CN201403251Y - Printed wiring board, printed circuit board and electronic product with printed circuit board - Google Patents
Printed wiring board, printed circuit board and electronic product with printed circuit board Download PDFInfo
- Publication number
- CN201403251Y CN201403251Y CN2009201460242U CN200920146024U CN201403251Y CN 201403251 Y CN201403251 Y CN 201403251Y CN 2009201460242 U CN2009201460242 U CN 2009201460242U CN 200920146024 U CN200920146024 U CN 200920146024U CN 201403251 Y CN201403251 Y CN 201403251Y
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- Prior art keywords
- assembly welding
- welding dish
- link
- pad
- circuit board
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Abstract
The utility model discloses a printed wiring board, a printed circuit board and an electronic product with the printed circuit board and relates to the field of electronic equipment, and the design aims at causing the printed wiring board not only to reduce the expense of area, but also to have better compatibility. The printed wiring board comprises a substrate that is provided with a first linkto an nth link mutually connected in parallel, wherein the first link to the nth link are provided with a first set of pad to an nth set of pad under one-to-one correspondence; the first set of pad tothe nth set of pad are used for pasting an electronic element that corresponds to the first link to the nth link, and the electronic element can only be pasted on one of the first set of pad to the nth set of pad; the pads with corresponding functions among the first set of pad to the nth set of pad coincide; and n is an integer more than or equal to 2. The printed wiring board can be used for bearing electronic elements.
Description
Technical field
The utility model relates to the electronic product field, relates in particular to printed substrate and printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is the supporter that needs all kinds of electronic devices and components that use in the electronic product.The design considerations of printed circuit board (PCB) is in circuit theory diagrams, and there is different demands in different market to the function of printed circuit board (PCB).If design printed circuit board (PCB) respectively, then will cause the increase of cost with corresponding function at different markets.
Therefore, general way is: be provided with and the corresponding pad of functional module as much as possible on a printed circuit board, and then can realize the electronic devices and components of corresponding function according to different market demands Surface Mount on corresponding pad, for unwanted function, Surface Mount electronic devices and components not on its corresponding pad then make that pad is idle to get final product.Like this, a printed circuit board (PCB) just can satisfy the demand in a plurality of markets.
For example be example with the mobile phone, the signal frequency range that use the domestic market is 800M, and the signal frequency range that use the overseas market is 1900M.As shown in Figure 1, in the radio circuit design of dual-band mobile phone, include antenna element 11, antenna element 11 is used for received signal, and send signal to divider unit 12, divider unit 12 is 800M and 1900M two-way with signal by frequency separation, and is the Duplexer Unit 13 that the signal of 800M passes to 800M with frequency, is the Duplexer Unit 14 that the signal of 1900M passes to 1900M with frequency.
Wherein, divider unit 12 comprises first branch road 121 parallel with one another and second branch road 122.First branch road 121 links to each other with the Duplexer Unit 14 of 1900M by pin one, links to each other with the Duplexer Unit 13 of 800M by pin 3.Second branch road 122 directly links to each other with the Duplexer Unit 13 of 800M.
As shown in Figure 2, be provided with in first branch road 121 in the first assembly welding dish, 123, the second branch roads 122 and be provided with the second assembly welding dish 124.When the double frequency design that realizes mobile phone, at the first assembly welding dish 123, and all need the corresponding electronic devices and components of Surface Mount in the Duplexer Unit 14 pairing pads of the Duplexer Unit 13 of 800M and 1900M, all the other obsolete pads and lead-in wire as 124 free time of the second assembly welding dish; When realizing the 800M single-frequency design of mobile phone, only need at the second assembly welding dish 124, and the corresponding electronic devices and components of Surface Mount in the Duplexer Unit 13 pairing pads of 800M, all the other obsolete pads and lead-in wire as 123 free time of the first assembly welding dish.
But the shortcoming of above-mentioned way is: owing to be provided with pad and the lead-in wire of a large amount of free time on printed circuit board (PCB), increased the expense of printed circuit board area on the one hand; Kong Xian pad and lead-in wire have caused interference to circuit performance on the other hand, thereby have reduced the compatibility of printed circuit board (PCB).
The utility model content
Technical problem to be solved in the utility model is to provide a kind of printed substrate, can either reduce the expense of area, has better compatibility again.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of printed substrate, comprise substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and can only be at described first assembly welding dish Surface Mount electronic devices and components to the wherein assembly welding dish of described n assembly welding dish, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
Particularly, n equals 2 or 3.
And the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
The utility model provides a kind of printed substrate.Since need corresponding electronic devices and components of Surface Mount in the described first assembly welding dish only when using described first link, all the other pad free time; In like manner, when using described n link, only need the corresponding electronic devices and components of Surface Mount in described n assembly welding dish, all the other pad free time.And the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, therefore compared with prior art, the decreased number of idle pad on the utility model printed substrate, reduced the expense of printed substrate area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed substrate.
Another technical problem to be solved in the utility model is to provide a kind of printed circuit board (PCB), can either reduce the expense of area, has better compatibility again.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of printed circuit board (PCB), comprise substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and electronic devices and components are arranged at described first assembly welding dish Surface Mount to the wherein assembly welding dish of described n assembly welding dish, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
Wherein, the described first assembly welding dish pad that has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
And, in the idle pad of the described first assembly welding dish to the described n assembly welding dish, be arranged with insulator.
The utility model provides a kind of printed circuit board (PCB).Since need corresponding electronic devices and components of Surface Mount in the described first assembly welding dish only when using described first link, all the other pad free time; In like manner, when using described n link, only need the corresponding electronic devices and components of Surface Mount in described n assembly welding dish, all the other pad free time.And the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, therefore compared with prior art, the decreased number of idle pad on the utility model printed circuit board (PCB), reduced the expense of printed circuit board area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed circuit board (PCB).
Another technical problem to be solved in the utility model is to provide a kind of electronic product, and the printed circuit board (PCB) in the described electronic product can either reduce the expense of area, has better compatibility again.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of electronic product, comprise housing, in described housing, be provided with printed circuit board (PCB), described printed circuit board (PCB) comprises substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and electronic devices and components are arranged at described first assembly welding dish Surface Mount to the wherein assembly welding dish of described n assembly welding dish, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
Wherein, the described first assembly welding dish pad that has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
And, in the idle pad of the described first assembly welding dish to the described n assembly welding dish, be arranged with insulator.
Further, described electronic product is a mobile communication terminal.
The utility model provides a kind of electronic product, includes printed circuit board (PCB) in the described electronic product.Since need corresponding electronic devices and components of Surface Mount in the described first assembly welding dish only when using described first link, all the other pad free time; In like manner, when using described n link, only need the corresponding electronic devices and components of Surface Mount in described n assembly welding dish, all the other pad free time.And the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, therefore compared with prior art, the decreased number of idle pad on the printed circuit board (PCB) that is had in the utility model electronic product, reduced the expense of printed circuit board area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed circuit board (PCB).
Description of drawings
Fig. 1 is the radio circuit design of dual-band mobile phone in the prior art;
Fig. 2 is the schematic diagram that pad distributes in the divider unit shown in Figure 1;
Fig. 3 is the structural representation of an embodiment of the utility model printed substrate;
Fig. 4 is the pictorial diagram of printed substrate shown in Figure 3;
Fig. 5 is the structural representation of another embodiment of the utility model printed substrate;
Fig. 6 is the structural representation of the utility model printed circuit board embodiment;
Fig. 7 is the structural representation of the utility model electronic product embodiment.
Embodiment
The utility model aims to provide a kind of printed substrate, printed circuit board (PCB) and has the electronic product of this printed circuit board (PCB), and described printed substrate and printed circuit board (PCB) can either reduce the expense of area, have better compatibility again.
Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.
The utility model embodiment printed substrate, comprise substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and electronic devices and components are arranged at described first assembly welding dish Surface Mount to the wherein assembly welding dish of described n assembly welding dish, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
Since need corresponding electronic devices and components of Surface Mount in the described first assembly welding dish only when using described first link, all the other pad free time; In like manner, when using described n link, only need the corresponding electronic devices and components of Surface Mount in described n assembly welding dish, all the other pad free time.And the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, therefore compared with prior art, the decreased number of idle pad on the utility model printed substrate, reduced the expense of printed substrate area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed substrate.
As shown in Figure 3, a specific embodiment for the utility model printed substrate, in the present embodiment, described printed substrate comprises substrate 2, on substrate 2, be provided with two first links 21 parallel with one another and second link 22, be provided with the first assembly welding dish that is numbered a to f in first link 21, be provided with the second assembly welding dish that is numbered a and d in second link 22, the first assembly welding dish is used for Surface Mount and first link, 21 corresponding electronic devices and components, the second assembly welding dish is used for Surface Mount and second link, 22 corresponding electronic devices and components, and once can only be in the first assembly welding dish or the second assembly welding dish Surface Mount electronic devices and components, wherein, the pad 23 that has corresponding function in the first assembly welding dish and the second assembly welding dish overlaps.
Corresponding function described herein refers to, and the pad that is numbered a is the input of first link 21 and second link 22 simultaneously, and the pad that is numbered d is the output of first link 21 and second link 22 simultaneously.
Radio circuit with dual-band mobile phone is designed to example, when 800M that realizes mobile phone and the design of 1900M double frequency, need be in the first assembly welding dish the corresponding electronic devices and components of Surface Mount; When realizing the 800M single-frequency design of mobile phone, only need the corresponding electronic devices and components of Surface Mount in the second assembly welding dish.On a circuit board, just can realize double frequency and two kinds of designs of 800M single-frequency like this.
Because having the pad 23 of corresponding function in the present embodiment in the first assembly welding dish and the second assembly welding dish overlaps, therefore the decreased number of idle pad on the substrate 2, reduced the expense of printed substrate area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed substrate.
As shown in Figure 4, the pad that has corresponding function in the first assembly welding dish and the second assembly welding dish is a rectangle.This is to coincide because have the pad of corresponding function in the first assembly welding dish and the second assembly welding dish, therefore may be in the pad that this coincides the different electronic devices and components of Surface Mount, perhaps along different direction Surface Mount electronic devices and components, the employing rectangle can increase the spatial accommodation of pad, so that pad can adapt to different situations.
In other embodiment of the present utility model, the pad that has corresponding function in the first assembly welding dish and the second assembly welding dish can also be Long Circle, ellipse or rhombus.
As shown in Figure 5, another specific embodiment for the utility model printed substrate, in the present embodiment, described printed substrate comprises substrate 2, on substrate 2, be provided with three first link 21, second link 22 and the 3rd links 24 parallel with one another, be provided with the first assembly welding dish that is numbered a to f in first link 21, be provided with the second assembly welding dish that is numbered a and d in second link 22, be provided with the pad that is numbered a and f in the 3rd link 24.
Wherein, the first assembly welding dish is used for Surface Mount and first link, 21 corresponding electronic devices and components, the second assembly welding dish is used for Surface Mount and second link, 22 corresponding electronic devices and components, the 3rd assembly welding dish is used for Surface Mount and the 3rd link 24 corresponding electronic devices and components, and Surface Mount electronic devices and components in the assembly welding dish therein once, wherein, the pad 23 that has corresponding function in the first assembly welding dish, the second assembly welding dish and the 3rd assembly welding dish overlaps.
Still the radio circuit with dual-band mobile phone is designed to example, when 800M that realizes mobile phone and the design of 1900M double frequency, need be in the first assembly welding dish the corresponding electronic devices and components of Surface Mount; When the 800M single-frequency design that realizes mobile phone, only need the corresponding electronic devices and components of Surface Mount in the second assembly welding dish; And when the 1900M single-frequency design that realizes mobile phone, only need the corresponding electronic devices and components of Surface Mount in the 3rd assembly welding dish; On a circuit board, just can realize double frequency, 800M single-frequency and three kinds of designs of 1900M single-frequency like this, improve the market adaptability.
Because having the pad 23 of corresponding function in the present embodiment in the first assembly welding dish, the second assembly welding dish and the 3rd assembly welding dish overlaps, therefore the decreased number of idle pad on the substrate 2, reduced the expense of printed substrate area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed substrate.
In sum, the utility model printed substrate can either reduce the expense of area, has better compatibility again.
As shown in Figure 6, specific embodiment for the utility model printed circuit board (PCB), in the present embodiment, described printed circuit board (PCB) comprises substrate 2, on substrate 2, be provided with two first links 21 parallel with one another and second link 22, be provided with the first assembly welding dish that is numbered a to f in first link 21, be provided with the second assembly welding dish that is numbered a and d in second link 22, the first assembly welding dish is used for Surface Mount and first link, 21 corresponding electronic devices and components, the second assembly welding dish is used for Surface Mount and second link, 22 corresponding electronic devices and components, and Surface Mount electronic devices and components 3 in the second assembly welding dish, wherein, the pad 23 that has corresponding function in the first assembly welding dish and the second assembly welding dish overlaps.
Because having the pad 23 of corresponding function in the present embodiment in the first assembly welding dish and the second assembly welding dish overlaps, therefore the decreased number of idle pad on the substrate 2, reduced the expense of printed substrate area so on the one hand, reduce idle pad on the other hand to both depositing the interference of circuit performance, thereby improved the compatibility of printed substrate.
And the pad that has corresponding function in the present embodiment first assembly welding dish and the second assembly welding dish is a rectangle.Can increase the spatial accommodation of pad like this, so that pad can adapt to the different electronic devices and components of Surface Mount, perhaps along different multiple situations such as direction Surface Mount electronic devices and components.
Further, be arranged with insulator 25 in the idle pad of the first assembly welding dish, insulator 25 can prevent that the foreign material with conductive capability from entering in the idle pad, avoids owing to the fault and the accident that cause that the printed circuit board (PCB) short circuit causes.
In sum, the utility model printed circuit board (PCB) can either reduce the expense of area, has better compatibility again.
As shown in Figure 7, specific embodiment for the utility model electronic product, in the present embodiment, described electronic product comprises housing 4, in housing 4, be provided with printed circuit board (PCB) 5, and the 26S Proteasome Structure and Function of printed circuit board (PCB) is identical described in the specific embodiment of the printed circuit board (PCB) in the present embodiment 5 and described the utility model printed circuit board (PCB), does not repeat them here.
Need to prove that electronic product described in the present embodiment is a mobile communication terminal.But the utility model is not limited to this, and in other embodiments, described electronic product can also be television set, refrigerator etc.
In sum, the printed circuit board (PCB) in the utility model electronic product can either reduce the expense of area, has better compatibility again.
The above; it only is embodiment of the present utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; can expect easily changing or replacing, all should be encompassed within the protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the described protection range of claim.
Claims (10)
1, a kind of printed substrate, comprise substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and can only be at described first assembly welding dish Surface Mount electronic devices and components to the wherein assembly welding dish of described n assembly welding dish, it is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
2, printed substrate according to claim 1 is characterized in that, n equals 2 or 3.
3, printed substrate according to claim 1 and 2 is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
4, a kind of printed circuit board (PCB), comprise substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and electronic devices and components are arranged at described first assembly welding dish Surface Mount to the wherein assembly welding dish of described n assembly welding dish, it is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
5, printed circuit board (PCB) according to claim 4 is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
6, according to claim 4 or 5 described printed circuit board (PCB)s, it is characterized in that, in the idle pad of the described first assembly welding dish to the described n assembly welding dish, be arranged with insulator.
7, a kind of electronic product, comprise housing, in described housing, be provided with printed circuit board (PCB), described printed circuit board (PCB) comprises substrate, on described substrate, be provided with first link to the n link parallel with one another, be provided with first assembly welding dish to the n assembly welding dish in described first link to the n link correspondingly, the described first assembly welding dish to described n assembly welding dish is used for Surface Mount and the corresponding electronic devices and components of described first link to the n link, and electronic devices and components are arranged at described first assembly welding dish Surface Mount to the wherein assembly welding dish of described n assembly welding dish, it is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish overlaps, and n is the integer more than or equal to 2.
8, electronic product according to claim 7 is characterized in that, the pad that the described first assembly welding dish has corresponding function to the described n assembly welding dish is oval, rectangle or rhombus.
9, according to claim 7 or 8 described electronic products, it is characterized in that, in the idle pad of the described first assembly welding dish to the described n assembly welding dish, be arranged with insulator.
10, electronic product according to claim 9 is characterized in that, described electronic product is a mobile communication terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201460242U CN201403251Y (en) | 2009-03-24 | 2009-03-24 | Printed wiring board, printed circuit board and electronic product with printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201460242U CN201403251Y (en) | 2009-03-24 | 2009-03-24 | Printed wiring board, printed circuit board and electronic product with printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201403251Y true CN201403251Y (en) | 2010-02-10 |
Family
ID=41663050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201460242U Expired - Fee Related CN201403251Y (en) | 2009-03-24 | 2009-03-24 | Printed wiring board, printed circuit board and electronic product with printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201403251Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076167A (en) * | 2011-01-11 | 2011-05-25 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board |
| CN107197595A (en) * | 2017-05-16 | 2017-09-22 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its welding design |
| CN114370890A (en) * | 2021-12-31 | 2022-04-19 | 佛山市国星光电股份有限公司 | Sensing device and manufacturing method thereof |
| WO2022237703A1 (en) * | 2021-05-08 | 2022-11-17 | 广州视源电子科技股份有限公司 | Radio frequency circuit board, radio-frequency module, and electronic device |
-
2009
- 2009-03-24 CN CN2009201460242U patent/CN201403251Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102076167A (en) * | 2011-01-11 | 2011-05-25 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board |
| CN102076167B (en) * | 2011-01-11 | 2012-07-04 | 惠州Tcl移动通信有限公司 | Mobile phone circuit board |
| CN107197595A (en) * | 2017-05-16 | 2017-09-22 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board and its welding design |
| WO2022237703A1 (en) * | 2021-05-08 | 2022-11-17 | 广州视源电子科技股份有限公司 | Radio frequency circuit board, radio-frequency module, and electronic device |
| CN114370890A (en) * | 2021-12-31 | 2022-04-19 | 佛山市国星光电股份有限公司 | Sensing device and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20130324 |