CN109874228A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN109874228A CN109874228A CN201910285323.2A CN201910285323A CN109874228A CN 109874228 A CN109874228 A CN 109874228A CN 201910285323 A CN201910285323 A CN 201910285323A CN 109874228 A CN109874228 A CN 109874228A
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- Prior art keywords
- printed circuit
- board assembly
- component
- electronic component
- board
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- 239000010410 layer Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
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- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of electronic equipment, since the first printed circuit-board assembly and the second printed circuit-board assembly are stacked, and, it is supported between first printed circuit-board assembly and the second printed circuit-board assembly by support component, the spatial joint clearance formed between the first printed circuit-board assembly and the second printed circuit-board assembly can accommodate the electronic component that the first printed circuit-board assembly and/or the second printed circuit-board assembly include；It can be understood that, for having and being contained in type and the same number of electronic equipment of printed circuit-board assembly electronic component, due to being the electronic component being laid out on the first printed circuit-board assembly and the second printed circuit-board assembly, so the layout type of electronic component is more diversified, the electronic component that can be laid out on the first printed circuit-board assembly and the second printed circuit-board assembly is more compact, so that the first printed circuit-board assembly and second printed circuit-board assembly the space occupied reduce.
Description
Technical field
The present invention relates to circuit board technology fields, and more specifically, it relates to electronic equipments.
Background technique
Current electronic equipment (for example, smart phone, apparatus such as computer) includes printed circuit-board assembly, such as
PCBA (Printed Circuit Board+Assembly) is provided with electronic component on printed circuit-board assembly.
Currently, printed circuit-board assembly occupies the larger space of electronic equipment.
Summary of the invention
In view of this, the present invention provides a kind of electronic equipment.
To achieve the above object, the invention provides the following technical scheme:
A kind of electronic equipment, comprising:
First printed circuit-board assembly；
Second printed circuit-board assembly, first printed circuit-board assembly are stacked in second printed circuit board
Component；
Support component is set between first printed circuit-board assembly and second printed circuit-board assembly；
Wherein, the support component makes first printed circuit-board assembly and second printed circuit-board assembly
The spatial joint clearance that can accommodate electronic component is formed between first surface.
It can be seen via above technical scheme that compared with prior art, the invention discloses a kind of electronic equipment, due to
One printed circuit-board assembly and the second printed circuit-board assembly are stacked, and, the first printed circuit-board assembly and the second printing
It is supported between circuit board assemblies by support component, is formed between the first printed circuit-board assembly and the second printed circuit-board assembly
Spatial joint clearance can accommodate the electronic component that the first printed circuit-board assembly and/or the second printed circuit-board assembly include；It can be with
Understand, for having and being contained in type and the same number of electronic equipment of printed circuit-board assembly electronic component,
Due to being the electronic component being laid out on the first printed circuit-board assembly and the second printed circuit-board assembly, so electronic component
Layout type is more diversified, the electronics member that can be laid out on the first printed circuit-board assembly and the second printed circuit-board assembly
Part is more compact, so that the first printed circuit-board assembly and second printed circuit-board assembly the space occupied reduce.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structure chart of implementation of electronic equipment provided by the embodiments of the present application；
Fig. 2 is a kind of structure chart of implementation of printed circuit-board assembly entirety provided by the embodiments of the present application；
Fig. 3 is a kind of structure chart of implementation of support component provided by the embodiments of the present application；
Fig. 4 a to Fig. 4 b be in hollow frame body provided by the embodiments of the present application and two printed circuit-board assemblies area compared with
The positional diagram of small printed circuit-board assembly；
Fig. 5 is the structure chart of another implementation of support component provided by the embodiments of the present application；
Fig. 6 is the first electrical property of the first printed circuit-board assembly, PCB hollow frame body, the second printed circuit-board assembly
The schematic diagram of connection；
Fig. 7 is the first printed circuit-board assembly provided by the embodiments of the present application and second of the second printed circuit-board assembly
The schematic diagram of electric connection；
Fig. 8 a to Fig. 8 e is the schematic diagram of the first electronic component layout type provided by the embodiments of the present application；
Fig. 9 a to Fig. 9 e is that connector provided by the embodiments of the present application is set in first printed circuit-board assembly
The position view of first surface；
Figure 10 is the sectional view of electronic equipment provided by the embodiments of the present application.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Electronic equipment (for example, smart phone, apparatus such as computer) includes printed circuit-board assembly, such as PCBA at present
(Printed Circuit Board+Assembly), printed circuit-board assembly includes electronic component.
In an alternative embodiment, the electronic component being arranged on printed circuit-board assembly include but be not limited to it is following at least
It is a kind of: processor, RF (Radio Frequency, radio frequency) element, the shielding part for shielding RF element, BIOS (Basic
Input Output System, basic input output system) chip, I/O (input/output, input/output) control core
Piece, key and panel control switch interface, indicator light plug connector, expansion slot, mainboard and plug-in card DC power supply for electrical connector.
Electronic equipment can be smart phone, or, PAD, or, laptop, or, the terminal devices such as desktop computer.Below
By electronic equipment be smart phone for in electronic equipment print printed circuit board effect and electronic equipment structure into
Row explanation.
Optionally, the electronic component on not set printed circuit-board assembly that electronic equipment includes includes but is not limited to following
It is at least one: at least one sensor, battery, address card placement region, charging interface seat (such as Type C interface seat), at least
One display screen, earphone base, audio parts.
Optionally, audio parts include but is not limited to following at least one: microphone, camera and loudspeaker.It is optional
, address card placement region can be SIM (Subscriber Identification Module, user identification module)
Card placement region.
As shown in Figure 1, a kind of structure chart of implementation for electronic equipment provided by the embodiments of the present application.
Optionally, electronic equipment includes printed circuit-board assembly whole 11, and electronic equipment further includes being not disposed on printing electricity
Electronic component on road board group part whole 11, such as: audio parts 12, at least one sensor 13, front camera 14, postposition
Camera 15, battery 16, address card placement region 17, charging interface seat 18, at least one display screen (not shown in figure 1) and
Antenna 19 etc..
Optionally, if electronic equipment is computer, optionally, the electronics member being not disposed on printed circuit-board assembly whole 11
Part is also possible that following at least one: data transmission interface (for example, USB interface), hard disk.
Printed circuit-board assembly provided by the embodiments of the present application whole 11 includes at least two printed circuit-board assemblies.Institute
It is with referred to as printed circuit-board assembly whole 11 because at least two printed circuit-board assembly is constituted by being electrically connected
One entirety.
Electronic component in what electronic equipment shown in FIG. 1 included be not disposed on printed circuit-board assembly whole 11 does not limit to
In above-mentioned several, what the embodiment of the present application can't correspond to that electronic equipment includes is not disposed in printed circuit-board assembly whole 11
Electronic component type and number be defined.
Printed circuit-board assembly whole 11 and the electricity being not included on printed circuit-board assembly whole 11 as can be seen from Figure 1
Subcomponent is electrically connected.So as to realize the various functions of electronic equipment.For example, being taken pictures using smart phone, or, sharp
It is conversed with smart phone.
Currently, electronic equipment only includes a printed circuit-board assembly, multiple electronic component A (will need to be laid out printing
Electronic component in circuit board assemblies is known as electronic component A) layout is opposite in one surface of the printed circuit-board assembly or two
Surface, it is to be understood that it is more due to being laid out electronic component A on a printed circuit-board assembly, in order to cloth
The complete multiple electronic component A of office, it is required that in one plane the space occupied is larger for the printed circuit-board assembly.
(layout will not needed in printing electricity due to not needing to be laid out the part electronic component B on printed circuit-board assembly
Electronic component in the board group part of road is known as electronic component B) position in the electronic device be it is fixed, in order to enable printed circuit
Board group part is routed less when being attached with one or more electronic component B, needs include to printed circuit-board assembly one
A or multiple electronic component A are laid out, and one or more electronic component A may be made in a table of printed circuit-board assembly
Face or two opposite surface placements it is more dispersed so that printed circuit-board assembly the space occupied further increases.
In an alternative embodiment, the electronic component layout that includes due to printed circuit-board assembly it is more dispersed, and not
The electronic component B that printed circuit-board assembly is arranged in generally is stacked or is set side by side with printed circuit-board assembly, i.e., simultaneously
Multiple electronic components that printed circuit-board assembly includes will not be arranged in the electronic component B for being not disposed on printed circuit-board assembly
In gap between A.So that the gap between multiple electronic component A that printed circuit-board assembly includes is underused.More
So that printed circuit-board assembly the space occupied is bigger.
It is understood that since printed circuit-board assembly the space occupied is bigger, if being not disposed on printed circuit board
The ability of electronic component B in component is constant, for example, battery capacity is constant, then may need to increase the size of electronic equipment, example
Such as increase the thickness of electronic equipment.Alternatively, the size constancy in order to maintain electronic equipment, can reduce and be not disposed on printed circuit
The ability of electronic component B in board group part, for example, reducing battery capacity.
In view of the above-mentioned problems, the embodiment of the present application provides a kind of electronic equipment, as shown in Figure 1, the electronic equipment includes
Printed circuit-board assembly whole 11 include at least two printed circuit-board assemblies, wherein at least two printed circuit-board assembly layer
Folded setting does not in one plane carry out stacked position's mode at least two printed circuit-board assemblies, so that printed circuit board
Component less than one printed circuit-board assembly the space occupied of whole 11 the space occupied.So that maintaining to be not disposed on print
In the case that the ability of electronic component B in printed circuit board component whole 11 is constant, the ruler of electronic equipment can be further decreased
It is very little, for example, reducing the thickness of electronic equipment；Alternatively, can be promoted and not set in the case where maintaining the size constancy of electronic equipment
The ability of the electronic component B in printed circuit-board assembly whole 11 is set, for example, improving battery capacity；Alternatively, reducing electronics
In the case where a small amount of size of equipment, the ability for the electronic component B being not disposed in printed circuit-board assembly whole 11 is promoted.
The particular topology mode of printed circuit-board assembly provided by the embodiments of the present application whole 11 is illustrated below.Such as
It is a kind of structure chart of implementation of printed circuit-board assembly entirety provided by the embodiments of the present application shown in Fig. 2.
As shown in Fig. 2, printed circuit-board assembly whole 11 includes that at least two printed circuit-board assemblies and setting are in place
The support component 23 between two adjacent printed circuit-board assemblies is set, below first printed circuit-board assembly adjacent with position
It 21 and second is illustrated for printed circuit-board assembly 22.If electronic equipment includes three or three or more printed circuit boards
When component, the relationship between the adjacent printed circuit-board assembly in any two position may refer to the first printed circuit-board assembly
21 and the second relationship between printed circuit-board assembly 22.
From figure 2 it can be seen that the first printed circuit-board assembly 21 is stacked in second printed circuit-board assembly
22。
In the embodiment of the present application, " being stacked " refers to the first printed circuit-board assembly 21 (such as Fig. 1 solid line in a first direction
Direction shown in arrow) at least partly projection with the projection of the second printed circuit-board assembly 22 in a first direction at least partly
Overlapping.
In an alternative embodiment, the size of the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22 can be with
It is identical, it can also be different.
In an alternative embodiment, the size of printed circuit-board assembly refers to, printed circuit-board assembly second direction (such as
Direction shown in Fig. 1 dotted arrow) length；In an alternative embodiment, the size of printed circuit-board assembly refers to, printed circuit
The projected area of board group part in a first direction.
Fig. 2 shows the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22 length in a second direction
Spend identical, Fig. 2 is only a kind of example, not to the first printed circuit-board assembly 21 and the second printed circuit in the embodiment of the present application
The length of board group part 22 in a second direction causes to limit, for example, the length of the first printed circuit-board assembly 21 in a second direction
Degree can be more than or less than or the length equal to the second printed circuit-board assembly 22 in a second direction.
Support component 23 is set between the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22.Wherein,
Support component 23 to form energy between the first printed circuit-board assembly 21 and the first surface of the second printed circuit-board assembly 22
Enough accommodate the spatial joint clearance of electronic component.
In an alternative embodiment, the first surface of the second printed circuit-board assembly 22 is the second printed circuit-board assembly 22
Upper surface (solid arrow instruction direction be from top to bottom), i.e., the first surface of the second printed circuit-board assembly 22 be it is close
The one side of first printed circuit-board assembly 21.
As shown in Fig. 2, between foring space between the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22
Gap.Electronic component that the first printed circuit-board assembly 21 includes is not shown in Fig. 2 and the second printed circuit-board assembly 22 includes
Electronic component.
It, can be the of the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22 in an alternative embodiment
The first electronic component and/or layout that the first printed circuit-board assembly 21 includes are laid out in the spatial joint clearance formed between one surface
The second electronic component that second printed circuit-board assembly 22 includes.
In the embodiment of the present application, the electronic component that the first printed circuit-board assembly 21 includes is referred to as the first electronic component；Claim
The electronic component that second printed circuit-board assembly 22 includes is the second electronic component.
Electronic equipment provided by the embodiments of the present application, by taking electronic equipment includes two printed circuit-board assemblies as an example, due to
First printed circuit-board assembly and the second printed circuit-board assembly are stacked, and, the first printed circuit-board assembly and the second print
It is supported between printed circuit board component by support component, is formed between the first printed circuit-board assembly and the second printed circuit-board assembly
Spatial joint clearance can accommodate the electronic component that the first printed circuit-board assembly and/or the second printed circuit-board assembly include；It can
With understanding, for having the type for being contained in printed circuit-board assembly electronic component and a same number of electronic equipment
Speech, due to being the electronic component being laid out on the first printed circuit-board assembly and the second printed circuit-board assembly, so electronics is first
The layout type of part is more diversified, the electricity that can be laid out on the first printed circuit-board assembly and the second printed circuit-board assembly
Subcomponent is more compact, so that the first printed circuit-board assembly and second printed circuit-board assembly the space occupied reduce.
Further, without being arranged in the electronic component B of the first printed circuit-board assembly and the second printed circuit-board assembly
In, it is if desired integrally attached to printed circuit-board assembly, due to can be with the first printed circuit-board assembly or the second printed circuit
Any printed circuit-board assembly is connected in board group part, is meeting printed circuit-board assembly entirety and is being not disposed on printed circuit board group
Electronic component B on part be routed when being attached it is less under conditions of, can make the first printed circuit-board assembly and second print
Printed circuit board component includes the layout of electronic component can be more compact, so that the first printed circuit-board assembly and the second print
The printed circuit-board assembly entirety occupied space that printed circuit board component is constituted is smaller.
Support component 23 provided by the embodiments of the present application is illustrated below.The realization side of support component 23 is described below
Formula, the embodiment of the present application provide but are not limited to following two.
The first: the support component is hollow frame body.
As shown in figure 3, a kind of structure chart of implementation for support component provided by the embodiments of the present application.
Hollow frame body shown in Fig. 3 is the square box frame body of one hollow (dash area is hollow space in Fig. 3), can
Choosing, hollow frame body can be a hollow round or ellipse frame body, and optionally, hollow frame body can be any
The hollow frame body of shape, the embodiment of the present application is without limiting here.
To sum up, hollow frame body is the ducted body along first direction perforation formed by side wall, described first direction (Fig. 2
Direction shown in middle solid arrow) be perpendicular to second printed circuit-board assembly first surface direction.
In an alternative embodiment, four angles of hollow frame body shown in Fig. 3 are additionally provided with through-hole, optionally, can be with
Using by the immobilising device of through-hole by the first printed circuit-board assembly 21, support component 23 and the second printed circuit-board assembly
22 are fixed together.Optionally, immobilising device can be screw.
It optionally, may include zero or one or multiple through-holes on hollow frame body, the embodiment of the present application is not to logical
The number and location in hole are defined, and Fig. 3 is merely illustrative, for example, through-hole can also be arranged on hollow frame body any bar side.
When being below hollow frame body to support component, support component and the first printed circuit-board assembly or the second printing electricity
The positional relationship of road board group part is illustrated.The embodiment of the present application provides but is not limited to following several positional relationships.
1st kind of positional relationship, cross-sectional area and the frame of the surrounded hollow space of the frame of hollow frame body
The sum of cross-sectional area tends to be identical with the lesser printed circuit-board assembly of area in described two printed circuit-board assemblies.
Optionally, the cross-sectional area of the surrounded hollow space of the frame of hollow frame body be in Fig. 3 dash area the
Projected area on one direction.The cross-sectional area of frame refers to the projected area of square box frame body in a first direction in Fig. 3.
Sum of the two is the perspective plane of the frame body of one solid (such as dash area shown in Fig. 3 is solid) in a first direction
Product.
" cross-sectional area of the surrounded hollow space of the frame of hollow frame body and the sum of the cross-sectional area of the frame
Tend to be identical with the lesser printed circuit-board assembly of area in described two printed circuit-board assemblies " illustrate hollow frame body
The boundary of projection on one direction almost with the lesser printing of projected area in a first direction in two printed circuit-board assemblies
The border overlay of circuit board assemblies.
As shown in fig. 4 a, in the first hollow frame body provided by the embodiments of the present application and two printed circuit-board assemblies
The positional diagram of the lesser printed circuit-board assembly of area.
Assuming that the first printed circuit-board assembly with projected area is smaller in a first direction in the second printed circuit-board assembly
Printed circuit-board assembly be the second printed circuit-board assembly；Alternatively, the first printed circuit-board assembly and the second printed circuit board
Projected area is identical in a first direction in component, using the second printed circuit-board assembly as projected area in a first direction compared with
Small printed circuit-board assembly.So Fig. 4 a is to remove the top view after the first printed circuit-board assembly in a first direction.
If the first printed circuit-board assembly with projected area is lesser in a first direction in the second printed circuit-board assembly
Printed circuit-board assembly is the first printed circuit-board assembly, then Fig. 4 a is to remove the second printed circuit board group in a first direction
Bottom view after part.
From Fig. 4 a can be seen that support component 23 boundary and the second printed circuit-board assembly 22 boundary (in Fig. 4 a with void
Line indicates the differentiation boundary of support component 23 with the second printed circuit-board assembly 22) projection in a first direction is Chong Die.
2nd kind of positional relationship, the cross-sectional area of the surrounded hollow space of the frame of hollow frame body and the cross of the frame
The sum of area of section is less than the lesser printed circuit-board assembly of area in described two printed circuit-board assemblies.
As shown in Figure 4 b, in second of hollow frame body provided by the embodiments of the present application and two printed circuit-board assemblies
The positional diagram of the lesser printed circuit-board assembly of area.
Assuming that the first printed circuit-board assembly with projected area is smaller in a first direction in the second printed circuit-board assembly
Printed circuit-board assembly be the second printed circuit-board assembly；Alternatively, the first printed circuit-board assembly and the second printed circuit board
Projected area is identical in a first direction in component, using the second printed circuit-board assembly as projected area in a first direction compared with
Small printed circuit-board assembly.So Fig. 4 b is to remove the top view after the first printed circuit-board assembly in a first direction.
If the first printed circuit-board assembly with projected area is lesser in a first direction in the second printed circuit-board assembly
Printed circuit-board assembly is the first printed circuit-board assembly, then Fig. 4 b is to remove the second printed circuit board group in a first direction
Bottom view after part.
From 4b as can be seen that the boundary of the projection of support component 23 in a first direction is contained in the second printed circuit board group
The boundary of the projection of part 22 in a first direction.
Fig. 4 a and Fig. 4 b are only support component and projected area is smaller in a first direction in two printed circuit-board assemblies
Printed circuit-board assembly positional relationship schematic diagram, do not cause to limit.For example, support component shown in Fig. 4 b is first
The a line of projection of a line of projection on direction with the second printed circuit-board assembly in a first direction is Chong Die；Another
In embodiment, the projection of support component in a first direction is completely contained in the second printed circuit-board assembly in a first direction
It projects and boundary is non-overlapping.
In an alternative embodiment, hollow frame body can be PCB (Printed Circuit Board, printed circuit
Plate) frame body.
Second: the support component includes at least two support columns, and the height of at least two support column is identical.
As shown in figure 5, the structure chart of another implementation for support component provided by the embodiments of the present application.
Fig. 5 is the visual angle with first direction, after the removal of the first printed circuit-board assembly 21, the support component 51 of displaying with
And second printed circuit-board assembly 22 first surface.
In an alternative embodiment, the first surface layout of the second printed circuit-board assembly 22 has electronic component.Second
The mode of the first surface layout electronic component of printed circuit-board assembly 22 can be as shown in figure 5, in the embodiment of the present application in Fig. 5
It is merely illustrative, the mode of the first surface layout electronic component of the second printed circuit-board assembly 22 is not limited, cloth is not also limited
The number and type of the electronic component of office.
In an alternative embodiment, the first surface of the second printed circuit-board assembly 22 can not be laid out electronic component.
From fig. 5, it can be seen that support component 23 may include multiple support columns 51.One support column 51 can be for such as Fig. 5
Shown in cylindrical body, alternatively, can be for cuboid etc., the embodiment of the present application not be limited the shape of support column 51.
Support component 23 may include multiple support columns 51, between multiple support columns 51 and the second printed circuit-board assembly 22
Relative position can be as shown in figure 5, still Fig. 5 limit multiple support columns 51 relative to the second printed circuit-board assembly 22
Layout type.
It is understood that the first printed circuit-board assembly and second that printed circuit-board assembly whole 11 includes print
Circuit board assemblies need to be electrically connected by conducting element, so that two printed circuit-board assemblies can constitute an entirety.
The embodiment of the present application provides but is not limited to the electricity of following several first printed circuit-board assemblies and the second printed circuit-board assembly
Property connection type.
The first, is provided at least one through-hole in the support component；First printed circuit-board assembly and institute
Conducting element of second printed circuit-board assembly by layout at least one through-hole is stated to be electrically connected.
If support component is PCB hollow frame body, conducting element includes: that at least one being arranged on hollow frame body is led to
The metal injected in hole, such as copper.
In an alternative embodiment, in order to enable the first printed circuit-board assembly and second printed circuit-board assembly
By being laid out the conducting element electric connection at least one through-hole, then, it optionally, can be in the first printed circuit board
The metal injected at least one through-hole being arranged on component, such as copper；It is arranged at least on the second printed circuit-board assembly
The metal injected in one through-hole, such as copper；And hollow frame body, the first printed circuit board are welded using metal (such as tin)
Component and the second printed circuit-board assembly.
At least one through-hole for being injected with metal, the first printed circuit being arranged by the first printed circuit-board assembly itself
At least one for being injected with metal being arranged in welding metal, PCB hollow frame body between board group part and PCB hollow frame body
Welding metal, the second printed circuit-board assembly between through-hole, PCB hollow frame body and the second printed circuit-board assembly are set itself
At least one through-hole for being injected with metal set is electrically connected, to form an entirety.
As shown in fig. 6, for the first printed circuit-board assembly, PCB hollow frame body, the second printed circuit-board assembly first
The schematic diagram that kind is electrically connected.
The first printed circuit-board assembly of welding, PCB hollow frame body, the second printed circuit-board assembly are not shown in Fig. 6
Welding metal.
In printed circuit board (PCB) common drilling have through-hole 211, blind hole 212, buried via hole 213 these three.Through-hole (VIA),
Copper foil circuit in printed circuit board different layers between conductive pattern is connected or is connected with this through-hole, but not
Module pin or the copper facing hole of other reinforcing materials can be inserted.
Printed circuit board is to stack accumulation by many copper foil layers to be formed.Copper foil layer each other be unable to intercommunication be because
A layer insulating is all spread between every layer of copper foil, so needing to connect by through-hole (via) Lai Jinhang signal between them.
Blind hole 212 will exactly be connected between the outermost layer circuit and neighbouring internal layer in printed circuit board with electroplating hole,
It is referred to as blind logical due to that can not see opposite.
Buried via hole 213, is exactly the connection of any circuit interlayer of printed circuit intralamellar part, but is not connected with outer layer, that is, does not have
Extend to the meaning of the via hole of circuit board surface.
Through-hole 211 in Fig. 6 involved in the embodiment of the present application.
In an alternative embodiment, the diameter of through-hole can be 0.2mm between 0.3mm.
From fig. 6, it can be seen that at least one through-hole, PCB hollow frame body that the first printed circuit-board assembly includes include
At least one through-hole, the second printed circuit-board assembly at least one through-hole for including, in a first direction can not be mutually right
It answers, for example, the through-hole that the first printed circuit-board assembly includes can not just correspond to the through-hole that PCB hollow frame body includes.It is optional
, at least one through-hole that at least one through-hole that the first printed circuit-board assembly includes, PCB hollow frame body include, second
At least one through-hole that printed circuit-board assembly includes, can correspond to each other in a first direction.
Second, the first surface of first printed circuit-board assembly is provided at least one first connection component, institute
The first surface for stating the second printed circuit-board assembly is provided at least one second connection component.The first printed circuit board group
Part and second printed circuit-board assembly pass through at least one described first connection component and at least one described second company
Connected components are electrically connected.
If support component be non-PCB empty frames frame body or at least two support columns, conducting element include: at least one first
Connection component and at least one second connection component.
Wherein, the first surface of the first printed circuit-board assembly is located at close to the side of the second printed circuit-board assembly.With
For first direction shown in Fig. 2, the first surface of the first printed circuit-board assembly is the following table of the first printed circuit-board assembly
Face.
In an alternative embodiment, connection component can be BB (Band to Band, plate is to plate) connector.
As shown in fig. 7, being the first printed circuit-board assembly provided by the embodiments of the present application and the second printed circuit board group
The schematic diagram of second of part electric connection.
It is illustrated so that connection component is connector as an example in Fig. 7, optionally, first connection component and one second
It can be connected by FPC (Flexible Printed Circuit, flexible circuit board) between connection component.
As shown in Figure 7, it is assumed that connector 71 is arranged in the first surface of the first printed circuit-board assembly, in the second printed circuit
Connector 72 is arranged in the first surface of board group part, can be connected by FPC 73 between connector 71 and connector 72.
The electronic component that printed circuit-board assembly includes is not shown in Fig. 7.
The cloth for the electronic component for including to the first printed circuit-board assembly 21 and the second printed circuit-board assembly 22 below
Office's mode is illustrated, and the embodiment of the present application provides but is not limited to following several layout type.
Assuming that the electronic component that the first printed circuit-board assembly 21 includes is referred to as the first electronic component；Claim the second printed circuit
The electronic component that board group part 22 includes is the second electronic component.
The first electronic component layout type: the first electronic component is laid out on a surface of the first printed circuit-board assembly
On；Second electronic component is laid out on two opposite surfaces of the second printed circuit-board assembly.
The first electronic component layout type includes two kinds: 1, and the first electronic component is laid out in the first printed circuit-board assembly
First surface on；Second electronic component is laid out on two opposite surfaces of the second printed circuit-board assembly；Wherein, first
The first surface of printed circuit-board assembly is located at close to the side of the second printed circuit-board assembly；2, the first electronic component layout exists
On the second surface of first printed circuit-board assembly；Second electronic component is laid out opposite at two of the second printed circuit-board assembly
Surface on；Wherein, the second surface of the first printed circuit-board assembly is located at away from the side of the second printed circuit-board assembly.
It is understood that according to the 1st kind of mode, since the first electronic component is laid out in the first printed circuit-board assembly
First surface on, and the second electronic component of part layout on the first surface of the second printed circuit-board assembly；I.e. first electricity
Subcomponent and the second electronic component of part are laid out between the first printed circuit-board assembly and the second printed circuit-board assembly
The spatial joint clearance of composition.
Since the first electronic component and the second electronic component of part are laid out in spatial joint clearance, in an alternative embodiment,
If spatial joint clearance is sufficiently high in a first direction, i.e., the height of spatial joint clearance in a first direction is greater than the first height, and first is high
Degree refers to layout in the first electronic component maximum height in a first direction of the first surface of the first printed circuit-board assembly
With layout the first surface of the second printed circuit-board assembly the second electronic component of part maximum height in a first direction
The sum of.So the first electronic component exists in the layout and the second electronic component of part of the first surface of the first printed circuit-board assembly
The layout of the first surface of second printed circuit-board assembly is independent of each other, but increases the first printed circuit-board assembly, second
The whole height in a first direction of the printed circuit-board assembly that printed circuit-board assembly, support component are constituted, so that printing electricity
Road board group part entirety the space occupied is larger.
In another alternative embodiment, if the height of spatial joint clearance in a first direction is greater than or equal to the second height, the
Two height refer to max be laid out the second surface of the first printed circuit-board assembly first electronic component in a first direction
Maximum height, be laid out the first surface of the second printed circuit-board assembly the second electronic component of part in a first direction most
Big height }；Then layout and part second electronic component of first electronic component in the first surface of the first printed circuit-board assembly
It influences each other in the layout of the first surface of the second printed circuit-board assembly；For example, the first electronic component layout is in the first printing
The first area of the first surface of circuit board assemblies, the second electronic component of part are laid out the first of the second printed circuit-board assembly
The second area on surface；Wherein, the no intersection region of the projection of first area and second area in a first direction.Optionally,
The sum of the projected area of first area and second area in a first direction is less than or equal to support component (assuming that support component is
Hollow frame body) projection in a first direction Internal periphery (hatched area as shown in Figure 3) area.
According to the 2nd kind of mode, the second electronic component is laid out on two opposing surfaces of the second printed circuit-board assembly；
If the first electronic component layout, on the second surface of the first printed circuit-board assembly, the one the first electronic components are in the first printing
Layout on circuit board assemblies will not influence layout of second electronic component on the second printed circuit-board assembly.
The first electronic component layout type is illustrated in the 2nd kind of mode as an example below.
It is the schematic diagram of the first electronic component layout type provided by the embodiments of the present application as shown in Fig. 8 a to Fig. 8 d.
It is as shown in Figure 8 a the second surface 81 of the first printed circuit-board assembly 21, by taking first direction shown in Fig. 2 as an example,
The second surface of first printed circuit-board assembly is the upper surface of the first printed circuit-board assembly.
Layout type, type or the number of electronic component shown in Fig. 8 a are only a kind of example, do not cause to limit.
It is as shown in Figure 8 b the first surface 82 of the first printed circuit-board assembly 21, the first of the first printed circuit-board assembly
Surface is located at close to the side of the second printed circuit-board assembly, by taking first direction shown in Fig. 2 as an example, the first printed circuit board group
The second surface of part is the lower surface of the first printed circuit-board assembly.
It can be seen that from Fig. 8 b and be not laid out the first electronic component in the first surface of the first printed circuit-board assembly 21, i.e.,
The first electronic component that one printed circuit-board assembly 21 includes is laid out the second surface 81 in the first printed circuit-board assembly.
It is as shown in Figure 8 c the first surface 83 of the second printed circuit-board assembly 22, the of the second printed circuit-board assembly 22
One surface is located at close to the side of the first printed circuit-board assembly 21, by taking first direction shown in Fig. 2 as an example, the second printed circuit
The first surface 83 of board group part 22 is the upper surface of the second printed circuit-board assembly.
It is as shown in figure 8d the second surface 84 of the second printed circuit-board assembly 22, the of the second printed circuit-board assembly 22
Two surfaces 84 are located remotely from the side of the first printed circuit-board assembly 21, by taking first direction shown in Fig. 2 as an example, the second printing electricity
The second surface 84 of road board group part 22 is the lower surface of the second printed circuit-board assembly.
It can be seen that two surface (i.e. the first tables being away from each other of the second printed circuit-board assembly 22 from Fig. 8 c and Fig. 8 d
Face 83 and second surface 84) on be provided with the second electronic component.
Layout type, the cloth of second printed circuit-board assembly two electronic components away from surface shown in Fig. 8 c and Fig. 8 d
Office's type and layout number are only a kind of example, do not cause to limit.
It as figure 8 e shows, is the overall schematic of Fig. 8 a to Fig. 8 d.
In Fig. 8 e, in an alternative embodiment, support component 23 can be hollow frame body, if support component 23 is hollow
Frame body, the second electronic component of part positioned at the first surface of the second printed circuit-board assembly 22 are laid out in hollow frame body pair
In the accommodating space answered.
In an alternative embodiment, if support component 23 includes at least two support columns, it is located at the second printed circuit board group
The second electronic component of part of the first surface of part 22 and the position of at least two support column can be any, here without
It limits.
The layout type of second of electronic component: the first electronic component is laid out a table in the first printed circuit-board assembly
On face；Second electronic component is laid out on a surface of the second printed circuit-board assembly.
The layout type of second of electronic component includes two ways: 1, the first electronic component is laid out in the first printed circuit
The first surface of board group part；Second electronic component is laid out the first surface in the second printed circuit-board assembly；2, the first electronics member
Part is laid out the first surface in the first printed circuit-board assembly；Second electronic component is laid out the of the second printed circuit-board assembly
Two surfaces；3, the first electronic component is laid out the second surface in the first printed circuit-board assembly；Second electronic component layout is the
The first surface of two printed circuit-board assemblies；4, the first electronic component is laid out the second surface in the first printed circuit-board assembly；
Second electronic component is laid out the second surface in the second printed circuit-board assembly.
It is understood that be laid out using the 1st kind of mode or the 2nd kind of mode or the 3rd kind of mode, it can be by the first electronics member
Part or the second electronic component are laid out the spatial joint clearance between the first printed circuit-board assembly and the second printed circuit-board assembly；It adopts
With the 1st kind of mode, the first electronic component exists in the layout of the first surface of the first printed circuit-board assembly and the second electronic component
The influence relationship of the layout of the first surface of second printed circuit-board assembly, for details, reference can be made to the first electronic component layout type
In the 1st kind of mode, which is not described herein again.Using the 2nd kind of mode or the 3rd kind of the first electronic component of mode and the second electronic component
Layout does not influence each other.
Using the 4th kind of mode, the first electronic component and the second electronic component are not laid out in the first printed circuit board group
Spatial joint clearance between part and the second printed circuit-board assembly.
The layout type of the third electronic component: the first electronic component is laid out two phases in the first printed circuit-board assembly
On back surface；Second electronic component is laid out on a surface of the second printed circuit-board assembly.
The layout type of the third electronic component includes two kinds: 1, and the first electronic component is laid out in the first printed circuit board group
On two opposing surfaces of part, the second electronic component is laid out on the first surface of the second printed circuit-board assembly；2, the first electricity
Subcomponent is laid out on two opposing surfaces of the first printed circuit-board assembly, and the second electronic component is laid out in the second printed circuit
On the second surface of board group part.
It is understood that due to the space constituted between the first printed circuit-board assembly and the second printed circuit-board assembly
The accommodation space in gap be it is certain, using the 1st kind of mode, since the first electronic component of part and the second electronic component are laid out
In spatial joint clearance, then the first electronic component of part is in the layout of the second surface of the first printed circuit-board assembly and the second electronics member
Part influences each other in the layout of the first surface of the second printed circuit-board assembly；For example, the first electronic component of part layout is the
The first area of the first surface of one printed circuit-board assembly, the second electronic component are laid out the of the second printed circuit-board assembly
The second area on one surface；Wherein, the no intersection region of the projection of first area and second area in a first direction.It is optional
, the sum of the projected area of first area and second area in a first direction is less than or equal to support component (assuming that support group
Part is hollow frame body) area of the Internal periphery (hatched area as shown in Figure 3) of projection in a first direction.
If the first electronic component of part is in the layout and the second electronic component of the first surface of the first printed circuit-board assembly
Do not influence each other in the layout of the first surface of the second printed circuit-board assembly, then need to increase the first printed circuit-board assembly with
The height of spatial joint clearance between second printed circuit-board assembly increases the thickness of printed circuit-board assembly whole 11, so that printing
Whole 11 the space occupied of circuit board assemblies increase.
It is understood that using the 2nd kind of the second electronic component of mode the second printed circuit-board assembly second surface
On layout will not influence layout of first electronic component on two opposing surfaces of first India's circuit board assemblies.
If being illustrated in a manner of the 2nd kind to the layout type of the third electronic component, then by taking Fig. 8 a to Fig. 8 d as an example；
Wherein, Fig. 8 a is the second surface of the second printed circuit-board assembly；Fig. 8 b is the first surface of the second printed circuit-board assembly；Figure
8c and Fig. 8 d is two opposing surfaces of the first printed circuit-board assembly.
The layout type of 4th kind of electronic component: the first electronic component is laid out two phases in the first printed circuit-board assembly
On back surface；Second electronic component is laid out on two opposing surfaces of the second printed circuit-board assembly.
It is understood that since the first electronic component of part is laid out the first surface in the first printed circuit-board assembly,
The first surface of the second printed circuit-board assembly of part the second electronic component cloth police station, i.e. the first electronic component of part and part
Second electronic component layout is in the spatial joint clearance between the first printed circuit-board assembly and the second printed circuit-board assembly.
Layout and part second electronics member of the first electronic component of part in the first surface of the first printed circuit-board assembly
Part can be laid out in the influence relationship of the layout of the first surface of the second printed circuit-board assembly referring specifically to the first electronic component
1st kind of mode in mode, which is not described herein again.
It is understood that may include can by the not set electronic component B to printed circuit-board assembly in electronic equipment
It is radiated the electronic component of spatial electromagnetic frequency, for example, antenna or battery；It is arranged in printed circuit-board assembly in electronic equipment
Electronic component A may include the electronic component that can be radiated spatial electromagnetic frequency, for example, wifi element, NCF (near
Field communication, near field communication (NFC)) element.Space electricity will be radiated in the embodiment of the present application
The electronic component of magnet rate is known as RF component.It optionally, may include RF component in printed circuit-board assembly whole 11, it can
Choosing, the not set electronic component B to printed circuit-board assembly may also include RF component.
In order to avoid influencing each other between RF component, alternatively, RF component influences other non-radio frequencies elements, printed circuit
Board group part whole 11 further includes the shielding part for being electromagnetically shielded to RF component.
In the embodiment of the present application, the electronic component that the first printed circuit-board assembly includes is known as the first electronic component, and second
The electronic component that printed circuit-board assembly includes is known as the second electronic component.
In an alternative embodiment, the first electronic component and the second electronic component do not include RF component；It is optional one
In embodiment, the first electronic component includes RF component, and the second electronic component does not include RF component；In an alternative embodiment
In, the first electronic component includes RF component and the second electronic component includes RF component；In an alternative embodiment, the first electricity
Subcomponent does not include RF component, and the second electronic component includes RF component, due to it is following be for the first electronic component and/or
In the case that second electronic component includes RF component, to the layout of shielding part, therefore, include below for the first electronic component
RF component and/or the second electronic component are illustrated comprising RF component.
In an alternative embodiment, the first electronic component may include one or more RF components；Second electronic component
It may include one or more RF components.
In the first electronic component layout type, one or more RF components that the first electronic component includes can be with cloth
Office is on a surface of the first printed circuit-board assembly；One or more RF components that second electronic component includes can be with cloth
Office is on a surface of the second printed circuit-board assembly, alternatively, multiple RF components that the second electronic component includes can divide
It Bu Ju not be on two opposite surfaces of the second printed circuit-board assembly.
In second of electronic component layout type, one or more RF components that the first electronic component includes can be with cloth
Office is on a surface of the first printed circuit-board assembly；One or more RF components that second electronic component includes can be with cloth
Office is on a surface of the second printed circuit-board assembly.
In the layout type of the third electronic component, one or more RF components that the second electronic component includes can be with
Layout is on a surface of the second printed circuit-board assembly；One or more RF components that first electronic component includes can be with
Layout is on a surface of the first printed circuit-board assembly, or, multiple RF components that the first electronic component includes can divide
It Bu Ju not be on two opposing surfaces of the first printed circuit-board assembly.
In the layout type of the 4th kind of electronic component, one or more RF components that the first electronic component includes can be with
Layout is on a surface of the first printed circuit-board assembly, or, multiple RF components that the first electronic component includes can divide
It Bu Ju not be on two opposing surfaces of the first printed circuit-board assembly；One or more radio frequencies member that second electronic component includes
Part can be laid out on a surface of the second printed circuit-board assembly, alternatively, multiple radio frequencies member that the second electronic component includes
Part can be laid out respectively on two opposite surfaces of the second printed circuit-board assembly.
Below with reference to the type of support component, the layout of RF component and shielding part is illustrated.
The first is laid out the radio frequency in the accommodating space that hollow frame body is formed if support component is hollow frame body
Element can use hollow frame body and be electromagnetically shielded to it, without additional shielding part.It is not laid out in the hollow frame bodily form
At accommodating space in RF component need shielding part to be electromagnetically shielded it.
It, can be in the external side plating metal of hollow frame, for example, copper, so that hollow frame in an alternative embodiment
Body can be as the shielding part being electromagnetically shielded to RF component.
Included at least below with the first electronic component: the first RF component, the second electronic component include at least: the second radio frequency
Element and third RF component, the first RF component are laid out on the second surface of first printed circuit-board assembly；The
Two RF components layout on the first surface of second printed circuit-board assembly and position in the accommodating space；Third is penetrated
Frequency component placement on the second surface of second printed circuit-board assembly, for be illustrated.
Since the first RF component layout is on the second surface of the first printed circuit-board assembly, due to not being laid out hollow
In the accommodating space that frame body is formed, additional shielding part is needed to be electromagnetically shielded it；First electronic component further include: use
In the shielding part being electromagnetically shielded to first RF component, which is laid out in first printed circuit-board assembly
Second surface on.
Since the second RF component layout on the first surface of second printed circuit-board assembly and is located in described
In the accommodating space that empty frames frame body is formed, it can use hollow frame body and the second RF component be electromagnetically shielded, be not necessarily to volume
Outer shielding part.
Since third RF component layout is on the second surface of the second printed circuit-board assembly, due to not being laid out hollow
In the accommodating space that frame body is formed, additional shielding part is needed to be electromagnetically shielded it.Second electronic component further include: use
In the shielding part being electromagnetically shielded to the third RF component, which is laid out in second printed circuit-board assembly
Second surface on.
In an alternative embodiment, if the second RF component and third RF component are laid out in the second printed circuit board group
On the first surface of part and it is located in the accommodating space that the hollow frame body is formed, using hollow frame body to the second radio frequency member
Part and third RF component are electromagnetically shielded.Without additional shielding part.
Similarly, which is not described herein again for the layout type of other electronic components.For example, if the first RF component layout is hollow
In the accommodating space that frame body is formed, then the first electronic component does not include for carrying out electromagnetic screen to first RF component
The shielding part covered.
Second, if support component includes at least two support columns, alternatively, the non-plating metal in the external side of hollow frame, that is, prop up
Support component can not be as the shielding part being electromagnetically shielded to RF component, then the first electronic component further includes for described
The shielding part that first RF component is electromagnetically shielded.If the second RF component and third RF component are located at the second printed circuit
Then a shielding part can be arranged for the second RF component and third RF component in the one side of board group part；If the second radio frequency is first
Part and third RF component are located at two opposite surfaces of the second printed circuit-board assembly, then need for the second radio frequency
Shielding part is respectively set in element and third RF component.
In an alternative embodiment, shielding part is for will at least be in the layout of the first printed circuit-board assembly or the second printing
The metal cap that one or more RF components on the same surface of circuit board assemblies cover.
As shown in Figure 1, the printed circuit-board assembly whole 11 that electronic equipment includes can also be not disposed on printing with other
The electronic component of circuit board assemblies whole 11 is connected.Printed circuit-board assembly provided by the embodiments of the present application whole 11 includes at least
First printed circuit-board assembly, support component, the second printed circuit-board assembly.Printed circuit-board assembly whole 11 can pass through company
It connects device and connects the electronic component being not disposed on first printed circuit-board assembly and second printed circuit-board assembly.
The setting position of connector is illustrated below, the embodiment of the present application is provided but is not limited to following several.
The first: is if first printed circuit-board assembly and the second printed circuit-board assembly size are identical and logical
Cross hollow frame body connection and support, the connector be set on the first surface of first printed circuit-board assembly and
Close to the edge of the first surface.
As illustrated in fig. 9, it is set to for connector provided by the embodiments of the present application in first printed circuit-board assembly
The schematic diagram of first surface.
Fig. 9 a only shows a connector 91, in an alternative embodiment, the of first printed circuit-board assembly
One or more connectors 91 have can be set in one surface.One or more connectors 91 can be located at close to the first printed circuit
Any position at the edge of the first surface of board group part, which is not described herein again.
In an alternative embodiment, connector 91 is located at outside the corresponding accommodating space of hollow frame body.Connector 91 is laid out
The corresponding accommodating space of hollow frame body may be reduced in the first surface of the first printed circuit-board assembly 21.So one or
Multiple connectors 91 can be as far as possible positioned at the marginal position of the first surface of the first printed circuit-board assembly, to reduce by one or more
The influence of the corresponding accommodating space of a 91 centering empty frames frame body of connector.
One or more connectors 91 are in order to rear as close as possible to the edge of the first surface of the first printed circuit-board assembly
It is continuous to be connected with the electronic component being not disposed on first printed circuit-board assembly and second printed circuit-board assembly
When connecing, wiring is few.
Second: if first printed circuit-board assembly and the second printed circuit-board assembly size are identical and logical
It crosses the connection of hollow frame body and supports, the connector is set on the second surface of second printed circuit-board assembly and leans on
The edge of the nearly second surface.
As shown in figure 9b, it is set to for connector provided by the embodiments of the present application in second printed circuit-board assembly
The schematic diagram of second surface.
Fig. 9 b only shows a connector 92, in an alternative embodiment, the of second printed circuit-board assembly
One or more connectors 92 have can be set in two surfaces.One or more connectors 92 can be located at close to the second printed circuit
Any position at the edge of the second surface of board group part.
One or more connectors 92 are in order to rear as close as possible to the edge of the second surface of the second printed circuit-board assembly
It is continuous to be connected with the electronic component being not disposed on first printed circuit-board assembly and second printed circuit-board assembly
When connecing, wiring is few.
The second surface that the second printed circuit-board assembly is arranged in connector 92 will not influence the corresponding appearance of hollow frame body
Between emptying.
The third: is if the size of first printed circuit-board assembly is less than the big of second printed circuit-board assembly
Small and connect and support by hollow frame body, the connector is set to the first surface of second printed circuit-board assembly
Other than upper and view field positioned at the hollow frame body.
As is shown in fig. 9 c, it is set to for connector provided by the embodiments of the present application in second printed circuit-board assembly
The schematic diagram of first surface.
Fig. 9 c only shows a connector 93, in an alternative embodiment, the of second printed circuit-board assembly
One or more connectors 93 have can be set in one surface.One or more connectors 93 can be located at the second printed circuit board group
The external any position of the hollow frame of the first surface of part, which is not described herein again.
In an alternative embodiment, connector 93 is positioned close to the first surface of the second printed circuit-board assembly as far as possible
Fringe region, so that the layout of connector 93 will not influence the corresponding accommodating space of hollow frame body.Connector 93 is set as far as possible
Set close to the second printed circuit-board assembly first surface fringe region, also for it is subsequent be not disposed on described first
When electronic component on printed circuit-board assembly and second printed circuit-board assembly is attached, wiring is few.
4th kind: if first printed circuit-board assembly and the second printed circuit-board assembly size are identical and logical
It crosses the support column connection and supports, the connector is set on the second surface of first printed circuit-board assembly and leans on
The edge of the nearly second surface.
As shown in figure 9d, it is set to for connector provided by the embodiments of the present application in first printed circuit-board assembly
The schematic diagram of second surface.
Fig. 9 d only shows a connector 94, in an alternative embodiment, the of first printed circuit-board assembly
One or more connectors 94 have can be set in two surfaces.If at least partly the first electronic component is laid out in the first printed circuit board
The second surface of component, one or more connectors 94 can be as far as possible positioned at the sides of the second surface of the first printed circuit-board assembly
Edge position, not influence at least partly the first electronic component in the layout of the second surface of the first printed circuit-board assembly.One
Or multiple connectors 94 can be as far as possible positioned at the marginal position of the second surface of the first printed circuit-board assembly, also for subsequent
It is attached with the electronic component being not disposed on first printed circuit-board assembly and second printed circuit-board assembly
When, wiring is few.
In an alternative embodiment, the second surface of the first printed circuit-board assembly is arranged in connector 94, so that even
The layout for connecing device 94 will not influence the corresponding accommodating space of hollow frame body.
5th kind: if first printed circuit-board assembly and the second printed circuit-board assembly size are identical and logical
It crosses the support column connection and supports, the connector is set on the first surface of second printed circuit-board assembly and leans on
The edge of the nearly first surface.
As shown in figure 9e, it is set to for connector provided by the embodiments of the present application in second printed circuit-board assembly
The schematic diagram of first surface.
Fig. 9 e only shows a connector 95, in an alternative embodiment, the of second printed circuit-board assembly
One or more connectors 95 have can be set in one surface.If at least partly the second electronic component is laid out in the second printed circuit board
The first surface of component, one or more connectors 95 can be as far as possible positioned at the sides of the first surface of the second printed circuit-board assembly
Edge position is reduced at least the second electronic component of part to reduce the influence of the corresponding accommodating space of centering empty frames frame body
The influence of the layout of the first surface of two printed circuit-board assemblies.One or more connectors 95 can be located at the second printing as far as possible
The marginal position of the first surface of circuit board assemblies, also for it is subsequent be not disposed on first printed circuit-board assembly and
When electronic component on second printed circuit-board assembly is attached, wiring is few.
6th kind: if support component includes at least two support columns, can also using it is above-mentioned the first appoint in the 5th kind
A kind of mode is laid out connector.
It is understood that since support component is not hollow frame body, it optionally, can not when being laid out connector
One or more connectors are laid out by the edge of near surface；Optionally, when being laid out connector, the edge cloth of near surface can be leaned on
The one or more connectors of office, in order to it is subsequent be not disposed on first printed circuit-board assembly and second printed circuit
When electronic component on board group part is attached, wiring is few.
In an alternative embodiment, as shown in Figure 1, connector connected be not disposed on the first printed circuit board group
Electronic component on part and second printed circuit-board assembly includes following at least one: battery, earphone base, fills display screen
Electrical interface seat, audio parts and antenna.
Wherein, the battery is set side by side with first printed circuit-board assembly；
The battery with and second printed circuit-board assembly be set side by side；
The display screen is stacked with first printed circuit-board assembly；
The display screen is stacked with second printed circuit-board assembly.
It is understood that the first printed circuit-board assembly, support component and the second printed circuit-board assembly constitute one
Printed circuit-board assembly whole 11；Battery and printed circuit-board assembly whole 11 are set side by side；Display screen and printed circuit board group
Part whole 11 is stacked.
It as shown in Figure 10, is the sectional view of electronic equipment provided by the embodiments of the present application.
As shown in Figure 10, battery 1001 is set side by side with printed circuit-board assembly whole 11；Display screen 1002 and printing electricity
Road board group part whole 11 is stacked.
In an alternative embodiment, first printed circuit-board assembly, positioned at first printed circuit-board assembly
First electronic component of the first surface, the support component, second printed circuit-board assembly and be located at institute
The sum of thickness of second electronic component of the second surface of the second printed circuit-board assembly is stated less than or equal to described
The thickness of battery.In the prior art since the thickness of battery causes to waste a part of sky in the interior layout of electronic equipment
Between, for example, electronic component wastes a part of space lower than the electronic component of cell thickness.The embodiment of the present invention sublayer
The design of folded two pcb boards is highly integrated by electronic component, while its height is less than or equal to the thickness of battery, sufficiently saves
The space of electronic equipment internal, the space of the saving can at least place more batteries or greater area of battery to increase
Add the cruise duration of the electronic equipment such as mobile phone.
It is understood that the thickness for being in the layout of the component of spatial joint clearance is contained in the thickness of support component.
Optionally, above-mentioned thickness refers to height in a first direction.
In an alternative embodiment, the first printed circuit-board assembly, support component and the second printed circuit-board assembly are constituted
Printed circuit-board assembly whole 11 may be coupled on the shell (for example, rear shell and/or center) of electronic equipment, and pass through
Shell is realized to this whole heat dissipation.
It should be noted that all the embodiments in this specification are described in a progressive manner, each embodiment weight
Point explanation is the difference from other embodiments, and the same or similar parts between the embodiments can be referred to each other.
For device or system class embodiment, since it is basically similar to the method embodiment, so be described relatively simple, it is related
Place illustrates referring to the part of embodiment of the method.
It should also be noted that, herein, relational terms such as first and second and the like are used merely to one
Entity or operation are distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation
There are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to contain
Lid non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor
The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit
Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology
In any other form of storage medium well known in field.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of electronic equipment, comprising:
First printed circuit-board assembly；
Second printed circuit-board assembly, first printed circuit-board assembly are stacked in the second printed circuit board group
Part；
Support component is set between first printed circuit-board assembly and second printed circuit-board assembly；
Wherein, the support component makes the first of first printed circuit-board assembly and second printed circuit-board assembly
The spatial joint clearance that can accommodate electronic component is formed between surface.
2. electronic equipment according to claim 1, the support component includes following any:
The support component is hollow frame body；The cross-sectional area of the surrounded hollow space of frame of the hollow frame body with
The sum of cross-sectional area of the frame becomes with the lesser printed circuit-board assembly of area in described two printed circuit-board assemblies
In identical；
Or,
The support component is hollow frame body；The cross-sectional area of the surrounded hollow space of frame of the hollow frame body with
The sum of cross-sectional area of the frame is less than the lesser printed circuit-board assembly of area in described two printed circuit-board assemblies
Area；
Or,
The support component includes at least two support columns, and the height of at least two support column is identical.
3. electronic equipment according to claim 2,
The hollow frame body further includes shielding part；The hollow frame body, first printed circuit-board assembly and described the
Two printed circuit-board assemblies constitute accommodating space；The shielding part is used to shield at least one electricity in the accommodating space
Subcomponent.
4. electronic equipment according to claim 2,
At least one through-hole is provided in the support component；First printed circuit-board assembly and the second printing electricity
Conducting element of the road board group part by layout at least one through-hole is electrically connected；
Or,
The first surface of first printed circuit-board assembly is provided at least one first connection component, the second printing electricity
The first surface of road board group part is provided at least one second connection component, first printed circuit-board assembly and described second
Printed circuit-board assembly passes through at least one described first connection component and at least one described second connection component electrically connects
It connects；The first surface of first printed circuit-board assembly is close to the side of second printed circuit-board assembly.
5. according to the electronic equipment of claim 2 or 4, the electronic equipment further include:
First electronic component, the first electronic component layout is on a surface of first printed circuit-board assembly；
Second electronic component, the second electronic component layout is on two opposite surfaces of second printed circuit-board assembly
On.
6. electronic equipment according to claim 5,
First electronic component includes at least: the first RF component and for first RF component carry out electromagnetic screen
The shielding part covered；Wherein, first RF component and the shielding part for being electromagnetically shielded to first RF component
Layout is on the second surface of first printed circuit-board assembly；
Second electronic component includes at least: the second RF component, third RF component and for the third radio frequency
The shielding part that element is electromagnetically shielded；
Wherein, the second RF component layout on the first surface of second printed circuit-board assembly and is located at the appearance
It is the hollow frame body for being electromagnetically shielded to second RF component in emptying；
The third RF component and shielding part for being electromagnetically shielded to the third RF component are laid out described
On the second surface of second printed circuit-board assembly.
7. electronic equipment according to claim 5, further includes:
Connector, the connector are not disposed on first printed circuit-board assembly and second printed circuit for connecting
Electronic component on board group part.
8. electronic equipment according to claim 7,
If first printed circuit-board assembly is identical as the second printed circuit-board assembly size and passes through hollow frame
It body connection and supports, the connector is set on the first surface of first printed circuit-board assembly and close to described the
The edge on one surface or the connector are set on the second surface of second printed circuit-board assembly and close to described
The edge of second surface；
If during the size of first printed circuit-board assembly is less than the size of second printed circuit-board assembly and passes through
The connection of empty frames frame body and support, the connector are set on the first surface of second printed circuit-board assembly and are located at institute
Other than the view field for stating hollow frame body；
If first printed circuit-board assembly is identical as the second printed circuit-board assembly size and passes through the support
Column connection and support, the connector are set on the second surface of first printed circuit-board assembly and close to described second
The edge on surface or the connector are set on the first surface of second printed circuit-board assembly and close to described the
The edge on one surface.
9. electronic equipment according to claim 7,
What the connector was connected is not disposed on first printed circuit-board assembly and second printed circuit-board assembly
On electronic component include following at least one: battery, display screen, earphone base, charging interface seat, audio parts and antenna；
Wherein, the battery is set side by side with first printed circuit-board assembly；
The battery with and second printed circuit-board assembly be set side by side；
The display screen is stacked with first printed circuit-board assembly；
The display screen is stacked with second printed circuit-board assembly.
10. electronic equipment according to claim 9, first printed circuit-board assembly are located at first printed circuit
First electronic component of the first surface of board group part, the support component, second printed circuit-board assembly with
And the sum of the thickness of second electronic component positioned at the second surface of second printed circuit-board assembly be less than or
Equal to the thickness of the battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910285323.2A CN109874228A (en) | 2019-03-28 | 2019-03-28 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910285323.2A CN109874228A (en) | 2019-03-28 | 2019-03-28 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109874228A true CN109874228A (en) | 2019-06-11 |
Family
ID=66922357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910285323.2A Pending CN109874228A (en) | 2019-03-28 | 2019-03-28 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109874228A (en) |
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