CN103369868B - A kind of manufacture method of pcb board and pcb board - Google Patents
A kind of manufacture method of pcb board and pcb board Download PDFInfo
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- CN103369868B CN103369868B CN201310288041.0A CN201310288041A CN103369868B CN 103369868 B CN103369868 B CN 103369868B CN 201310288041 A CN201310288041 A CN 201310288041A CN 103369868 B CN103369868 B CN 103369868B
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Abstract
The invention discloses a kind of manufacture method and pcb board of pcb board, relate to PCB technical field, for can reduce PCB processing cost, improve via hole layout density and invent.Described method comprises: first paste dry film at the layer on surface of metal of the PCB being manufactured with via hole, described dry film covers the via hole of described porose disc to be removed; Then remove the dry film covered on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed; Then etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole.The present invention be mainly used in make pcb board without porose disc via hole.
Description
Technical field
The present invention relates to PCB technical field, particularly relate to a kind of manufacture method and pcb board of pcb board.
Background technology
PCB(PrintedCircuitBoard, printed circuit board (PCB)) be one of electronic unit important in electronics industry, be not only the supporting body of electronic devices and components, and be the supplier realizing electric interconnection between electronic devices and components.Nowadays, PCB develops into double sided board, multi-layer sheet from initial lamina, and wherein multi-layer sheet is high with its packaging density, volume is little, and signaling rate is high, be convenient to many advantages such as wiring and be widely used.
Multi-layer sheet is made through the technique such as lamination, bonding by the polylith lamina etched or double sided board, wherein in order to realize electrical connection between layers, generally to make via hole on PCB, the process making via hole comprises: first, intersection's boring of the wire be communicated with is needed at each layer, then, the method of chemical deposition can be adopted on hole wall to plate layer of metal, in this deposition process, the PCB top layer of hole periphery also can be coated with layer of metal, form porose disc 8, such as, shown in Fig. 1.But under some application scenarios, then need to remove porose disc, what current removal porose disc adopted is mechanical back drill (backdrilling) technique, machinery back drill is possessed the special drill equipment of control dark ability to the position needing to remove porose disc holed according to the drilling depth preset by a kind of, thus realize the object of removal porose disc.
But there is some weak point following in this method:
The first, this back drill equipment is compared common rig and is belonged to special installation, and input cost is higher, factory building occupation of land space is larger, also will be equipped with skilled operating personnel etc. simultaneously, cause the processing cost of PCB higher like this;
Second, while back drill, the base material of hole periphery also can drilled fall (as shown in Figure 2), this just requires to need reserved back drill space (referring to the radial space along via hole) on the base material of hole periphery during the layout in hole on Design PCB plate, and back drill space can take the more area in PCB surface, thus layout density is caused to reduce.
Summary of the invention
Embodiments of the invention provide a kind of manufacture method and pcb board of pcb board, can reduce the processing cost of PCB, improve the layout density of via hole.
For achieving the above object, embodiments of the invention adopt following technical scheme:
First aspect, embodiments provides a kind of manufacture method of pcb board, comprising:
Paste dry film at the layer on surface of metal of the PCB being manufactured with via hole, described dry film covers the via hole of described porose disc to be removed;
Remove the dry film covered on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed;
Etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole.
In conjunction with first aspect mode in the cards, in the first mode in the cards, the layer on surface of metal of the described PCB being manufactured with via hole pastes dry film, and described dry film also comprises before covering the via hole of described porose disc to be removed:
By filling holes with resin technique, the via hole of described porose disc to be removed is filled up resin.
In conjunction with first aspect mode in the cards, in the second mode in the cards, described removal covers the dry film on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed and specifically comprises:
Exposure is carried out to the PCB being pasted with described dry film and obtains exposure area and unexposed area, described unexposed area comprises the via area of described porose disc to be removed, removed the dry film of described unexposed area by development, the via hole of porose disc to be removed in described unexposed area is exposed.
In conjunction with first aspect the second mode in the cards, in the third mode in the cards, describedly to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole formed and comprises without porose disc via hole:
Etched by the metal level of etch process to described unexposed area, make the porose disc of the via hole of the porose disc to be removed of described unexposed area etched, formed without porose disc via hole, the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
In conjunction with first aspect mode in the cards, in the 4th kind of mode in the cards, described removal covers the dry film on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed and specifically comprises:
Carry out exposure to the PCB being pasted with described dry film and obtain exposure area and unexposed area, described exposure area comprises the via area of porose disc to be removed, is removed the dry film of described unexposed area by development;
Covering metal protective layer on the layer on surface of metal of described unexposed area;
Remove the dry film of described exposure area, the via hole of porose disc to be removed in described exposure area is exposed.
In conjunction with first aspect the 4th kind of mode in the cards, in the 5th kind of mode in the cards, describedly to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole formed and comprises without porose disc via hole:
Etched by the metal level of etch process to described exposure area, make the porose disc of the via hole of the porose disc to be removed of described exposure area etched, formed without porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
In conjunction with first aspect mode in the cards, in the 6th kind of mode in the cards, describedly to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole formed and comprises without porose disc via hole:
Etched by the porose disc of etch process to the via hole of described porose disc to be removed, make described porose disc region to be removed porose disc and by this porose disc to vias inside extend and adjacent metal level is etched, formed without porose disc via hole.
In conjunction with first aspect the 6th kind of mode in the cards, in the 7th kind of mode in the cards, be describedly less than height between described PCB top layer to time top layer without metal level etched in porose disc via hole along the height of described via hole axis.
In conjunction with first aspect the 7th kind of mode in the cards, the height between PCB top layer described in the 8th kind of mode in the cards to time top layer is greater than 6 mils.
Second aspect, the embodiment of the present invention additionally provides a kind of pcb board, and described PCB is made by the manufacture method of the pcb board of above-mentioned either type.
The manufacture method of the pcb board that the embodiment of the present invention provides and pcb board, after the dry film that will cover on the via hole of porose disc to be removed is removed, etched away by the porose disc of etch process by described porose disc via hole to be removed, thus formed without porose disc via hole, can find out that the present invention replaces mechanical back drill technique by etch process like this, on the one hand, the input of carrying on the back rig can be avoided, thus the processing cost of PCB can be reduced; On the other hand, when etching porose disc, the base material of hole periphery not being affected, therefore not needing reserved back drill space when designing the layout in hole, thus the layout density in hole can be improved.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation in pcb board in prior art with porose disc;
Fig. 2 is the structural representation after removing porose disc in prior art in pcb board;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 3 provides for the embodiment of the present invention one;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 4 provides for the embodiment of the present invention two;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 5 provides for the embodiment of the present invention three;
Structural representation in the Making programme of the pcb board that Fig. 6 a-6h provides for the invention process two example;
Structural representation in the Making programme of the pcb board that Fig. 7 a-7i provides for the invention process three example.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of protection of the invention.
Embodiment one:
The schematic flow sheet of the manufacture method of the pcb board that Fig. 3 provides for the embodiment of the present invention one.As shown in Figure 3, the manufacture method of this pcb board, comprising:
S10, paste dry film at the layer on surface of metal of the PCB being manufactured with via hole, described dry film covers the via hole of described porose disc to be removed;
The dry film that S12, removal cover on the via hole of described porose disc to be removed, makes the via hole of described porose disc to be removed expose;
S12, to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole.
Can find out like this, the present invention replaces mechanical back drill technique by etch process, on the one hand, can avoid the input of carrying on the back rig, thus can reduce the processing cost of PCB; On the other hand, when etching porose disc, the base material of hole periphery not being affected, therefore not needing reserved back drill space when designing the layout in hole, thus the layout density in hole can be improved.
In order to those skilled in the art understand the present invention better, below in conjunction with the accompanying drawing in the embodiment of the present invention, the processing cost that can reduce PCB, the PCB manufacture method of layout density that improves via hole are clearly and completely described.
Embodiment two:
As shown in Figure 4, specifically the comprising of described PCB manufacture method:
S20, by process for pressing, polylith lamina or double sided board are gone out line pattern to be processed and pcb board 1 hole to be drilled through laminates, form the state shown in Fig. 6 a;
Typically, the outer field plate of pcb board 1 and the plate of internal layer treat pressing plate by the bonding formation of prepreg, then will treat that pressing plate pressing forms line pattern to be processed and pcb board 1 hole to be drilled.
When not excessive metal level 2 is very thick, can be etched metal level 2 by etch process, make metal level 2 reduced thickness on pcb board 1 surface, etching difficulty can be reduced like this when the metal level 2 of subsequent etch exposure area, and the outer-layer circuit pattern precision of pcb board 1 can be made to improve further.For metal level, such as, can select layers of copper, and the layers of copper on pcb board 1 surface can be made thinning by subtracting process for copper.
S21, on the pcb board 1 after abovementioned steps, make via hole 4;
Wherein, the process making via hole 4 specifically comprises:
First, as shown in Figure 6 b, holes drilled through 3 on line pattern to be processed and pcb board 1 hole to be drilled;
Next, as fig. 6 c, by heavy process for copper (comprising electroless copper and electro-coppering) by the surface deposition metal level 5(of described through hole 3 as layers of copper), in this deposition process, the PCB of through hole 3 periphery also can deposit layer of metal on the surface, thus be formed with the via hole 4 of porose disc, comprising porose disc to be removed via hole and do not remove the via hole of porose disc.
S22, as shown in fig 6d, by filling holes with resin technique, the via hole of porose disc to be removed in pcb board 1 is filled up resin 6; Wherein, making the via hole of porose disc to be removed fill up resin 6 in this step is in order to when carrying out subsequent etch porose disc to be removed, can avoid etching the metal level 5 of via hole surface deposition, but also the corrosion of creeping from porose disc can be avoided to extend to vias inside; In addition, in via hole, fill up the spacing that resin can also reduce Kong Yukong, reduce the area of plate, improve wiring density.In order to make above-mentioned effect reach better, when carrying out filling holes with resin to the via hole of porose disc to be removed, filling holes with resin can also be carried out to the via hole not removing porose disc.Selecting for resin material, can be here epoxy resin or other not with the material of etching solution generation chemical action.
What deserves to be explained is, the via hole 4 usually arranged on pcb board 1 comprises line conduction hole, jack and louvre, is understandable that, insert hole is used to the via hole inserting electronic component, therefore can not fill in resin in insert hole.In addition, fill up in louvre resin can also avoid follow-up when soldering of electronic components the material such as scolding tin flow in louvre, thus avoid the radiating effect affecting louvre.
S23, as shown in fig 6e, at the metal level 2 surface mount dry film 7 of PCB, wherein, described dry film covers the via hole of described porose disc to be removed;
S24, the PCB being pasted with described dry film 7 carried out to exposure and obtain exposure area and unexposed area, described unexposed area comprises the via area of porose disc to be removed, removed the dry film 7 of described unexposed area by development, the via hole of porose disc to be removed in described unexposed area is exposed.
When exposure described in this step adopts egative film to expose, in egative film, the part of corresponding porose disc position to be removed is lightproof part, to ensure that the dry film below the light tight position of egative film is not exposed, removed by this part dry film by liquid medicine during development, porose disc to be removed like this can be now completely etched away when etch process owing to not having the protection of dry film; And the corresponding via hole not removing porose disc is light transmission part in egative film, to ensure that the dry film below egative film printing opacity position is exposed, solidifies, during development, this part via hole is being formed with the via hole of porose disc due to the protection of dry film.
But; this step can also make the outer-layer circuit figure on the corresponding pcb board 1 in the light transmission part of same egative film when exposing; dry film below such egative film printing opacity solidifies after exposure; during development, outer-layer circuit figure is retained due to the protection of dry film; like this after next step etch process, outer-layer circuit figure can be formed and without porose disc via hole simultaneously.
According to foregoing, employing laser scanning exposure (LaserDirectImage is not got rid of in the exposure adopted in the present embodiment, LDI), because the graphics Web publishing formed after LDI exposure is accurately meticulous, therefore the present invention can also make the surface of pcb board 1 obtains high-precision line pattern according to LDI exposure.
S25, as shown in Figure 6 f, to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole;
This step can specifically comprise:
Etched by the metal level of etch process to described unexposed area, make the porose disc in the porose disc region to be removed of described unexposed area etched, formed without porose disc via hole 4 ＇, correspondingly, the described via hole not removing porose disc is perforated tray via hole, and the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
The etch process that this step adopts instead of original mechanical back drill technique, can avoid the input of back drill equipment, thus can reduce the processing cost of PCB; And for mechanical back drill, under regular situation, the via hole of diameter 0.3mm needs reserved 0.6mm back drill space, and the present invention adopt etch process etch porose disc time the base material of via hole periphery is not affected, therefore do not need reserved back drill space when designing the layout in hole, thus the layout density in hole can be improved.
It should be noted that, mention in background technology under some application scenarios, need to remove porose disc, such as when pcb board 1 is connected with external equipment, for avoiding that external equipment contacts with the via hole of PCB, conducting and produce harmful effect, here disconnected and also want to keep certain safe distance between external equipment by the metal level 2 on the metal level in the via hole of porose disc to be removed and pcb board 1 surface, such step 25 can also comprise:
As shown in figure 6g, etched by the metal level of etch process to described unexposed area, make described porose disc region to be removed porose disc and by this porose disc to vias inside extend and adjacent metal level is etched, the hole wall that this partial metal layers exposes after removing is insulator, therefore makes axially to form certain safe distance along via hole between the metal level in via hole and external equipment.
But, effect due to via hole itself is by the electrical connection of circuit between layers, therefore too much in via etch metal level, thus cause the disconnection of circuit between layers, need the partial metal layers that etches to be less than the height between described PCB top layer to secondary top layer along the height of described via hole axis in via hole.
In conjunction with the back drill equipment in background technology content, for guaranteeing to remove porose disc completely, usually require that the laminated thickness between PCB top layer to time top layer is greater than more than the twice of back drill equipment drilling depth tolerance, and this laminated thickness is greater than 12 mils (mil), because this thickness has been greater than conventional laminated thickness, therefore higher to the designing requirement of PCB laminated construction, and increase the difficulty of impedance matching, add the design restriction of PCB.But the present invention removes porose disc by etch process, particular/special requirement is not had to the laminated thickness between PCB top layer to time top layer, laminated thickness can be made like this to meet conventional laminated thickness, the height between PCB top layer to time top layer is made to be greater than 6 mils, because this reducing the designing requirement of PCB laminated construction, and reduce the difficulty of impedance matching, thus reduce the design restriction of PCB.
S26, as shown in figure 6h, remove the dry film in described exposure area, the outer-layer circuit figure in described exposure area is exposed, then carries out welding resistance, surface-treated technique.
Technique due to the employing in this step is manufacture method ripe in prior art, therefore with reference to the method for prior art, no longer can be described in detail here herein.
Embodiment three:
As shown in Figure 5, specifically the comprising of described PCB manufacture method:
S30, by process for pressing, polylith lamina or double sided board are gone out line pattern to be processed and pcb board 1 ＇ hole to be drilled through laminates, form the state shown in Fig. 7 a;
S31, on pcb board 1 ＇ after abovementioned steps, make via hole 4 ＇ as Fig. 7 b;
S32, as shown in Figure 7 c, by filling holes with resin technique, the via hole of porose disc to be removed in pcb board 1 ＇ is filled up resin 6 ＇;
S33, as shown in figure 7d, at metal level 2 ＇ surface mount dry film 7 ＇ of PCB, wherein, described dry film 7 ＇ covers the via hole of described porose disc to be removed;
Step S30 ~ S34 can use for reference the content described by step S20 ~ S24 of embodiment one, therefore no longer carries out repeated description to step S30 ~ S34 here.
S34, the PCB being pasted with described dry film carried out to exposure and obtain exposure area and unexposed area, described exposure area comprises the via area of porose disc to be removed, is removed the dry film of described unexposed area by development, forms the state shown in Fig. 7 e;
When exposure described in this step adopts egative film to expose, in egative film, the via hole of corresponding porose disc to be removed is light transmission part, and to ensure that the dry film below egative film printing opacity position is exposed, solidifies, after development, this part via hole is covered by dry film; And lightproof part correspondence does not remove the region of porose disc and the region of outer-layer circuit figure in egative film, after exposure, development, the dry film in light tight region is removed, and the metal level of unexposed area is exposed.
S35, as depicted in fig. 7f, covering metal protective layer 8 ＇ on the layer on surface of metal of described unexposed area;
Carrying out this step is that described coat of metal 8 ＇ can adopt tin coating in order to have an impact to metal level 2 ＇ of unexposed area when subsequent etch porose disc.
S36, as shown in figure 7g, remove the dry film of described exposure area, the via hole of porose disc to be removed in described exposure area is exposed;
S37, as shown in Fig. 7 h, to be etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole;
This step can specifically comprise:
Etched by the metal level of etch process to described exposure area, make the porose disc of the via hole of the porose disc to be removed of described exposure area etched, formed without porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
The etch process that this step adopts instead of original mechanical back drill technique, can avoid the input of back drill equipment, thus can reduce the processing cost of PCB; And for mechanical back drill, under regular situation, the via hole of diameter 0.3mm needs reserved 0.6mm back drill space, and the present invention adopt etch process etch porose disc time the base material of via hole periphery is not affected, therefore do not need reserved back drill space when designing the layout in hole, thus the layout density in hole can be improved.
It should be noted that, mention in background technology under some application scenarios, need to remove porose disc, such as when pcb board 1 ＇ is connected with external equipment, for avoiding that external equipment contacts with the via hole of PCB, conducting and produce harmful effect, here disconnected and also want to keep certain safe distance between external equipment by metal level 2 ＇ on the metal level in the via hole of porose disc to be removed and pcb board 1 ＇ surface, such step 37 can also comprise:
Refer again to Fig. 7 g, etched by the metal level of etch process to described exposure area, make described porose disc region to be removed porose disc and by this porose disc to vias inside extend and adjacent metal level is etched, the hole wall that this partial metal layers exposes after removing is insulator, therefore makes axially to form certain safe distance along via hole between the metal level in via hole and external equipment.
But, effect due to via hole itself is by the electrical connection of circuit between layers, therefore too much in via etch metal level, thus cause the disconnection of circuit between layers, need the partial metal layers that etches to be less than the height between described PCB top layer to secondary top layer along the height of described via hole axis in via hole.
In conjunction with the back drill equipment in background technology content, for guaranteeing to remove porose disc completely, usually require that the laminated thickness between PCB top layer to time top layer is greater than more than the twice of back drill equipment drilling depth tolerance, and this laminated thickness is greater than 12 mils (mil), because this thickness has been greater than conventional laminated thickness, therefore higher to the designing requirement of PCB laminated construction, and increase the difficulty of impedance matching, add the design restriction of PCB.But the present invention removes porose disc by etch process, particular/special requirement is not had to the laminated thickness between PCB top layer to time top layer, laminated thickness can be made like this to meet conventional laminated thickness, the height between PCB top layer to time top layer is made to be greater than 6 mils, because this reducing the designing requirement of PCB laminated construction, and reduce the difficulty of impedance matching, thus reduce the design restriction of PCB.
S38, as shown in figure 7i, remove coat of metal 8 ＇ (as tin coating), the dry film in described unexposed area successively, the outer-layer circuit figure in described unexposed area is exposed, then carry out welding resistance, surface-treated technique.
Technique due to the employing in this step is manufacture method ripe in prior art, therefore with reference to the method for prior art, no longer can be described in detail here herein.
In sum, PCB manufacture method provided by the invention, replaces original mechanical back drill technique to remove porose disc by etch process, first can avoid the input of back drill equipment, thus the processing cost of PCB can be reduced, and when etching porose disc, the base material of hole periphery is not affected; Secondly do not need reserved back drill space when designing the layout in hole, thus the layout density in hole can be improved; Then, the designing requirement of PCB laminated construction can also be reduced, and reduce the difficulty of impedance matching, thus reduce the design restriction of PCB.
Embodiment four:
Correspondingly, the embodiment of the present invention additionally provides a kind of pcb board, this pcb board is that the manufacture method of any one PCB in the cards provided by above-described embodiment is made, because the embodiment of pcb board all illustrates in the above-described embodiments, therefore repeated description is not being carried out to pcb board here.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (9)
1. a manufacture method for pcb board, is characterized in that, comprising:
Paste dry film at the layer on surface of metal of the PCB being manufactured with via hole, described dry film covers the via hole of porose disc to be removed;
Remove the dry film covered on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed;
Etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed without porose disc via hole;
Described removal covers the dry film on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed and specifically comprises:
Carry out exposure to the PCB being pasted with described dry film and obtain exposure area and unexposed area, described exposure area comprises the via area of porose disc to be removed, is removed the dry film of described unexposed area by development;
Covering metal protective layer on the layer on surface of metal of described unexposed area;
Remove the dry film of described exposure area, the via hole of porose disc to be removed in described exposure area is exposed.
2. the manufacture method of pcb board according to claim 1, is characterized in that, the layer on surface of metal of the described PCB being manufactured with via hole pastes dry film, and described dry film also comprises before covering the via hole of described porose disc to be removed:
By filling holes with resin technique, the via hole of described porose disc to be removed is filled up resin.
3. the manufacture method of pcb board according to claim 1, is characterized in that, described removal covers the dry film on the via hole of described porose disc to be removed, the via hole of described porose disc to be removed is exposed and specifically comprises:
Exposure is carried out to the PCB being pasted with described dry film and obtains exposure area and unexposed area, described unexposed area comprises the via area of described porose disc to be removed, removed the dry film of described unexposed area by development, the via hole of porose disc to be removed in described unexposed area is exposed.
4. the manufacture method of pcb board according to claim 3, is characterized in that, is describedly etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed and comprises without porose disc via hole:
Etched by the metal level of etch process to described unexposed area, make the porose disc of the via hole of the porose disc to be removed of described unexposed area etched, formed without porose disc via hole, the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
5. the manufacture method of pcb board according to claim 1, is characterized in that, is describedly etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed and comprises without porose disc via hole:
Etched by the metal level of etch process to described exposure area, make the porose disc of the via hole of the porose disc to be removed of described exposure area etched, formed without porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
6. the manufacture method of pcb board according to claim 1, is characterized in that, is describedly etched by the porose disc of etch process to the via hole of described porose disc to be removed, this via hole is formed and comprises without porose disc via hole:
Etched by the porose disc of etch process to the via hole of described porose disc to be removed, make described porose disc region to be removed porose disc and by this porose disc to vias inside extend and adjacent metal level is etched, formed without porose disc via hole.
7. the manufacture method of pcb board according to claim 6, is characterized in that, is describedly less than height between described PCB top layer to time top layer without metal level etched in porose disc via hole along the height of described via hole axis.
8. the manufacture method of pcb board according to claim 7, is characterized in that, the height between described PCB top layer to time top layer is greater than 6 mils.
9. a pcb board, is characterized in that, described PCB is made by the manufacture method of the pcb board described in any one of claim 1-8.
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| CN201310288041.0A CN103369868B (en) | 2013-07-10 | 2013-07-10 | A kind of manufacture method of pcb board and pcb board |
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| CN201310288041.0A CN103369868B (en) | 2013-07-10 | 2013-07-10 | A kind of manufacture method of pcb board and pcb board |
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| CN103369868B true CN103369868B (en) | 2016-03-30 |
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Families Citing this family (10)
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| CN104093276B (en) * | 2014-06-13 | 2017-06-06 | 江苏博敏电子有限公司 | A kind of liquid crystal display PCB manufacture crafts |
| CN104470222A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Back drilling and diskless vie hole forming process for PCB |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104640345B (en) * | 2015-02-26 | 2018-03-06 | 华为技术有限公司 | Printed circuit board (PCB) and board, printed circuit board manufacturing method |
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| CN112770505B (en) * | 2020-11-27 | 2022-08-05 | 惠州市特创电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN113015316B (en) * | 2021-02-22 | 2022-04-29 | 江西志浩电子科技有限公司 | Preparation process of PCB (printed circuit board) with hole-free ring back drilled hole |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
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| US7875809B2 (en) * | 2007-06-21 | 2011-01-25 | Kinsus Interconnect Technology Corp. | Method of fabricating board having high density core layer and structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
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