CN102413629A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN102413629A CN102413629A CN2011102120023A CN201110212002A CN102413629A CN 102413629 A CN102413629 A CN 102413629A CN 2011102120023 A CN2011102120023 A CN 2011102120023A CN 201110212002 A CN201110212002 A CN 201110212002A CN 102413629 A CN102413629 A CN 102413629A
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- dielectric substrate
- transmission line
- printed circuit
- circuit board
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Abstract
The invention discloses a printed circuit board and a manufacturing method thereof. The printed circuit board comprises a medium substrate and a transmission line, wherein the medium substrate is made of a prepreg with thickness larger than a set value, the transmission line is formed on the prepreg, a windowed solder mask is formed on the medium substrate at the position of the transmission line. By utilizing the technical scheme, the signal transmission loss can be reduced, the board cost can be reduced, the manufacturing process can be simplified and the production cost is lowered further.
Description
Technical field
The present invention relates to field of circuit boards, particularly a kind of printed circuit board and manufacturing approach thereof.
Background technology
Along with the high speed development of modern communication technology, the message transmission rate between plate is increasingly high, has reached the 10G bits per second, and high speed transmission of signals is also increasingly high to the requirement of signal quality.
In the modern communication circuit design, (Printed Cricuit Board, when PCB) going up transmission, the most frequently used structure of transmission line is a microstrip line construction to signal at printed circuit board.The width of signal transmssion line, thickness with and with the distance of ground plane, the dielectric constant of medium has determined the characteristic impedance of microstrip line jointly.The transmission line structure that the most often uses has 4 kinds: surperficial microstrip line, embedded microstrip line, strip line, biobelt line.Adopt surperficial microstrip line, the cabling of signal from the output to the input is on the top layer of PCB, and PCB is last need not to beat via hole, only needs a complete effective reference horizontal plane of manufacturing.And strip line must have 2 complete reference horizontal plane of manufacturing, and via hole has also been introduced the impedance discontinuity point simultaneously.
The design of existing P CB has:
1, adopts conventional PCB lamination and technique processing method;
2,, adopt high-performance sheet material to come transmit high-speed signals in order to reduce signal transmission attenuation.But, since the material behavior of high-performance sheet material with and the restriction of cost, make and generally adopt the mixed pressure technology now, promptly layer uses a high-performance sheet material at the high-speed transmission line place, other layer still service rating is the material of FR-4.
Adopt conventional PCB lamination and technique processing method, the green oil coat can bring certain loss for the signal transmission, and along with the raising of signal transmission rate, skin effect strengthens simultaneously, and the loss of signal increases; Use high-performance sheet material; Employing mixed pressure technology; When the lamination pressing, can have grade is the material of FR-4 and the surface smoothness problem between the high-performance sheet material; Owing to the dissymmetrical structure of interlayer, can there be the angularity problem of PCB pressing, these problems are all had higher requirement to the technology manufacturing process of PCB.
Summary of the invention
The embodiment of the invention provides a kind of printed circuit board, in order to reduce signal transmission attenuation, reduces board cost and simplifies manufacture craft.
A kind of printed circuit board that the embodiment of the invention provides comprises:
Dielectric substrate adopts the prepreg of thickness greater than set point;
Transmission line is formed on the said dielectric substrate;
Solder mask being windowed in said transmission line position is formed on the said dielectric substrate.
The manufacturing approach of a kind of printed circuit board that the embodiment of the invention provides comprises:
One dielectric substrate is provided, and wherein, said dielectric substrate adopts the prepreg of thickness greater than set point;
On said dielectric substrate, lay transmission line;
On said dielectric substrate, apply solder mask, said solder mask is windowed in said transmission line position.
The embodiment of the invention provides a kind of printed circuit board, comprising: dielectric substrate, adopt the prepreg of thickness greater than set point; Transmission line is formed on the said dielectric substrate; Solder mask being windowed in said transmission line position is formed on the said dielectric substrate.Use this programme, can reduce signal transmission attenuation, reduce board cost, simplify manufacture craft, further reduce production costs.
Description of drawings
Fig. 1 is the structural representation of the printed circuit board of the embodiment of the invention;
Fig. 2 is the schematic flow sheet of a specific embodiment of the manufacturing approach of printed circuit board of the present invention;
Fig. 3 is the schematic flow sheet of another specific embodiment of the manufacturing approach of printed circuit board of the present invention.
Description of reference numerals:
Among Fig. 1, the 11-dielectric substrate; The 12-transmission line; The solder mask that 13-is windowed in said transmission line 12 positions.
Embodiment
In order to reduce signal transmission attenuation, reduce production costs, the printed circuit board that the embodiment of the invention provides comprises: dielectric substrate, adopt the prepreg of thickness greater than set point; Transmission line is formed on the said dielectric substrate; Solder mask being windowed in said transmission line position is formed on the said dielectric substrate.
Fig. 1 is the structural representation of the printed circuit board of the embodiment of the invention.As shown in Figure 1, the printed circuit board of the embodiment of the invention comprises:
Said dielectric substrate 11, adopting by grade is the prepreg of the thickness processed of the material of FR-4 greater than 12 mils.Like this, the insertion loss when both having lowered the signal transmission helps the application in low-cost occasion again.
Said transmission line 12 adopts the difference microstrip line construction; Said transmission line 12 comprises: copper foil layer is formed on the said dielectric substrate 11; Nickel gold process layer is formed on the said copper foil layer.Therefore, can reduce under the high frequency situations skin effect to a certain extent to the influence of signal.
Fig. 2 is the schematic flow sheet of a specific embodiment of the manufacturing approach of printed circuit board of the present invention.
Referring to shown in Figure 2, the manufacturing process of the printed circuit board that the present invention implements is following:
Step 201: a dielectric substrate is provided, and wherein, said dielectric substrate adopts the prepreg of thickness greater than set point.
Here, provide one to be the prepreg of thickness more than 12 mils that the material of FR-4 is processed by grade.When adopting high-performance sheet material as dielectric substrate, will be the insertion loss during as dielectric substrate of the material of FR-4 much smaller than adopting grade though insert loss, high-performance sheet material costs an arm and a leg, and has limited its application in low-cost occasion.Employing is that thickness that the material of FR-4 is processed is the prepreg of 12 mils during as dielectric substrate by grade, is that thickness that the material of FR-4 is processed is the prepreg of 4 mils during as dielectric substrate than adopting by grade, inserts loss and has reduced about 3.8dB/m.Therefore, dielectric substrate, adopting by grade is the prepreg of thickness more than 12 mils that the material of FR-4 is processed, the insertion loss when both having lowered the signal transmission helps the application in low-cost occasion again.
Step 202: on said dielectric substrate, lay transmission line.
Here, said transmission line adopts the difference microstrip line construction.On said dielectric substrate, lay copper foil layer; On copper foil layer, form nickel gold process layer.Printed circuit board generally adopts Copper Foil as conductor material, and the conductivity of Copper Foil is 5.8 * 10
7S/m, relative permeability are 1, and the skin depth at 5GHz (10Gbps) frequency place is 0.93um; The conductivity of gold is 6.0 * 10
7S/m, relative permeability are 1, the skin depth 1.08um at 5GHz (10Gbps) frequency place.It is thus clear that said transmission line surface treatment process adopts the nickel gold process, can reduce under the high frequency situations skin effect to a certain extent to the influence of signal.
Step 203: on said dielectric substrate, apply solder mask, said solder mask is windowed in said transmission line position.
In the course of processing of printed circuit board, on transmission line, apply solder mask and prevent that copper conductor is oxidized, resistance solder paste ink material also is a kind of medium, covers above the transmission line and will inevitably produce certain influence to the transmission characteristic of transmission line.Printed circuit board provided by the invention adopts the nickel gold process to do surface treatment on copper conductor in manufacturing process, prevents that said copper conductor is oxidized.Therefore said solder mask is windowed in said transmission line position, avoided the adverse effect of said solder mask said transmission line characteristic.
Fig. 3 is the schematic flow sheet of another specific embodiment of the manufacturing approach of printed circuit board of the present invention.
Step 301: a dielectric substrate is provided, and wherein, said dielectric substrate adopts the prepreg of thickness greater than 12 mils.
Here, it is the prepreg of thickness more than 12 mils that the material of FR-4 is processed that dielectric substrate adopts by grade, and the insertion loss when both having lowered the signal transmission helps the application in low-cost occasion again.
Step 302: on said dielectric substrate, lay transmission line.
Step 303: adopt the nickel gold process to do surface treatment said transmission line.
Here, the transmission line surface treatment process adopts the nickel gold process, both can reduce to a certain extent that skin effect can prevent again that to the influence of signal copper conductor is oxidized under the high frequency situations.
Step 304: on said dielectric substrate, apply solder mask.
Step 305: said solder mask is windowed in said transmission line position.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. a printing board PCB is characterized in that, comprising:
Dielectric substrate adopts the prepreg of thickness greater than set point;
Transmission line is formed on the said dielectric substrate;
Solder mask being windowed in said transmission line position is formed on the said dielectric substrate.
2. PCB as claimed in claim 1 is characterized in that, it is the material of FR-4 that said dielectric substrate adopts grade.
3. PCB as claimed in claim 1 is characterized in that, said set point is 12 mils.
4. PCB as claimed in claim 1 is characterized in that, said transmission line adopts the difference microstrip line construction.
5. like claim 1 or 4 described PCB, it is characterized in that said transmission line comprises:
Copper foil layer is formed on the said dielectric substrate;
Nickel gold process layer is formed on the said copper foil layer.
6. the manufacturing approach of a printing board PCB is characterized in that, this method comprises:
One dielectric substrate is provided, and wherein, said dielectric substrate adopts the prepreg of thickness greater than set point;
On said dielectric substrate, lay transmission line;
On said dielectric substrate, apply solder mask, said solder mask is windowed in said transmission line position.
7. method as claimed in claim 6 is characterized in that, it is the material of FR-4 that said dielectric substrate adopts grade.
8. method as claimed in claim 6 is characterized in that, said set point is 12 mils.
9. method as claimed in claim 6 is characterized in that, on said dielectric substrate, lays transmission line and comprises:
On said dielectric substrate, lay the transmission line that adopts the difference microstrip line construction.
10. like claim 6 or 9 described methods, it is characterized in that, on said dielectric substrate, lay transmission line and comprise:
On said dielectric substrate, lay copper foil layer;
On copper foil layer, form nickel gold process layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102120023A CN102413629A (en) | 2011-07-27 | 2011-07-27 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102120023A CN102413629A (en) | 2011-07-27 | 2011-07-27 | Printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102413629A true CN102413629A (en) | 2012-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102120023A Pending CN102413629A (en) | 2011-07-27 | 2011-07-27 | Printed circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN102413629A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103661171A (en) * | 2013-12-23 | 2014-03-26 | 重庆集诚汽车电子有限责任公司 | High-power routing structure based on PCB copper foil |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN107318220A (en) * | 2017-08-21 | 2017-11-03 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107318219A (en) * | 2017-08-21 | 2017-11-03 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
| CN107404803A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
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| CN1500232A (en) * | 2001-03-29 | 2004-05-26 | 日立化成工业株式会社 | Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it |
| CN1604312A (en) * | 2003-09-30 | 2005-04-06 | Tdk株式会社 | Flip chip mounting circuit board, its manufacturing method and integrated circuit device |
| CN101014225A (en) * | 2006-01-30 | 2007-08-08 | 富士通株式会社 | Multilayer printed circuit board and manufacturing method thereof |
| JP2008004809A (en) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | Mounting substrate |
| CN101916753A (en) * | 2010-08-04 | 2010-12-15 | 联发软体设计(深圳)有限公司 | Printed circuit board used for multi-column quadrature flat pin-free package chip |
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2011
- 2011-07-27 CN CN2011102120023A patent/CN102413629A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1500232A (en) * | 2001-03-29 | 2004-05-26 | 日立化成工业株式会社 | Method for mfg. printed wiring board and photosenstive resin compsn. to be used for it |
| CN1604312A (en) * | 2003-09-30 | 2005-04-06 | Tdk株式会社 | Flip chip mounting circuit board, its manufacturing method and integrated circuit device |
| CN101014225A (en) * | 2006-01-30 | 2007-08-08 | 富士通株式会社 | Multilayer printed circuit board and manufacturing method thereof |
| JP2008004809A (en) * | 2006-06-23 | 2008-01-10 | Mitsubishi Electric Corp | Mounting substrate |
| CN101916753A (en) * | 2010-08-04 | 2010-12-15 | 联发软体设计(深圳)有限公司 | Printed circuit board used for multi-column quadrature flat pin-free package chip |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103661171A (en) * | 2013-12-23 | 2014-03-26 | 重庆集诚汽车电子有限责任公司 | High-power routing structure based on PCB copper foil |
| CN103661171B (en) * | 2013-12-23 | 2016-04-13 | 重庆集诚汽车电子有限责任公司 | The high-power Wiring structure of Based PC B Copper Foil |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN107318220A (en) * | 2017-08-21 | 2017-11-03 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107318219A (en) * | 2017-08-21 | 2017-11-03 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107404802A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board, the preparation method of printed circuit board and electronic equipment |
| CN107404803A (en) * | 2017-08-21 | 2017-11-28 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107404803B (en) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | Printed circuit board and electronic equipment |
| CN107318220B (en) * | 2017-08-21 | 2019-12-03 | Oppo广东移动通信有限公司 | Printed circuit board and electronic equipment |
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Application publication date: 20120411 |