CN212812161U - Wireless communication module - Google Patents

Abstract

The utility model provides a wireless communication module, which comprises a circuit board, a communication processing chip, at least one decoupling capacitor and at least two pre-buried bonding pads; each pre-buried bonding pad is arranged between the outer surfaces of the two outermost layers of the circuit board; one pre-buried bonding pad is electrically connected with a power input pin of the communication processing chip, and the other pre-buried bonding pads are electrically connected with a grounding pin of the communication processing chip; two ends of each decoupling capacitor are respectively welded with one embedded bonding pad; an air-forbidden region cabin is formed between two pre-buried bonding pads welded at two ends of each decoupling capacitor; the circuit board provides a carrier for electrical connection of the electronic components of the module; the decoupling capacitor reduces the power supply noise of the communication processing chip and provides energy for the chip; and welding a decoupling capacitor on the pre-buried bonding pad. The utility model discloses increase the problem that decoupling capacitor is high in order to solve some mains impedance, satisfy the PDN performance of product, reduce the area of module, reduce the volume, reduce the number of piles of circuit board, reduce cost.

Description

Wireless communication module

Technical Field

The utility model relates to a power distribution network technical field, in particular to wireless communication module.

Background

A PDN (Power delivery network) is a physical path that delivers Power from a Power source to a load. The current flows from the power supply terminal to the load terminal through the PDN, and then flows back from the load terminal to the power supply terminal through the PDN. Variations in load size and load frequency can cause the voltage of the load transmitted by the PDN to no longer be equal to the voltage of the power supply output, but can cause unpredictable failures of the load once the load attains a voltage below the operational requirements of the load.

The basic requirements of PDN are: in the case where the current fluctuation of the communication processing chip is known, in order to supply a relatively stable power supply to the communication processing chip, the impedance of the PDN needs to be lower than a certain target value over the entire frequency band from the direct current to a certain highest frequency. The PDN realizes a low impedance requirement in the entire frequency band by using a plurality of functional elements, such as a power module, an on-Board decoupling capacitor, a Printed Circuit Board (PCB) power supply, a distributed capacitor between a ground plane and a Printed Circuit Board (PCB), a capacitor on package, and an on-chip capacitor. The PDN should not only provide a clean power supply for the communication processing chip, but also generally serve as a reference plane or path for signals, and should also minimize noise at the power supply and ground planes, thereby reducing EMI (electromagnetic Interference) radiation of the power supply network.

Currently, the basic requirements of a PDN are usually satisfied by a wireless communication module with decoupling capacitors placed on one side:

referring to fig. 1 and 2, in the case where the current fluctuation of the communication processing chip is known, a relatively stable power supply is supplied to the communication processing chip 1 on the wireless communication module. The position of the decoupling capacitor 2 must be arranged close to the communication processing chip, so that the good inner plane and the backflow of the power supply and the ground plane are realized while the decoupling capacitor is increased.

The disadvantages are as follows: the wireless communication module has large area and volume, and the circuit board has more layers and high cost.

However, as the clock frequency of the electronic component is continuously increased and more functions are integrated inside the communication processing chip, the power consumption of the communication processing chip on the wireless communication module is continuously increased, and meanwhile, the power supply voltage of the communication processing chip of the wireless communication module is continuously reduced due to the progress of the manufacturing process of the communication processing chip. Moreover, the increase of the integration level of the communication processing chip of the wireless communication module causes the communication processing chip of the same wireless communication module to need more power types, and the design difficulty of the power supply system of the wireless communication module is increased by various power domains. Meanwhile, the sensitivity of a communication processing chip in the wireless communication module to power supply fluctuation is increased, and the design margin of a power supply system is directly reduced. Under the condition, the number of decoupling capacitors used by the wireless communication module with the decoupling capacitors placed on one side is small, the PDN performance of a product cannot be well met, the area is large, the size is large, the number of layers of a circuit board is large, and the cost is high.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is that the decoupling capacitor that wireless communication module used in order to overcome among the prior art single face put decoupling capacitor is small in quantity, can not satisfy the PDN performance of product well, and the area is big, bulky, and the number of piles of circuit board is many, defect with high costs provides a wireless communication module.

The utility model discloses an above-mentioned technical problem is solved through following technical scheme:

the utility model provides a wireless communication module, which comprises a circuit board, a communication processing chip, at least one decoupling capacitor and at least two pre-buried bonding pads;

each embedded bonding pad is arranged between the outer surfaces of the two outermost layers of the circuit board;

one pre-buried bonding pad is electrically connected with a power input pin of the communication processing chip, and the other pre-buried bonding pads are electrically connected with a grounding pin of the communication processing chip;

two ends of each decoupling capacitor are respectively welded with one embedded bonding pad;

an air-forbidden region cabin is formed between the two pre-buried bonding pads welded at the two ends of each decoupling capacitor;

the circuit board is used for providing a carrier for electrical connection of electronic components of the wireless communication module;

the decoupling capacitor is used for reducing noise of a power supply of the communication processing chip and providing energy for the communication processing chip;

the pre-buried bonding pad is used for welding the decoupling capacitor.

Preferably, the welding manner between the two ends of the decoupling capacitor and the pre-buried bonding pad includes SMT (Surface mount Technology).

Preferably, the position of the keep-out area cabin corresponds to the position of the communication processing chip.

Preferably, the area of the outermost layer of the circuit board, which is opposite to the keep-out area compartment, is not provided with electronic components other than the decoupling capacitor and the communication processing chip.

Preferably, an area of the inner layer of the circuit board opposite to the keep-out area compartment is not provided with electronic components other than the decoupling capacitor.

Preferably, the keep-out zone compartment passes through inner layers of a plurality of the circuit boards.

Preferably, the shape of the keep-out region cabin comprises a cuboid.

Preferably, the direction of height of cuboid perpendicular to the surface of circuit board, the direction of length perpendicular to of cuboid the surface of pre-buried pad, the direction of width of cuboid parallel to the surface of pre-buried pad.

Preferably, for the size of a single cuboid, the length of the cuboid ranges from 0.48 mm to 0.52 mm, the width of the cuboid ranges from 0.2 mm to 0.3 mm, and the height of the cuboid ranges from 0.13 mm to 0.17 mm;

and/or, for the size of a single cuboid, the length of the cuboid ranges from 0.67 mm to 0.73 mm, the width of the cuboid ranges from 0.37 mm to 0.43 mm, and the height of the cuboid ranges from 0.25 mm to 0.31 mm;

and/or, for the size of a single cuboid, the length range of the cuboid comprises 1.25 mm-1.35 mm, the width range of the cuboid comprises 0.65 mm-0.75 mm, and the height range of the cuboid comprises 0.35 mm-0.45 mm.

The utility model discloses an actively advance the effect and lie in: through the buried capacitor of formula of subsiding on the surface layer of the circuit board of wireless communication module of pre-buried pad, wireless communication module can enough increase the decoupling capacitance in order to solve the high problem of some mains impedance, satisfies the PDN performance of product, can dwindle wireless communication module's area again, reduces the volume, reduces the number of piles of circuit board, reduce cost.

Drawings

Fig. 1 is a structural diagram of a wireless communication module with decoupling capacitors placed on one side.

Fig. 2 is a front view of a wireless communication module and a chassis with decoupling capacitors disposed on one side.

Fig. 3 is a schematic structural diagram of a wireless communication module according to a preferred embodiment of the present invention.

Fig. 4 is a schematic structural diagram of an emptiness-forbidden zone compartment of the wireless communication module according to the preferred embodiment of the present invention.

Fig. 5 is a front view of the wireless communication module and the bottom plate according to the preferred embodiment of the present invention.

Detailed Description

The present invention will be more clearly and completely described below with reference to the accompanying drawings, which are used to illustrate preferred embodiments of the present invention, but not to limit the scope of the present invention.

The present embodiment provides a wireless communication module. Referring to fig. 3, the wireless communication module includes a circuit board 10, a communication processing chip 1, at least one decoupling capacitor 2, and at least two pre-buried pads 4;

each pre-buried bonding pad 4 is arranged between the outer surfaces of the two outermost layers of the circuit board 10;

one pre-buried bonding pad 4 is electrically connected with a power input pin of the communication processing chip 1, and the other pre-buried bonding pads 4 are electrically connected with a grounding pin of the communication processing chip 1;

two ends of each decoupling capacitor 2 are respectively welded with one embedded bonding pad 4;

an air-forbidden region cabin 5 is respectively formed between two pre-embedded bonding pads 4 welded at two ends of each decoupling capacitor 2;

the circuit board 10 is a carrier for providing electrical connection of electronic components of the wireless communication module;

the decoupling capacitor 2 is used for reducing the noise of the power supply of the communication processing chip 1 and providing energy for the communication processing chip 1;

the pre-buried bonding pad 4 is used for welding the decoupling capacitor 2.

The size of the pre-buried pad 4 can be set as required.

In an alternative embodiment, the way of welding the two ends of the decoupling capacitor 2 and the embedded pad 4 includes SMT.

In an alternative embodiment, the location of the keep-out zone compartment 5 corresponds to the location of the communication processing chip 1.

In an alternative embodiment, the outermost region of the circuit board 10 opposite the keep-out compartment 5 is not provided with electronic components other than the coupling capacitor 2 and the communication processing chip 1.

In an alternative embodiment, the inner layer of the circuit board 10 is not provided with electronic components, except for the coupling capacitors 2, in the region opposite the keep-out compartment 5.

In an alternative embodiment, the keep-out zone compartment 5 passes through the inner layers of several circuit boards 10. Referring to fig. 4, the keep-out zone compartment 5 passes through two layers of the circuit board 10.

In an alternative embodiment, the shape of the keep-out zone compartment 5 comprises a cuboid. In fig. 4, L denotes the length of the rectangular parallelepiped, W denotes the width of the rectangular parallelepiped, and H denotes the height of the rectangular parallelepiped.

In a specific embodiment, the height direction of the cuboid is perpendicular to the surface of the circuit board 10, the length direction of the cuboid is perpendicular to the surface of the embedded pad 4, and the width direction of the cuboid is parallel to the surface of the embedded pad 4.

In an alternative embodiment, for the dimensions of a single said cuboid, the length of the cuboid ranges from 0.48 mm to 0.52 mm, the width of the cuboid ranges from 0.2 mm to 0.3 mm, and the height of the cuboid ranges from 0.13 mm to 0.17 mm;

and/or, for the size of a single said cuboid, the length of the cuboid ranges from 0.67 mm to 0.73 mm, the width of the cuboid ranges from 0.37 mm to 0.43 mm, and the height of the cuboid ranges from 0.25 mm to 0.31 mm;

and/or, for the size of a single said cuboid, the length of the cuboid ranges from 1.25 mm to 1.35 mm, the width of the cuboid ranges from 0.65 mm to 0.75 mm, and the height of the cuboid ranges from 0.35 mm to 0.45 mm.

The cuboid includes but not limited to above three kinds of sizes, can set up the size of cuboid as required, can be provided with a plurality of cuboids of different sizes in same wireless communication module. And setting whether the vacancy district cabin 5 penetrates through the inner layer of the circuit board 10 and the number of penetrating layers according to the height of the cuboid.

Referring to fig. 5, the wireless communication module is soldered to the chassis base 3, and the decoupling capacitor 2 does not expose the outer surface of the wireless communication module, so that soldering can be performed using a general soldering technique (e.g., SMT) without performing a special soldering process. Because a part of the decoupling capacitor 2 is arranged in the wireless communication module and is not arranged on the outer surface of the wireless communication module, the decoupling capacitor can be flexibly arranged, the area of the wireless communication module is reduced, the volume is reduced, the layer number of a circuit board is reduced, and the cost is reduced. Furthermore, a plurality of decoupling capacitors 2 may be connected in parallel to the power input pin of each communication processing chip 1 to optimize PDN performance. The number and type of decoupling capacitors 2 may be set as desired.

The utility model discloses a formula buried capacitor is subsided on the top layer of wireless communication module's circuit board to pre-buried pad, and wireless communication module can enough increase the problem that decoupling capacitor is high in order to solve partly power impedance, satisfies the PDN performance of product, can dwindle wireless communication module's area again, reduces the volume, reduces the number of piles of circuit board, reduce cost.

Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.

Claims (9)

1. A wireless communication module is characterized by comprising a circuit board, a communication processing chip, at least one decoupling capacitor and at least two pre-buried bonding pads;

each embedded bonding pad is arranged between the outer surfaces of the two outermost layers of the circuit board;

one pre-buried bonding pad is electrically connected with a power input pin of the communication processing chip, and the other pre-buried bonding pads are electrically connected with a grounding pin of the communication processing chip;

two ends of each decoupling capacitor are respectively welded with one embedded bonding pad;

an air-forbidden region cabin is formed between the two pre-buried bonding pads welded at the two ends of each decoupling capacitor;

the circuit board is used for providing a carrier for electrical connection of electronic components of the wireless communication module;

the decoupling capacitor is used for reducing noise of a power supply of the communication processing chip and providing energy for the communication processing chip;

the pre-buried bonding pad is used for welding the decoupling capacitor.

2. The wireless communication module of claim 1, wherein the way of bonding the two ends of the decoupling capacitor to the pre-buried pad comprises SMT.

3. The wireless communication module of claim 1, wherein a location of the keep-out zone compartment corresponds to a location of the communication processing chip.

4. The wireless communication module of claim 1, wherein a region of the outermost layer of the circuit board opposite the keep-out compartment is free of electronic components other than the decoupling capacitor and the communication processing chip.

5. The wireless communication module of claim 1, wherein a region of the inner layer of the circuit board opposite the keep-out zone compartment is free of electronic components other than the decoupling capacitance.

6. The wireless communication module of claim 1, wherein the keep-out zone compartment passes through inner layers of the circuit board.

7. The wireless communication module of claim 1, wherein the shape of the keep-out zone compartment comprises a cuboid.

8. The wireless communication module of claim 7, wherein a height direction of the cuboid is perpendicular to the surface of the circuit board, a length direction of the cuboid is perpendicular to the surface of the pre-buried pad, and a width direction of the cuboid is parallel to the surface of the pre-buried pad.

9. The wireless communication module of claim 8, wherein for a single size of the cuboid, a length of the cuboid ranges from 0.48 mm to 0.52 mm, a width of the cuboid ranges from 0.2 mm to 0.3 mm, and a height of the cuboid ranges from 0.13 mm to 0.17 mm;

and/or, for the size of a single cuboid, the length of the cuboid ranges from 0.67 mm to 0.73 mm, the width of the cuboid ranges from 0.37 mm to 0.43 mm, and the height of the cuboid ranges from 0.25 mm to 0.31 mm;

and/or, for the size of a single cuboid, the length range of the cuboid comprises 1.25 mm-1.35 mm, the width range of the cuboid comprises 0.65 mm-0.75 mm, and the height range of the cuboid comprises 0.35 mm-0.45 mm.

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