CN110012598A - Battery protecting plate - Google Patents
Battery protecting plate Download PDFInfo
- Publication number
- CN110012598A CN110012598A CN201910181039.0A CN201910181039A CN110012598A CN 110012598 A CN110012598 A CN 110012598A CN 201910181039 A CN201910181039 A CN 201910181039A CN 110012598 A CN110012598 A CN 110012598A
- Authority
- CN
- China
- Prior art keywords
- daughter board
- via hole
- battery protecting
- copper foil
- protecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000011889 copper foil Substances 0.000 claims abstract description 43
- 230000008054 signal transmission Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 18
- 239000010949 copper Substances 0.000 abstract description 18
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The present invention relates to a kind of battery protecting plates; including at least two daughter boards, the daughter board is successively overlapped pressing, and multiple via holes are provided on the daughter board; need the via hole of connection signal transmission line that orifice ring is set the daughter board, the via hole for not needing connection signal transmission line for the daughter board removes orifice ring；The daughter board includes copper foil layer and substrate layer, and the copper foil layer is located above the substrate layer, and the region copper foil layer thickness of the daughter board upward wiring narrow space is greater than the broad region copper foil layer thickness in daughter board upward wiring space.The battery protecting plate does not need the orifice ring of the via hole of connection signal transmission line by removal, and increases copper thickness, saves the cabling space of battery protecting plate, increases the heat dissipation area of system, while increasing major loop high current current-carrying capacity, promotes fast charge electrical property.
Description
Technical field
The present invention relates to charging technique fields, especially relate to a kind of battery protecting plate.
Background technique
With the development of science and technology smart electronics product obtains rapidly developing and application, the function of smart electronics product are more next
It is more diversified, cause the electronic component on smart electronics interiors of products circuit board also to get over densification.
Printed circuit board (full name in English is Printed Circuit Board, english abbreviation abbreviation PCB) tends to high density
It designs, the spatial area on pcb board is not able to satisfy intensive electronic component and wiring requirements, interior in a limited space to realize well
PCB design, need to change previous PCB design mode, with meet pcb board tend to high density designs the needs of.
Heat dissipation support when the copper foil of multi-layer PCB board flows back and works as the signal of circuit, the size meeting of copper foil area
Directly affect the performance and heat dissipation of multi-layer PCB board circuit system.In the design of existing multi-layer PCB board, multi-layer PCB board it is each
Layer via hole can all have orifice ring, but the orifice ring having not connection signal transmission line, and internal layer copper thickness is uniform, so that PCB
The selectable space of wiring that the copper foil area of the copper foil layer of plate surface tails off with pcb board is few, and simultaneity factor heat dissipation area also subtracts
It is small.
The via hole of signal transmssion line is not connected to for the internal layer of pcb board, orifice ring is occupied without electric property, these orifice rings
The effective area of each layer of pcb board, secondly at the relatively narrow place of high current copper foil, copper foil width is smaller, and extra space is had no on pcb board
Come intensive electronic component and the progress wires design of arranging, especially in the confined space of battery protecting plate, even more as high current
Current-carrying capacity realize bottleneck, influence fast charge circuit performance.
Summary of the invention
The main object of the present invention is to provide a kind of battery protecting plate, and the mistake of connection signal transmission line is not needed by removing
The orifice ring in hole, and increase copper thickness, the cabling space of battery protecting plate is saved, increases the heat dissipation area of system, increases simultaneously
Major loop high current current-carrying capacity promotes fast charge electrical property.
The present invention proposes that a kind of battery protecting plate, including at least two daughter boards, the daughter board are successively overlapped pressing, the son
It is provided with multiple via holes on plate, needs the via hole of connection signal transmission line that orifice ring is set the daughter board, for the daughter board
The via hole removal orifice ring of connection signal transmission line is not needed；The daughter board includes copper foil layer and substrate layer, and the copper foil layer is located at
Above the substrate layer, it is wide that the region copper foil layer thickness of the daughter board upward wiring narrow space is greater than daughter board upward wiring space
Wealthy region copper foil layer thickness.
Further, above-mentioned battery protecting plate further included hole body, the via hole crossed hole body and run through each daughter board, institute
Hole body was stated to be electrically connected with the via hole of the daughter board.
Further, the hole body of crossing is hollow column structure.
Further, the material for crossing hole body is metal.
Further, the material of the orifice ring is metal.
Further, the diameter of the orifice ring is greater than the diameter of the via hole.
Further, the thickness of the copper foil layer of the daughter board is greater than or equal to 1/2oz.
Further, after the daughter board overlapping pressing, the via hole between daughter board and daughter board at different location forms through-hole, blind hole
One of with buried via hole.
Compared with prior art, the beneficial effects of the present invention are:
The orifice ring of the via hole of connection transmission line is not needed by removing, and increases copper thickness, saves battery protecting plate
Cabling space, increases the heat dissipation area of system, while increasing major loop high current current-carrying capacity, promotes fast charge electrical property.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of battery protecting plate of the embodiment of the present invention；
Fig. 2 is a kind of sectional view of battery protecting plate of the embodiment of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
In figure: 1, daughter board, 2, via hole, 3, signal transmssion line, 4, orifice ring, 5, mistake hole body.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Referring to Figures 1 and 2, the present invention proposes a kind of battery protecting plate, including at least two layers of daughter board 1, and the daughter board 1 is successively
Overlapping presses, and is provided with multiple via holes 2 on the daughter board 1, needs the via hole 2 of connection signal transmission line 3 to set the daughter board 1
Orifice ring 4 is set, the via hole 2 for not needing connection signal transmission line 3 for the daughter board 1 removes orifice ring 4；The daughter board 1 includes copper foil
Layer and substrate layer (not shown), the copper foil layer are located above the substrate layer, the daughter board upward wiring narrow space
Region copper foil layer thickness is greater than the broad region copper foil layer thickness in daughter board upward wiring space.
In this embodiment, battery protecting plate includes the multilayer daughter board 1 for being successively overlapped pressing, is provided on daughter board 1 several
Via hole 2, via hole 2 is for connecting each layer daughter board 1, and via hole 2 is the metal cylinder being plated between each layer of battery protecting plate, respectively
Between straton plate signal transmission can be carried out by via hole 2；The via hole 2 that daughter board 1 does not need connection signal transmission line 3 refers to via hole
2 are not attached with signal transmssion line 3, and orifice ring 4 occupies daughter board space without electric property, and removing the orifice ring 4 can increase
Add the effective use area of daughter board 1；The daughter board 1 includes copper foil layer and substrate layer, and the copper foil layer is located on the substrate layer
Square, copper thickness includes 1/2oz, 1oz, 2oz etc. in general pcb board, and oz is the unit of the expression copper thickness in pcb board,
1oz=35um, the preferred copper thickness of this programme battery protecting plate are 1/2oz；The region of the 1 upward wiring narrow space of daughter board
Copper foil layer thickness is greater than the broad region copper foil layer thickness in daughter board upward wiring space, and in other words, i.e., cabling space is narrow
Region increase copper foil layer copper thickness refer on battery protecting plate due to by other copper foil circuit boards extruding narrow
Or centre offers via hole 2, so that the position that original copper foil circuit board current carrying area narrows, increases copper foil in 1 part of daughter board
The copper thickness of layer narrower region, increases to 2/3oz copper thickness by 1/2oz, increases it according to the thickness for increasing conductor
The principle of current-carrying capacity is come what is realized, so copper foil is thicker, conductive capability is stronger.
It is followed successively by the first daughter board, the second daughter board, third from top to bottom by taking four layers of battery protecting plate as an example, such as in Fig. 2
Plate and the 4th daughter board.The daughter board is provided with via hole 2, and each via hole 2 is provided with orifice ring 4.If wherein the first daughter board,
The orifice ring 4 of two daughter boards and the 4th daughter board is electrically connected with signal transmssion line 3 respectively, and the orifice ring 4 of third daughter board is not passed with signal
Defeated line 3 connects, and removes the orifice ring 4 of third daughter board, thus can provide more skies for the design of multi-layer cell protection board
Between.
It is noted that only forming orifice ring 4 in the via hole 2 for needing connection signal transmission line 3, passed without connection signal
Orifice ring 4 is not prepared in the via hole 2 of defeated line 3, specific implementation method sets 0 for 4 diameter of orifice ring in 2 template of via hole,
Then orifice ring 4 is not formed in via hole 2.The area occupied for reducing invalid orifice ring 4, increases the effective area of daughter board 1, protects battery
There are more spaces when backplate upward wiring, reduces the difficulty of cabling design.
By removing the invalid orifice ring 4 of via hole 2, invalid orifice ring refers to the orifice ring of not electric property, so that copper
The copper foil area of layers of foil increases, and improves the circulation of battery protecting plate, is conducive to the heat dissipation of battery protecting plate, guarantees that battery exists
Good heat dissipation in the course of work, while the layout area of battery protecting plate is increased, be conducive to setting for battery protecting plate cabling
Meter；Part increases the copper thickness of narrower region on the copper foil layer of battery protecting plate, increases battery protecting plate entirety copper foil
Area makes the signal of battery protecting plate flow back more steady, smooth, improves the transmission matter of battery protecting plate signal transmssion line
Amount, and then improve the stability of battery system.In multi-layer cell protection board, via hole more than 2,1 number of plies of daughter board is more, copper foil
Width and thickness change, battery protecting plate can be more using space it is right so that the current-carrying capacity of battery protecting plate increases
It is more particularly evident to promote fast charge electrical property.
In one embodiment, above-mentioned battery protecting plate further included hole body, and the hole body of crossing runs through each daughter board
Via hole, it is described cross hole body be electrically connected with the via hole of the daughter board.
In this embodiment, battery protecting plate further included hole body, was provided with via hole on each straton plate of battery protecting plate,
The via hole that hole body runs through each daughter board is crossed, when being overlapped pressing between each straton plate, on the vertical direction of battery protecting plate, respectively
It was provided with hole body between via hole pressing, the via hole on different daughter boards was connected by crossing hole body, so that each straton
Pass through hole body between plate and carries out signal transmission.
In a specific embodiment, the hole body of crossing is hollow column structure.
In this embodiment, crossing hole body is column structure, and hollow column structure passes through the via hole between each straton plate
It wears, it is preferable that this programme selects hollow cylindrical structure, and cylindrical body lateral wall and the inner sidewall of the orifice ring on daughter board are electrically connected
It connects, so that the signal on daughter board is transferred to other daughter boards by the hole body of crossing connecting with orifice ring, daughter board can be more stable with daughter board
Transmission signal.
In one embodiment, the material for crossing hole body is metal.
In this embodiment, the material for crossing hole body is metal, due to the conductive characteristic of metal material, selects metal material
Hole body was made, so that preferably carrying out signal transmission between each daughter board.The preferred metal material of this programme battery protecting plate is
Copper.Copper electric conductivity is good, and soft, can be preferably compatible with the copper foil layer on battery protecting plate, to improve transmission
Stablize, securely and reliably.
In one embodiment, the material of the orifice ring 4 is metal.
In this embodiment, orifice ring 4 is made of metal material, and making material is not limited to metal material, can also be by it
He is made conductive material, it is preferred that the material of orifice ring 4 is copper.The electric conductivity of copper is good, and resistance is low, and soft, guarantees electricity
Stream can stablize transmission, securely and reliably.
In a specific embodiment, the diameter of the orifice ring is greater than the diameter of the via hole.
In this embodiment, on each straton plate of battery protecting plate, the diameter of the orifice ring on the daughter board is greater than described
The diameter of via hole on daughter board.It should be understood that assuming that orifice ring and via hole are circular configuration, then orifice ring is exactly concentric with via hole
Annulus.It should be noted that orifice ring and via hole can be semicircle, it is also possible to the structures such as sector, herein with no restrictions.
In one embodiment, the thickness of the copper foil layer of the daughter board is greater than or equal to 1/2oz.
In this embodiment, copper thickness includes 1/2oz, 1oz, 2oz etc. in general pcb board, and oz is the table in pcb board
Show the unit of copper thickness, 1oz=35um, the region copper foil layer of the daughter board upward wiring narrow space with a thickness of 1/2oz, and
The thickness of the broad region copper foil layer in daughter board upward wiring space is greater than 1/2oz, specifically, can be set to 2/3oz.
In one embodiment, after the daughter board overlapping pressing, the via hole between daughter board and daughter board at different location forms logical
One of hole, blind hole and buried via hole.
In this embodiment, the battery protecting plate that an entirety is formed after the daughter board overlapping pressing, between daughter board and daughter board
Via hole at different location forms the one of which in through-hole, blind hole and buried via hole.Through-hole is that hole passes through entire battery protecting plate, i.e.,
Via hole between daughter board and daughter board can be used for realizing intraconnection or the mounting-positioning holes as element through connection；Blind hole refers to position
In the top layer of battery protecting plate and the surface of bottom, the company of surface line and following internal layer circuit is used for certain depth
It connects, specifically, if there is one four layers of pcb board, the via hole and third of the via hole of the pcb board of first layer, the pcb board of the second layer
The via hole of the pcb board of layer, they run through connection between any two, and the via hole of the 4th layer of pcb board not through, material is thus formed
Blind hole；Buried via hole refers to the connecting hole positioned at battery protection inner cord, it may not extend to the surface of battery protecting plate, i.e., four layers
Pcb board removes bottom and top layer, and via hole runs through connection on intermediate each straton plate.
It is noted that using blind hole as example, if there is one four layers of pcb board, the pcb board signal transmission of first layer
Line 3 is connected to the pcb board of third layer, as long as opening up via hole 2 on first layer, the second layer and third layer pcb board, the 4th layer of PCB
For plate without opening up via hole 2, result in formation of blind holes, save the 4th layer of copper foil area, increase the 4th layer of cabling space；
Via hole 2 is used to be connected to the copper foil that intermediate each layer needs to be connected to, and via hole 2 can play electrical connection, fixed or positioning devices works
With.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (8)
1. a kind of battery protecting plate, which is characterized in that including at least two daughter boards, the daughter board is successively overlapped pressing, the son
It is provided with multiple via holes on plate, needs the via hole of connection signal transmission line that orifice ring is set the daughter board, for the daughter board
The via hole removal orifice ring of connection signal transmission line is not needed；The daughter board includes copper foil layer and substrate layer, and the copper foil layer is located at
Above the substrate layer, it is wide that the region copper foil layer thickness of the daughter board upward wiring narrow space is greater than daughter board upward wiring space
Wealthy region copper foil layer thickness.
2. battery protecting plate according to claim 1, which is characterized in that further included hole body, the hole body of crossing is through each
The via hole of the daughter board, the hole body of crossing are electrically connected with the via hole of the daughter board.
3. battery protecting plate according to claim 2, which is characterized in that the hole body of crossing is hollow column structure.
4. battery protecting plate according to claim 2, which is characterized in that the material for crossing hole body is metal.
5. battery protecting plate according to claim 1, which is characterized in that the material of the orifice ring is metal.
6. battery protecting plate according to claim 1, which is characterized in that the diameter of the orifice ring is greater than the straight of the via hole
Diameter.
7. battery protecting plate according to claim 1, which is characterized in that the thickness of the copper foil layer of the daughter board is greater than or waits
In 1/2oz.
8. battery protecting plate according to claim 1, which is characterized in that after the daughter board overlapping pressing, daughter board and daughter board
Between via hole at different location form one of through-hole, blind hole and buried via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910181039.0A CN110012598A (en) | 2019-03-11 | 2019-03-11 | Battery protecting plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910181039.0A CN110012598A (en) | 2019-03-11 | 2019-03-11 | Battery protecting plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110012598A true CN110012598A (en) | 2019-07-12 |
Family
ID=67166825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910181039.0A Pending CN110012598A (en) | 2019-03-11 | 2019-03-11 | Battery protecting plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012598A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112668279A (en) * | 2020-12-30 | 2021-04-16 | 芯和半导体科技(上海)有限公司 | Via hole modeling method |
| CN114501790A (en) * | 2022-02-22 | 2022-05-13 | 苏州泰鼎智能科技有限公司 | A low-cost battery protection board |
| CN116017886A (en) * | 2022-12-30 | 2023-04-25 | 厦门亚锝电子科技有限公司 | Method for increasing heat dissipation and current carrying capacity of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2863721A1 (en) * | 2013-10-18 | 2015-04-22 | Tripod Technology Corporation | Printed circuit board package structure and manufacturing method thereof |
| CN105101642A (en) * | 2015-07-13 | 2015-11-25 | 广东欧珀移动通信有限公司 | A method for increasing the metal foil area of a multilayer PCB board and a multilayer PCB board |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
-
2019
- 2019-03-11 CN CN201910181039.0A patent/CN110012598A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2863721A1 (en) * | 2013-10-18 | 2015-04-22 | Tripod Technology Corporation | Printed circuit board package structure and manufacturing method thereof |
| CN105101642A (en) * | 2015-07-13 | 2015-11-25 | 广东欧珀移动通信有限公司 | A method for increasing the metal foil area of a multilayer PCB board and a multilayer PCB board |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112668279A (en) * | 2020-12-30 | 2021-04-16 | 芯和半导体科技(上海)有限公司 | Via hole modeling method |
| CN112668279B (en) * | 2020-12-30 | 2023-12-08 | 芯和半导体科技（上海）股份有限公司 | Via modeling method |
| CN114501790A (en) * | 2022-02-22 | 2022-05-13 | 苏州泰鼎智能科技有限公司 | A low-cost battery protection board |
| CN116017886A (en) * | 2022-12-30 | 2023-04-25 | 厦门亚锝电子科技有限公司 | Method for increasing heat dissipation and current carrying capacity of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190712 |
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| RJ01 | Rejection of invention patent application after publication |