CN102869205A - Method for shaping printed circuit board (PCB) plated-through hole - Google Patents
Method for shaping printed circuit board (PCB) plated-through hole Download PDFInfo
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- CN102869205A CN102869205A CN2011101879120A CN201110187912A CN102869205A CN 102869205 A CN102869205 A CN 102869205A CN 2011101879120 A CN2011101879120 A CN 2011101879120A CN 201110187912 A CN201110187912 A CN 201110187912A CN 102869205 A CN102869205 A CN 102869205A
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Abstract
The invention relates to a method for shaping a printed circuit board (PCB) plated-through hole, which comprises the following steps: electroplating, wherein a base board drilled with a through hole is electroplated to obtain a plated-through hole; hole plugging, wherein, corrosion-against materials is fully filled in the plated-through hole without reserving a welding pad; picture processing, a circuit picture is processed on a bottom copper, so that the non-circuit bottom copper and the welding pad unnecessary to reserve of the plated-through hole are exposed; and etching, the non-circuit bottom copper is etched and removed by adopting an acid etching liquid, the welding pad bottom copper exposed on at least one end hole opening of the plated-through hole filled with the corrosion-against materials is also etched and removed so as to obtain the corrosion-against materials without the welding pad of at least one end hole opening of the plated-through hole. The method breaks through the limit of the traditional design and technique, hole openings at one end or even both ends of the shaped plated-through hole are free from the welding pad, the pad-free can be realized for the holes in the step; the method is applicable to process in batches and also stable in use; the obtained PCB board product can effectively improve the signal quality of a high-radio frequency product and is widely applied to communication, military affairs and other fields with the demand of a high frequency microwave signal.
Description
Technical field
The present invention relates to the pcb board preparing technical field, specifically relate to pcb board plated-through hole forming method.
Background technology
Among the existing circuit board preparation technology, the technique in two kinds of processing metal holes is arranged usually: the first is to cover hole technique, comprise " ... → plating → figure processing → acid etching → check → ... " etc. step; The second is graphic plating technique, comprise " ... → plating → figure processing → graphic plating → alkali etching → check → ... " etc. step.When hole technique is covered in employing, be to cover through hole by dry film, avoid etching liquid to enter in the plated-through hole, therefore all can leave the weld-ring that has 4.5mil at least on the plated-through hole two sides, otherwise can break by sealing of hole; And when adopting the figure galvanic process, because figure contraposition and proportional error, be difficult to realize pad circle and hole wall copper band etc. greatly, and all can leave the pad circle of 2mil on the plated-through hole two sides.The metallization pore structure that existing technological forming goes out as shown in Figure 1, among the figure, pad 4 is all left at the two ends of the plated-through hole 3 on the substrate 1.
Under normal conditions, product also needs to have pad 4 and outer-layer circuit to realize being connected, realize that outer cabling is connected with internal layer by hole copper, this needs the aperture of circuit to leave pad circle (that is: surpassing the copper facing hole encloses), guarantee that outer layer signal is connected with the reliable of internal layer by hole copper, this also is the effect of making PCB.
But residual like this pad (residual pad refers to that area is greater than the part of hole wall copper band on the pad circle) can make a big impact to some specialities signal performance, as pad shielding action meeting cause to high-frequency signal reflection problems etc.Therefore, on high-frequency microwave signal was used, indivedual via holes or device aperture need not outer the connection, require landless, to prevent pad the radio frequency signal performance are made a big impact, and avoid pad to shielding and the reflection problems of signal.Yet existing plated-through hole process technology can not be accomplished complete landless, that is: the aperture copper band is consistent with the copper facing hole.And be to realize landless, often adopt manual blade to repair removing method, its inefficiency is not suitable for batch production, and after repairing, outward appearance is also more ugly, also may cause the hole wall copper loss to hinder.
Summary of the invention
Technical problem to be solved by this invention is, a kind of pcb board plated-through hole forming method is provided, and do not have the plated-through hole of pad to mold place, aperture at least at one end.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: a kind of pcb board plated-through hole forming method comprises the steps:
Plating step is electroplated the substrate that is drilled with through hole, and copper at the bottom of the through-hole wall on substrate surface and the substrate forms one deck simultaneously obtains plated-through hole;
The consent step, the full erosion resistant of filling in the plated-through hole that need not keep pad;
The figure procedure of processing covers on the substrate except plated-through hole and need not zone the aperture of pad with dry film, reprocesses out line pattern, makes that the pad that need not keep of copper and plated-through hole exposes at the bottom of the logicalnot circuit;
Etching step adopts acidic etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
Further, between consent step and figure procedure of processing, also even step out, make the erosion resistant surfacing in aperture, plated-through hole two ends.
Further, the erosion resistant step that also fades away after the acid etching step takes off except the erosion resistant in the plated-through hole.
Further, described erosion resistant is welding resistance paint.
Further, at the bottom of the pad at aperture, described plated-through hole two ends place copper all by ablation.
On the other hand, the present invention also provides a kind of pcb board plated-through hole forming method, comprises the steps:
Electroplate, form end copper layer on the substrate top layer, obtain plated-through hole;
The figure procedure of processing covers plated-through hole and welding disking area thereof that copper copper face at the bottom of the logicalnot circuit that needs ablation and aperture need not to keep pad with dry film, reprocess out circuitous pattern;
The graphic plating step adds thick copper layer at the copper face of the circuit that exposes and forms circuit copper, and plate protective layer outside circuit copper;
The consent step, the full erosion resistant of filling in the plated-through hole that need not keep pad;
Etching step adopts alkaline etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
Further, between consent step and etching step, also even step out, make the erosion resistant surfacing in aperture, plated-through hole two ends.
Beneficial effect of the present invention is as follows: method of the present invention break traditions design and the limitation of processing technology, one end of the plated-through hole that forms out even the aperture landless at two ends, and can also be used for landless is realized in the hole in the step, be fit to batch machining and stable.The pcb board product energy Effective Raise radio frequency products signal quality of gained reduces the impact that other factors causes.The inventive method can be widely used in the pcb board that there is the high-frequency microwave signal demand in the fields such as preparation communication and military affairs.
Description of drawings
Fig. 1 is the structural representation of existing technological forming plated-through hole out.
Fig. 2 is that the pcb board plated-through hole that the inventive method makes is clogged the schematic diagram that erosion resistant and single face landless are arranged.
Fig. 3 is the schematic diagram of the pcb board plated-through hole single face landless that makes of the inventive method.
Fig. 4 is that the pcb board plated-through hole that the inventive method makes is clogged the schematic diagram that erosion resistant and two-sided landless are arranged.
Fig. 5 is the schematic diagram of the two-sided landless of pcb board plated-through hole that makes of the inventive method.
Fig. 6 is the schematic diagram of the pcb board plated-through hole single face landless that makes of the embodiment of the invention 3.
Fig. 7 is the schematic diagram of the two-sided landless of pcb board plated-through hole that makes of the embodiment of the invention 3.
Embodiment
The present invention will be described in more detail below by specific embodiment and with reference to accompanying drawing.The embodiment that it should be understood that the following stated only is for explanation rather than restriction the present invention.
The present embodiment of the present invention provides a kind of pcb board plated-through hole forming method, and the method is in conjunction with covering the moulding that hole technique realizes plated-through hole, comprising the steps:
Plating step is electroplated the substrate 1 that is drilled with through hole, and copper 2 at the bottom of the through-hole wall on substrate 1 surface and the substrate 1 forms one deck simultaneously obtains plated-through hole 3;
The consent step, the full erosion resistant 5 of filling in the plated-through hole that need not keep pad, described erosion resistant 4 is a kind of materials that mobile and viscosity are arranged, can dry or solidify and be not easy to come off, can corrode by etching resistant liquid, with the copper layer 2 that protection is covered, erosion resistant preferably adopts welding resistance paint;
The figure procedure of processing covers on the substrate 1 except plated-through hole and need not zone the aperture of pad with dry film, reprocesses out line pattern, makes that the pad that need not keep 4 of copper and plated-through hole 3 exposes at the bottom of the logicalnot circuit;
Etching step adopts acidic etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
Further, the present invention can also optionally carry out following steps:
Even step out, between consent step and figure procedure of processing, carry out, make the erosion resistant surfacing in aperture, plated-through hole two ends, be beneficial to carry out follow-up figure procedure of processing.
The erosion resistant step that fades away is carried out after the acid etching step, to take off except the erosion resistant in the plated-through hole.For some plated-through holes that plug-in unit need to be installed in the hole, need to take off except the erosion resistant in the hole, such as Fig. 3 and shown in Figure 5; And for the plated-through hole that plug-in unit need not be installed, 4 of this erosion resistants also can not fade away, and are used as consent and use, such as Fig. 2 and shown in Figure 4.
In the specific implementation, copper can be all by ablation at the bottom of the pad at aperture, described plated-through hole two ends place, as shown in Figure 5, and also can be according to copper at the bottom of the pad at one stomidium mouth place, a product needed ablation metal hole, as shown in Figure 3.
Above method is to cover the moulding that hole technique realizes plated-through hole in conjunction with existing, plating step wherein, figure procedure of processing, etching step all with have the corresponding steps of covering in the technique of hole now and do not have essential distinction, seldom give unnecessary details at this.This covers hole technique, by in the figure procedure of processing, cover on the substrate 1 except plated-through hole and need not zone the aperture of pad with dry film, reprocess out line pattern, make that the pad that need not keep 4 of copper and plated-through hole 3 exposes at the bottom of the logicalnot circuit, thereby in follow-up etching step, the copper in landless zone, aperture is etched away, guarantee that hole wall copper band and pad circle etc. are large, overcome have now cover that plated-through hole two sides in the technique of hole can leave all that the weld-ring that has 4.5mil at least causes affect radiofrequency signal performance, pad to problems such as the shielding of signal and reflections.
In the present embodiment, the present invention also provides a kind of pcb board plated-through hole forming method, and the method is to realize the moulding of plated-through hole in conjunction with graphic plating technique, comprises the steps:
Electroplate, form end copper layer 2 on substrate 1 top layer, obtain plated-through hole 3;
The figure procedure of processing covers through hole and welding disking area thereof that copper copper face at the bottom of the logicalnot circuit that needs ablation and aperture need not to keep pad with dry film, reprocess out circuitous pattern;
The graphic plating step adds thick copper layer at the copper face of the circuit that exposes and forms circuit copper, and plate protective layer outside circuit copper;
The consent step, the full erosion resistant of filling in the plated-through hole that need not keep pad;
Etching step adopts alkaline etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
Further, the present invention can also optionally carry out following steps:
Even step out, between consent step and etching step, carry out, make the erosion resistant surfacing in aperture, plated-through hole two ends.
The erosion resistant step that fades away is carried out after etching step, to take off except the erosion resistant in the plated-through hole.For some plated-through holes that plug-in unit need to be installed in the hole, need to take off except the erosion resistant in the hole, and for the plated-through hole that plug-in unit need not be installed, this erosion resistant then also can not fade away, be used as consent and use.
Similarly, in the present embodiment, can the pad at the described plated-through hole of an ablation one stomidium mouth place at the bottom of copper, but also copper at the bottom of the pad at two ends, ablation metal hole, respectively such as Fig. 3 and shown in Figure 5.
This figure galvanic process; by in the figure procedure of processing; cover through hole and welding disking area thereof that copper copper face at the bottom of the logicalnot circuit that needs ablation and aperture need not to keep pad with dry film; reprocess out circuitous pattern; copper face at the circuit that exposes adds thick copper layer formation circuit copper; and outside circuit copper, plate protective layer; then by follow-up etching step the copper that the aperture need not welding disking area is etched away; guarantee that hole wall copper band and pad circle etc. are large; overcome in the existing figure galvanic process because figure contraposition and proportional error; be difficult to realize pad circle and hole wall copper band etc. greatly, and can leave all on the plated-through hole two sides that the pad circle of 2mil causes affect the radiofrequency signal performance; pad is to problems such as the shielding of signal and reflections.
Among above two embodiment, its through hole all is the situations that are through to the complete through hole of another side from a side of pcb board.And in the present embodiment, then be to be provided with groove at pcb board, the bottom land of groove is provided with through hole and goes forward side by side the row metal processing and form plated-through hole, and equally also can adopt the technical scheme of above two embodiment for this plated-through hole that is positioned at the groove bottom land and obtain plated-through hole in the aperture, one or both ends of plated-through hole landless, its structural representation is respectively such as Figure 6 and Figure 7, wherein Fig. 6 is an end landless, and Fig. 7 is the two ends landless.
The present invention is not by needing the full resist ink of plated-through hole filling of pad at least one end, then do not cover the zone of described plated-through hole and aperture need landless by the dry film in the figure procedure of processing of covering hole technique, or it is regional to cover the etched copper face of needs and this plated-through hole and aperture need landless by the dry film in the figure procedure of processing of figure galvanic process, realization need not the aperture purpose of the copper removal of pad in follow-up etching step, the method break traditions design and the limitation of processing technology, one end of the plated-through hole that forms out even the aperture landless at two ends, and further can also be used for landless is realized in the hole in the step, be fit to batch machining and stable.The pcb board product energy Effective Raise radio frequency products signal quality of gained reduces the impact that other factors causes.The inventive method can be widely used in preparation has the high-frequency microwave signal demand such as fields such as communications pcb board.
Claims (10)
1. a pcb board plated-through hole forming method is characterized in that, comprises the steps:
Plating step is electroplated the substrate that is drilled with through hole, and copper at the bottom of the through-hole wall on substrate surface and the substrate forms one deck simultaneously obtains plated-through hole;
The consent step, the full erosion resistant of filling in the plated-through hole that need not keep pad;
The figure procedure of processing covers on the substrate except plated-through hole and need not zone the aperture of pad with dry film, reprocesses out line pattern, makes that the pad that need not keep of copper and plated-through hole exposes at the bottom of the logicalnot circuit;
Etching step adopts acidic etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
2. pcb board plated-through hole forming method as claimed in claim 1 is characterized in that, also evens step out between consent step and figure procedure of processing, makes the erosion resistant surfacing in aperture, plated-through hole two ends.
3. pcb board plated-through hole forming method as claimed in claim 1 is characterized in that, the erosion resistant step that also fades away after the acid etching step takes off except the erosion resistant in the plated-through hole.
4. pcb board plated-through hole forming method as claimed in claim 1 is characterized in that, described erosion resistant is welding resistance paint.
5. pcb board plated-through hole forming method as claimed in claim 1 is characterized in that, copper is all by ablation at the bottom of the pad at place, aperture, described plated-through hole two ends.
6. a pcb board plated-through hole forming method is characterized in that, comprises the steps:
Electroplate, form end copper layer on the substrate top layer, obtain plated-through hole;
The figure procedure of processing covers through hole and welding disking area thereof that copper copper face at the bottom of the logicalnot circuit that needs ablation and aperture need not to keep pad with dry film, reprocess out circuitous pattern;
The graphic plating step adds thick copper layer at the copper face of the circuit that exposes and forms circuit copper, and plate protective layer outside circuit copper;
The consent step, the full erosion resistant of filling in the plated-through hole that need not keep pad;
Etching step adopts alkaline etching liquid to carry out etching, copper at the bottom of the ablation logicalnot circuit, and copper and obtained plated-through hole at least one stomidium mouth landless of plated-through hole also by ablation at the bottom of filling had the pad that at least one stomidium mouth of plated-through hole place of erosion resistant exposes.
7. pcb board plated-through hole forming method as claimed in claim 6 is characterized in that, also evens step between consent step and etching step out, makes the erosion resistant surfacing in aperture, plated-through hole two ends.
8. pcb board plated-through hole forming method as claimed in claim 6 is characterized in that, the erosion resistant step that also fades away after the alkali etching step takes off except the erosion resistant in the plated-through hole.
9. pcb board plated-through hole forming method as claimed in claim 6 is characterized in that, described erosion resistant is welding resistance paint.
10. pcb board plated-through hole forming method as claimed in claim 6 is characterized in that, copper is all by ablation at the bottom of the pad at place, aperture, described plated-through hole two ends.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110187912.0A CN102869205B (en) | 2011-07-06 | 2011-07-06 | Pcb board plated through-hole forming method |
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| CN201110187912.0A CN102869205B (en) | 2011-07-06 | 2011-07-06 | Pcb board plated through-hole forming method |
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| CN102869205A true CN102869205A (en) | 2013-01-09 |
| CN102869205B CN102869205B (en) | 2016-06-15 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103369868A (en) * | 2013-07-10 | 2013-10-23 | 华为技术有限公司 | Manufacturing method of PCB (Printed Circuit Board) and PCB |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104640380A (en) * | 2013-11-13 | 2015-05-20 | 北大方正集团有限公司 | Non-plating through hole with hole ring making method and printed circuit board manufacturing method |
| CN104754885A (en) * | 2014-05-06 | 2015-07-01 | 东莞生益电子有限公司 | Manufacturing method of circuit board |
| CN104883822A (en) * | 2015-06-12 | 2015-09-02 | 西安大为印制电路板厂 | Method for producing high-intensity double-face and multilayer printed circuit board |
| CN103957668B (en) * | 2014-05-06 | 2016-10-05 | 东莞生益电子有限公司 | The manufacture method of circuit board |
| CN107681037A (en) * | 2017-09-14 | 2018-02-09 | 苏州晶台光电有限公司 | A kind of method for packing of the close display LED light source component of achievable superelevation |
| CN109843000A (en) * | 2019-03-26 | 2019-06-04 | 新华三技术有限公司 | The preparation method and pcb board of pcb board |
| CN110265305A (en) * | 2019-05-17 | 2019-09-20 | 珠海市万州光电科技有限公司 | A kind of infrared bracket of patch type and its production technology, infrared receiving terminal |
| CN112165794A (en) * | 2020-09-28 | 2021-01-01 | 高德(苏州)电子有限公司 | Method for removing PTH hole ring of multilayer board by etching technology |
| CN114071883A (en) * | 2021-11-09 | 2022-02-18 | 深圳市百柔新材料技术有限公司 | Wet film process for etching large hole cover of PCB (printed circuit board) and PCB processing method |
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| CN103369868A (en) * | 2013-07-10 | 2013-10-23 | 华为技术有限公司 | Manufacturing method of PCB (Printed Circuit Board) and PCB |
| CN103369868B (en) * | 2013-07-10 | 2016-03-30 | 华为技术有限公司 | A kind of manufacture method of pcb board and pcb board |
| CN104640380A (en) * | 2013-11-13 | 2015-05-20 | 北大方正集团有限公司 | Non-plating through hole with hole ring making method and printed circuit board manufacturing method |
| CN104640380B (en) * | 2013-11-13 | 2018-07-24 | 北大方正集团有限公司 | A kind of non-heavy copper hole with orifice ring and print circuit plates making method |
| CN104754885A (en) * | 2014-05-06 | 2015-07-01 | 东莞生益电子有限公司 | Manufacturing method of circuit board |
| CN103957668B (en) * | 2014-05-06 | 2016-10-05 | 东莞生益电子有限公司 | The manufacture method of circuit board |
| CN104754885B (en) * | 2014-05-06 | 2017-10-31 | 生益电子股份有限公司 | The manufacture method of circuit board |
| CN104519669A (en) * | 2014-12-18 | 2015-04-15 | 深圳市五株科技股份有限公司 | Method for replacing backdrill copper removal process |
| CN104883822B (en) * | 2015-06-12 | 2017-12-26 | 西安大为印制电路板厂 | It is a kind of to produce that high density is two-sided and the method for multilayer printed circuit board |
| CN104883822A (en) * | 2015-06-12 | 2015-09-02 | 西安大为印制电路板厂 | Method for producing high-intensity double-face and multilayer printed circuit board |
| CN107681037A (en) * | 2017-09-14 | 2018-02-09 | 苏州晶台光电有限公司 | A kind of method for packing of the close display LED light source component of achievable superelevation |
| CN109843000A (en) * | 2019-03-26 | 2019-06-04 | 新华三技术有限公司 | The preparation method and pcb board of pcb board |
| CN110265305A (en) * | 2019-05-17 | 2019-09-20 | 珠海市万州光电科技有限公司 | A kind of infrared bracket of patch type and its production technology, infrared receiving terminal |
| CN110265305B (en) * | 2019-05-17 | 2024-04-12 | 珠海市万州光电科技有限公司 | Patch type infrared bracket, production process thereof and infrared receiving head |
| CN112165794A (en) * | 2020-09-28 | 2021-01-01 | 高德(苏州)电子有限公司 | Method for removing PTH hole ring of multilayer board by etching technology |
| CN114071883A (en) * | 2021-11-09 | 2022-02-18 | 深圳市百柔新材料技术有限公司 | Wet film process for etching large hole cover of PCB (printed circuit board) and PCB processing method |
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| CN102869205B (en) | 2016-06-15 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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