes: a plurality of circuit boards arranged in a vertical direction; the full-terminal device is positioned between two adjacent circuit boards, the upper surface and the lower surface of the full-terminal device are both welding surfaces, and the full-terminal device is connected with the circuit boards through the welding surfaces; and the first device is positioned on the upper surface of the circuit board at the top layer.
It can be seen that the integrated circuit board assembly in the present application includes a plurality of circuit boards, a full-terminal device and a first device, the first device is disposed on the upper surface of the top circuit board, the upper surface and the lower surface of the full-terminal device are both soldering surfaces, so the full-terminal device has the characteristic of double-sided soldering, the full-terminal device is disposed between two adjacent circuit boards and connected with the circuit boards through the upper surface and the lower surface, which plays a supporting role for the circuit boards, and simultaneously realizes the signal interconnection of two adjacent circuit boards, and the full-terminal device can also play a necessary circuit function, no other materials need to be introduced into the whole integrated circuit board assembly, all the integrated circuit boards are effective devices, on one hand, the layout area of the circuit boards is saved, thereby the area of the integrated circuit board assembly is reduced, on the other hand, the density of the effective devices per unit area of the circuit boards can be increased, and, the preparation process can adopt the mature existing process and is simple; in addition, the integrated circuit board assembly is in a modular design, and the compatibility of hardware design can be greatly improved.
In addition, the application also provides an integrated circuit board assembly manufacturing method and electronic equipment with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art integrated circuit board assembly;
fig. 2 is a schematic structural diagram of an integrated circuit board assembly according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of another embodiment of an integrated circuit board assembly;
fig. 4 is a schematic structural diagram of another integrated circuit board assembly provided in an embodiment of the present application;
fig. 5 is a flowchart illustrating a method for fabricating an integrated circuit board assembly according to an embodiment of the present disclosure;
fig. 6 is a flowchart of another method for manufacturing an integrated circuit board assembly according to an embodiment of the present disclosure.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background section, at present, the frame plate 3 'is arranged between two adjacent circuit boards in the vertical direction to support the top circuit board 2' and the bottom circuit board 1', and meanwhile, the surfaces of the frame plate 3' contacting the upper circuit board and the lower circuit board are provided with independent pads, and independent welding points are formed through reflow soldering, so that the input and output signal interconnection of the upper circuit board and the lower circuit board is realized, and the chip 4 'and the device 5' can be further soldered on the top circuit board 2 'and the bottom circuit board 1', as shown in fig. 1. Due to the addition of the frame plate, the material cost of the integrated circuit board is increased, and meanwhile, the process welding difficulty is high, so that the processing cost is high; and the frame plate only has the functions of supporting and interconnecting, has no practical effect on signals, reduces the density of effective devices and ensures that the integration level is still not high enough.
In view of the above, the present application provides an integrated circuit board assembly, please refer to fig. 2, and fig. 2 is a schematic structural diagram of an integrated circuit board assembly according to an embodiment of the present application, including:
a plurality of circuit boards 1 arranged in a vertical direction;
the full-terminal device 2 is positioned between two adjacent circuit boards 1, the upper surface and the lower surface of the full-terminal device 2 are both welding surfaces, and the full-terminal device 2 is connected with the circuit boards 1 through the welding surfaces;
a first device 3 located on the upper surface of the circuit board 1 on the top layer.
It should be noted that the number of the circuit boards 1 is not specifically limited in the present application, as the case may be. The number of the circuit boards 1 is two or more. The full-terminal device 2 can also serve as an input-output interface of the circuit board 1.
The type of the first device 3 is not particularly limited in this application, and may be set by itself. For example, the first device 3 may be a full-terminal device, or a half-terminal device. Only the upper surface or the lower surface of the half-terminal device is a soldering surface through which the half-terminal device is soldered to the circuit board 1 on the top layer. The upper and lower surfaces of the full terminal device are both bonding surfaces that can be used for bonding, which is a characteristic of the full terminal device itself.
It should be noted that the number of the full-terminal devices 2 between two adjacent circuit boards 1 is not specifically limited in this application, as the case may be. For example, the number of the full-terminal devices 2 between two adjacent circuit boards 1 is one, as shown in fig. 2, the number of the circuit boards 1 in fig. 2 is two; when the number of the circuit boards 1 is three, the structure of the integrated circuit board assembly is schematically shown in fig. 3, and so on, the number of the circuit boards 1 may be larger. The number of the circuit boards 1 in fig. 2 is two, and the two circuit boards are the simplest capacitor parallel filter circuits or RC parallel circuits, the first device 3 and the two full-terminal devices 2 in fig. 3 are physically connected in parallel through the circuit boards 1 except the circuit board 1 at the bottom layer, the parallel connection requirement of a plurality of devices on the circuit is met, and the layout area gain of the circuit board 1 can be increased to more than 100%.
Referring to fig. 4, fig. 4 is a schematic structural diagram of another integrated circuit board assembly according to an embodiment of the present disclosure. When the number of the full-terminal devices 2 between two adjacent circuit boards 1 is multiple, and multiple full-terminal devices 2 are distributed along the outer edge of the circuit board 1, the method further includes:
and the chip 4 is positioned on the circuit board 1, and the chip 4 can control the integrated circuit board assembly to realize more complex circuit functions, so that the functions of the integrated circuit board assembly are more diversified, and the application range is wider.
It should be noted that, in fig. 2 to 4, the circuit board 1 to which the devices are connected on both the upper surface and the lower surface, that is, the circuit board 1 except for the circuit board 1 on the lowermost layer has metal vias, so as to realize signal parallel connection between the full-terminal device 2 and between the full-terminal device 2 and the first device 3. The circuit board 1 at the lowermost layer determines whether to provide metal vias as required.
The number of chips 4 is not specifically limited in this application, and may be set by itself. Further, the position of the circuit board 1 on which the chip 4 is located is not specifically limited in this application, and the chip 4 may be disposed on any circuit board 1.
It should be noted that fig. 4 shows the number of the circuit boards 1 as two, but the number of the circuit boards 1 is not limited to two, and may be three or more, and is specifically set as needed.
Further, the integrated circuit board assembly further includes: and the second devices 5 are positioned on the lower surface of the circuit board 1 and are within the range of the full-terminal devices 2, and the height of the second devices 5 is smaller than that of the full-terminal devices 2.
Because the second device 5 is located in the range of the full-terminal devices 2, and the full-terminal devices 2 are located between the two adjacent circuit boards 1, the height of the second device 5 needs to be smaller than the height of the full-terminal devices 2, otherwise, the two adjacent circuit boards 1 cannot be connected through the full-terminal devices 2. The full-terminal device 2 can also serve as an input-output interface of the circuit board 1.
The second device 5 may be a half-terminal device or a full-terminal device 2, and is not particularly limited in this application. Further, the kind of the second device 5 is not particularly limited in this application, as the case may be. For example, the second device 5 may be a resistor, or a capacitor, or an inductor, etc.
The full-terminal device 2 includes, but is not limited to, any one or any combination of a capacitor, a resistor, a magnetic bead, and an inductor. It will be appreciated that when the number of circuit boards 1 in the integrated circuit board assembly is two and the number of full-terminal devices 2 between two circuit boards 1 is one, the full-terminal devices 2 may be any one of capacitors, resistors, beads, inductors, or other types of devices as desired. When the number of the circuit boards 1 in the integrated circuit board assembly is three or more, and the number of the full-terminal devices 2 between the two circuit boards 1 is one, the number of the full-terminal devices 2 in the integrated circuit board assembly is more than two, and the types of the full-terminal devices 2 can be one or more, and can be set as required.
In order to reduce the difficulty of the processing technology, preferably, the circuit board is a glass fiber hard circuit board. In order to improve the flexibility of the integrated circuit board assembly, the circuit board can also be a flexible circuit board. However, the present application is not limited to this, and the circuit board 1 may be a ceramic circuit board, etc. as another possible embodiment.
The thickness of the circuit boards 1 except the circuit board 1 at the bottom layer can be set according to the actual processing capacity and the design requirement of the height in the vertical direction, and the thickness is generally in the range of 0.2 mm-0.5 mm. The thickness of the circuit board 1 positioned at the lowermost layer is greater than the thickness of the other circuit boards 1.
The integrated circuit board assembly comprises a plurality of circuit boards 1, full-terminal devices 2 and first devices 3, wherein the first devices 3 are arranged on the upper surface of a top circuit board 1, the upper surface and the lower surface of each full-terminal device 2 are both welding surfaces, so the full-terminal devices 2 have the characteristic of double-sided welding, the full-terminal devices 2 are arranged between two adjacent circuit boards 1 and are connected with the circuit boards 1 through the upper surfaces and the lower surfaces, the circuit boards 1 are supported, signal interconnection of the two adjacent circuit boards 1 is realized simultaneously, the full-terminal devices 2 can also play a necessary circuit function, other materials do not need to be introduced into the whole integrated circuit board assembly, the integrated circuit boards 1 are all effective devices, on one hand, the layout area of the circuit boards 1 is saved, the area of the integrated circuit board assembly is reduced, on the other hand, the density of the effective devices in unit area of the circuit boards 1 can be improved, moreover, the preparation process can adopt the mature existing process and is simple; in addition, the integrated circuit board assembly is in a modular design, and the compatibility of hardware design can be greatly improved.
Referring to fig. 5, fig. 5 is a flowchart of a method for manufacturing an integrated circuit board assembly according to an embodiment of the present disclosure, where the method includes:
step S101: a first device, a full-terminal device, and a plurality of circuit boards are obtained.
The number of the circuit boards is not specifically limited in the application, and is selected according to the requirement. The number of the circuit boards is more than or equal to two.
Step S102: and soldering the first device to the upper surface of the circuit board on the top layer.
The soldering method can be selected from reflow soldering, so that the soldering temperature and the manufacturing cost are easier to control, and oxidation can be avoided in the soldering process.
Step S103: and respectively and successively welding the welding surfaces of the full-terminal device with the surfaces of the circuit board on the top layer, which are opposite to the upper surface, and the surfaces of the rest circuit boards to obtain an integrated circuit board assembly, wherein the welding surfaces are the upper surface and the lower surface of the full-terminal device.
It should be noted that the one-side sequential soldering in this step means that only one soldering surface of the all-terminal device is soldered to the surface of the circuit board at each soldering time, and two soldering surfaces of the all-terminal device cannot be soldered to the circuit board to be connected at the same time, which cannot be realized technically.
The soldering mode in the step can also be selected from reflow soldering, so that the soldering temperature and the manufacturing cost are easier to control, and oxidation can be avoided in the soldering process.
In order to avoid the reliability risk caused by the introduction of multiple high-temperature reflows of the first device and the full-terminal device, when the full-terminal device is welded with the circuit board at the bottommost layer, the solder paste between the full-terminal device and the circuit board at the bottommost layer can adopt low-temperature solder paste, so that the introduction of a high-temperature environment is avoided.
The integrated circuit board assembly manufactured in the embodiment comprises a plurality of circuit boards, full-terminal devices and first devices, wherein the first devices are arranged on the upper surface of the top circuit board, and the upper surfaces and the lower surfaces of the full-terminal devices are both welding surfaces, so that the full-terminal devices have the characteristic of double-sided welding, the full-terminal devices are arranged between two adjacent circuit boards and are connected with the circuit boards through the upper surfaces and the lower surfaces, the circuit boards are supported, signal interconnection of the two adjacent circuit boards is realized, the full-terminal devices can also play a necessary circuit function, other materials are not required to be introduced into the whole integrated circuit board assembly, the integrated circuit boards are all effective devices, on one hand, the layout area of the circuit boards is saved, the area of the integrated circuit board assembly is reduced, on the other hand, the density of the effective devices in unit area of the circuit boards can be improved, in addition, the integrated circuit board assembly is in modular design, and compatibility of hardware design can be greatly improved.
On the basis of the foregoing embodiment, in an embodiment of the present application, when the number of the circuit boards is greater than or equal to three and the number of the full-terminal devices between two adjacent circuit boards is one, the sequentially soldering the soldering surfaces of the full-terminal devices to the surface of the circuit board on the top layer opposite to the upper surface and the surfaces of the other circuit boards on a single surface includes:
step S1: welding the upper surface of the full-terminal device with the lower surface of the circuit board on the top layer, wherein the lower surface is opposite to the upper surface;
step S2: soldering an upper surface of the circuit board adjacent to the circuit board at the top layer to a lower surface of the full-terminal device;
step S3: and taking the circuit board adjacent to the circuit board at the top layer as a new circuit board at the top layer, and returning to the step S1 until all the circuit boards and all the full-terminal devices are welded.
On the basis of the foregoing embodiment, in an embodiment of the present application, when the number of the circuit boards is two, and the number of the full-terminal devices between two adjacent circuit boards is one, the one-side successive soldering of the soldering surfaces of the full-terminal devices with the surface of the circuit board on the top layer opposite to the upper surface and the surfaces of the other circuit boards respectively includes:
welding the upper surface of the full-terminal device with the lower surface of the circuit board on the top layer, wherein the lower surface is opposite to the upper surface;
and welding the upper surface of the circuit board at the bottom layer with the lower surface of the full-terminal device.
On the basis of the above embodiment, in an embodiment of the present application, when the number of the full-terminal devices between two adjacent circuit boards is multiple, and the multiple full-terminal devices are distributed along the outer edge of the circuit board and are provided with chips, taking the circuit board with the chip disposed on the top layer as an example, the manufacturing method of the integrated circuit board assembly includes:
step S201: obtaining a first device, a full-terminal device, a chip and a plurality of circuit boards;
step S202: soldering a first device and a chip to an upper surface of the circuit board at a top layer;
step S203: and respectively and successively welding the welding surfaces of the full-terminal device with the surfaces of the circuit board on the top layer, which are opposite to the upper surface, and the surfaces of the rest circuit boards to obtain an integrated circuit board assembly, wherein the welding surfaces are the upper surface and the lower surface of the full-terminal device.
In this embodiment, two circuit boards are taken as an example for explanation, and it can be understood that when the number of the circuit boards is greater than two and the chips are simultaneously located on a plurality of circuit boards, the chips are soldered on the set circuit boards and the full-terminal devices are soldered between the adjacent circuit boards, and the manufacturing processes are similar and are not described in detail herein.
Referring to fig. 6, fig. 6 is a flowchart of another method for manufacturing an integrated circuit board assembly according to an embodiment of the present application, where when the number of the circuit boards is two and the number of the full-terminal devices between two adjacent circuit boards is one, the method includes:
step S301: a first device, a full-terminal device, and a plurality of circuit boards are obtained.
In the step, a plurality of circuit boards are spliced together.
Step S302: a plurality of first devices are soldered to the upper surfaces of the plurality of spliced circuit boards on the top layer.
In the step, one circuit board is welded with one first device in the plurality of spliced circuit boards.
Step S303: and respectively welding full-terminal devices on the surfaces of the circuit boards which are spliced and positioned on the top layer and are opposite to the upper surface.
In the circuit boards spliced in the step, one circuit board is welded with one full-terminal device, namely, in the circuit boards spliced in the step, each circuit board is welded with one first device and one full-terminal device.
Step S304: and cutting the circuit boards which are spliced and positioned at the top layer to obtain a single circuit board welded with the first device and the full-terminal device.
Step S305: and welding the full-terminal device on the single circuit board with the circuit board at the bottommost layer to obtain the integrated circuit board assembly.
It should be noted that the order of steps S302 and S303 is not specifically limited in this application, and may be interchanged.
In this embodiment, consider to improve makeup rate and the actual processing degree of difficulty, the circuit board that will be located the top layer sets up to the splice plate of polylith, then weld first device and full terminal device on the circuit board of concatenation, be about to a plurality of circuit boards that are located the top layer splice processing together, first device and the whole welding of full terminal device accomplish the back, divide the board again, obtain the circuit board of solitary welding first device and full terminal device, later with the circuit board of solitary welding first device and full terminal device as a whole reflow soldering to the circuit board of bottom again, promote the efficiency of manufacture.
On the basis of the above embodiment, when the number of the circuit boards is equal to three, the integrated circuit board assembly manufacturing process further includes, after step S304:
welding the full-terminal devices on the single circuit boards with the upper surfaces of the spliced circuit boards adjacent to the circuit board on the top layer;
welding full-terminal devices on the lower surfaces of the plurality of spliced circuit boards adjacent to the circuit board on the top layer;
dividing a plurality of spliced circuit boards adjacent to the top circuit board to obtain a single double-layer stacked circuit board structure; the double-layer stacked circuit board structure body sequentially comprises a full-terminal device, a circuit board, a full-terminal device, a circuit board and a first device from bottom to top;
accordingly, step S305: soldering the full-terminal devices on the single circuit board to the circuit board at the bottom layer to obtain an integrated circuit board assembly comprising:
and welding the full-terminal device at the lowermost end of the double-layer stacked circuit board structure body with the circuit board at the bottommost layer to obtain the integrated circuit board assembly.
It should be noted that, when the number of the circuit boards is four or more, the manufacturing process is analogized, and details are not described in this application.
It should be noted that, for an integrated circuit board assembly including a chip, in order to improve manufacturing efficiency, circuit boards other than the bottommost circuit board may also be set as a splice board, and for a specific process, reference is made to the above related embodiments, and details are not repeated here.
The application further provides an electronic device comprising the integrated circuit board assembly of any of the above embodiments.
Electronic devices include, but are not limited to, laptops, tablets, cell phones, voice players, smart watches, and the like.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The integrated circuit board assembly, the manufacturing method thereof and the electronic device provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. An integrated circuit board assembly, comprising:
a plurality of circuit boards arranged in a vertical direction;
the full-terminal device is positioned between two adjacent circuit boards, the upper surface and the lower surface of the full-terminal device are both welding surfaces, and the full-terminal device is connected with the circuit boards through the welding surfaces;
and the first device is positioned on the upper surface of the circuit board at the top layer.
2. The integrated circuit board assembly of claim 1, wherein the number of full-terminal devices between two adjacent circuit boards is one.
3. The integrated circuit board assembly of claim 1, wherein when the number of full-terminal devices between two adjacent circuit boards is plural and the plural full-terminal devices are distributed along the outer edge of the circuit boards, further comprising:
a chip on the circuit board.
4. The integrated circuit board assembly of claim 3, further comprising:
and the second device is positioned on the lower surface of the circuit board and is within the range of the full-terminal devices, and the height of the second device is smaller than that of the full-terminal devices.
5. The integrated circuit board assembly of claim 1, wherein the full terminal device is any one or any combination of a capacitor, a resistor, a magnetic bead, an inductor.
6. The integrated circuit board assembly of any one of claims 1-5, wherein the circuit board is a fiberglass rigid circuit board.
7. A method of fabricating an integrated circuit board assembly, comprising:
obtaining a first device, a full-terminal device, and a plurality of circuit boards;
soldering the first device to an upper surface of the circuit board at a top layer;
and respectively and successively welding the welding surfaces of the full-terminal device with the surfaces of the circuit board on the top layer, which are opposite to the upper surface, and the surfaces of the rest circuit boards to obtain an integrated circuit board assembly, wherein the welding surfaces are the upper surface and the lower surface of the full-terminal device.
8. The method for manufacturing an integrated circuit board assembly according to claim 7, wherein when the number of the circuit boards is equal to or greater than three and the number of the full-terminal devices between two adjacent circuit boards is one, the step of soldering the soldering surfaces of the full-terminal devices to the surface of the circuit board on the top layer opposite to the upper surface and the surfaces of the rest of the circuit boards one by one comprises:
step S1: welding the upper surface of the full-terminal device with the lower surface of the circuit board on the top layer, wherein the lower surface is opposite to the upper surface;
step S2: soldering an upper surface of the circuit board adjacent to the circuit board at the top layer to a lower surface of the full-terminal device;
step S3: and taking the circuit board adjacent to the circuit board at the top layer as a new circuit board at the top layer, and returning to the step S1 until all the circuit boards and all the full-terminal devices are welded.
9. The method of fabricating an integrated circuit board assembly according to claim 7, wherein when the number of the circuit boards is two and the number of the full-terminal devices between two adjacent circuit boards is one, the soldering the first device to the upper surface of the circuit board at the top layer includes:
soldering a plurality of the first devices to an upper surface of a plurality of the circuit boards at a top level of a splice;
correspondingly, the soldering the full-terminal device between the surface of the circuit board on the top layer opposite to the upper surface and the rest of the circuit boards comprises:
respectively welding the full-terminal devices on the surfaces, opposite to the upper surface, of the plurality of spliced circuit boards on the top layer;
dividing a plurality of spliced circuit boards on the top layer to obtain a single circuit board welded with the first device and the full-terminal device;
soldering full-terminal devices on the single circuit board to the circuit board at the lowermost layer.
10. An electronic device comprising the integrated circuit board assembly of any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110806673.6A CN113692116A (en) | 2021-07-16 | 2021-07-16 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110806673.6A CN113692116A (en) | 2021-07-16 | 2021-07-16 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
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| Publication Number | Publication Date |
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| CN113692116A true CN113692116A (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110806673.6A Pending CN113692116A (en) | 2021-07-16 | 2021-07-16 | Integrated circuit board assembly, manufacturing method thereof and electronic equipment |
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| Country | Link |
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| CN (1) | CN113692116A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060245308A1 (en) * | 2005-02-15 | 2006-11-02 | William Macropoulos | Three dimensional packaging optimized for high frequency circuitry |
| CN109041418A (en) * | 2018-09-29 | 2018-12-18 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
| CN109121292A (en) * | 2018-09-29 | 2019-01-01 | 维沃移动通信有限公司 | A kind of board structure of circuit, production method and electronic equipment |
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2021
- 2021-07-16 CN CN202110806673.6A patent/CN113692116A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060245308A1 (en) * | 2005-02-15 | 2006-11-02 | William Macropoulos | Three dimensional packaging optimized for high frequency circuitry |
| CN109041418A (en) * | 2018-09-29 | 2018-12-18 | 维沃移动通信有限公司 | A kind of board structure of circuit and electronic equipment |
| CN109121292A (en) * | 2018-09-29 | 2019-01-01 | 维沃移动通信有限公司 | A kind of board structure of circuit, production method and electronic equipment |
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Application publication date: 20211123 |