CN212519571U - Printed circuit board assembly and terminal - Google Patents
Printed circuit board assembly and terminal Download PDFInfo
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- CN212519571U CN212519571U CN202020601842.3U CN202020601842U CN212519571U CN 212519571 U CN212519571 U CN 212519571U CN 202020601842 U CN202020601842 U CN 202020601842U CN 212519571 U CN212519571 U CN 212519571U
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Abstract
The embodiment of the application provides a printed circuit board assembly and terminal, relates to surface mounting technology field, can reduce the whole tiled area of printed circuit board assembly and occupy to be favorable to the frivolous design at terminal. A printed circuit board assembly comprising: the first element is fixedly connected to the printed circuit board and electrically connected to the printed circuit board; a second component positioned between the first component and the printed circuit board, the second component being electrically connected to the printed circuit board.
Description
Technical Field
The application relates to the technical field of surface mounting, in particular to a printed circuit board assembly and a terminal.
Background
A terminal such as a mobile phone is provided with a Printed Circuit Board Assembly (PCBA). As shown in fig. 1 and fig. 2, fig. 1 is a top view of a Printed Circuit Board assembly in the prior art, and fig. 2 is a schematic cross-sectional view along AA' in fig. 1, in the prior art, a first element 01 and a second element 02 are tiled and soldered on a Printed Circuit Board 03 (PCB). The occupation of the whole tiled area of the printed circuit board assembly becomes a limitation condition for the lightness and thinness of the terminal.
SUMMERY OF THE UTILITY MODEL
This application technical scheme provides a printed circuit board subassembly and terminal, can reduce the whole tiling area of printed circuit board subassembly and occupy to be favorable to the frivolous design at terminal.
In a first aspect, an embodiment of the present application provides a printed circuit board assembly, including: the first element is fixedly connected to the printed circuit board and electrically connected to the printed circuit board; a second component positioned between the first component and the printed circuit board, the second component being electrically connected to the printed circuit board.
Optionally, a side surface of the printed circuit board adjacent to the first component is provided with a recess in which the second component is soldered to the printed circuit board.
Optionally, the first component is soldered to the printed circuit board, and the soldering position between the first component and the printed circuit board is located outside the recess.
Optionally, the printed circuit board assembly further comprises: the embedded adapter plate is positioned between the printed circuit board and the first element, and the second element is positioned inside the embedded adapter plate; the embedded adapter plate is fixedly connected to the printed circuit board and the first element.
Optionally, the embedded interposer is welded to the printed circuit board through a plurality of first interposer pads, the embedded interposer is welded to the first element through a plurality of second interposer pads, and the plurality of first interposer pads and the plurality of second interposer pads correspond one to one; each first interposer pad and the corresponding second interposer pad are electrically connected by a wire in the buried interposer.
Optionally, each first interposer pad and the corresponding second interposer pad are opposite in a thickness direction of the printed circuit board assembly; at least one first interposer pad and a corresponding second interposer pad are electrically connected by a conductive trace in the buried interposer extending in a thickness direction of the printed circuit board assembly.
Optionally, the plurality of first interposer pads comprise first heat dissipation pads, and the plurality of second interposer pads comprise second heat dissipation pads corresponding to the first heat dissipation pads; the first and second heat sink pads are connected by a hollow conductor structure.
Optionally, each first interposer pad and the corresponding second interposer pad are opposite in a thickness direction of the printed circuit board assembly; at least one first adapter plate bonding pad and the corresponding second adapter plate bonding pad are electrically connected through the bent and extended wires in the embedded adapter plate.
Optionally, a strength enhancing material is filled between the first element and the buried interposer.
Optionally, the first element is an active element and the second element is a passive element.
Optionally, the printed circuit board assembly further comprises: a third component positioned between the first component and the printed circuit board, the third component being positioned outside the buried interposer, the third component being electrically connected to the printed circuit board.
In a second aspect, embodiments of the present application provide a terminal including the printed circuit board assembly described above.
Printed circuit board assembly and terminal in this application embodiment through making to connect range upon range of setting between first component and the second component on same printed circuit board, has reduced printed circuit board assembly's whole tiling area and has taken up to be favorable to the frivolous design of terminal.
Drawings
FIG. 1 is a top view of a prior art printed circuit board assembly;
FIG. 2 is a schematic cross-sectional view along AA' of FIG. 1;
FIG. 3 is a schematic structural diagram of a printed circuit board according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a printed circuit board assembly according to an embodiment of the present application;
FIG. 5 is a top view of the printed circuit board assembly of FIG. 4;
FIG. 6 is a schematic cross-sectional view along direction BB' in FIG. 5;
FIG. 7 is a schematic diagram of another printed circuit board according to an embodiment of the present disclosure;
fig. 8 is a perspective view of an embodiment of an embedded interposer;
fig. 9 is a schematic structural view of another printed circuit board assembly according to an embodiment of the present application;
FIG. 10 is a perspective schematic view of the printed circuit board assembly of FIG. 9;
FIG. 11 is a top view of the printed circuit board assembly of FIG. 10;
FIG. 12a is a schematic cross-sectional view taken along line CC' of FIG. 11;
FIG. 12b is a schematic cross-sectional view in direction DD' of FIG. 11;
FIG. 13 is a top view of another printed circuit board assembly in accordance with an embodiment of the present application;
FIG. 14 is a schematic cross-sectional view in the direction DD' in FIG. 13;
fig. 15 is a schematic flow chart illustrating one soldering method of the printed circuit board assembly according to the embodiment of the present application;
fig. 16 is a schematic flow chart illustrating another soldering method for a printed circuit board assembly according to an embodiment of the present application;
fig. 17 is a schematic flow chart illustrating another soldering method for a printed circuit board assembly according to an embodiment of the present application;
fig. 18 is a schematic cross-sectional view of another printed circuit board assembly according to an embodiment of the present application;
fig. 19 is a schematic view of a soldering process for the printed circuit board assembly of fig. 18;
FIG. 20 is a bottom pad layout of three first components in an embodiment of the present application;
FIG. 21 is a schematic diagram of another printed circuit board according to an embodiment of the present application;
FIG. 22 is a schematic cross-sectional view of the direction FF' in FIG. 21;
FIG. 23 is a schematic view of another cross-sectional structure of the direction FF' in FIG. 21.
Detailed Description
The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.
As shown in fig. 3 to 6, fig. 3 is a schematic structural diagram of a printed circuit board in an embodiment of the present application, fig. 4 is a schematic structural diagram of a printed circuit board assembly in an embodiment of the present application, fig. 5 is a top view of the printed circuit board assembly in fig. 4, and fig. 6 is a schematic structural diagram of a cross section along direction BB' in fig. 5, which provides a printed circuit board assembly in an embodiment of the present application, including: a printed circuit board 1 and a first component 21, the first component 21 being fixedly connected to the printed circuit board 1 and the first component 21 being electrically connected to the printed circuit board 1; a second component 22 located between the first component 21 and the printed circuit board 1, the second component 22 being electrically connected to the printed circuit board 1.
In particular, the provision of the second component 22 between the first component 21 and the printed circuit board 1 makes it possible to reduce the area of the printed circuit board 1, as long as it is ensured that the connection between the first component 21 and the printed circuit board 1 does not affect the second component 22. For example, the surface of the printed circuit board 1 is provided with a plurality of circuit board pads 3, some of the circuit board pads 3 are used for realizing the soldering with the first component 21, if the circuit board pads 3 used for soldering the first component 21 and the printed circuit board 1 are not fully paved on the surface of the printed circuit board 1, the space outside the circuit board pads 3 can be utilized, the second component 22 with smaller occupied space is arranged between the first component 21 and the printed circuit board 1, so that the first component 21 and the second component 22 connected with the same printed circuit board 1 are arranged in a stacking manner in the thickness direction of the printed circuit board 1, and the whole tiled area occupation of the printed circuit board assembly is reduced, namely the area occupation of the printed circuit board assembly in the direction perpendicular to the thickness direction is reduced. In the embodiment of the present application, the tiling area means an area occupied in a plane perpendicular to the thickness direction of the printed circuit board assembly. If the second component 22 is electrically connected to the printed circuit board 1 by soldering, the surface of the printed circuit board 1 is further provided with other circuit board pads 3 for realizing the soldering between the second component 22 and the printed circuit board 1, the surface of the first component 21 is provided with first component pads 210, the first component pads 210 and the corresponding circuit board pads 3 are soldered by solder 5, the surface of the second component 22 is provided with second component pads 220, and the second component pads 220 and the corresponding circuit board pads 3 are soldered by solder 5.
Printed circuit board assembly in this application embodiment through making to connect range upon range of setting between the first component on same printed circuit board and the second component, has reduced printed circuit board assembly's whole tiling area and has taken up to be favorable to the frivolous design at terminal.
Alternatively, as shown in fig. 3 to 6, a side surface of the printed circuit board 1 adjacent to the first member 21 is provided with a recess 4, and the second member 22 is soldered to the printed circuit board 1 within the recess 4.
Alternatively, as shown in fig. 3 to 6, the first component 21 is soldered to the printed circuit board 1, and the soldering position between the first component 21 and the printed circuit board 1 is located outside the recess 4.
Specifically, a recess 4 is provided on the printed circuit board 1, the bottom surface of the recess 4 is provided with a circuit board land 3 for soldering a second component 22, and the second component 22 is a component of a small size, for example, a capacitance of 0.22mm high. The printed circuit board 1 comprises circuit board pads 3 which are positioned outside the groove 4 and used for welding the first element 21 and circuit board pads 3 which are positioned in the groove 4 and used for welding the second element 21, and the printed circuit board assembly is described by taking a specific process method as an example. In addition, the solder paste can be printed on the steel mesh at the position of each circuit board pad 3 outside the groove 4, and then the solder paste can be sprayed on each circuit board pad 3 in the groove 4, so that the steel mesh cost can be reduced. In order to ensure the strength and reliability of the whole printed circuit board 1, the thickness of the printed circuit board 1 at the groove 4 may be set to be not less than 0.35 mm. The minimum distance between the second element 22 and the first element 21 after welding is larger than 0.1mm, so that the second element 22 can be prevented from influencing the welding of the first element 21 in the welding process, or the gap after welding is too small to cause the collision between the first element 21 and the second element 22 in a subsequent falling scene.
In addition, in the solder joint drop simulation test, the maximum drop stress corresponding to the solder joint of the first component 21 in the printed circuit board assembly shown in fig. 3 to 6 is 169.1MPa, the maximum drop stress corresponding to the solder joint of the second component 22 is 83MPa, and the maximum drop stress corresponding to the solder joint of the first component 01 in the printed circuit board assembly shown in fig. 1 and 2 isThe stress is 161MPa, and the maximum drop stress corresponding to the welding spot of the second element 02 is 76.3MPa, wherein the greater the drop stress of the welding spot is, the easier the welding spot is to break due to drop, so that compared with the prior art, the structure in the embodiment of the application has the advantages that the drop strength reliability of the first element is improved by 5%, and the drop strength reliability of the second element is improved by 9%. In the solder joint temperature impact simulation test, the equivalent plastic strain of the printed circuit board assembly shown in fig. 3 to 6 corresponding to the solder joint of the first component 21 is 2.23 × 10-2The equivalent plastic strain of the second element 22 at the welding point corresponding to the temperature impact is 0.66 multiplied by 10-2And the equivalent plastic strain of the printed circuit board assembly shown in fig. 1 and 2 corresponding to the temperature impact equivalent plastic strain of the first element 01 at the welding point is 2.06 × 10-2The equivalent plastic strain of the second element 02 welding point corresponding to the temperature impact is 0.65 multiplied by 10-2And the larger the temperature impact equivalent plastic strain is, the easier the solder joint is to break due to temperature impact, so that compared with the prior art, the structure in the embodiment of the application has the advantages that the temperature impact reliability of the first element is improved by 8%, and the temperature impact reliability of the second element is almost unchanged. That is to say, this application embodiment has still improved the reliability of solder joint when having reduced printed circuit board assembly's whole tiling area and taking up.
For example, in a mobile phone terminal, there are a Universal Flash Storage (UFS), a Front End Module (FEM), an accelerometer and gyroscope (a + G), a duplexer, or four rf switches, where the area of the bottom of the UFS without pads is 107.25mm2The area of the bottom of the FEM without bonding pad is 5.25mm2The area of the bottom of the duplexer without a bonding pad is 5mm2The area of the bottom of the A + G without a bonding pad is 2.5mm2The area of the bottom of each of the four radio frequency switches without a bonding pad is 4 multiplied by 2mm2The total area of the bottom of the device without bonding pads in the mobile phone terminal is 128mm2If the above-mentioned thickness is 128mm2The area of the printed circuit board is utilized to arrange other elements, and 128mm of the area of the printed circuit board which is originally and separately occupied can be saved2These areas can be increased if used to increase the space occupied by the cellAdding 100mAh of battery capacity.
Alternatively, as shown in fig. 7 to 12b, fig. 7 is a schematic structural diagram of another printed circuit board in the embodiment of the present application, fig. 8 is a schematic perspective structural diagram of an embedded interposer in the embodiment of the present application, fig. 9 is a schematic structural diagram of another printed circuit board assembly in the embodiment of the present application, fig. 10 is a schematic perspective structural diagram of the printed circuit board assembly in fig. 9, fig. 11 is a top view of the printed circuit board assembly in fig. 10, fig. 12a is a schematic structural diagram of a cross section in the CC 'direction in fig. 11, and fig. 12b is a schematic structural diagram of a cross section in the DD' direction in fig. 11. The printed circuit board assembly further comprises: an embedded adapter plate 6 positioned between the printed circuit board 1 and the first element 21, the second element 22 being positioned inside the embedded adapter plate 6; the buried interposer 6 is fixedly connected to the printed circuit board 1 and the first component 21.
Specifically, in the structure shown in fig. 7 to 12b, compared with the structure shown in fig. 3 to 6, the first element 21 and the second element 22 are stacked in the thickness direction of the printed circuit board 1 to reduce the overall tiled area of the printed circuit board assembly, and the difference is that in the structure shown in fig. 7 to 12b, the embedded interposer 6 fixedly connected to the printed circuit board 1 and the first element 21 is added without providing a groove on the printed circuit board 1, and the second element 22 is disposed inside the embedded interposer 6. On the one hand, a fixed connection between the first component 21 and the printed circuit board 1 can be achieved by means of the buried adapter plate 6, and on the other hand, the second component 22 can be arranged inside the buried adapter plate 6, so that the second component 22 is located between the printed circuit board 1 and the first component 21. The overall thickness of the embedded interposer 6 is too thick to avoid excessive thickness of the stacked pcb assemblies.
Alternatively, as shown in fig. 7 to 12b, a first surface of the embedded interposer 6 is provided with a plurality of first interposer pads 61, a second surface of the embedded interposer 6 is provided with a plurality of second interposer pads 62, the first surface and the second surface are respectively two opposite surfaces of the embedded interposer 6, the embedded interposer 6 is soldered to the printed circuit board 1 through the plurality of first interposer pads 61, the embedded interposer 6 is soldered to the first component 21 through the plurality of second interposer pads 62, and the plurality of first interposer pads 61 and the plurality of second interposer pads 62 correspond to each other one by one; each first interposer pad 61 and the corresponding second interposer pad 62 are electrically connected by the wire 7 in the buried interposer 6. Between the embedded adapter plate 6 and the printed circuit board 1, the two are welded through the first adapter plate pad 61, that is, the first adapter plate pad 61 and the corresponding circuit board pad 3 are welded through the solder 5 between the two, between the embedded adapter plate 6 and the first component 21, the two are welded through the second adapter plate pad 62, that is, the second adapter plate pad 62 and the corresponding first component pad 210 are welded through the solder 5 between the two, inside the embedded adapter plate 6, the first adapter plate pad 61 and the second adapter plate pad 62 are electrically connected through the lead 7, so as to realize the electrical connection between the first component 21 and the printed circuit board 1, and simultaneously, the fixed connection among the first component 21, the embedded adapter plate 6 and the printed circuit board 1 is realized. It should be noted that the second component 22 located inside the buried interposer 6 also needs to be electrically connected to the printed circuit board 1, and therefore, an additional pad (not shown) for electrically connecting the second component 22 to the printed circuit board 1 may be provided between the buried interposer 6 and the printed circuit board 1.
Alternatively, as shown in fig. 7 to 12b, the plurality of first interposer pads 61 includes a first heat dissipation pad 610, and the plurality of second interposer pads 62 includes a second heat dissipation pad 620 corresponding to the first heat dissipation pad 610; the first and second heat dissipation pads 610 and 620 are connected by a hollow conductor structure 700. The conductor structure 700 is surrounded by the conductor sidewall between the first heat sink pad 610 and the second interposer pad 62 to form a hollow cylindrical structure, the hollow area 70 in the middle can be a circular through hole, and the hollow area 70 extends from the first heat sink pad 610 to the second heat sink pad 620, which is more favorable for transferring the heat of the first component 21 to the printed circuit board 1. The first and second heat dissipation pads 610 and 620 may be used to transmit a ground signal at the same time.
Alternatively, as shown in fig. 7 to 12b, each first interposer pad 61 and the corresponding second interposer pad 62 are opposed in the thickness direction of the printed circuit board assembly; at least one first interposer pad 61 and a corresponding second interposer pad 62 are electrically connected by a conductor 7 in the buried interposer 6 extending in the thickness direction of the printed circuit board assembly. That is, the wires 7 are electrically connected by the shortest distance between the first interposer pad 61 and the corresponding second interposer pad 62 to reduce signal delay due to transmission of the wires 7 in the buried interposer 6.
Alternatively, as shown in fig. 13 and 14, fig. 13 is a top view of another printed circuit board assembly in the embodiment of the present application, and fig. 14 is a schematic cross-sectional view taken along direction EE' in fig. 13, wherein each first interposer pad 61 and the corresponding second interposer pad 62 are opposite to each other in the thickness direction of the printed circuit board assembly; at least one first interposer pad 61 and a corresponding second interposer pad 62 are electrically connected by a meander-extending wire 7 in the buried interposer 6.
Specifically, in the structure shown in fig. 13 and 14, at least a part of the second element 22 may be located between the first interposer pad 61 and the corresponding second interposer pad 62, and the first interposer pad 61 and the corresponding second interposer pad 62 may be electrically connected between the two circuit board pads by bending the extended wire 7 to bypass the second element 22, so that the second element 22 in the embedded interposer 6 may be disposed without avoiding the position of the circuit board pad, that is, between the first element 21 and the printed circuit board 1, the second element 22 occupying a larger area may be disposed, and only the wire 7 inside the embedded interposer 6 needs to bypass the second element 22.
The following further illustrates the embodiments of the present application by several welding methods. As shown in fig. 15, fig. 15 is a schematic flow chart of a soldering method of the printed circuit board assembly according to the embodiment of the present application, in which solder paste or flux is first applied to the surface of the printed circuit board 1, then the embedded interposer 6 is placed on the printed circuit board 1, then the solder paste or flux is applied to the embedded interposer 6, then the first component 21 is placed on the embedded interposer 6, and finally soldering is performed together. As shown in fig. 16, fig. 16 is a flow chart illustrating another soldering method of the printed circuit board assembly according to the embodiment of the present application, in which solder paste or flux is first applied to the surface of the printed circuit board 1, then the embedded interposer 6 is placed on the printed circuit board 1, and solder paste or flux is applied to the solder of the first component with solder, then the embedded interposer 6 is placed, and finally soldering is performed together. As shown in fig. 17, fig. 17 is a schematic flow chart of another soldering method for a printed circuit board assembly according to an embodiment of the present invention, in which a solder paste or flux is first applied to the first component 21 with solder, then the first component 21 is placed on the embedded interposer 6 for soldering, then the solder paste or flux is applied to the printed circuit board 1, and the integrated structure after the first component 21 and the embedded interposer 6 are soldered is placed on the printed circuit board 1 for soldering.
Alternatively, as shown in fig. 18, fig. 18 is a schematic cross-sectional view of another printed circuit board assembly in the embodiment of the present application, and a strength-enhancing material 8 is filled between the first element 21 and the buried interposer 6. The strength enhancing material 8 may be specifically an Epoxy Molding Compound (EMC) or a package-level underfill (underfill), and the like, where the strength enhancing material 8 is used to enhance the overall strength between the first component 21 and the embedded interposer 6, so as to reduce the subsequent poor welding caused by the lower overall strength between the first component 21 and the embedded interposer 6, and if the strength enhancing material 8 is not provided, when the integrally welded first component 21 and the embedded interposer 6 are placed on the printed circuit board 1 for welding, the overall warpage and deformation may be caused by the lower overall strength of the first component 21 and the embedded interposer 6 and the thinner thickness of the two components, which further causes unstable solder joint contact, and may cause poor welding. After the strength reinforcing material 8 is filled between the first element 21 and the embedded adapter plate 6, the overall strength between the first element 21 and the embedded adapter plate 6 is improved, and warping deformation is not easy to occur, so that the stability of subsequent welding is improved. As shown in fig. 19, fig. 19 is a schematic diagram of a soldering process of the printed circuit board assembly shown in fig. 18, in which first the first component 21 is dipped with solder paste or flux and then placed on the embedded interposer 6 and soldered, then the strength-enhancing material 8 is filled between the first component 21 and the embedded interposer 6, then the solder paste or flux is applied on the printed circuit board 1, and the integrated structure of the first component 21 and the embedded interposer 6 which are soldered and filled with the strength-enhancing material 8 is placed on the printed circuit board 1 for soldering.
Optionally, in the above embodiments, the first element 21 is an active element, and the second element 22 is a passive element. The active device is a device capable of performing data operation and processing, such as a chip, and the passive device is a circuit device that does not affect the basic characteristics of a signal and only allows the signal to pass through without being changed, such as a resistor, a capacitor, an inductor, and the like. Generally, the space occupied by the active component is larger, and the space occupied by the passive component is smaller, so that the first component 21 can be an active component, the second component 22 can be a passive component, and the active component and the passive component are arranged in a laminated manner in the thickness direction of the printed circuit board, so as to reduce the whole area occupied. Of course, in other practical embodiments, if some active components are smaller and some active components are larger, the first component 21 and the second component 22 may be both active components, and the larger active components and the smaller active components may be stacked in the thickness direction of the printed circuit board. The active device can be, for example, an Application Processor (AP), a Double Data Rate (DDR), a UFS, a FEM, a duplexer, a + G, and a radio frequency switch.
It should be noted that, the arrangement of the bottom pads of the first element 21 is not limited in the embodiment of the present application, for example, in the structures shown in fig. 3 to 6, the bottom pad distribution of the first element 21 may be any one of the three arrangements shown in fig. 20, and fig. 20 is a schematic bottom pad distribution diagram of the three first elements in the embodiment of the present application, as long as it is ensured that the bottom pads of the first element are not fully arranged, and there is an area outside the pads sufficient for placing the second element.
Alternatively, as shown in fig. 21 and fig. 22, fig. 21 is a schematic structural diagram of another printed circuit board in the embodiment of the present application, and fig. 22 is a schematic structural diagram of a cross section in the direction FF' in fig. 21, where the printed circuit board assembly further includes: a third component 23 positioned between the first component 21 and the printed circuit board 1, the third component 23 being positioned outside the buried interposer 7, the third component 23 being electrically connected to the printed circuit board 1. For the third element 23 having a larger height, in order to secure the thickness range of the printed circuit board, the third element 23 may be disposed outside the buried interposer 7 so as to dispose the third element 23 having a larger height between the first element 21 and the printed circuit board 1. As shown in fig. 23, fig. 23 is another cross-sectional view of fig. 21 from FF', and in the structure shown in fig. 23, the second elements 22 located at the left and right sides have a larger height, but are still disposed in the buried interposer 7, which results in a larger thickness of the whole printed circuit board assembly than the design of fig. 22.
It should be noted that the solder 5 in the embodiment of the present application may be a solder paste printed on the pad, or a solder paste printed on the pad + a solder ball/solder plating layer of the device itself, or a solder ball/solder plating layer of the device itself, and the embodiment of the present application is not limited to a specific implementation form of the solder 5.
On the other hand, embodiments of the present application further provide a terminal, which includes the printed circuit board assembly in the foregoing embodiments. The terminal can be a mobile phone, a tablet computer and the like. The specific structure and principle of the printed circuit board assembly are the same as those of the above embodiments, and are not described herein again.
Along with the design trend of terminal frivolousization, the thickness of terminal and the area of printed circuit board wherein are all restricted because the space is limited, the printed circuit board subassembly in this application embodiment can reduce the area that printed circuit board occupied under the certain prerequisite of printed circuit board subassembly thickness to save more spaces, so that set up the battery of bigger area in order to improve battery capacity, or set up more other functional device, in order to improve terminal performance.
In the embodiments of the present application, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, and means that there may be three relationships, for example, a and/or B, and may mean that a exists alone, a and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" and similar expressions refer to any combination of these items, including any combination of singular or plural items. For example, at least one of a, b, and c may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (12)
1. A printed circuit board assembly, comprising:
the electronic device comprises a printed circuit board and a first element, wherein the first element is fixedly connected to the printed circuit board and is electrically connected to the printed circuit board;
a second component positioned between the first component and the printed circuit board, the second component being electrically connected to the printed circuit board.
2. The printed circuit board assembly of claim 1,
a groove is formed in the surface of one side, close to the first element, of the printed circuit board, and the second element is welded to the printed circuit board in the groove.
3. The printed circuit board assembly of claim 2,
the first element is welded on the printed circuit board, and the welding position between the first element and the printed circuit board is positioned outside the groove.
4. The printed circuit board assembly of claim 1, further comprising:
the embedded adapter plate is positioned between the printed circuit board and the first element, and the second element is positioned inside the embedded adapter plate;
the embedded adapter plate is fixedly connected to the printed circuit board and the first element.
5. The printed circuit board assembly of claim 4,
the embedded adapter plate is welded on the printed circuit board through a plurality of first adapter plate welding pads, the embedded adapter plate is welded on the first element through a plurality of second adapter plate welding pads, and the plurality of first adapter plate welding pads correspond to the plurality of second adapter plate welding pads one to one;
and each first adapter plate bonding pad and the corresponding second adapter plate bonding pad are electrically connected through a lead in the embedded adapter plate.
6. The printed circuit board assembly of claim 5,
the plurality of first interposer pads comprise first heat sink pads, and the plurality of second interposer pads comprise second heat sink pads corresponding to the first heat sink pads;
the first and second heat-dissipating pads are connected by a hollow conductor structure.
7. The printed circuit board assembly of claim 5,
each first adapter plate bonding pad and the corresponding second adapter plate bonding pad are opposite in the thickness direction of the printed circuit board assembly;
at least one first adapter plate bonding pad and the corresponding second adapter plate bonding pad are electrically connected through the conducting wire extending along the thickness direction of the printed circuit board assembly in the embedded adapter plate.
8. The printed circuit board assembly of claim 5,
each first adapter plate bonding pad and the corresponding second adapter plate bonding pad are opposite in the thickness direction of the printed circuit board assembly;
at least one first adapter plate bonding pad and the corresponding second adapter plate bonding pad are electrically connected through the bent and extended wire in the embedded adapter plate.
9. The printed circuit board assembly of claim 5,
and a strength reinforcing material is filled between the first element and the embedded adapter plate.
10. The printed circuit board assembly of claim 1,
the first element is an active element, and the second element is a passive element.
11. The printed circuit board assembly of claim 4, further comprising:
a third component positioned between the first component and the printed circuit board, the third component positioned outside of the buried interposer, the third component electrically coupled to the printed circuit board.
12. A terminal, comprising a printed circuit board assembly according to any of claims 1 to 11.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020601842.3U CN212519571U (en) | 2020-04-21 | 2020-04-21 | Printed circuit board assembly and terminal |
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| CN202020601842.3U CN212519571U (en) | 2020-04-21 | 2020-04-21 | Printed circuit board assembly and terminal |
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| CN212519571U true CN212519571U (en) | 2021-02-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709642A (en) * | 2023-08-07 | 2023-09-05 | 荣耀终端有限公司 | Circuit board assembly, electronic equipment, frame plate and component integration method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709642A (en) * | 2023-08-07 | 2023-09-05 | 荣耀终端有限公司 | Circuit board assembly, electronic equipment, frame plate and component integration method |
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