CN219876291U - Circuit board module structure and electronic equipment - Google Patents
Circuit board module structure and electronic equipment Download PDFInfo
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- CN219876291U CN219876291U CN202320503780.6U CN202320503780U CN219876291U CN 219876291 U CN219876291 U CN 219876291U CN 202320503780 U CN202320503780 U CN 202320503780U CN 219876291 U CN219876291 U CN 219876291U
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- 230000009286 beneficial effect Effects 0.000 description 2
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- 238000003491 array Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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Abstract
A circuit board module structure and electronic equipment relate to the technical field of electronic products. The circuit board module structure comprises a first circuit board and a second circuit board which are arranged in a stacked mode and are connected with each other, the area of the first circuit board is smaller than that of the second circuit board, one surface of the first circuit board, which faces away from the second circuit board, is a first layout, the area, which is close to the first circuit board and is not shielded by the first circuit board, of the second circuit board is a second layout, the first layout and the second layout are respectively used for configuring electronic elements, and a bottom bonding pad is arranged on the second circuit board. The circuit board module can increase the device layout space of the module in a limited space.
Description
Technical Field
The utility model relates to the technical field of electronic products, in particular to a circuit board module structure and electronic equipment.
Background
A printed circuit board, also called a printed circuit board (Printed circuit board, abbreviated as PCB), is a provider of electrical connections for electronic components. The main advantage of using a printed circuit board is that wiring and assembly errors are greatly reduced, and automation level and production efficiency are improved.
In the wireless communication module, the space of the ornament of the rf multimode multi-mode device is continuously compressed due to the requirement of miniaturization, so that the area of the PCB circuit board is continuously reduced, and with the advent of the 5G era, more and more electronic devices need to be carried on the circuit board of the electronic equipment such as the smart phone, the tablet personal computer and the like. Thus, how to realize the layout of more electronic devices in a limited space becomes a technical problem to be solved.
Disclosure of Invention
The utility model aims to provide a circuit board module structure and electronic equipment, which can increase the device layout space of a module in a limited space.
Embodiments of the present utility model are implemented as follows:
in one aspect of the present utility model, a circuit board module structure is provided, where the circuit board module structure includes a first circuit board and a second circuit board that are stacked and connected to each other, the area of the first circuit board is smaller than that of the second circuit board, a surface of the first circuit board facing away from the second circuit board is a first layout, an area of the second circuit board, which is close to the first circuit board and is not shielded by the first circuit board, is a second layout, the first layout and the second layout are respectively used for configuring an electronic component, and a bottom pad is disposed on the second circuit board. The circuit board module can increase the device layout space of the module in a limited space.
Optionally, the circuit board module structure further includes a plurality of connection pads, the plurality of connection pads are disposed around the periphery of the first circuit board, and the plurality of connection pads are used for connecting the first circuit board and the second circuit board.
Optionally, the circuit board module structure further includes a plurality of connection pads, each of the plurality of connection pads is disposed on a surface of the first circuit board, which is close to the second circuit board, and the plurality of connection pads are used for connecting the first circuit board and the second circuit board.
Optionally, the plurality of connection pads are evenly distributed on the first circuit board.
Optionally, the circuit board module structure further includes a plurality of connection pads, a part of the connection pads are disposed on one surface of the first circuit board close to the second circuit board, another part of the connection pads are disposed on the periphery of the first circuit board, and the connection pads are used for connecting the first circuit board and the second circuit board.
Optionally, the orthographic projection of the first circuit board on the second circuit board is located in a central region of the second circuit board.
Optionally, the second circuit board has a hollowed-out area exposing at least a part of the first circuit board, and the area of the first circuit board exposed from the hollowed-out area is in a third layout, and the third layout is used for configuring the electronic component.
Optionally, the hollowed-out area is located in a central area of the second circuit board.
Optionally, the area of the hollowed-out area is greater than or equal to half the area of the first layout.
In another aspect of the present utility model, an electronic device is provided, which includes the above circuit board module structure.
The beneficial effects of the utility model include:
the circuit board module structure comprises a first circuit board and a second circuit board which are arranged in a stacked mode and are connected with each other, the area of the first circuit board is smaller than that of the second circuit board, one surface of the first circuit board, which faces away from the second circuit board, is in a first layout, the area, which is close to the first circuit board and is not shielded by the first circuit board, of the second circuit board is in a second layout, the first layout and the second layout are respectively used for configuring electronic elements, and a bottom bonding pad is arranged on the second circuit board. According to the utility model, the first circuit board is arranged on the second circuit board, and the area of the first circuit board is smaller than that of the second circuit board, so that one surface of the first circuit board, which is away from the second circuit board, can be used as a first layout, and meanwhile, the part of the second circuit board, which is not shielded by the first circuit board, can be used as a second layout, so that at least two layouts can be formed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a circuit board module structure according to an embodiment of the present utility model;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a second schematic diagram of a circuit board module structure according to an embodiment of the present utility model;
FIG. 4 is a side view of FIG. 3;
fig. 5 is a third schematic structural diagram of a circuit board module structure according to an embodiment of the utility model.
Icon: 10-a first circuit board; 11-a first layout situation; 12-a third layout situation; 20-a second circuit board; 21-a second layout situation; 22-hollowed-out areas; 30-bottom pads; 40-connection pads.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1 and 2, the present embodiment provides a circuit board module structure, which includes a first circuit board 10 and a second circuit board 20 that are stacked and connected to each other, wherein an area of the first circuit board 10 is smaller than an area of the second circuit board 20, a surface of the first circuit board 10 facing away from the second circuit board 20 is a first layout 11, an area of the second circuit board 20, which is close to the first circuit board 10 and is not shielded by the first circuit board 10, is a second layout 21, the first layout 11 and the second layout 21 are respectively used for configuring electronic components, and a bottom pad 30 is disposed on the second circuit board 20. The circuit board module can increase the device layout space of the module in a limited space.
The first circuit board 10 and the second circuit board 20 are stacked, as shown in fig. 1 and 2, specifically, the first circuit board 10 and the second circuit board 20 are stacked up and down. It should be noted that, in the present embodiment, the first circuit board 10 is entirely located above the second circuit board 20, so that the orthographic projection of the first circuit board 10 on the second circuit board 20 is entirely located in the second circuit board 20. Of course, in other embodiments, the first circuit board 10 and the second circuit board 20 may also be partially overlapped, and in this case, the orthographic projection portion of the first circuit board 10 on the second circuit board 20 is located in the second circuit board 20.
The present utility model sets the area of the first circuit board 10 smaller than the area of the second circuit board 20, and places the first circuit board 10 completely on the second circuit board 20, so that the portion of the second circuit board 20 not covered by the first circuit board 10 can be used as the second layout 21.
While the first layout 11 is a side of the first circuit board 10 facing away from the second circuit board 20, it should be understood that the first layout 11 and the second layout are used for layout of electronic components, and the electronic components may be chips, resistors, capacitors, inductors, etc., which are not examples.
The utility model also provides a bottom bonding pad 30 on the second circuit board 20, and the bottom bonding pad 30 is arranged to facilitate connection between the circuit board module structure and external equipment. The number of the bottom pads 30 is not limited in the present utility model, and those skilled in the art can set the number according to the need.
The first circuit board 10 and the second circuit board 20 are stacked, and the areas of the first circuit board 10 and the second circuit board 20 are different, so that a first layout 11 can be formed on the first circuit board 10, and a second layout can be formed on the second circuit board 20, at least two layout areas can be formed, and compared with the circuit boards of single boards in the prior art, the layout of the circuit board module structure provided by the utility model is more, and more electronic elements can be laid out in a limited space.
In summary, the circuit board module structure provided by the present utility model includes a first circuit board 10 and a second circuit board 20 which are stacked and connected to each other, the area of the first circuit board 10 is smaller than that of the second circuit board 20, one surface of the first circuit board 10 facing away from the second circuit board 20 is a first layout 11, the area of the second circuit board 20, which is close to the first circuit board 10 and is not blocked by the first circuit board 10, is a second layout 21, the first layout 11 and the second layout 21 are respectively used for configuring electronic components, and the second circuit board 20 is provided with a bottom pad 30. According to the utility model, the first circuit board 10 is arranged on the second circuit board 20 in a stacked manner, and the area of the first circuit board 10 is smaller than that of the second circuit board 20, so that one surface of the first circuit board 10, which is away from the second circuit board 20, can be used as a first layout 11, and meanwhile, the part of the second circuit board 20, which is not shielded by the first circuit board 10, can be used as a second layout 21, so that at least two layouts can be formed.
In order to facilitate the connection between the first circuit board 10 and the second circuit board 20, in a first possible embodiment, as shown in fig. 1 and 2, optionally, the circuit board module structure further includes a plurality of connection pads 40, where the plurality of connection pads 40 are disposed around the periphery of the first circuit board 10, and the plurality of connection pads 40 are used to connect the first circuit board 10 and the second circuit board 20.
That is, in this embodiment, the plurality of connection pads 40 are disposed around the outer periphery of the first circuit board 10, and as shown in fig. 2, the connection manner of the pads is a castellated pad.
In a second possible embodiment, as shown in fig. 3 and 4, the circuit board module structure optionally further includes a plurality of connection pads 40, where the plurality of connection pads 40 are disposed on a surface of the first circuit board 10 adjacent to the second circuit board 20, and the plurality of connection pads 40 are used to connect the first circuit board 10 and the second circuit board 20.
That is, the connection pads 40 are located at the bottom of the first circuit board 10, and this embodiment takes the form of an array structure of the bottom pads 30. The pads in this form may be distributed around the bottom of the first circuit board 10 or may be distributed in a middle area of the bottom of the first circuit board 10. The connection mode of the connection pad 40 is characterized by miniaturization and higher pad density compared with the castellated pad.
Optionally, whether using the castellated pads or the array of bottom pads 30, the plurality of connection pads 40 are uniformly distributed on the first circuit board 10 to improve connection reliability of the circuit board module structure.
In a third possible embodiment, optionally, the circuit board module structure further includes a plurality of connection pads 40, a portion of the connection pads 40 are disposed on a surface of the first circuit board 10 adjacent to the second circuit board 20, another portion of the connection pads 40 are disposed on an outer periphery of the first circuit board 10, and the connection pads 40 are used to connect the first circuit board 10 and the second circuit board 20.
Briefly, in this embodiment, a combination of castellated pads and arrays of bottom pads 30 are employed.
It should be noted that, the connection manner of the connection pad 40 may be any one of the castellated pad or the bottom pad 30 array or a combination of the two, which is not specifically limited in the present utility model, and may be determined by a person skilled in the art according to actual needs.
To facilitate placement of the electronic components, optionally, the orthographic projection of the first circuit board 10 onto the second circuit board 20 is located at a central region of the second circuit board 20, as shown in fig. 1 and 3. Of course, the placement of the first circuit board 10 at the center of the second circuit board 20 is merely an example, and in other embodiments, the first circuit board 10 may be disposed at one corner of the second circuit board 20 according to different requirements.
Referring to fig. 5 again, optionally, the second circuit board 20 has a hollowed-out area 22 exposing at least a part of the area of the first circuit board 10, and the area of the first circuit board 10 exposed from the hollowed-out area 22 is a third layout 12, where the third layout 12 is used for configuring electronic components.
The utility model can make at least part of the first circuit board 10 exposed by hollowed-out design on the second circuit board 20, at this time, the exposed area of the first circuit board 10 can be used as the third layout 12 to continue layout of electronic components, so, on one hand, the utility model can effectively utilize the first circuit board 10 without changing the areas of the first circuit board 10 and the second circuit board 20, thereby forming an upper layout and a lower layout on the first circuit board 10, and can generate three layouts in total in combination with one layout of the second circuit board 20, and from the aspect of the utility model, more electronic components can be laid out; on the other hand, in the case of arranging as many electronic components, more layout situations can be formed by providing the hollowed-out area 22 on the second circuit board 20, so that the area of the first circuit board 10 and/or the second circuit board 20 can be properly reduced, and from this point of view, the above-mentioned design of the present utility model can be advantageous for device miniaturization.
Referring to fig. 5, in the embodiment, the hollowed-out area 22 is located in a central area of the second circuit board 20.
Alternatively, in other possible embodiments, the hollowed-out area 22 may be further disposed around the second circuit board 20, and specifically, a person skilled in the art may set the position or shape of the hollowed-out area 22 according to the requirement.
In order to further increase the area of the third layout 12, so that the circuit board module structure provided by the utility model can layout more electronic components in a limited space, optionally, the area of the hollowed-out area 22 is greater than or equal to half the area of the first layout 11. Illustratively, the area of the hollowed-out area 22 is 1/2, 2/3, or 4/5 of the area of the first layout 11, and the present utility model is not limited to this.
In another aspect of the present utility model, an electronic device is provided, which includes the above circuit board module structure.
Because the specific structure and the beneficial effects of the circuit board module structure are described in detail in the foregoing, the utility model is not repeated here.
The above description is only of alternative embodiments of the present utility model and is not intended to limit the present utility model, and various modifications and variations will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
In addition, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described further.
Claims (9)
1. The circuit board module structure is characterized by comprising a first circuit board and a second circuit board which are arranged in a stacked mode and are connected with each other, wherein the area of the first circuit board is smaller than that of the second circuit board, one surface of the first circuit board, which faces away from the second circuit board, is a first layout, the area, which is close to the first circuit board and is not shielded by the first circuit board, of the second circuit board is a second layout, the first layout and the second layout are respectively used for configuring electronic elements, and a bottom bonding pad is arranged on the second circuit board;
the second circuit board is provided with a hollowed-out area at least exposing a part of the first circuit board, and the area of the first circuit board exposed from the hollowed-out area is in a third layout, and the third layout is used for configuring electronic elements.
2. The circuit board module structure of claim 1, further comprising a plurality of connection pads, wherein a plurality of the connection pads are disposed around the periphery of the first circuit board, and wherein a plurality of the connection pads are used to connect the first circuit board and the second circuit board.
3. The circuit board module structure of claim 1, further comprising a plurality of connection pads, wherein a plurality of connection pads are disposed on a surface of the first circuit board adjacent to the second circuit board, and wherein a plurality of connection pads are used to connect the first circuit board and the second circuit board.
4. A circuit board module structure according to claim 2 or 3, wherein a plurality of said connection pads are uniformly distributed on said first circuit board.
5. The circuit board module structure of claim 1, further comprising a plurality of connection pads, wherein a portion of the connection pads are disposed on a surface of the first circuit board adjacent to the second circuit board, another portion of the connection pads are disposed on an outer periphery of the first circuit board, and the connection pads are configured to connect the first circuit board and the second circuit board.
6. The circuit board assembly structure of claim 1, wherein the orthographic projection of the first circuit board on the second circuit board is located in a central region of the second circuit board.
7. The circuit board module structure of claim 1, wherein the hollowed-out area is located in a central area of the second circuit board.
8. The circuit board module structure of claim 1 or 7, wherein the hollowed-out area is greater than or equal to half the area of the first layout.
9. An electronic device comprising the circuit board module structure of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320503780.6U CN219876291U (en) | 2023-03-10 | 2023-03-10 | Circuit board module structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320503780.6U CN219876291U (en) | 2023-03-10 | 2023-03-10 | Circuit board module structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876291U true CN219876291U (en) | 2023-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320503780.6U Active CN219876291U (en) | 2023-03-10 | 2023-03-10 | Circuit board module structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876291U (en) |
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2023
- 2023-03-10 CN CN202320503780.6U patent/CN219876291U/en active Active
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| GR01 | Patent grant |