CN207897217U - A kind of high reliability carbon ink wiring board - Google Patents
A kind of high reliability carbon ink wiring board Download PDFInfo
- Publication number
- CN207897217U CN207897217U CN201721470342.5U CN201721470342U CN207897217U CN 207897217 U CN207897217 U CN 207897217U CN 201721470342 U CN201721470342 U CN 201721470342U CN 207897217 U CN207897217 U CN 207897217U
- Authority
- CN
- China
- Prior art keywords
- substrate
- carbon ink
- wiring board
- top layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 45
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000011101 paper laminate Substances 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- -1 polyethylene Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003063 flame retardant Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 39
- 238000005516 engineering process Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The utility model discloses a kind of high reliability carbon ink wiring boards,Including circuit board body,Circuit board body bottom is provided with substrate,It is provided with boundary on the outside of substrate,It is provided with conducting wire on the upside of substrate,Via,Pad,Pass through bonding connection between conducting wire and substrate,Pass through bonding connection between pad and substrate,It is connected by conducting wire between via,It is connected by conducting wire between pad,Substrate quadrangle is provided with mounting hole,Substrate top is provided with top layer,It is provided with top layer plurality of copper traces on the upside of top layer,Top layer plurality of copper traces end is provided with via,It is provided with bus plane and ground plane on the downside of top layer,Bus plane passes through bonding connection with ground plane,It is provided with carbon ink layer on the downside of bus plane,It is provided with bottom on the downside of carbon ink layer,It is provided with bottom plurality of copper traces below bottom,It is relatively simple in terms of the material-structure of base material that the device solves current wiring board,Seldom this material of carbon ink is applied in the production of wiring board,Have ignored carbon ink to wiring board when in use advantage the problem of.
Description
Technical field
The utility model is related to carbon ink wiring board technology field, specially a kind of high reliability carbon ink wiring board.
Background technology
With the development of science and technology, wiring board is important electronic unit, is the supporter of electronic component, is electronics
The carrier of component electrical connection since it is made of electron printing, therefore is referred to as " printing " wiring board, and electronics is set
For using after wiring board, due to the consistency of similar wiring board, so as to avoid the mistake of artificial wiring, and electronics member can be realized
Device inserting or attachment, automatic tin soldering, automatic detection automatically, ensure that the quality of electronic equipment, improves labor productivity, drop
Low cost, and it is easy to repair, and circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization for permanent circuit are used
Electric appliance layout plays an important role, while also having the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.
Currently, wiring board is relatively simple in terms of the material-structure of base material, this material of carbon ink is seldom applied into circuit
In the production of plate, have ignored carbon ink to wiring board in use the advantages of.
How a kind of high reliability carbon ink wiring board is designed, and becoming us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of high reliability carbon ink wiring boards, to solve to carry in above-mentioned background technology
It is going out currently, wiring board is relatively simple in terms of the material-structure of base material, this material of carbon ink is seldom applied into wiring board
In production, have ignored carbon ink to wiring board in use the advantages of the problem of.
To achieve the above object, the utility model provides the following technical solutions：A kind of high reliability carbon ink wiring board, including
Circuit board body, the circuit board body bottom are provided with substrate, and boundary is provided on the outside of the substrate, is set on the upside of the substrate
It is equipped with conducting wire, the first via, pad, passes through bonding connection, the pad and the substrate between the conducting wire and the substrate
Between by bonding connection, connected, connected by conducting wire between the pad, the base by conducting wire between the via
Plate quadrangle is provided with mounting hole.
Further, the substrate top is provided with top layer, and top layer plurality of copper traces, the top are provided on the upside of the top layer
Layer plurality of copper traces is made of flame-proof cover copper foil ratio phenolic paper laminate, and top layer plurality of copper traces surface is provided with ink.
Further, top layer plurality of copper traces end is provided with the second via, and bus plane is provided on the downside of the top layer
And ground plane, the bus plane pass through bonding connection with the ground plane.
Further, carbon ink layer is provided on the downside of the bus plane, the carbon ink layer is connected with the bus plane by Nian Jie
It connects, the carbon ink layer is made of good carbon ink.
Further, it is provided with bottom on the downside of the carbon ink layer, bottom plurality of copper traces is provided with below the bottom, it is described
Bottom plurality of copper traces surface is provided with ink.
Further, protective film made of the substrate surface setting layer of polyethylene material, the substrate protection film
Thickness is 13 μm.
Compared with prior art, the utility model has the beneficial effects that：This kind high reliability carbon ink wiring board, it is in substrate
Upside is provided with top layer plurality of copper traces, and downside is provided with bottom plurality of copper traces, and top layer plurality of copper traces and bottom plurality of copper traces
It is made of high-quality flame-proof cover copper foil ratio phenolic paper laminate, while top layer plurality of copper traces surface is provided with ink so that this device
One layer of good protective layer is formed on top layer plurality of copper traces surface, carbon ink layer is arranged in it in a substrate, and carbon ink layer is using excellent
The carbon ink of matter is made so that and this device has good conductive property and good wearability and smaller friction coefficient, it
It is provided with protective film made of layer of polyethylene material in substrate surface, can not only protect the conducting wire of plate face, but also can be with
The intensity of substrate being improved, the thickness of substrate protection film is 13 μm so that feel is preferable in use for device, is conveniently operated,
It is relatively simple in terms of the material-structure of base material that the device solves current wiring board, and this material of carbon ink is seldom applied to circuit
In the production of plate, have ignored carbon ink to wiring board in use the advantages of the problem of.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the board structure schematic diagram of the utility model；
In figure：1- wiring board ontologies；2- substrates；3- mounting holes；4- conducting wires；The first vias of 5-；6- pads；The boundaries 7-；8-
Top layer plurality of copper traces；9- top layers；The second vias of 10-；11- carbon ink layers；12- bottoms；13- bus planes；14- bottom plurality of copper traces；
15- ground planes；
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of high reliability carbon ink wiring board, including electricity
Road plate ontology 1,1 bottom of the circuit board body are provided with substrate 2, and 2 outside of the substrate is provided with boundary 7, on the substrate 2
Side is provided with conducting wire 4, the first via 5, pad 6, passes through bonding connection, the pad 6 between the conducting wire 4 and the substrate 2
By bonding connection between the substrate 2, is connected by conducting wire 4 between the via 5, pass through conducting wire 4 between the pad 6
Connection, 2 four jiaos of the substrate are provided with mounting hole 3.
Further, 2 top of the substrate is provided with top layer 9, and 9 upside of the top layer is provided with top layer plurality of copper traces 8, institute
It states top layer plurality of copper traces 8 to be made of flame-proof cover copper foil ratio phenolic paper laminate, 8 surface of top layer plurality of copper traces is provided with oil
Ink so that this device forms one layer of good protective layer on 8 surface of top layer plurality of copper traces.
Further, 8 end of top layer plurality of copper traces is provided with the second via 10, and 9 downside of the top layer is provided with electricity
Active layer 13 and ground plane 15, the bus plane 13 pass through bonding connection with the ground plane 15.
Further, 13 downside of the bus plane is provided with carbon ink layer 11, and the carbon ink layer 11 is logical with the bus plane 13
Bonding connection is crossed, the carbon ink layer 11 is made of good carbon ink so that this device has good electric conductivity, and good
Wearability and smaller friction coefficient.
Further, 11 downside of the carbon ink layer is provided with bottom 12, and bottom plurality of copper traces is provided with below the bottom
14,14 surface of bottom plurality of copper traces is provided with ink.
Further, protective film made of 2 surface of substrate setting layer of polyethylene material, 2 protective film of the substrate
Thickness be 13 μm so that device can not only protect the conducting wire of plate face, but also can improve the intensity of substrate, while make
It is preferable with feel in the process, it is conveniently operated.
Operation principle：First, 2 each layer of substrate is bonded using binder in sequence, then according to drilling demand
Mounting hole 3 and via 5 are made by machinery equipment, plating is had to pass through inside 3 hole wall of mounting hole, boundary 7 is set on a substrate 2,
Then in 2 surface layout conducting wire 4 of substrate, next welding resistance paint is covered on outermost conducting wire, so conducting wire is not just
Plated portions can be touched especially, then the element welded will be needed to be laid out in circuit board body 1, in components' placement
When, not only to consider the trend of signal, while also to consider the global density of device layout, accomplish that density is uniform, then
Element is welded in circuit board body by welding, then detection circuit board ontology 1 and component whether access, if
It all goes well, you can complete such as to do work, amplify, declining so that electric current is flowed along route good in advance in various components
The functions such as subtract, modulate, demodulating, encoding.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of high reliability carbon ink wiring board, including circuit board body (1), it is characterised in that：Circuit board body (1) bottom
Layer is provided with substrate (2), and boundary (7) is provided on the outside of the substrate (2), and conducting wire (4), the are provided on the upside of the substrate (2)
One via (5), pad (6), by bonding connection between the conducting wire (4) and the substrate (2), the pad (6) with it is described
It by bonding connection between substrate (2), is connected by conducting wire (4) between first via (5), is led between the pad (6)
Conducting wire (4) connection is crossed, substrate (2) quadrangle is provided with mounting hole (3).
2. a kind of high reliability carbon ink wiring board according to claim 1, it is characterised in that：Substrate (2) top is set
It is equipped with top layer (9), top layer plurality of copper traces (8) is provided on the upside of the top layer (9), the top layer plurality of copper traces (8) is using fire-retardant
Coating foil phenolic paper laminate is made, and top layer plurality of copper traces (8) surface is provided with ink.
3. a kind of high reliability carbon ink wiring board according to claim 2, it is characterised in that：The top layer plurality of copper traces
(8) end is provided with the second via (10), and bus plane (13) and ground plane (15) are provided on the downside of the top layer (9), described
Bus plane (13) passes through bonding connection with the ground plane (15).
4. a kind of high reliability carbon ink wiring board according to claim 3, it is characterised in that：On the downside of the bus plane (13)
It is provided with carbon ink layer (11), the carbon ink layer (11) with the bus plane (13) by bonding connection, adopt by the carbon ink layer (11)
It is made of good carbon ink.
5. a kind of high reliability carbon ink wiring board according to claim 4, it is characterised in that：On the downside of the carbon ink layer (11)
It is provided with bottom (12), is provided with bottom plurality of copper traces (14) below the bottom, bottom plurality of copper traces (14) surface is set
It is equipped with ink.
6. a kind of high reliability carbon ink wiring board according to claim 1, it is characterised in that：Substrate (2) surface is set
Protective film made of layer of polyethylene material is set, the thickness of substrate (2) protective film is 13 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721470342.5U CN207897217U (en) | 2017-11-07 | 2017-11-07 | A kind of high reliability carbon ink wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721470342.5U CN207897217U (en) | 2017-11-07 | 2017-11-07 | A kind of high reliability carbon ink wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207897217U true CN207897217U (en) | 2018-09-21 |
Family
ID=63547791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721470342.5U Expired - Fee Related CN207897217U (en) | 2017-11-07 | 2017-11-07 | A kind of high reliability carbon ink wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207897217U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11202368B2 (en) | 2020-04-28 | 2021-12-14 | Cisco Technology, Inc. | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane |
-
2017
- 2017-11-07 CN CN201721470342.5U patent/CN207897217U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11202368B2 (en) | 2020-04-28 | 2021-12-14 | Cisco Technology, Inc. | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane |
| US11706870B2 (en) | 2020-04-28 | 2023-07-18 | Cisco Technology, Inc. | Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180921 |