CN203482489U

CN203482489U - Multilayer printed circuit board (PCB)

Info

Publication number: CN203482489U
Application number: CN201320547483.8U
Authority: CN
Inventors: 黄云清
Original assignee: SHENZHEN GUANGDA ELECTRONIC CO Ltd
Current assignee: SHENZHEN GUANGDA ELECTRONIC CO Ltd
Priority date: 2013-08-28
Filing date: 2013-08-28
Publication date: 2014-03-12
Anticipated expiration: 2023-08-28

Abstract

The utility model relates to the technical field of PCBs, especially to a multilayer PCB. The multilayer PCB comprises surface-layer substrates for carrying components and an intermediate wiring-layer substrate, wherein the intermediate wiring-layer substrate at least includes a grounding wire layer and a power supply layer, the grounding wire layer and the power supply layer are arranged adjacent to each other in a pairwise manner, and a copper substrate whose thickness is 100mum to 120mum is adhered to the outer side of the surface-layer substrate. In wiring of the multilayer PCB, the power supply layer and the grounding wire layer are reasonably arranged as power supply grids and grounding grids respectively, so that a power supply is closely adjacent to grounding wires to realize excellent capacitive coupling, inductance can be better controlled, and finally electromagnetic interference can be well controlled. The copper substrate in the thickness of 100mum to 120mum is relatively thick, so that highly-efficient heat radiation effect can be ensured, and better mechanical endurance can be obtained.

Description

Multi-layer PCB board

Technical field

The utility model relates to pcb board technical field, relates in particular to a kind of multi-layer PCB board.

Background technology

Pcb board claims again printed circuit board (PCB), is the supplier of electronic devices and components electrical connection, its development history of existing more than 100 year, according to the circuit number of plies, can be divided into single sided board, double sided board and multi-layer sheet.Nearly all electronic product all comprises pcb board, along with the integrated level of pcb board is more and more higher, components and parts on pcb board are arranged also more and more intensive, power consumption is increasing, area of dissipation is not enough, pcb board components and parts are overheated usually causes component aging, inefficacy, the lost of life, thereby whole aircraft reliability is declined.

Utility model content

Technical problem to be solved in the utility model is to provide the better multi-layer PCB board of a kind of heat dispersion.

The technical solution of the utility model is: a kind of multi-layer PCB board, comprise for carrying top layer substrate and the middle wiring layer substrate of components and parts, in the middle of described, in wiring layer substrate, at least comprise one deck ground plane and one deck bus plane, the adjacent setting of described ground plane and bus plane also arranges in pairs, substrate outside, described top layer is also bonded with layer of copper substrate, and the thickness of described copper base is 100 μ m～120 μ m.

Wherein, substrate outside in described top layer is provided with heat conductive insulating glue-line, and described copper base is bonded on the substrate of top layer by heat conductive insulating glue-line.

Wherein, be equipped with the position location hole of correspondence mutually on described top layer substrate, heat conductive insulating glue-line, metal substrate and intermediate wiring layer substrate, the quantity of described location hole is four, lays respectively at four corners of copper base.

Wherein, on described copper base, be also provided with and window, described in the place of windowing also carry components and parts.

The beneficial effects of the utility model are: multi-layer PCB board described in the utility model comprises for carrying top layer substrate and the middle wiring layer substrate of components and parts, in the middle of described, in wiring layer substrate, at least comprise one deck ground plane and one deck bus plane, the adjacent setting of described ground plane and bus plane also arranges in pairs, in multiple-plate wiring, bus plane and ground plane reasonably cloth become power grid and earth grid, VDD-to-VSS line is tight adjacently can realize good capacitive coupling, can also control better inductance, finally control EMI well.If when bus plane is horizontal wiring, ground plane preferred vertical wiring.

In addition, substrate outside, described top layer is also bonded with layer of copper substrate, the thickness of described copper base is 100 μ m～120 μ m, the radiating effect of copper base is all got well doubly a lot than aluminium base and iron substrate, current capacity is very large, can improve product power density and reliability, extend the useful life of product, be applicable to the heat radiation that high-frequency circuit and high low temperature change regional and accurate communication equipment greatly, copper base thickness is thicker, not only efficient radiating effect can be guaranteed, better mechanical durability can also be obtained.

Accompanying drawing explanation

Fig. 1 is the generalized section of multi-layer PCB board embodiment described in the utility model;

Fig. 2 is the front schematic view of multi-layer PCB board embodiment described in the utility model.

Wherein, 1, top layer substrate; 2, middle wiring layer substrate; 21, bus plane; 22, ground plane; 3, components and parts; 4, copper base; 41, window; 5, heat conductive insulating glue-line; 6, location hole.

Embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.

Embodiment as multi-layer PCB board described in the utility model, as depicted in figs. 1 and 2, described multi-layer PCB board comprises for carrying top layer substrate 1 and the middle wiring layer substrate 2 of components and parts 3, in the middle of described, in wiring layer substrate 2, at least comprise one deck ground plane 22 and one deck bus plane 21, the setting adjacent with bus plane 21 of described ground plane 22 also arranges in pairs, one of them top layer substrate 1 outside is also bonded with layer of copper substrate 4, and the thickness of described copper base 4 is 100 μ m～120 μ m.

Multi-layer PCB board described in the utility model comprises for carrying top layer substrate 1 and the middle wiring layer substrate 2 of components and parts 3, in the middle of described, in wiring layer substrate 2, at least comprise one deck ground plane 22 and one deck bus plane 21, the setting adjacent with bus plane 21 of described ground plane 22 also arranges in pairs, in multiple-plate wiring, bus plane 21 and ground plane 22 reasonably cloth become power grid and earth grid, bus plane 21 and ground plane 22 are tight adjacently can realize good capacitive coupling, can also control better inductance, finally control EMI well.If when bus plane is horizontal wiring, ground plane preferred vertical wiring.

In addition, substrate 1 outside, described top layer is also bonded with layer of copper substrate 4, the thickness of described copper base 4 is 100 μ m～120 μ m, the radiating effect of copper base 4 is all got well doubly a lot than aluminium base and iron substrate, current capacity is very large, can improve product power density and reliability, extend the useful life of product, be applicable to the heat radiation that high-frequency circuit and high low temperature change regional and accurate communication equipment greatly, copper base 4 thickness are thicker, not only efficient radiating effect can be guaranteed, better mechanical durability can also be obtained.

When multi-layer PCB board two sides all carries components and parts 3, also need on described copper base 4, arrange and window 41, described in 41 places of windowing carry components and parts 3.

In the present embodiment, substrate 1 outside, described top layer is provided with heat conductive insulating glue-line 5, and described copper base 4 is bonded on top layer substrate 1 by heat conductive insulating glue-line 5.Heat conductive insulating glue-line 5 is key technologies of copper base pcb board, in heat conductive insulating glue-line 5, core heat conduction composition is that alundum (Al2O3) and silica flour form and the polymer of epoxy resin filling forms, and thermal resistance is little, and viscoelastic property is good, the ability with resistant to thermal aging, can bear machinery and thermal stress.

In the present embodiment, on described top layer substrate 1, heat conductive insulating glue-line 2, metal substrate 4 and intermediate wiring layer substrate 2, be equipped with the position location hole 6 of correspondence mutually, the quantity of described location hole 6 is four, lay respectively at four corners of copper base 4, can effectively control the positioning precision between each substrate.

The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.

Claims

1. a multi-layer PCB board, it is characterized in that, comprise for carrying top layer substrate and the middle wiring layer substrate of components and parts, in the middle of described, in wiring layer substrate, at least comprise one deck ground plane and one deck bus plane, the adjacent setting of described ground plane and bus plane also arranges in pairs, substrate outside, described top layer is also bonded with layer of copper substrate, and the thickness of described copper base is 100 μ m～120 μ m.

2. multi-layer PCB board according to claim 1, is characterized in that, substrate outside in described top layer is provided with heat conductive insulating glue-line, and described copper base is bonded on the substrate of top layer by heat conductive insulating glue-line.

3. multi-layer PCB board according to claim 2, it is characterized in that, on described top layer substrate, heat conductive insulating glue-line, metal substrate and intermediate wiring layer substrate, be equipped with the position location hole of correspondence mutually, the quantity of described location hole is four, lays respectively at four corners of copper base.

4. multi-layer PCB board according to claim 3, is characterized in that, on described copper base, be also provided with and window, described in the place of windowing also carry components and parts.