CN106658959A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN106658959A CN106658959A CN201510717966.1A CN201510717966A CN106658959A CN 106658959 A CN106658959 A CN 106658959A CN 201510717966 A CN201510717966 A CN 201510717966A CN 106658959 A CN106658959 A CN 106658959A
- Authority
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- China
- Prior art keywords
- layer
- hole
- copper
- substrate
- flexible pcb
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
Abstract
A flexible circuit board includes an inner layer circuit substrate, a second base material layer and a third base material layer formed on two opposite surfaces of the inner layer circuit substrate, and a first outer layer conducting circuit layer and a second outer layer conducting circuit layer formed on the second base material layer and the third base material layer which are away from the surface of the inner layer circuit substrate; the flexible circuit board also includes a first through hole penetrating through the inner layer circuit substrate, a second through hole penetrating through the second base material layer and the first outer layer conducting circuit layer and a third through hole penetrating through the third base material layer and the second outer layer conducting circuit layer, the first through hole, the second through hole and the third through hole are in one-to-one correspondence and communicate with one another, the diameter of the first through hole is smaller than the diameters of the second through hole and the third through hole, and hole-filling electroplating materials are formed in the first through hole, the second through hole and the third through hole to be electrically connected with the inner layer circuit substrate, the first outer layer conducting circuit layer and the second outer layer conducting circuit layer. The invention also relates to a method for manufacturing the flexible circuit board.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to a kind of flexible PCB and preparation method thereof.
Background technology
Filling perforation electroplating technology because of its achievable circuit board high density designs, and with high planarization, height
The features such as thermal diffusivity and excellent electrical conductance, interconnect (high density in high density
Interconnect, HDI) circuit board and integrated circuit (integrated circuit, IC) product
In extensively apply, flexible PCB has continued to use the development trend of technique.Because its additive is made
With principle and Common platings equipment limit, filling perforation processing hole type design would generally be designed using blind hole.
In the prior art, the ectonexine of general flexible PCB is generally adopted and set with the blind hole in aperture
Meter.Although this kind of design can produce high density circuit board and ensure that the smooth of piece and welding can
By property, but, the defect of this kind of preparation method is also apparent from：Making programme is longer, relatively costly,
Filling perforation liquid medicine exchange capacity is poor, additives function can not be played effectively.
The content of the invention
In view of this, the present invention provides a kind of flexible PCB and its system that can solve the problem that the problems referred to above
Make method.
A kind of flexible PCB, it includes an internal layer circuit substrate, is formed in the internal layer circuit substrate
With respect to two surfaces the second substrate layer and the 3rd substrate layer and be respectively formed at second substrate layer and
The one first external conducting wire layer on the surface away from the internal layer circuit substrate of the 3rd substrate layer
With one second external conducting wire layer；The flexible PCB also includes that at least one runs through the internal layer circuit
The first through hole of substrate, at least one through second substrate layer and the first external conducting wire layer
Second through hole and at least one is through the 3rd substrate layer and the 3rd of the second external conducting wire layer
Through hole, the first through hole and second through hole are corresponded and communicated with the third through-hole, and this first
The aperture of through hole less than second through hole and the third through-hole aperture, the first through hole, this second
It is formed with filling perforation plated material in through hole and the third through-hole to electrically connect the internal layer circuit substrate, be somebody's turn to do
First external conducting wire layer and the second external conducting wire layer.
A kind of preparation method of flexible PCB, it includes：An internal layer circuit substrate is provided, this is interior
The first through hole of at least insertion internal layer circuit substrate is formed with layer circuit substrate；There is provided one
Two copper-clad base plates and one the 3rd copper-clad base plate, and by the second copper-clad substrate and the 3rd copper-clad base plate
It is attached to the opposite sides of the internal layer circuit substrate, and then forms a circuit substrate intermediate, this
One outer layer copper-clad base plate includes one the 3rd copper foil layer, and the second outer layer copper-clad base plate includes one the 4th bronze medal
Layers of foil；At least one is formed on the circuit substrate intermediate and extends through the first outer layer copper-clad base plate
And second through hole and third through-hole of the second outer layer copper-clad base plate, second through hole and the threeway
Hole corresponds and communicates with the first through hole, the aperture of the first through hole less than second through hole and
The aperture of the third through-hole；Filling perforation is electroplated；And make the 3rd copper foil layer and the 4th copper foil layer
Form one first external conducting wire layer and the second external conducting wire layer.
Flexible PCB that the present invention is provided and preparation method thereof, is capable of achieving multi-layer sheet filling perforation, adopts
The through hole of internal layer is designed with the pore sizeization of the second through hole of outer layer and third through-hole, 1) in filling perforation
Internal layer via regions can improve liquid medicine exchange capacity during plating；2) up and down differentiation design in aperture can be protected
Card additives function can be played effectively, so as to reach good filling perforation effect；3) need flow process few,
Low cost.
Description of the drawings
Fig. 1 is the sectional view of the two-sided copper-clad base plate that preferred embodiment is provided.
Fig. 2 is that the sectional view after through hole is formed on the double-sided copper-clad substrate shown in Fig. 1.
Fig. 3 is that the copper foil layer of the double-sided copper-clad substrate that the formation shown in Fig. 2 is had into first through hole makes
Form inner layer conductive line layer, and then the sectional view of the inner layer circuit board for being formed.
Fig. 4 is the two one side copper-clad base plates and two glue-line pressings that will be provided in the embodiment of the present invention
In the opposite sides of the inner layer circuit board shown in Fig. 3, the sectional view of the circuit substrate intermediate of formation.
Fig. 5 is will to be formed after the second through hole and third through-hole on the intermediate circuit substrate shown in Fig. 4
Sectional view.
Fig. 6 is formed on the hole wall of the first through hole shown in Fig. 5, the second through hole and third through-hole
Sectional view after one chemical deposit.
Fig. 7 by the first through hole shown in Fig. 6, the second through hole and third through-hole filling perforation plating after cut open
View.
Fig. 8 to form outer layer conduction by making in the copper plate shown in Fig. 7 and the three, the 4th copper foil layers
Sectional view after circuit.
Main element symbol description
| Flexible PCB | 100 |
| First copper-clad base plate | 10 |
| The first base material layer | 11 |
| First copper foil layer | 12 |
| Second copper foil layer | 13 |
| First through hole | 14 |
| First inner layer conductive line layer | 15 |
| Second inner layer conductive line layer | 16 |
| Internal layer circuit substrate | 110 |
| Second copper-clad substrate | 20 |
| Second substrate layer | 21 |
| 3rd copper foil layer | 22 |
| 3rd copper-clad base plate | 30 |
| 3rd substrate layer | 31 |
| 4th copper foil layer | 32 |
| First glue-line | 41 |
| Second glue-line | 42 |
| Circuit substrate intermediate | 120 |
| Second through hole | 51 |
| Third through-hole | 52 |
| Chemical deposit | 61 |
| First copper plate | 62 |
| Second copper plate | 63 |
| First external conducting wire layer | 71 |
| Second external conducting wire layer | 72 |
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Below in conjunction with drawings and Examples, the flexible PCB provided the technical program and its system
It is described in further detail as method.
Refer to Fig. 1～Fig. 8, the making of the flexible PCB 100 that preferred embodiment is provided
Method is as follows：
The first step, refers to Fig. 1, there is provided one first copper-clad base plate 10.
In the present embodiment, first copper-clad base plate 10 is a two-sided copper-clad base plate.This first covers copper
Substrate 10 includes a first base material layer 11, one first copper foil layer 12 and one second copper foil layer 13.Should
First copper foil layer 12 and second copper foil layer 13 are formed in relative two of the first base material layer 11
On surface.
The material of the first base material layer 11 can be polyimides (polyimide, PI), gather to benzene
Naphthalate (Polyethylene Terephthalate, PET), poly- naphthalenedicarboxylic acid second two
One kind in the materials such as alcohol ester (Polyethylene Naphthalate, PEN).
Second step, refers to Fig. 2, and in first copper-clad base plate 10 at least one first through hole is formed
14。
Specifically, the first through hole can be formed by way of machine drilling or laser drill
14.The first through hole 14 is through first copper foil layer 12 and second copper foil layer 13.This first lead to
Hole 14 be a micro through hole, its aperture D1=(10～50) um.In the present embodiment, this first lead to
Hole 14 is formed by the way of laser drill.
3rd step, refers to Fig. 3, and first copper foil layer 12 is made to form the first inner layer conductive line
Road floor 15, second copper foil layer 13 is made to form the second inner layer conductive line layer 16, and then shape
Into an internal layer circuit substrate 110.
Specifically, the first inner layer conductive line layer can be formed by image transfer and etch process
15 and the second inner layer conductive line layer 16.
The internal layer circuit substrate 110 includes the first base material layer 11 and is formed in the first base material layer
The first inner layer conductive line layer 15 and the second inner layer conductive line layer on 11 relative two surfaces
16.The internal layer circuit substrate 110 also includes at least one first through hole 14.
4th step, refers to Fig. 4, there is provided a second copper-clad substrate 20, one the 3rd copper-clad base plate 30,
One first glue-line 41 and one second glue-line 42, and the second copper-clad substrate 20 is passed through into first glue
Layer 41 is pressed together on the surface away from the first base material layer 11 of the first inner layer conductive line layer 15
On, the 3rd copper-clad base plate 30 is pressed together on into the second inner layer conductive line by second glue-line 42
On the surface away from the first base material floor 11 of road floor 16, a circuit substrate intermediate 120 is formed.
In the present embodiment, the copper-clad base plate 30 of second copper-clad substrate 20 and the 3rd is one side
Copper-clad base plate.In other embodiments, the copper-clad base plate 30 of second copper-clad substrate 20 and the 3rd
Can also be single double-sided copper-clad substrate, or including multiple one side copper-clad base plates, multiple two-sided cover
Copper base.
In the present embodiment, the second copper-clad substrate 20 includes that one second substrate layer 21 and is formed
The 3rd copper foil layer 22 on second substrate layer 21.3rd copper-clad base plate 30 includes one the 3rd
Substrate layer 31 and one is formed in the 4th copper foil layer 32 on the 3rd substrate layer 31.
The material of the substrate layer 31 of the second substrate layer 21 and the 3rd can be polyimides
(polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate,
PET), the material such as PEN (Polyethylene Naphthalate, PEN)
In one kind.
First glue-line 41 and second glue-line 42 are semi-solid preparation film.
Second substrate layer 21 is relative with first glue-line 41, the 3rd substrate layer 31 with this
Two glue-lines 42 are relative.
Specifically, that the copper-clad base plate 30 of second copper-clad substrate 20 and the 3rd is pressed into this is interior
When on layer circuit substrate 110, part first glue-line 41 and second glue-line 42 can enter this
One through hole 14.
5th step, refers to Fig. 5, and at least one second is formed on the circuit substrate intermediate 120
Through hole 51 and at least a third through-hole 52.
Second through hole 51 is through the second copper-clad substrate 20 and first glue-line 41, the threeway
Hole 52 is through the 3rd copper-clad base plate 30 and second glue-line 42.Second through hole 51 and this
Three through holes 52 are corresponded and communicated with the first through hole 14.Preferably, second through hole 51
With the central axis and the central axes of the first through hole 14 of the third through-hole 52.
The aperture D2 of second through hole 51 is more than the aperture D1 of the first through hole 14, the threeway
The aperture D3 in hole 52 is equal with the aperture D2 of second through hole 51.Specifically,
D3=D2=D1+ (25～75) um.
6th step, refers to Fig. 6-7, to second through hole 51, the third through-hole 52 and this
One through hole 14 carries out filling perforation plating.
Specifically, first, refer to Fig. 6, to second through hole 51, the third through-hole 52 and
The first through hole 14 carries out hole metallization, second through hole 51, the third through-hole 52 and this
A chemical deposit 61 is formed on the hole wall of one through hole 14.Secondly, Fig. 7 is referred to, to defining
Second through hole 51 of chemical deposit 61, the third through-hole 52 and the plating of first through hole 14 are filled out
The full plated material of filling in hole, second through hole 51, the third through-hole 52 and the first through hole 14,
And one first copper plate is formed respectively on the surface of the 3rd copper foil layer 22 and the 4th copper foil layer 32
62 and one second copper plate 63.In the present embodiment, the plated material is copper.
Corresponded due to second through hole 51 and the third through-hole 52 and the first through hole 14 and
Communicate, therefore the number of times of filling perforation plating can be reduced, it is only necessary to once can just complete the first through hole
14th, the filling perforation plating of second through hole 51 and the third through-hole 52.
Because the aperture of the first through hole 14 between 10～50um and less than second through hole 51 and is somebody's turn to do
The aperture of third through-hole 52, so, when filling perforation is electroplated, the first through hole 14 can be preferentially electric
Plating is filled up.And because the aperture of the first through hole 14 is narrower, advantageously reduce when filling perforation is electroplated and produce
The chance of raw empty bag.What is occurred in plated material when " sky bag " refers to plating in this section includes air
Bubbling.In addition, the exchange capacity in the liquid medicine in the region of first through hole 14 is stronger, be conducive to
The absorption of accelerator is electroplated in filling perforation, and upper and lower aperture differentiation design can ensure filling perforation high/low currents position area
Domain distribution is unaffected, and additives function can be played effectively, can reach good filling perforation effect.
Certainly, Kong Jin is being carried out to the second through hole 51, the third through-hole 52 and the first through hole 14
Before categoryization, in addition it is also necessary to first the circuit substrate intermediate 120 is surface-treated.
7th step, refers to Fig. 8, and the 3rd copper foil layer 22 and first copper plate 62 are made
One first external conducting wire layer 71 is formed, by the 4th copper foil layer 32 and second copper plate 63
Make and form one second external conducting wire layer 72, and then form the flexible PCB 100.
The first external conducting wire layer 71 and the second external conducting wire layer 72 can pass through shadow
As transfer and etch process are formed.
Certainly, the preparation method of the flexible PCB 100 also includes：In the first outer layer conductor wire
The surface of road floor 71 and the second external conducting wire floor 72 is formed protects the first outer layer conductor wire
The cover layer (not shown) of road floor 71 and the second external conducting wire floor 72.
In the present embodiment, the preparation method of the flexible PCB 100 is using double-sided copper-clad substrate
It is stacked with forming with two one side copper-clad base plates.In other embodiments, the flexible PCB 100
Can also be using double-sided copper-clad substrate and multiple one side copper-clad base plates or multiple double-sided copper-clad substrates
Or multiple one side copper-clad base plates are formed with double-sided copper-clad substrate hybrid stack-ups.
Fig. 8 is referred to, the flexible PCB 100 includes an internal layer circuit substrate 110, is formed in
One first glue-line on relative two surfaces of the internal layer circuit substrate 110 and one second glue-line 42, formation
One second substrate layer on the surface away from the internal layer circuit substrate 110 of first glue-line 41
21st, one be formed on the surface away from the internal layer circuit substrate 110 of second glue-line 42
Three substrate layers 31, it is formed on the surface away from first glue-line 41 of second substrate layer 21
First external conducting wire layer 71 and be formed in the 3rd substrate layer 31 away from second glue-line 42
Surface on the second external conducting wire layer 72.The internal layer circuit substrate 110 includes one first base
Material layer 11 and be formed in the first base material layer 11 relative two surfaces the first inner layer conductive line layer
15 and the second inner layer conductive line layer 16.
The flexible PCB 100 also includes a first through hole 14, one second through hole 51 and the 3rd
Through hole 52.The first through hole 14 runs through the internal layer circuit substrate 110, and second through hole 51 runs through
The first external conducting wire layer 71, second substrate layer 21 and first glue-line 41, the 3rd
Through hole 52 runs through the second external conducting wire layer 72, the 3rd substrate layer 31 and second glue-line
42.First first through hole 14 it is relative one by one with second through hole 51 and the third through-hole 52 and
Communicate.The aperture D1 of the first through hole 14 less than second through hole 51 aperture D2 and this
The aperture D3 of three through holes 52, the aperture D3 of the third through-hole 52 and the hole of second through hole 51
Footpath D2 is equal.Specifically, D3=D2=D1+ (25～75) um.
Filling perforation plating is formed with the first through hole 14, second through hole 51 and the third through-hole 52
Material, the flexible PCB 100 passes through the first through hole 14, second through hole 51 and the 3rd
Filling perforation plated material in through hole 52 electrically connects the first inner layer conductive line layer 15, this is in second
Layer conductive circuit layer 16, the first external conducting wire layer 71 and the second external conducting wire layer
72。
Flexible PCB 100 that the present invention is provided and preparation method thereof, is capable of achieving multi-layer sheet filling perforation,
Using the first through hole 14 of internal layer and the second through hole 51 of outer layer and the pore size of third through-hole 52
Change design, the chance for empty bag occur 1) is reduced when filling perforation is electroplated；2) internal layer when filling perforation is electroplated
Via regions can improve liquid medicine exchange capacity；3) up and down differentiation design in aperture can ensure filling perforation height
Electric current position area distribution is unaffected, and additives function can be played effectively, good so as to reach
Filling perforation effect；4) due to first through hole 14 and second through hole 51 and the phase of third through-hole 52 of outer layer
Connection, it is only necessary to which filling perforation plating can be completed to first through hole 14, the second through hole 51 and the
The filling perforation plating of three through holes 52, needs flow process few, low cost.
It is understood that above example is only used for illustrating the present invention, it is not used as to the present invention
Restriction.For the person of ordinary skill of the art, technology according to the present invention design is made
Other it is various it is corresponding change with deformation, all fall within the protection domain of the claims in the present invention.
Claims (10)
1. a kind of preparation method of flexible PCB, it includes：
One internal layer circuit substrate is provided, at least insertion internal layer is formed with the internal layer circuit substrate
The first through hole of circuit substrate；
One second copper-clad substrate and one the 3rd copper-clad base plate are provided, and by the second copper-clad substrate and are somebody's turn to do
3rd copper-clad base plate is attached to the opposite sides of the internal layer circuit substrate, and then forms a circuit substrate
Intermediate, the first outer layer copper-clad base plate includes one the 3rd copper foil layer, the second outer layer copper-clad base plate
Including one the 4th copper foil layer；
At least one is formed on the circuit substrate intermediate and extends through the first outer layer copper-clad base plate
And second through hole and third through-hole of the second outer layer copper-clad base plate, second through hole and the threeway
Hole corresponds and communicates with the first through hole, the aperture of the first through hole less than second through hole and
The aperture of the third through-hole；
Filling perforation is electroplated；And
3rd copper foil layer and the 4th copper foil layer are made to form one first external conducting wire layer
With the second external conducting wire layer.
2. the preparation method of flexible PCB as claimed in claim 1, it is characterised in that this is interior
The making side of layer circuit substrate includes step：
By one first copper-clad base plate, first copper-clad base plate includes a first base material layer and is formed in
First copper foil layer and the second copper foil layer on relative two surfaces of the first base material layer；
The first through hole is formed on first copper-clad base plate；And
First copper foil layer and second copper foil layer are made to be formed one first inner layer conductive circuit and
One second inner layer conductive circuit.
3. the preparation method of flexible PCB as claimed in claim 1, it is characterised in that entering
Before row filling perforation plating, the preparation method of the flexible PCB also includes：In second through hole, it is somebody's turn to do
A chemical deposit is formed on the hole wall of third through-hole and the first through hole.
4. the preparation method of flexible PCB as claimed in claim 1, it is characterised in that this
Two copper-clad base plates and the 3rd copper-clad base plate are bonded respectively by one first glue-line and one second glue-line
On relative two surfaces of the internal layer circuit substrate.
5. a kind of flexible PCB, it includes an internal layer circuit substrate, is formed in the internal layer circuit base
Plate with respect to two surfaces the second substrate layer and the 3rd substrate layer and be respectively formed at second substrate layer
With one first external conducting wire on the surface away from the internal layer circuit substrate of the 3rd substrate layer
Layer and one second external conducting wire layer；The flexible PCB also includes at least one through the internal layer electricity
The first through hole of base board, at least one run through second substrate layer and the first external conducting wire layer
The second through hole and at least through the of the 3rd substrate layer and the second external conducting wire layer
Three through holes, the first through hole and second through hole and the third through-hole are corresponded and communicated, and this
The aperture of one through hole less than second through hole and the third through-hole aperture, the first through hole, this
Filling perforation plated material is formed with two through holes and the third through-hole with electrically connect the internal layer circuit substrate,
The first external conducting wire layer and the second external conducting wire layer.
6. flexible PCB as claimed in claim 5, it is characterised in that the first through hole is
Micro through hole, D1=(10～50) um, wherein, D1 is the aperture of the first through hole.
7. flexible PCB as claimed in claim 6, it is characterised in that D3=D2=D1+ (25～75)
Um, wherein D2 are the aperture of second through hole, and D3 is the aperture of the third through-hole.
8. flexible PCB as claimed in claim 5, it is characterised in that the internal layer circuit substrate
Lead including a first base material layer and one first internal layer for being formed in relative two surface of the first base material layer
Electric line layer and one second inner layer conductive line layer.
9. flexible PCB as claimed in claim 8, it is characterised in that the flexible PCB is also
Including one first glue-line and second glue-line, first glue-line is located at the first inner layer conductive line layer
And second substrate layer between, second glue-line is located at the second inner layer conductive line layer and the 3rd
Between substrate layer.
10. flexible PCB as claimed in claim 9, it is characterised in that second through hole is also
Through first glue-line, the third through-hole also extends through second glue-line.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510717966.1A CN106658959A (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and manufacturing method thereof |
| TW104141405A TW201715928A (en) | 2015-10-28 | 2015-12-10 | Flexible print circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510717966.1A CN106658959A (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658959A true CN106658959A (en) | 2017-05-10 |
Family
ID=58830118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510717966.1A Pending CN106658959A (en) | 2015-10-28 | 2015-10-28 | Flexible circuit board and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106658959A (en) |
| TW (1) | TW201715928A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800935A (en) * | 2019-04-01 | 2020-10-20 | 新扬科技股份有限公司 | Circuit board structure |
| CN114286540A (en) * | 2020-09-28 | 2022-04-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109219259B (en) * | 2017-07-05 | 2021-09-14 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN113133202B (en) * | 2020-01-15 | 2022-05-27 | 碁鼎科技秦皇岛有限公司 | Embedded capacitor circuit board and manufacturing method thereof |
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| CN101562953A (en) * | 2003-02-13 | 2009-10-21 | 株式会社藤仓 | Multilayer board and its manufacturing method |
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- 2015-10-28 CN CN201510717966.1A patent/CN106658959A/en active Pending
- 2015-12-10 TW TW104141405A patent/TW201715928A/en unknown
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| CN101562953A (en) * | 2003-02-13 | 2009-10-21 | 株式会社藤仓 | Multilayer board and its manufacturing method |
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| CN102740582A (en) * | 2011-04-06 | 2012-10-17 | 日本梅克特隆株式会社 | Multilayer printed wiring board and producing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111800935A (en) * | 2019-04-01 | 2020-10-20 | 新扬科技股份有限公司 | Circuit board structure |
| CN114286540A (en) * | 2020-09-28 | 2022-04-05 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
| CN114286540B (en) * | 2020-09-28 | 2023-08-18 | 宏启胜精密电子(秦皇岛)有限公司 | Method for manufacturing circuit board and circuit board |
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| TW201715928A (en) | 2017-05-01 |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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