CN107197595B - Printed circuit board and welding design thereof - Google Patents
Printed circuit board and welding design thereof Download PDFInfo
- Publication number
- CN107197595B CN107197595B CN201710344512.3A CN201710344512A CN107197595B CN 107197595 B CN107197595 B CN 107197595B CN 201710344512 A CN201710344512 A CN 201710344512A CN 107197595 B CN107197595 B CN 107197595B
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- CN
- China
- Prior art keywords
- wireless module
- circuit board
- printed circuit
- pad group
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Abstract
The invention relates to a circuit board manufacturing technology, in particular to a printed circuit board and a welding design thereof, wherein the printed circuit board comprises a wireless module welding area; a first pad group corresponding to each pin of a first wireless module is distributed at the center of the wireless module welding area; a second bonding pad group corresponding to each pin of a second wireless module is distributed at the edge of the wireless chip welding area; connecting the bonding pads corresponding to the pins with the same function in the first wireless module and the second wireless module; above-mentioned technical scheme can compatible different wireless module, can not increase extra welding area simultaneously, and integrated level and reliability are high.
Description
Technical Field
The invention relates to a circuit board manufacturing technology, in particular to a printed circuit board and a welding design thereof.
Background
A Printed Circuit Board (PCB) is an important electronic component, is a support for an electronic component, and is a carrier for electrical connection of the electronic component.
Printed circuit boards have evolved from single-layer to double-sided, multi-layer, and flexible, and still remain the trend for each. Due to the continuous development towards high precision, high density and high reliability, the volume is continuously reduced, the cost is reduced, and the performance is improved, so that the printed board still keeps strong vitality in the development engineering of future electronic equipment.
Although the general wireless modules are more selected, the cost is higher, and some wireless modules with high collection degree can save part of the design cost, but have the risk of production and supply, if different soldering areas of the wireless modules are provided on the printed circuit board, the size of the printed circuit board is inevitably increased.
Disclosure of Invention
In order to solve the problems, the invention provides a welding design of a printed circuit board, which is applied to the printed circuit board; wherein the printed circuit board comprises a wireless module soldering area; the weld design includes:
the first pad group corresponding to each pin of a first wireless module is arranged at the center of the welding area of the wireless module;
the second bonding pad group corresponding to each pin of a second wireless module is arranged at the edge of the wireless chip welding area;
and the first wireless module and the second wireless module are connected with the bonding pads corresponding to the pins with the same function.
The above-mentioned soldering design, wherein said printed circuit board further comprises:
a main module welding area;
a third pad group corresponding to a corresponding pin in a main control module is distributed in the main module welding area;
each bonding pad in the first bonding pad group and the second bonding pad group is connected with a corresponding bonding pad in the third bonding pad group through a lead on the printed circuit board.
In the above welding design, the connected pads in the first pad group, the second pad group and the third pad group are disposed adjacent to each other.
In the above welding design, the printed circuit board has two layers, and the first pad group, the second pad group and the third pad group are disposed on the same surface of the printed circuit board on the same layer.
A printed circuit board comprising a printed circuit board solder design as described above, further comprising:
each pin of the first wireless module is correspondingly connected with the first bonding pad group; or
And each pin of the second wireless module is correspondingly connected with the second bonding pad group.
In the printed circuit board, the second wireless module includes a plurality of idle pins, and a part or all of the package of the idle pins is removed.
The printed circuit board is characterized in that the length and/or width of the printed circuit board is less than 10 cm.
The printed circuit board is characterized in that the model of the second wireless module is RTL8189 ETV.
In the printed circuit board, the first wireless module is of a single-transmitting single-receiving type.
Has the advantages that: the printed circuit board and the welding design thereof provided by the invention can be compatible with different wireless modules, and meanwhile, the additional welding area is not increased, and the integration level and the reliability are high.
Drawings
FIG. 1 is a schematic diagram of a solder design for a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of a wireless module without idle pins removed according to an embodiment of the present invention;
fig. 3 is a schematic circuit diagram of a wireless transmission chip with idle pins removed according to an embodiment of the invention.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
In a preferred embodiment, as shown in fig. 1, a soldering design for a printed circuit board is provided, which can be applied to a printed circuit board; wherein the printed circuit board comprises a wireless module welding area AA 1; the weld design may include:
the first bonding pad group 11 corresponding to each pin of a first wireless module is arranged at the center of the wireless module welding area AA 1;
the second bonding pad group 12 corresponding to each pin of a second wireless module is arranged at the edge of the wireless chip bonding area AA 1;
and the bonding pads corresponding to the pins with the same function in the first wireless module and the second wireless module are connected.
In the technical scheme, the welding pads corresponding to the pins with the same function in the first wireless module and the second wireless module are connected, so that the pins with the same function in the first wireless module and the second wireless module can be connected to the same device or pin, and the first wireless module and the second wireless module are not welded to the printed circuit board at the same time; as a further explanation, since the first wireless module and the second wireless module are one, a pad corresponding to a certain functional pin of the first wireless module generally exists in the first pad set 11, and a pad corresponding to the same functional pin of the second wireless module generally exists in the second pad set 12, and these two pads are electrically connected on the printed circuit board; the first pad set 11 and the second pad set 12 are completely overlapped (co-layout) and uniformly distributed in the wireless module soldering area AA1, so that an additional area is not increased.
As shown in fig. 1, in a preferred embodiment, the printed circuit board may further include:
main module weld area AA 2;
a third pad group (not shown in the drawing) corresponding to a corresponding pin in a main control module is disposed in the main module welding area AA 2;
each pad of the first pad group 11 and the second pad group 12 is connected to a corresponding pad of the third pad group through a conductive line on the printed circuit board.
In the above technical solution, the construction manner of the conductive line may be the existing technique, for example, the conductive line is constructed through a through hole and/or by routing on a printed circuit board, which is not described herein again.
In the above embodiment, preferably, the pads connected in the first pad group 11, the second pad group 12 and the third pad group are disposed adjacent to each other, so that the path between the pads is shortest, the occupied area of the wiring loop can be reduced, and the printed circuit board is suitable for a small-sized printed circuit board; the main module welding area AA2 is for welding the main module, which may be a control module, but this is only a preferred case and should not be considered as limiting the invention.
In a preferred embodiment, the printed circuit board is a double-layer printed circuit board, and the first pad group 11, the second pad group 12 and the third pad group are disposed on the same surface of the same layer of printed circuit board, but this is only a preferred case, and may be on different surfaces of the same layer of printed circuit board, or on different layers; the printed circuit board may also be four or more layers.
In a preferred embodiment, a printed circuit board is further provided, which may include the above printed circuit board soldering design, wherein the printed circuit board soldering design further includes:
each pin of the first wireless module is correspondingly connected with the first bonding pad group 11; or
And each pin of the second wireless module is correspondingly connected with the second bonding pad group 12.
In the above technical solution, the printed circuit board may further include a main module connected to the third pad group.
In the above embodiment, preferably, the second wireless module may include a plurality of idle pins, and a package of some or all of the idle pins is removed.
In the above technical solution, as shown in fig. 2, a plurality of idle pins often exist in the packaged wireless module, that is, the pins 4, 5, 6, 7, 8, 10, 11, 13, 21, 23, 24, 25, 26, 27, 28, 29, 30, 32, 34, 35, 37, 38, 39, 40, 41, 42, 43, 44 in fig. 2, the idle pins are all removed, and the removed wireless transmission chip 20 is shown in fig. 3.
In a preferred embodiment, the length and/or width of the printed circuit board may be less than 10 cm.
In a preferred embodiment, the second radio module is of the type RTL8189ETV, but this is only a preferred case and should not be construed as limiting the invention.
In a preferred embodiment, the first wireless module is of the single-transmitting and single-receiving type, but this is only a preferred case and should not be construed as limiting the invention.
While the specification concludes with claims defining exemplary embodiments of particular structures for practicing the invention, it is believed that other modifications will be made in the spirit of the invention. While the above invention sets forth presently preferred embodiments, these are not intended as limitations.
Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.
Claims (6)
1. A printed circuit board welding design structure is applied to a printed circuit board; wherein the printed circuit board includes a wireless module soldering area; the weld design includes:
the first pad group corresponding to each pin of a first wireless module is arranged at the center of the welding area of the wireless module;
the second bonding pad group corresponding to each pin of a second wireless module is arranged at the edge of the wireless chip welding area;
the first wireless module and the second wireless module are connected with each other through bonding pads corresponding to pins with the same function;
the printed circuit board is provided with one of the first wireless module and the second wireless module;
the first wireless module is a single-transmitting single-receiving wireless module;
the second wireless module is a WIFI module with the model number of RTL8189 ETV;
the second wireless module comprises a plurality of idle pins, and when the second wireless module is packaged, part or all of the packaging of the idle pins is removed.
2. The solder design structure of claim 1, wherein the printed circuit board further comprises:
a main module welding area;
a third pad group corresponding to a corresponding pin in a main control module is distributed in the main module welding area;
each bonding pad in the first bonding pad group and the second bonding pad group is connected with a corresponding bonding pad in the third bonding pad group through a lead on the printed circuit board.
3. The bond design structure of claim 2, wherein connected bond pads of the first, second, and third sets of bond pads are disposed adjacent to each other.
4. The solder design structure of claim 2, wherein the printed circuit board is double-layered, and the first pad set, the second pad set, and the third pad set are disposed on the same side of the printed circuit board on the same layer.
5. A printed circuit board including the solder design structure of the printed circuit board according to any one of claims 1 to 4, characterized by further comprising:
each pin of the first wireless module is correspondingly connected with the first bonding pad group; or
Each pin of the second wireless module is correspondingly connected with the second bonding pad group;
the printed circuit board is provided with one of the first wireless module and the second wireless module.
6. A printed circuit board according to claim 5, wherein the length and/or width of the printed circuit board is less than 10 cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710344512.3A CN107197595B (en) | 2017-05-16 | 2017-05-16 | Printed circuit board and welding design thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710344512.3A CN107197595B (en) | 2017-05-16 | 2017-05-16 | Printed circuit board and welding design thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107197595A CN107197595A (en) | 2017-09-22 |
| CN107197595B true CN107197595B (en) | 2021-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710344512.3A Active CN107197595B (en) | 2017-05-16 | 2017-05-16 | Printed circuit board and welding design thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN107197595B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107920416A (en) * | 2017-11-07 | 2018-04-17 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its welding design |
| CN107967380B (en) * | 2017-11-15 | 2021-09-07 | 晶晨半导体(上海)股份有限公司 | Layout design method of printed circuit board |
| CN110021500A (en) * | 2019-05-09 | 2019-07-16 | 广西睿奕科技开发有限公司 | It is suitble to one into the four two-way magnetic latching relay for going out phenotype |
| CN117042292A (en) * | 2022-03-28 | 2023-11-10 | 荣耀终端有限公司 | Circuit board structure, chip system and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101176390A (en) * | 2005-05-19 | 2008-05-07 | Cts公司 | Reduced-size VCO/PLL module |
| CN104540314A (en) * | 2014-12-31 | 2015-04-22 | 记忆科技(深圳)有限公司 | Goldfinger of sata interface and goldfinger connecting terminal |
| US20170012603A1 (en) * | 2015-07-07 | 2017-01-12 | Skyworks Solutions, Inc. | Devices and methods related to stacked duplexers |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201403251Y (en) * | 2009-03-24 | 2010-02-10 | 青岛海信移动通信技术股份有限公司 | Printed wiring board, printed circuit board and electronic product with printed circuit board |
| CN106061109B (en) * | 2016-08-15 | 2018-09-11 | 深圳市明泰电讯有限公司 | A kind of circuit board and its circuit of crystal compatibility |
-
2017
- 2017-05-16 CN CN201710344512.3A patent/CN107197595B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101176390A (en) * | 2005-05-19 | 2008-05-07 | Cts公司 | Reduced-size VCO/PLL module |
| CN104540314A (en) * | 2014-12-31 | 2015-04-22 | 记忆科技(深圳)有限公司 | Goldfinger of sata interface and goldfinger connecting terminal |
| US20170012603A1 (en) * | 2015-07-07 | 2017-01-12 | Skyworks Solutions, Inc. | Devices and methods related to stacked duplexers |
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| Publication number | Publication date |
|---|---|
| CN107197595A (en) | 2017-09-22 |
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