CN103369868A - Manufacturing method of PCB (Printed Circuit Board) and PCB - Google Patents
Manufacturing method of PCB (Printed Circuit Board) and PCB Download PDFInfo
- Publication number
- CN103369868A CN103369868A CN2013102880410A CN201310288041A CN103369868A CN 103369868 A CN103369868 A CN 103369868A CN 2013102880410 A CN2013102880410 A CN 2013102880410A CN 201310288041 A CN201310288041 A CN 201310288041A CN 103369868 A CN103369868 A CN 103369868A
- Authority
- CN
- China
- Prior art keywords
- via hole
- porose disc
- pcb
- dry film
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a PCB (Printed Circuit Board) and the PCB, which relate to the technical field of PCBs and are invented to reduce the processing cost of the PCB and increase the layout density of via holes. The method comprises the following steps: firstly, sticking a dry film to the surface of a metal layer on a PCB provided with via holes, wherein the dry film is covered on the via holes from which hole plates are to be removed; secondly, removing the dry film covered on the via holes from which the hole plates are to be removed so as to expose the via holes from which the hole plates are to be removed; and lastly, etching the hole plates of the via holes from which the hole plates are to be removed via an etching process to form via holes without hole plates. The method is mainly used for forming via holes without hole plates in PCBs.
Description
Technical field
The present invention relates to the PCB technical field, relate in particular to a kind of manufacture method and pcb board of pcb board.
Background technology
PCB(Printed Circuit Board, printed circuit board (PCB)) be one of electronic unit important in the electronics industry, be not only the supporting body of electronic devices and components, and be the supplier who realizes electric interconnection between the electronic devices and components.Many advantages such as nowadays, PCB develops into double sided board, multi-layer sheet from initial lamina, and wherein multi-layer sheet is high with its packaging density, volume is little, and signaling rate is high, be convenient to connect up and being widely used.
Multi-layer sheet is to be made through lamination, the technique such as bonding by the good polylith lamina of etching or double sided board, wherein in order to realize electrical connection between layers, generally to make via hole at PCB, the process of making via hole comprises: at first, need intersection's boring of the wire of connection at each layer, then, can adopt the method for chemical deposition to plate layer of metal at hole wall, in this deposition process, also can be coated with layer of metal on the PCB top layer of hole periphery, form porose disc 8, for example shown in Figure 1.But under some application scenarios, then need to remove porose disc, what remove at present the porose disc employing is mechanical back drill (back drilling) technique, the machinery back drill is to hole to the position of needs removal porose disc and according to default drilling depth by a kind of special drill equipment that possesses the dark ability of control, thereby realizes removing the purpose of porose disc.
But there is following some weak point in this method:
The first, this back drill equipment is compared common rig and is belonged to special installation, and input cost is higher, factory building occupation of land space is larger, also will be equipped with skilled operating personnel etc. simultaneously, causes like this processing cost of PCB higher;
Second, in back drill, the base material of hole periphery also can be drilled falls (as shown in Figure 2), when just requiring the layout in hole on the Design PCB plate, this need to reserve back drill space (referring to the radial space along via hole) at the base material of hole periphery, and the back drill space can take the more area in PCB surface, thereby causes layout density to reduce.
Summary of the invention
Embodiments of the invention provide a kind of manufacture method and pcb board of pcb board, can reduce the processing cost of PCB, the layout density of raising via hole.
For achieving the above object, embodiments of the invention adopt following technical scheme:
First aspect, the embodiment of the invention provide a kind of manufacture method of pcb board, comprising:
Layer on surface of metal at the PCB that is manufactured with via hole is pasted dry film, and described dry film covers the via hole of porose disc described to be removed;
Removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed;
By etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed without the porose disc via hole.
In conjunction with first aspect mode in the cards, in the first mode in the cards, the layer on surface of metal of described PCB being manufactured with via hole is pasted dry film, and the via hole that described dry film covers porose disc described to be removed also comprises before:
By filling holes with resin technique the via hole of porose disc described to be removed is filled up resin.
In conjunction with first aspect mode in the cards, in the second mode in the cards, described removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed specifically comprise:
The PCB that is pasted with described dry film exposed obtain exposure area and unexposed area, described unexposed area comprises the via area of porose disc described to be removed, remove the dry film of described unexposed area by developing, the via hole of porose disc to be removed in the described unexposed area is exposed.
In conjunction with first aspect the second mode in the cards, in the third mode in the cards, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the metal level of described unexposed area is carried out etching, so that the porose disc of the via hole of the porose disc to be removed of described unexposed area is etched, form without the porose disc via hole, the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
In conjunction with first aspect mode in the cards, in the 4th kind of mode in the cards, described removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed specifically comprise:
The PCB that is pasted with described dry film exposed obtains exposure area and unexposed area, and described exposure area comprises the via area of porose disc to be removed, and removes the dry film of described unexposed area by developing;
Covering metal protective layer on the layer on surface of metal of described unexposed area;
Remove the dry film of described exposure area, the via hole of porose disc to be removed in the described exposure area is exposed.
In conjunction with the 4th kind of mode in the cards of first aspect, in the 5th kind of mode in the cards, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the metal level of described exposure area is carried out etching, so that the porose disc of the via hole of the porose disc to be removed of described exposure area is etched, form without the porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
In conjunction with first aspect mode in the cards, in the 6th kind of mode in the cards, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the porose disc of the via hole of porose disc described to be removed is carried out etching so that the porose disc in porose disc described to be removed zone and by this porose disc to vias inside extend and adjacent metal level etched, form without the porose disc via hole.
In conjunction with the 6th kind of mode in the cards of first aspect, in the 7th kind of mode in the cards, described without etched metal level in the porose disc via hole along the axial height of described via hole less than described PCB top layer to the height between time top layer.
In conjunction with the 7th kind of mode in the cards of first aspect, on PCB top layer described in the 8th kind of mode in the cards to the height between time top layer greater than 6 mils.
Second aspect, the embodiment of the invention also provide a kind of pcb board, and described PCB is made by the manufacture method of the pcb board of above-mentioned arbitrary mode.
The manufacture method of the pcb board that the embodiment of the invention provides and pcb board, to cover after the dry film on the via hole of removing porose disc is removed, etch away by the porose disc of etch process with porose disc via hole described to be removed, thereby form without the porose disc via hole, can find out that like this present invention replaces mechanical back drill technique by etch process, on the one hand, the input of back drill hole equipment can be avoided, thereby the processing cost of PCB can be reduced; On the other hand, when the etching porose disc, on the not impact of base material of hole periphery, therefore when the layout in design hole, do not need to reserve the back drill space, thereby can improve the layout density in hole.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation that has porose disc in the prior art in the pcb board;
Fig. 2 is the structural representation of removing in the pcb board in the prior art behind the porose disc;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 3 provides for the embodiment of the invention one;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 4 provides for the embodiment of the invention two;
The process blocks schematic diagram of the manufacture method of the pcb board that Fig. 5 provides for the embodiment of the invention three;
Structural representation in the making flow process of the pcb board that Fig. 6 a-6h provides for the invention process two examples;
Structural representation in the making flow process of the pcb board that Fig. 7 a-7i provides for the invention process three examples.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work belongs to the scope of protection of the invention.
Embodiment one:
The schematic flow sheet of the manufacture method of the pcb board that Fig. 3 provides for the embodiment of the invention one.As shown in Figure 3, the manufacture method of this pcb board comprises:
S10, paste dry film at the layer on surface of metal of the PCB that is manufactured with via hole, described dry film covers the via hole of porose disc described to be removed;
S12, remove the dry film on the via hole cover porose disc described to be removed, the via hole of porose disc described to be removed is exposed;
S12, by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed without the porose disc via hole.
Can find out that like this present invention replaces mechanical back drill technique by etch process, on the one hand, can avoid the input of back drill hole equipment, thereby can reduce the processing cost of PCB; On the other hand, when the etching porose disc, on the not impact of base material of hole periphery, therefore when the layout in design hole, do not need to reserve the back drill space, thereby can improve the layout density in hole.
For those skilled in the art understand the present invention better, below in conjunction with the accompanying drawing in the embodiment of the invention, the processing cost that can reduce PCB, the PCB manufacture method that improves the layout density of via hole are clearly and completely described.
Embodiment two:
As shown in Figure 4, specifically comprising of described PCB manufacture method:
S20, by process for pressing polylith lamina or double sided board are gone out line pattern to be processed and pcb board 1 to be holed through laminates, form the state shown in Fig. 6 a;
Usually, the outer field plate of pcb board 1 and the plate of internal layer are treated pressing plate by the bonding formation of prepreg, will treat that then the pressing plate pressing forms line pattern to be processed and pcb board 1 to be holed.
When not excessive metal level 2 is very thick, can carry out etching to metal level 2 by etch process, make metal level 2 reduced thickness on pcb board 1 surface, can when the metal level 2 of subsequent etch exposure area, reduce the etching difficulty like this, and the outer-layer circuit pattern precision of pcb board 1 is further improved.For metal level, for example can select the copper layer, and can make by subtracting process for copper the copper layer attenuate on pcb board 1 surface.
S21, the pcb board after the process abovementioned steps 1 are made via hole 4;
Wherein, the process of making via hole 4 specifically comprises:
At first, shown in Fig. 6 b, drill through hole 3 at line pattern to be processed and pcb board 1 to be holed;
Next, shown in Fig. 6 c, by surface deposition metal level 5(such as the copper layer of heavy process for copper (comprising electroless copper and electro-coppering) with described through hole 3), in this deposition process, also can deposit layer of metal on the PCB surface of through hole 3 peripheries, thereby be formed with the via hole 4 of porose disc, comprising the via hole of porose disc to be removed with do not remove the via hole of porose disc.
S22, shown in Fig. 6 d, by filling holes with resin technique the via hole of porose disc to be removed in the pcb board 1 is filled up resin 6; Wherein, making the via hole of porose disc to be removed fill up resin 6 in this step is for when carrying out subsequent etch porose disc to be removed, can avoid the metal level 5 of via hole surface deposition is carried out etching, but also can avoid extending to vias inside from the corrosion of creeping that porose disc begins; In addition, in via hole, fill up the spacing that resin can also dwindle Kong Yukong, reduce the area of plate, improve wiring density.In order to make above-mentioned effect reach better, when the via hole for the treatment of the removal porose disc carries out filling holes with resin, can also carry out filling holes with resin to the via hole of not removing porose disc.For selecting of resin material, can be here epoxy resin or other not with the material of etching solution generation chemical action.
What deserves to be explained is that the via hole 4 that usually arranges at pcb board 1 comprises line conduction hole, jack and louvre, is understandable that insert hole is to insert the via hole of electronic component, so can not fill in resin in the insert hole.In addition, fill up in the louvre resin can also avoid follow-up when soldering of electronic components the material such as scolding tin flow in the louvre, thereby avoid affecting the radiating effect of louvre.
S23, shown in Fig. 6 e, paste dry films 7 on metal level 2 surface of PCB, wherein, described dry film covers the via hole of porose disc described to be removed;
S24, the PCB that is pasted with described dry film 7 exposed obtains exposure area and unexposed area, described unexposed area comprises the via area of porose disc to be removed, remove the dry film 7 of described unexposed area by developing, the via hole of porose disc to be removed in the described unexposed area is exposed.
When the egative film exposure is adopted in exposure described in this step, the part of corresponding porose disc to be removed position is lightproof part in the egative film, be not exposed with the dry film that guarantees below, the light tight position of egative film, by liquid medicine this part dry film is removed during development, porose disc to be removed like this can not etched away when etch process fully owing to there is the protection of dry film; And the corresponding via hole of not removing porose disc is the light transmission part in the egative film, is exposed, solidifies with the dry film that guarantees below, egative film printing opacity position, and during development, this part via hole is being formed with the via hole of porose disc owing to the protection of dry film.
But; this step can also make the outer-layer circuit figure on the corresponding pcb board 1 in the light transmission part of same egative film when exposing; the dry film of egative film printing opacity below solidifies after exposure like this; outer-layer circuit figure is owing to the protection of dry film is retained during development; like this through behind next step the etch process, can form simultaneously outer-layer circuit figure and without the porose disc via hole.
According to foregoing, employing laser scanning exposure (Laser Direct Image is not got rid of in the exposure of adopting in the present embodiment, LDI), because formed figure is meticulousr accurately after the LDI exposure, if so the present invention adopt the LDI exposure can also make on the surface of pcb board 1 to obtain high-precision line pattern.
S25, shown in Fig. 6 f, by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed without the porose disc via hole;
This step can specifically comprise:
By etch process the metal level of described unexposed area is carried out etching, so that the porose disc in porose disc the to be removed zone of described unexposed area is etched, formation is without porose disc via hole 4 ＇, correspondingly, the described via hole of not removing porose disc is the perforated tray via hole, and the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
The etch process that this step adopts has replaced original mechanical back drill technique, can avoid the input of back drill equipment, thereby can reduce the processing cost of PCB; And for mechanical back drill, under the regular situation, the via hole of diameter 0.3mm need to be reserved 0.6mm back drill space, and the present invention when adopting etch process etching porose disc on the not impact of base material of via hole periphery, therefore when the layout in design hole, do not need to reserve the back drill space, thereby can improve the layout density in hole.
Need to prove, mention in the background technology under some application scenarios, need to remove porose disc, such as when pcb board 1 is connected with external equipment, external equipment contacts with the via hole of PCB in order to avoid, conducting produces harmful effect, here the metal level in the via hole that will porose disc be removed disconnect with the metal level on pcb board 1 surface 2 and also want and external equipment between the certain safe distance of maintenance, step 25 can also comprise like this:
Shown in Fig. 6 g, by etch process the metal level of described unexposed area is carried out etching, so that the porose disc in porose disc described to be removed zone and by this porose disc to vias inside extend and adjacent metal level etched, the hole wall that this part metals layer exposes after removing is insulator, therefore so that axially upward form certain safe distance along via hole between the metal level in the via hole and the external equipment.
But, because the effect of via hole itself is with the between layers electrical connection of circuit, therefore too much metal level in the via etch, thereby cause the between layers disconnection of circuit, need in the via hole etched part metals layer along the axial height of described via hole less than described PCB top layer to the height between time top layer.
In conjunction with the back drill equipment in the background technology content, for guaranteeing to remove fully porose disc, usually require the PCB top layer to more than the twice of laminated thickness greater than back drill equipment drilling depth tolerance between time top layer, and this laminated thickness is greater than 12 mils (mil), because this thickness is greater than the laminated thickness of routine, therefore higher to the designing requirement of PCB laminated construction, and strengthened the difficulty of impedance matching, increased the design restriction of PCB.But the present invention removes porose disc by etch process, the PCB top layer there is not specific (special) requirements to the laminated thickness between time top layer, can make like this laminated thickness satisfy conventional laminated thickness, so that the PCB top layer gets final product greater than 6 mils to the height between time top layer, therefore reduced the designing requirement of PCB laminated construction, and the difficulty that reduces impedance matching, thereby the design that has reduced PCB limits.
S26, shown in Fig. 6 h, remove the dry film in the described exposure area, the outer-layer circuit figure in the described exposure area is exposed, then carry out welding resistance, surface-treated technique.
Because the technique of the employing in this step is manufacture method ripe in the prior art, therefore can with reference to the method for prior art, no longer be described in detail here herein.
Embodiment three:
As shown in Figure 5, specifically comprising of described PCB manufacture method:
S30, by process for pressing polylith lamina or double sided board are gone out line pattern to be processed and pcb board 1 ＇ to be holed through laminates, form the state shown in Fig. 7 a;
S31, such as Fig. 7 b through the making of pcb board 1 ＇ after abovementioned steps via hole 4 ＇;
S32, shown in Fig. 7 c, by filling holes with resin technique the via hole of porose disc to be removed among pcb board 1 ＇ is filled up resin 6 ＇;
S33, shown in Fig. 7 d, paste dry film 7 ＇ on metal level 2 ＇ of PCB surface, wherein, described dry film 7 ＇ cover the via hole of porose disc described to be removed;
Step S30～S34 can use for reference the step S20 of embodiment one～described content of S24, so no longer step S30～S34 is carried out repeated description here.
S34, the PCB that is pasted with described dry film exposed obtains exposure area and unexposed area, and described exposure area comprises the via area of porose disc to be removed, and removes the dry film of described unexposed area by developing, and forms the state shown in Fig. 7 e;
When the egative film exposure was adopted in exposure described in this step, the via hole of corresponding porose disc to be removed was the light transmission part in the egative film, was exposed, solidified with the dry film that guarantees below, egative film printing opacity position, and after the development, this part via hole is covered by dry film; And the lightproof part correspondence is not removed the zone of porose disc and the zone of outer-layer circuit figure in the egative film, and after exposure, developing, the dry film in light tight zone is removed, and the metal level of unexposed area is exposed.
S35, shown in Fig. 7 f, covering metal protective layer 8 ＇ on the layer on surface of metal of described unexposed area;
To carry out this step and be in order can metal level 2 ＇ of unexposed area not to be exerted an influence when the subsequent etch porose disc, described coat of metal 8 ＇ can adopt tin coating.
S36, shown in Fig. 7 g, remove the dry film of described exposure area, the via hole of porose disc to be removed in the described exposure area is exposed;
S37, shown in Fig. 7 h, by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed without the porose disc via hole;
This step can specifically comprise:
By etch process the metal level of described exposure area is carried out etching, so that the porose disc of the via hole of the porose disc to be removed of described exposure area is etched, form without the porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
The etch process that this step adopts has replaced original mechanical back drill technique, can avoid the input of back drill equipment, thereby can reduce the processing cost of PCB; And for mechanical back drill, under the regular situation, the via hole of diameter 0.3mm need to be reserved 0.6mm back drill space, and the present invention when adopting etch process etching porose disc on the not impact of base material of via hole periphery, therefore when the layout in design hole, do not need to reserve the back drill space, thereby can improve the layout density in hole.
Need to prove, mention in the background technology under some application scenarios, need to remove porose disc, such as when pcb board 1 ＇ is connected with external equipment, external equipment contacts with the via hole of PCB in order to avoid, conducting produces harmful effect, here the metal level in the via hole that will porose disc be removed disconnect with metal level 2 ＇ on pcb board 1 ＇ surface and also want and external equipment between the certain safe distance of maintenance, step 37 can also comprise like this:
Refer again to Fig. 7 g, by etch process the metal level of described exposure area is carried out etching, so that the porose disc in porose disc described to be removed zone and by this porose disc to vias inside extend and adjacent metal level etched, the hole wall that this part metals layer exposes after removing is insulator, therefore so that axially upward form certain safe distance along via hole between the metal level in the via hole and the external equipment.
But, because the effect of via hole itself is with the between layers electrical connection of circuit, therefore too much metal level in the via etch, thereby cause the between layers disconnection of circuit, need in the via hole etched part metals layer along the axial height of described via hole less than described PCB top layer to the height between time top layer.
In conjunction with the back drill equipment in the background technology content, for guaranteeing to remove fully porose disc, usually require the PCB top layer to more than the twice of laminated thickness greater than back drill equipment drilling depth tolerance between time top layer, and this laminated thickness is greater than 12 mils (mil), because this thickness is greater than the laminated thickness of routine, therefore higher to the designing requirement of PCB laminated construction, and strengthened the difficulty of impedance matching, increased the design restriction of PCB.But the present invention removes porose disc by etch process, the PCB top layer there is not specific (special) requirements to the laminated thickness between time top layer, can make like this laminated thickness satisfy conventional laminated thickness, so that the PCB top layer gets final product greater than 6 mils to the height between time top layer, therefore reduced the designing requirement of PCB laminated construction, and the difficulty that reduces impedance matching, thereby the design that has reduced PCB limits.
S38, shown in Fig. 7 i, remove successively coat of metal 8 ＇ (such as tin coating), dry film in the described unexposed area, the outer-layer circuit figure in the described unexposed area is exposed, then carry out welding resistance, surface-treated technique.
Because the technique of the employing in this step is manufacture method ripe in the prior art, therefore can with reference to the method for prior art, no longer be described in detail here herein.
In sum, PCB manufacture method provided by the invention replaces original mechanical back drill technique to remove porose disc by etch process, at first can avoid the input of back drill equipment, thereby can reduce the processing cost of PCB, and the base material on the hole periphery does not affect when the etching porose disc; Secondly when the layout in design hole, do not need to reserve the back drill space, thereby can improve the layout density in hole; Then, can also reduce the designing requirement of PCB laminated construction, and the difficulty that reduces impedance matching, thereby the design that has reduced PCB limits.
Embodiment four:
Correspondingly, the embodiment of the invention also provides a kind of pcb board, this pcb board is that the manufacture method of any PCB in the cards of being provided by above-described embodiment is made, because the embodiment of pcb board is in the above-described embodiments explanation all, so pcb board be not repeated in this description here.
The above; be the specific embodiment of the present invention only, but protection scope of the present invention is not limited to this, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (10)
1. the manufacture method of a pcb board is characterized in that, comprising:
Layer on surface of metal at the PCB that is manufactured with via hole is pasted dry film, and described dry film covers the via hole of porose disc described to be removed;
Removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed;
By etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed without the porose disc via hole.
2. the manufacture method of pcb board according to claim 1 is characterized in that, the layer on surface of metal of described PCB being manufactured with via hole is pasted dry film, and the via hole that described dry film covers porose disc described to be removed also comprises before:
By filling holes with resin technique the via hole of porose disc described to be removed is filled up resin.
3. the manufacture method of pcb board according to claim 1 is characterized in that, described removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed specifically comprise:
The PCB that is pasted with described dry film exposed obtain exposure area and unexposed area, described unexposed area comprises the via area of porose disc described to be removed, remove the dry film of described unexposed area by developing, the via hole of porose disc to be removed in the described unexposed area is exposed.
4. the manufacture method of pcb board according to claim 3 is characterized in that, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the metal level of described unexposed area is carried out etching, so that the porose disc of the via hole of the porose disc to be removed of described unexposed area is etched, form without the porose disc via hole, the metal level of described exposure area forms the outer-layer circuit figure of described PCB.
5. the manufacture method of pcb board according to claim 1 is characterized in that, described removal covers the dry film on the via hole of porose disc described to be removed, and the via hole of porose disc described to be removed is exposed specifically comprise:
The PCB that is pasted with described dry film exposed obtains exposure area and unexposed area, and described exposure area comprises the via area of porose disc to be removed, and removes the dry film of described unexposed area by developing;
Covering metal protective layer on the layer on surface of metal of described unexposed area;
Remove the dry film of described exposure area, the via hole of porose disc to be removed in the described exposure area is exposed.
6. the manufacture method of pcb board according to claim 5 is characterized in that, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the metal level of described exposure area is carried out etching, so that the porose disc of the via hole of the porose disc to be removed of described exposure area is etched, form without the porose disc via hole, the metal level of described unexposed area forms the outer-layer circuit figure of described PCB.
7. the manufacture method of pcb board according to claim 1 is characterized in that, describedly by etch process the porose disc of the via hole of porose disc described to be removed is carried out etching, this via hole is formed comprise without the porose disc via hole:
By etch process the porose disc of the via hole of porose disc described to be removed is carried out etching so that the porose disc in porose disc described to be removed zone and by this porose disc to vias inside extend and adjacent metal level etched, form without the porose disc via hole.
8. the manufacture method of pcb board according to claim 7 is characterized in that, described without etched metal level in the porose disc via hole along the axial height of described via hole less than described PCB top layer to the height between time top layer.
9. the manufacture method of pcb board according to claim 8 is characterized in that, described PCB top layer to the height between time top layer greater than 6 mils.
10. a pcb board is characterized in that, described PCB is made by the manufacture method of each described pcb board of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310288041.0A CN103369868B (en) | 2013-07-10 | 2013-07-10 | A kind of manufacture method of pcb board and pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310288041.0A CN103369868B (en) | 2013-07-10 | 2013-07-10 | A kind of manufacture method of pcb board and pcb board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103369868A true CN103369868A (en) | 2013-10-23 |
| CN103369868B CN103369868B (en) | 2016-03-30 |
Family
ID=49370087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310288041.0A Active CN103369868B (en) | 2013-07-10 | 2013-07-10 | A kind of manufacture method of pcb board and pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103369868B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470222A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Back drilling and diskless vie hole forming process for PCB |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| CN104883808A (en) * | 2015-05-05 | 2015-09-02 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN104093276B (en) * | 2014-06-13 | 2017-06-06 | 江苏博敏电子有限公司 | A kind of liquid crystal display PCB manufacture crafts |
| CN107885950A (en) * | 2017-11-24 | 2018-04-06 | 郑州云海信息技术有限公司 | A kind of method that overlapping via is deleted in PCB design |
| CN109348632A (en) * | 2018-11-01 | 2019-02-15 | 郑州云海信息技术有限公司 | A kind of processing method that aperture insulation is carried out by etching mode |
| CN112165794A (en) * | 2020-09-28 | 2021-01-01 | 高德(苏州)电子有限公司 | Method for removing PTH hole ring of multilayer board by etching technology |
| CN112770505A (en) * | 2020-11-27 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN113015316A (en) * | 2021-02-22 | 2021-06-22 | 江西志浩电子科技有限公司 | Non-porous ring back-drilled PCB and preparation process thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080314622A1 (en) * | 2007-06-21 | 2008-12-25 | Chien-Wei Chang | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
-
2013
- 2013-07-10 CN CN201310288041.0A patent/CN103369868B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080314622A1 (en) * | 2007-06-21 | 2008-12-25 | Chien-Wei Chang | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof |
| CN102869205A (en) * | 2011-07-06 | 2013-01-09 | 深南电路有限公司 | Method for shaping printed circuit board (PCB) plated-through hole |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104093276B (en) * | 2014-06-13 | 2017-06-06 | 江苏博敏电子有限公司 | A kind of liquid crystal display PCB manufacture crafts |
| CN104470222A (en) * | 2014-11-28 | 2015-03-25 | 广东依顿电子科技股份有限公司 | Back drilling and diskless vie hole forming process for PCB |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104640345B (en) * | 2015-02-26 | 2018-03-06 | 华为技术有限公司 | Printed circuit board (PCB) and board, printed circuit board manufacturing method |
| CN104640345A (en) * | 2015-02-26 | 2015-05-20 | 华为技术有限公司 | Printed circuit board and manufacturing method of printed circuit board |
| CN104883808A (en) * | 2015-05-05 | 2015-09-02 | 华为技术有限公司 | Printed circuit board and manufacturing method thereof |
| CN104883808B (en) * | 2015-05-05 | 2017-12-01 | 华为技术有限公司 | A kind of manufacture method of printed circuit board (PCB) and printed circuit board (PCB) |
| CN107885950A (en) * | 2017-11-24 | 2018-04-06 | 郑州云海信息技术有限公司 | A kind of method that overlapping via is deleted in PCB design |
| CN109348632A (en) * | 2018-11-01 | 2019-02-15 | 郑州云海信息技术有限公司 | A kind of processing method that aperture insulation is carried out by etching mode |
| CN112165794A (en) * | 2020-09-28 | 2021-01-01 | 高德(苏州)电子有限公司 | Method for removing PTH hole ring of multilayer board by etching technology |
| CN112770505A (en) * | 2020-11-27 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN112770505B (en) * | 2020-11-27 | 2022-08-05 | 惠州市特创电子科技股份有限公司 | Circuit board and preparation method thereof |
| CN113015316A (en) * | 2021-02-22 | 2021-06-22 | 江西志浩电子科技有限公司 | Non-porous ring back-drilled PCB and preparation process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103369868B (en) | 2016-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103369868B (en) | A kind of manufacture method of pcb board and pcb board | |
| CN103188886B (en) | A kind of printed circuit board and preparation method thereof | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| CN101772279B (en) | Method for manufacturing PCB plate with blind holes | |
| US9706667B2 (en) | Via in a printed circuit board | |
| KR100499008B1 (en) | Two-sided PCB without via hole and the manufacturing method thereof | |
| CN105321915A (en) | Embedded board and method of manufacturing the same | |
| CN103687344A (en) | Circuit board manufacturing method | |
| CN104349587A (en) | Method for manufacturing printed circuit board and via thereof, and printed circuit board | |
| TWI665949B (en) | Flexible printed circuit board and method for making the same | |
| JP2013118370A (en) | Via hole plating method and printed circuit board manufactured using the same | |
| US20140166355A1 (en) | Method of manufacturing printed circuit board | |
| CN105555014A (en) | Printed circuit board, electronic module and method of manufacturing the same | |
| TWI678136B (en) | Circuit board and method for manufacturing the same | |
| CN103687342A (en) | Printed circuit board with break hole and production method of printed circuit board | |
| KR20160080526A (en) | Printed circuit board and method of manufacturing the same | |
| CN104640379A (en) | Printed circuit board and manufacturing method thereof | |
| CN211063845U (en) | Mechanical blind hole HDI circuit board | |
| CN105530768A (en) | Circuit board manufacturing method and circuit board | |
| CN109246935B (en) | Manufacturing method of stepped groove with non-metalized side wall | |
| CN103687279A (en) | Printed circuit board and manufacturing method for same | |
| CN104125699A (en) | Printed circuit board and manufacturing method | |
| JP2009099773A (en) | Circuit board with shield | |
| TW201811136A (en) | Printed circuit board with thick copper conducting line and method same | |
| CN115052424A (en) | Flexible circuit board with micro blind holes and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |