CN221010368U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The circuit board assembly comprises a circuit board, wherein the circuit board is provided with a plurality of partitions, each partition is provided with at least one electric device, a plurality of isolation structures are arranged between at least two adjacent partitions, each isolation structure is fixedly connected to the circuit board, and the isolation structures are used for signal isolation between the electric devices on the adjacent partitions; the shielding cover is fixed on the circuit board and forms a containing space with the circuit board, and each electric device and each isolation structure are located in the containing space. By the design, the flatness of the shielding cover is effectively improved, so that the flatness of the shielding cover is guaranteed to meet the requirements, and the reliability of the electronic equipment can be improved.

Description

Circuit board assembly and electronic equipment

Technical Field

The disclosure relates to the field of electronic equipment, and in particular relates to a circuit board assembly and electronic equipment.

Background

In the prior art, a plurality of electric devices are usually arranged on a main board of the electronic equipment, and in order to ensure the function and use of each electric device, a shielding cover and a retaining wall are often required to be arranged to avoid signal interference among the devices. However, the retaining wall in the related art has a problem in that it is easy to cause difficulty in meeting the requirement of flatness of the shield case at the time of assembly.

Disclosure of utility model

To overcome the problems in the related art, the present disclosure provides a circuit board assembly and an electronic device.

According to a first aspect of the present disclosure, there is provided a circuit board assembly comprising: the circuit board is provided with a plurality of partitions, each partition is provided with at least one electric device, a plurality of isolation structures are arranged between at least two adjacent partitions, each isolation structure is fixedly connected to the circuit board, and the isolation structures are used for signal isolation between the electric devices on the adjacent partitions; the shielding cover is fixed on the circuit board and forms a containing space with the circuit board, and each electric device and each isolation structure are located in the containing space.

In some embodiments of the disclosure, the isolation structure and the shielding case are separate structures.

In some embodiments of the present disclosure, the isolation structure and the electrical device are both soldered to the circuit board by surface mount technology.

In some embodiments of the present disclosure, the isolation structure is a copper structure.

In some embodiments of the present disclosure, the isolation structures are columnar structures and/or block structures.

In some embodiments of the present disclosure, the spacing between adjacent isolation structures is 0.2-2.0 mm.

In some embodiments of the present disclosure, the isolation structures have a height of 0.2mm to 0.4mm.

In some embodiments of the present disclosure, a flatness of an end surface of the isolation structure facing away from the circuit board is less than or equal to 0.05mm.

In some embodiments of the disclosure, a first end of each isolation structure is welded to the circuit board, a second end of the isolation structure is disposed opposite to the first surface of the shielding case, and a preset gap is formed between the second end of the isolation structure and the first surface.

In some embodiments of the present disclosure, the preset gap is 0.05mm to 0.1mm.

According to a second aspect of the present disclosure, there is provided an electronic device comprising a circuit board assembly as described above.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects:

In the circuit board assembly provided by the disclosure, a plurality of isolation structures are arranged between at least two adjacent partitions of the circuit board so as to isolate signals between electric devices on the adjacent partitions. And a shielding cover is further arranged on the circuit board, the shielding cover and the circuit board form a containing space, and each electric device and each isolation structure are positioned in the containing space. The design effectively improves the flatness of the shielding cover so as to ensure that the flatness of the shielding cover meets the requirements, and further the reliability of the electronic equipment can be improved. In addition, the process of combining and fixing the isolation structure and the shielding cover is saved, and the assembly process is simplified, so that the assembly processing cost is effectively reduced.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic cross-sectional view of a circuit board assembly shown when the isolation structure is a columnar structure, according to an exemplary embodiment;

FIG. 2 is a schematic cross-sectional view of a circuit board assembly when the isolation structure is a block structure, according to an example embodiment;

FIG. 3 is a schematic diagram illustrating a circuit board assembly when the isolation structure is a columnar structure, according to an exemplary embodiment;

FIG. 4 is a schematic diagram illustrating a circuit board assembly when the isolation structure is a block structure, according to an exemplary embodiment;

Fig. 5 is a schematic structural view of a circuit board when an isolation structure is a columnar structure, according to another exemplary embodiment;

Fig. 6 is a schematic structural view of a circuit board when the isolation structure is a block structure, according to another exemplary embodiment.

In the figure:

1-a circuit board; 11-an electrical device; 12-isolation structures; 13-chip; 2-shielding case; 21-an accommodating space; 3-bonding pads; 31-welding spots.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

In the prior art, a plurality of electric devices are usually arranged on a main board of the electronic equipment, and in order to ensure the function and use of each electric device, a shielding cover and a retaining wall are often required to be arranged to avoid signal interference among the devices. The shielding case is welded on the main board, and forms a containing space with the main board, and each electric device is located in the containing space. The shielding cover is used for shielding electromagnetic waves generated by the electric devices from radiating outwards and preventing interference of external electric fields, magnetic fields or electromagnetic fields and the like on the electric devices in the accommodating space. Meanwhile, retaining walls are further arranged in the accommodating space to avoid signal interference between the electric devices, for example, the retaining walls are arranged between every two adjacent electric devices, or the electric devices are arranged on each interval according to the need of shielding to divide the circuit board into intervals, and the retaining walls are arranged between every two adjacent intervals to prevent signal interference between the electric devices on the two adjacent intervals.

In the related art, the retaining wall and the shielding case are generally fixed by welding or gluing, and then uniformly welded on the circuit board, for example, by a surface mounting process. However, when fixing the retaining wall and the shielding case through welding, on the one hand, the problem of poor welding such as cold joint, float height easily appears to lead to the surface roughness of shielding case to lead to the planarization of shielding case to not satisfy the planarization requirement, can influence follow-up mounting process and the assembly process of complete machine, and then has influenced electronic equipment's reliability. On the other hand, the welding and fixing process is additionally added, so that the assembling process is complicated, and the assembling and processing cost is increased.

In order to solve the above technical problems, the present disclosure provides a circuit board assembly, in which a plurality of isolation structures are disposed between at least two adjacent partitions of a circuit board to perform signal isolation between electrical devices on the adjacent partitions. And a shielding cover is further arranged on the circuit board, the shielding cover and the circuit board form a containing space, and each electric device and each isolation structure are positioned in the containing space. By adopting the arrangement form, each isolation structure is conveniently fixed on the circuit board, the isolation structure and the shielding cover are not required to be combined and fixed, the flatness of the shielding cover due to bad influence of welding between the isolation structure and the shielding cover is effectively avoided, the flatness of the shielding cover is effectively improved, the flatness of the shielding cover is ensured to meet the requirements, and the reliability of electronic equipment is further improved. Meanwhile, the process of combining and fixing the isolation structure and the shielding cover is saved, and the assembly process is simplified, so that the assembly and processing cost is effectively reduced.

An exemplary embodiment of the present disclosure provides a circuit board assembly, as shown in fig. 1, including a circuit board 1 and a shielding case 2, where a surface of the circuit board 1 has a plurality of partitions, and each partition is provided with at least one electric device 11, and the electric device 11 may be, for example, a main control module, a power module, or a WiFi module. As shown in fig. 3, a plurality of isolation structures 12 are disposed between at least two adjacent partitions, and for example, the electric devices 11 having signal isolation requirements are disposed on the respective partitions, respectively, and further, a plurality of isolation structures 12 are disposed between the two adjacent partitions to perform signal isolation between the electric devices 11 on the adjacent partitions. Illustratively, the master control module, the power supply module, or the WiFi module all have signal isolation requirements, and the master control module, the power supply module, or the WiFi module is respectively disposed on the first partition, the second partition, and the third partition, and a plurality of isolation structures 12 are disposed between two adjacent partitions, for example, a plurality of isolation structures 12 are disposed between the first partition and the second partition, a plurality of isolation structures 12 are disposed between the second partition and the third partition, and a plurality of isolation structures 12 are disposed between the first partition and the third partition. The isolation structure 12 is fixedly connected to the circuit board 1, and the fixing connection manner may be, for example, welding, and the isolation structure 12 is used for signal isolation between the electric devices 11 on adjacent partitions. The shielding case 2 is fixed on the circuit board 1 and forms a containing space 21 with the circuit board 1, each electrical device 11 and each isolation structure 12 are located in the containing space 21, and the shielding case 2 is used for shielding electromagnetic waves generated by each electrical device 11 from radiating outwards and preventing interference of external electric fields, magnetic fields or electromagnetic fields and the like on each electrical device 11 in the containing space 21.

By means of the design, the flexibility of the setting position of the isolation structure 12 can be improved, the isolation structure 12 is fixedly connected to the circuit board 1, the isolation structure 12 and the shielding cover 2 are not required to be combined and fixed, the flatness of the shielding cover 2 due to bad influence of welding between the isolation structure 12 and the shielding cover 2 is effectively avoided, the flatness of the shielding cover 2 is effectively improved, the flatness of the shielding cover 2 is guaranteed to meet requirements, and the reliability of electronic equipment can be improved. Meanwhile, the process of combining and fixing the isolation structure 12 and the shielding case 2 is omitted, and the assembly process is simplified, so that the assembly and processing cost is effectively reduced.

The circuit board assembly provided by the embodiment is not limited to be applied to electronic equipment, but also can be applied to other equipment with signal isolation requirements, such as household appliances or fields related to communication.

In one embodiment, as shown in fig. 1, the isolation structure 12 and the shielding case 2 are separate structures, and illustratively, the isolation structure 12 and the shielding case 2 may be in contact or separated from each other. By the design, the convenience of assembling the isolation structure 12 is improved, the flatness of the shielding cover 2 due to bad influence of welding between the isolation structure 12 and the shielding cover 2 can be further avoided, and accordingly the flatness of the shielding cover 2 is effectively improved, the flatness of the shielding cover 2 is guaranteed to meet requirements, and the reliability of electronic equipment can be improved.

In one embodiment, as shown in fig. 3, the isolation structure 12 and the electrical device 11 are soldered to the circuit board 1 by surface mount technology (Surface Mount Technology, SMT). It is understood that the surface mounting technology refers to a circuit mounting technology for mounting a leadless or short-lead surface-mounted component on a surface of a printed circuit board (Printed Circuit Board, PCB) or other substrate, and soldering and assembling the component by reflow soldering or dip soldering. The isolation structure 12 and the electrical device 11 may be soldered to the circuit board 1 by surface mount technology, or the isolation structure 12 and the electrical device 11 may be soldered to the circuit board 1 by surface mount technology, respectively, for example. As shown in fig. 5 and 6, the circuit board 1 is provided with a plurality of pads 3 corresponding to each isolation structure 12 and each electric device 11, and the pads 31 are printed on each pad 3, where the printing precision requirement may be ±12.5 μm, and the pads 31 may be, for example, 5 # powder solder paste or a solder paste with smaller particles, so as to ensure the consistency of the connection strength of the pads 31 and the connection strength of each pad 31.

The electrical devices 11 and the isolation structures 12 are synchronously mounted on the corresponding bonding pads 3, and meanwhile, the chip 13 may be arranged on the circuit board 1, for example, the bonding pads 3 are arranged corresponding to the chip 13 of the circuit board 1, the welding spots 31 are printed on the bonding pads 3, and the chip 13 is mounted on the corresponding bonding pads 3. The mounting accuracy requirement may be, for example, ±25 μm.

The circuit board 1 on which the electric device 11, the isolation structure 12 and the chip 13 are mounted is subjected to a first curing. Then, the shield case 2 is attached to the circuit board 1, and the circuit board 1 to which the shield case 2 is attached is soldered to the electric device 11, the isolation structure 12, and the shield case 2 by reflow soldering. The soldered circuit board 1 is subjected to a second curing.

In the related art, a certain assembly error exists when the retaining wall is assembled on the main board, and therefore, besides a certain distance from an adjacent electric device, a safety distance needs to be increased to prevent the retaining wall from being relatively close to the electric device after the retaining wall is assembled on the main board, so that the area of the main board occupied by the bonding pad for connecting the retaining wall is relatively large. Meanwhile, in order to ensure the stability of the retaining wall when being welded on the main board, a pad with a larger area is needed to provide more welding spots for welding, so that the pad for connecting the retaining wall further occupies a larger area of the main board, and the miniaturization design of the electronic equipment is not facilitated.

In this embodiment, the isolation structures 12 and the electric devices 11 are soldered to the circuit board 1 by the surface mounting technology, and the isolation structures 12 are mounted simultaneously with the mounting of the electric devices 11, for example, by tray feeding or by flyer feeding.

By adopting the arrangement form, due to the accuracy of the surface mounting technology, the isolation structure 12 can be accurately mounted on the corresponding bonding pad 3 without extra safety distance, and the occupied area of the bonding pad 3 for connecting the isolation structure 12 can be effectively reduced. In addition, the surface mounting technology can ensure the stability of the isolation structure 12 during welding, and further does not need to additionally increase the area on the bonding pad 3 to provide more welding spots 31, so that the occupied area of the bonding pad 3 for connecting the isolation structure 12 can be further reduced, the overall layout of the circuit board 1 is convenient to optimize, and the miniaturization design of electronic equipment is facilitated.

In one embodiment, as shown in fig. 1 and 3, the isolation structure 12 is a copper structure, and the copper structure has good shielding performance, so that the signal isolation effect on the electrical devices 11 on the adjacent partitions can be effectively improved.

In one embodiment, the isolation structure 12 may be a columnar structure, for example, a cylindrical structure, or a prismatic structure, and the prisms may be, for example, quadrangular prisms, or triangular prisms.

In this embodiment, the isolation structure 12 may be a columnar structure, which can play a supporting role on the shielding case 2, so as to avoid collapse of the shielding case 2, thereby effectively improving the flatness of the shielding case 2. Illustratively, when the size of the shielding case 2 is large or the structural strength of the shielding case 2 is low, the middle region of the shielding case 2 is easily collapsed, and the middle region of the shielding case 2 may be supported by the columnar structure in the accommodating space 21 to effectively avoid the collapse of the shielding case 2.

In another embodiment, as shown in fig. 2 and 4, the isolation structure 12 may be a block structure, and the height of the block structure is lower than that of the columnar structure, and the height of the block structure is used as a basic requirement to satisfy the radio frequency shielding effect. When the size of the shielding case 2 is smaller or the structural strength of the shielding case 2 is higher, a block structure may be used as the isolation structure 12, so as to further avoid the unevenness or breakage of the shielding case 2 caused by the isolation structure 12, thereby further improving the flatness of the shielding case 2.

Illustratively, both the chip 13 and the columnar structure may be mounted using tray loading, and the block structure may be mounted via femto loading.

Because copper post structure and cubic structure all can play good shielding signal's effect, and the height of cubic structure is less than copper post structure's height, and then the material of production cubic structure is less, and high copper post structure can play good supporting role to the shield cover. Based on this, in an embodiment, the columnar structures and the block structures are alternately arranged along the boundary lines of the adjacent partitions, so that the effect of signal isolation between the electric devices 11 on the adjacent partitions is ensured, and meanwhile, the shielding cover 2 can be supported, and the material use of the isolation structure 12 can be saved, so that the production cost is further reduced.

In one embodiment, as shown in fig. 3 and 4, the spacing between the adjacent isolation structures 12 is 0.2-2.0 mm, and by adopting such a configuration, on one hand, the material usage of the isolation structures 12 can be further saved while the signal isolation effect on the electrical devices 11 on the adjacent partitions is ensured, and the production cost is reduced. On the other hand, the area occupation of the circuit board 1 can be further reduced, thereby facilitating optimization of the overall layout of the circuit board 1.

In an embodiment, the height of the isolation structure 12 is 0.2 mm-0.4 mm, so that the damage of the shielding case 2 or the uneven of the shielding case 2 caused by the too high height of the isolation structure 12 with a columnar structure is avoided, and the flatness of the shielding case 2 is further improved.

Since there is a certain assembly error when the shielding case 2 is mounted on the circuit board 1, in this embodiment, as shown in fig. 1 and 2, a first end of each of the isolation structures 12 in the isolation structure 12 is welded to the circuit board 1, a second end of the isolation structure 12 is opposite to the first surface of the shielding case 2, and a predetermined gap is provided between the second end of the isolation structure 12 and the first surface. By adopting the arrangement form, a safe distance is reserved between the isolation structure 12 and the shielding case 2, so that the situation that the isolation structure 12 causes uneven shielding case 2 and even the isolation structure 12 is pricked is avoided, and the flatness and reliability of the shielding case 2 are further improved. It can be appreciated that the first surface of the shielding case 2 is a surface of the shielding case 2 facing the accommodating space 21.

In one embodiment, the flatness of the end surface of the isolation structure 12 facing away from the circuit board is less than or equal to 0.05mm. By the design, the isolation structure 12 is convenient to adsorb in the surface mounting process, so that the mounting precision of the isolation structure 12 can be effectively improved. In another embodiment, the flatness of the surface of each isolation structure 12 is less than or equal to 0.05mm, so that the welding consistency of each isolation structure 12 can be improved while the isolation structures 12 are convenient to adsorb, and further, the flatness of the shielding cover 2 can be effectively improved, the problem that the isolation structures 12 are poor in welding and the like is effectively avoided, and the repairing cost is saved. It is understood that flatness less than or equal to 0.05mm means flatness accuracy is required to be within + -0.05 mm.

In an embodiment, the preset gap is 0.05 mm-0.1 mm, so that the signal isolation effect of the isolation structure 12 is ensured, and the isolation structure 12 can also play a supporting role, so that the flatness of the shielding cover 2 is improved.

An exemplary embodiment of the present disclosure provides an electronic device, which may be, for example, a mobile device such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, a PDA (personal DIGITAL ASSISTANT), or a non-mobile device such as a personal computer (personal computer, PC), a Television (TV), a teller machine, or a self-service machine.

The electronic device includes the circuit board assembly as described above, as shown in fig. 1, and in the circuit board assembly as described above, including the circuit board 1 and the shielding case 2, there are a plurality of partitions on a surface on the circuit board 1, and each partition is provided with at least one electric device 11, and the electric device 11 may be, for example, a main control module, a power supply module, a WiFi module, or the like. A plurality of isolation structures 12 are disposed between at least two adjacent partitions, and as shown in fig. 3, for example, the electric devices 11 having signal isolation requirements are disposed on the respective partitions, respectively, and then a plurality of isolation structures 12 are disposed between the two adjacent partitions to perform signal isolation between the electric devices 11 on the adjacent partitions. Illustratively, the master control module, the power supply module, or the WiFi module all have signal isolation requirements, and the master control module, the power supply module, or the WiFi module is respectively disposed on the first partition, the second partition, and the third partition, and a plurality of isolation structures 12 are disposed between two adjacent partitions, for example, a plurality of isolation structures 12 are disposed between the first partition and the second partition, a plurality of isolation structures 12 are disposed between the second partition and the third partition, and a plurality of isolation structures 12 are disposed between the first partition and the third partition. The isolation structure 12 is soldered to the circuit board 1, and the isolation structure 12 is used for signal isolation between the electrical devices 11 on adjacent partitions. The shielding case 2 is fixed on the circuit board 1 and forms a containing space 21 with the circuit board 1, each electrical device 11 and each isolation structure 12 are located in the containing space 21, and the shielding case 2 is used for shielding electromagnetic waves generated by each electrical device 11 from radiating outwards and preventing interference of external electric fields, magnetic fields or electromagnetic fields and the like on each electrical device 11 in the containing space 21.

By means of the design, the flexibility of the setting position of the isolation structure 12 can be improved, the isolation structure 12 is fixedly connected to the circuit board 1, the isolation structure 12 and the shielding cover 2 are not required to be combined and fixed, the flatness of the shielding cover 2 due to bad influence of welding between the isolation structure 12 and the shielding cover 2 is effectively avoided, the flatness of the shielding cover 2 is effectively improved, the flatness of the shielding cover 2 is guaranteed to meet requirements, and the reliability of electronic equipment can be improved. Meanwhile, the process of combining and fixing the isolation structure 12 and the shielding case 2 is omitted, and the assembly process is simplified, so that the assembly and processing cost is effectively reduced.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (11)

1. A circuit board assembly, the circuit board assembly comprising:

The circuit board is provided with a plurality of partitions, each partition is provided with at least one electric device, a plurality of isolation structures are arranged between at least two adjacent partitions, each isolation structure is fixedly connected to the circuit board, and the isolation structures are used for signal isolation between the electric devices on the adjacent partitions;

The shielding cover is fixed on the circuit board and forms a containing space with the circuit board, and each electric device and each isolation structure are located in the containing space.

2. The circuit board assembly of claim 1, wherein the isolation structure is a split structure with the shield.

3. The circuit board assembly of claim 1, wherein the isolation structures and the electrical devices are soldered to the circuit board by surface mount technology.

4. The circuit board assembly of claim 1, wherein the isolation structure is a copper structure.

5. The circuit board assembly of claim 1, wherein the isolation structures are columnar structures and/or block structures.

6. The circuit board assembly of claim 1, wherein a spacing between adjacent ones of the isolation structures is 0.2-2.0 mm.

7. The circuit board assembly of claim 1, wherein the height of the isolation structure is 0.2mm to 0.4mm.

8. The circuit board assembly of any one of claims 1 to 7, wherein the flatness of the end surface of the isolation structure facing away from the circuit board is less than or equal to 0.05mm.

9. The circuit board assembly of claim 1, wherein a first end of each of the isolation structures is welded to the circuit board, a second end of the isolation structure is disposed opposite the first surface of the shield, and a predetermined gap is provided between the second end of the isolation structure and the first surface.

10. The circuit board assembly of claim 9, wherein the predetermined gap is 0.05mm to 0.1mm.

11. An electronic device comprising a circuit board assembly according to any one of claims 1 to 10.