CN107318220B - Printed circuit board and electronic equipment - Google Patents
Printed circuit board and electronic equipment Download PDFInfo
- Publication number
- CN107318220B CN107318220B CN201710722837.0A CN201710722837A CN107318220B CN 107318220 B CN107318220 B CN 107318220B CN 201710722837 A CN201710722837 A CN 201710722837A CN 107318220 B CN107318220 B CN 107318220B
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- Prior art keywords
- layer
- printed circuit
- circuit board
- signal wire
- present
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of printed circuit board and electronic equipments, and wherein printed circuit board includes signal wire and first medium layer, and first medium layer is provided with boss, and boss protrudes from first medium layer surface, and signal wire is set on boss.The present invention can promote impedance consistency.
Description
Technical field
The present invention relates to printed circuit board technology fields, and in particular to a kind of printed circuit board and electronic equipment.
Background technique
The production method of the route of existing printed circuit board is realized generally by exposing, etching, and when due to etching and is lost
Carve the exposure and time of contact difference of liquid medicine, therefore the trapezoidal structure in cross section of the route etched, the upper surface of route
Width is less than the lower surface width of route, and the impedance of route is big, so that line impedance is not easy to manage.
Summary of the invention
The embodiment of the present invention provides a kind of printed circuit board and electronic equipment, can promote impedance consistency.
In a first aspect, the embodiment of the present invention provides printed circuit board, including signal wire and first medium layer, described first is situated between
Matter layer is provided with boss, and the boss protrudes from the first medium layer surface, and the signal wire is set on the boss.
Second aspect, the embodiment of the invention provides a kind of electronic equipment, the electronic equipment includes that shell and setting exist
The intracorporal printed circuit board of shell, the printed circuit board are printed circuit board as described above.
Printed circuit board provided in an embodiment of the present invention, signal wire be set on boss can increase signal wire and with its phase
The spacing of adjacent reference layer can reduce the impedance of signal wire, promote impedance consistency.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural schematic diagram of electronic equipment provided in an embodiment of the present invention.
Fig. 2 is the positive structure schematic of electronic equipment provided in an embodiment of the present invention.
Fig. 3 is the fractionation schematic diagram of electronic equipment provided in an embodiment of the present invention.
Fig. 4 is the structural schematic diagram of shell provided in an embodiment of the present invention.
Fig. 5 is another structural schematic diagram of shell of the embodiment of the present invention.
Fig. 6 is another structural schematic diagram of electronic equipment provided in an embodiment of the present invention.
Fig. 7 is another positive structure schematic of electronic equipment provided in an embodiment of the present invention.
Fig. 8 is the sectional view of printed circuit board provided in an embodiment of the present invention.
Fig. 9 is the sectional view of signal wire provided in an embodiment of the present invention.
Figure 10 is the schematic diagram that mold provided in an embodiment of the present invention and first medium layer cooperate.
Figure 11 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 12 is the structural schematic diagram of first medium layer provided in an embodiment of the present invention.
Figure 13 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 14 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 15 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 16 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 17 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 18 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 19 is the sectional view of another printed circuit board provided in an embodiment of the present invention.
Figure 20 is the sectional view of another printed circuit board provided in an embodiment of the present invention.
Figure 21 is the sectional view of another printed circuit board provided in an embodiment of the present invention.
Figure 22 is the sectional view of another printed circuit board provided in an embodiment of the present invention.
Figure 23 is the structural schematic diagram that pad provided in an embodiment of the present invention and signal wire cooperate.
Figure 24 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 25 is another structural schematic diagram that pad provided in an embodiment of the present invention and signal wire cooperate.
Figure 26 is another sectional view of printed circuit board provided in an embodiment of the present invention.
Figure 27 is the flow diagram of the production method of printed circuit board provided in an embodiment of the present invention.
Figure 28 is another flow diagram of the production method of printed circuit board provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy
Fixed orientation construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.In
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower"
It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it
Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above "
Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of
First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
The embodiment of the invention provides a kind of printed circuit board, method for manufacturing printed circuit board and electronic equipments.Below will
It is described in detail respectively.
1 to Fig. 3 is please referred to, Fig. 1 is the structural schematic diagram of electronic equipment provided in an embodiment of the present invention, and Fig. 2 is the present invention
The front schematic view for the electronic equipment that embodiment provides, Fig. 3 are the fractionation schematic diagram of electronic equipment provided in an embodiment of the present invention.
The electronic equipment 1 includes shell 10, printed circuit board 14, display screen 15, battery 16.
Wherein, the battery 16 installation in the housing 10, is electrically connected with the printed circuit board 14, with to electronic equipment 1
Power supply is provided.
Wherein, in the housing 10, which can be the master of electronic equipment 1 for the printed circuit board 14 installation
Plate can integrate antenna, motor, microphone, camera, light sensor, receiver and processing on printed circuit board 14
The functional units such as device.
Wherein, which installs in the housing 10, meanwhile, which is electrically connected on printed circuit board 14,
To form the display surface of electronic equipment 1.
Referring to Figure 4 together, Fig. 4 is the structural schematic diagram of shell provided in an embodiment of the present invention.The shell 10 can wrap
Cover board 11, center 12 and rear cover 13 are included, cover board 11, center 12 and the intercombination of rear cover 13 form the shell 10, the shell 10 tool
There is the confined space formed by cover board 11, center 12 and rear cover 13, to accommodate printed circuit board 14, display screen 15, battery 16
Equal devices.In some embodiments, the lid of cover board 11 is set on center 12, and the lid of rear cover 13 is set on center 12, cover board 11 and rear cover
13 are located at the opposite face of center 12, and cover board 11 and rear cover 13 are oppositely arranged, and the confined space of shell 10 is located at cover board 11 and rear cover
Between 13.
It should be noted that the structure of shell of the embodiment of the present invention is not limited to this, referring to Fig. 5, Fig. 5 is that the present invention is real
Apply another structural schematic diagram of a shell.The difference of the Fig. 5 and Fig. 4 is: rear cover and center are integrally formed to form a center 12
Structure.Shell 10 shown in fig. 5 includes cover board 11 and center 12, and cover board 11 and center 12 are fixed to each other to form a confined space,
For storing the devices such as printed circuit board 14, display screen 15, battery 16.
Wherein, which is installed on display screen 15, to cover display screen 15.Cover board 11 can be transparent glass cover
Plate.In some embodiments, cover board 11 can be the glass cover-plate made of the materials such as sapphire.The cover board 11 includes
Display area 111 and non-display area 112.The display area 111 can be used to show the picture of electronic equipment 1 or for user
Carry out touching manipulation etc..The top area of the non-display area 112 opens up the aperture for sound and light conduction, this is non-display
The functional units such as fingerprint mould group, touch controlled key can be set on 112 bottom of region.
It should be noted that the structure of the display screen is not limited to this, referring to Figure 6 together and Fig. 7, Fig. 6 are the present invention
Embodiment provide electronic equipment another structural schematic diagram, Fig. 7 be electronic equipment provided in an embodiment of the present invention it is another just
Face structural schematic diagram.The electronic equipment 2 includes shell 20, printed circuit board 24, display screen 25.The display screen 25 includes display
Region and non-display area.The non-display area is formed directly on display screen 25, such as in the non-display area of display screen 25
It is arranged to transparent configuration, so that optical signal passes through, or directly opens up in the non-display area of display screen 25 for light conduction
Front camera, photoelectric sensor etc. can be set to non-display area position by aperture, so that front camera is taken pictures, light
Electric inductor detection.
Wherein the shell 20 includes cover board 21, center 22 and rear cover 23.It should be noted that cover board 21, center 22 and after
Mutual cooperation relationship between lid 23 can be refering to cover board 11, center 12 and rear cover 13, and details are not described herein.Wherein, cover board 21
Including display area 211 and non-display area 212, the non-display area 212 is corresponding with the non-display area of display screen 25, should
Display area 211 is corresponding with the display area of display screen 25.
Wherein printed circuit board 24 can be refering to the above printed circuit board 14, and details are not described herein.
It should be noted that, although Fig. 6 and Fig. 7 are not shown, which further includes having battery, is had refering to above
Battery 16, details are not described herein.
In some embodiments, which is arranged in shell 10.Specifically, the printed circuit board 14 can be with
It is screwed on center 12, card can also be fitted on center by the way of buckle by screw.It should be noted that the present invention is real
The mode that a printed circuit board is specifically fixed on center 12 is applied to be not limited to this, can be with other way, for example pass through buckle
The mode fixed jointly with screw.
It should be noted that the center can be the center 12 in electronic equipment 1, or in other equipment
Frame, the embodiment of the present invention are illustrated by taking the center 12 of electronic equipment 1 as an example, it should be noted that in the embodiment of the present invention
Frame is not limited in electronic equipment 1.
In embodiments of the present invention, it will be described from the angle of printed circuit board and preparation method thereof, the printed circuit
Plate specifically can be set in the electronic device, such as mobile phone, PC, tablet computer, palm PC (PDA, Personal
Digital Assistant) etc..
In some embodiments, on printed circuit board the impedance of signal wire respectively with the line width of signal wire, the thickness of signal wire
The dielectric constant of degree, the thickness of a medium adjacent with the signal wire and the medium is related.To reduce signal line impedance, promoted
Impedance consistency, the embodiment of the present invention will be normal from the thickness of the thickness of the line width of signal wire, signal wire, medium and the dielectric of medium
At least one of number aspect is described.
Referring to Fig. 8, Fig. 8 is the sectional view of printed circuit board provided in an embodiment of the present invention.The printed circuit board 14 can
To include first medium layer 142 and signal wire 141.Wherein, signal wire 141 is set on first medium layer 142.It needs to illustrate
It is that the signal wire of the embodiment of the present invention can be located at the surface layer of printed circuit board, the internal layer of printed circuit board can also be located at.This
Inventive embodiments are illustrated so that signal wire is located at the surface layer of printed circuit board as an example.In the embodiment of the present invention, signal wire 141
Impedance mainly with the line width of signal wire 141 (W1 and W2), the thickness T1 of signal wire 141, first medium layer 142 thickness H1 and
The dielectric constant of first medium layer 142 is related.
In some embodiments, referring to Fig. 9, Fig. 9 is the sectional view of signal wire provided in an embodiment of the present invention, the signal
Line 141 includes end to end first surface 1411, first side 1413, second surface 1412 and second side 1414.
Wherein, first surface 1411 is set on first medium layer 142, first surface 1411 and first medium layer 142
Surface is connected.The first surface 1411 has the first line width W1.
Wherein, second surface 1412 has the second line width W2.
In some embodiments, second surface 1412 and first surface 1411 are oppositely arranged, and first surface 1411 and
Two surfaces 1412 are parallel to each other.First surface 1411 and the wide setting of second surface 1412, specifically, the of first surface 1411
Second line width W2 of one line width W1 and second surface 1412 is equal.The difference of first line width W1 and the second line width W2 are smaller, signal
The impedance of line 141 is smaller, and the embodiment of the present invention is identical by the first line width W1 and the second line width W2 setting, can reduce signal wire
141 impedance can specifically reduce the 10% of impedance tolerance, so that impedance control is more preferable, to promote impedance consistency, be promoted
The stability of 141 signal of signal wire transmission, reduces loss.Wherein, which is that the second line width W2 and the first line width W1 is produced
The difference of raw impedance.
Wherein, first side 1413 and second side 1414 are oppositely arranged, and first side 1413 and second side 1414
It is parallel to each other.In some embodiments, the high settings such as first side 1413 and second side 1414.First side 1413 and second
Side 1414 is set between first surface 1411 and second surface 1412, further, first side 1413 and second side
1414 is vertical with first surface 1411 and second surface 1412 respectively, first surface 1411, first side 1413, second surface
1412 and second side 1414 be connected with each other from beginning to end after form a rectangular configuration.
In some embodiments, signal wire 141 protrudes from 142 surface of first medium layer.It should be noted that the present invention is real
Applying a signal wire 141 also can be set in first medium layer 142.
In specific process, the embodiment of the present invention can make the first line width W1 using printing technology or filling technique
It is identical with the second line width W2.
Such as: referring to Fig. 10, Figure 10 is the schematic diagram that mold provided in an embodiment of the present invention and first medium layer cooperate.
It is possible, firstly, to place a mold 200 on 142 surface of first medium layer, there is strip shape gob 210, and the strip shape gob on the mold 200
210 section is rectangular configuration.Then, filling or printing copper powder in the strip shape gob 210 of the mold 200, and copper powder is solidified,
To form the signal wire 141.Signal wire 141 removes the mold 200 after being formed again.It should be noted that institute of the embodiment of the present invention
The mold 200 used can be integrally formed structure, is also possible to two molds and cooperatively forms the strip shape gob.
Also for example: please referring to Figure 11 and Figure 12, Figure 11 is another section of printed circuit board provided in an embodiment of the present invention
Figure, Figure 12 are the structural schematic diagram of first medium layer provided in an embodiment of the present invention.It is possible, firstly, on first medium layer 142
Accommodating groove 1421 is opened up, accommodating groove 1421 includes the first side wall 1422, second sidewall 1423 and bottom wall 1424, the first side wall 1422
Opposite and parallel with second sidewall 1423, bottom wall 1424 is connected between the first side wall 1422 and second sidewall 1423, the first side
Wall 1422 and second sidewall 1423 are vertical with bottom wall 1424 respectively；Specifically, the section of the accommodating groove 1421 is rectangular configuration.So
Afterwards, copper powder is filled in the accommodating groove 1421, and copper powder is solidified, to form the signal wire 141.Further, the accommodating groove
1421 height is equal to the thickness T1 of signal wire.
The above are the embodiment of the present invention by the impedance of the line width reduction signal wire of change signal wire, promotes impedance consistency
A kind of concrete mode.
Figure 13 is please referred to, Figure 13 is another sectional view of printed circuit board provided in an embodiment of the present invention.The first medium
142 surface of layer have upwardly extended boss 1425, and signal wire 141 is set on the boss 1425.Specifically, the boss 1425 and
One dielectric layer 142 is wholely set.It should be noted that boss of the embodiment of the present invention 1425 is also possible to first medium layer 142
Double-layer structure, specifically, please referring to Figure 14, Figure 14 is another sectional view of printed circuit board provided in an embodiment of the present invention, should
Boss 1425 is stacked in 142 surface of first medium layer.Boss 1425 is arranged in the embodiment of the present invention on first medium layer 142, and
Signal wire 141 is set on boss 1425, so as to increase the thickness of first medium layer 142, so that first medium layer 142
Actual (real) thickness be equal to H1 add boss 1425 thickness, the impedance of signal wire 141 can be reduced in this way, can specifically reduce resistance
The 3% of anti-tolerance promotes impedance consistency so that impedance control is more preferable, and the stability of 141 signal of promotion signal line transmission subtracts
Few loss.
It should be noted that increasing the actual (real) thickness of first medium layer 142 after setting boss 1425 of the embodiment of the present invention
Add, specifically the spacing of the reference layer adjacent thereto into printed circuit board 14 of signal wire 141.Figure 15 is please referred to, Figure 15 is this hair
Another sectional view for the printed circuit board that bright embodiment provides.The reference layer 146 is disposed adjacent with first medium layer 142, and first
Dielectric layer 142 is set between signal wire 141 and reference layer 146.Setting boss 1425 of the embodiment of the present invention makes reference layer 146
Spacing to signal wire 141 is the sum of the thickness of H1 and boss 1425.
Wherein, the vertical section of the boss is rectangular configuration or isosceles trapezoidal structure.The width of the boss 1425 is equal to signal
The maximum width of line 141, it should be noted that in the actual production process, the width of the boss 1425 is slightly wider than signal wire 141
Maximum width.It should also be noted that, the width setting of boss of the embodiment of the present invention 1425 is not limited to this.
The above are the embodiment of the present invention by the impedance of the height reduction signal wire of change first medium layer, promotes impedance one
A kind of concrete mode of cause property.It should be noted that the embodiment of the present invention, can also change simultaneously the width and first of signal wire
The height of dielectric layer.Specifically, please referring to Figure 16 and Figure 17, Figure 16 is the another of printed circuit board provided in an embodiment of the present invention
Sectional view, Figure 17 are another sectional view of printed circuit board provided in an embodiment of the present invention.The surface of the first medium layer 141 is convex
There is boss 1425 out, which specifically can be refering to the above content, further, the first line width W1 of the signal wire 141
Identical with the second line width W2, having can be refering to the above content.The embodiment of the present invention can further reduce signal wire 141
Impedance, the impedance consistency of further promotion signal line, the stability of further 141 signal of promotion signal line transmission are reduced
Loss.
Figure 18 is please referred to, Figure 18 is another sectional view of printed circuit board provided in an embodiment of the present invention.The printed circuit
Plate 14 can also include the first ground wire 143 and soldermask layer 144.
Wherein, which is set on first medium layer 142.Specifically, first ground wire 143 and signal wire
141 are set on the same surface of first medium layer 142, and first ground wire 143 and signal wire 141 are located on the same floor, fixed herein
Justice is the first signals layer 147.
Wherein, which is set on the first signals layer 147, and is not disposed on signal wire 141.Specifically, anti-
Layer 144 is provided with anti-welding interval, anti-welding to be located at interval at 141 position of signal wire, and soldermask layer 144 extends to the of signal wire 141
One side 1413 and second side 1414, and be arranged with first side 1413, the interval of second side 1414.In some embodiments
In, soldermask layer 144 may include the first anti-welding end 1441, the second anti-welding end 1442, the first rake 1443 and the second rake
1444。
In some embodiments, which can use anti-solder paste, play the role of insulation.
Wherein, the first anti-welding end 1441 is adjacent with first side 1413, and the first anti-welding end 1441 and first side 1413
In parallel, the second anti-welding end 1442 is adjacent with second side 1414, and the second anti-welding end 1442 is parallel with second side 1414.One
The distance of the first anti-welding end 1441 to first side 1413 is equal to the second anti-welding end 1442 to second side 1414 in a little embodiments
Distance.
Wherein, the first rake 1443 is set between the first anti-welding end 1441 and 144 surface of soldermask layer, the second rake
1444 are set between the second anti-welding end 1442 and 144 surface of soldermask layer.Further, the first rake 1443 and the second inclination
Portion 1444 is symmetrical arranged.
It should be noted that the inventor of the embodiment of the present invention has found during the experiment, set up defences on 141 upper berth of signal wire
Layer 144 will increase the impedance of signal wire 141, influence impedance consistency.For this purpose, the embodiment of the present invention on signal wire 141 not
It is laid with soldermask layer 144, impedance is can reduce, can specifically reduce the 2% of impedance tolerance, so that impedance control is more preferable, thus
The impedance consistency of promotion signal line, the stability of 141 signal of promotion signal line transmission, reduces loss.
Further, Figure 19 is please referred to, Figure 19 is the sectional view of another printed circuit board provided in an embodiment of the present invention, should
Printed circuit board 14 can be not provided with soldermask layer in 141 position of signal wire, can also be by the first line width W1 of signal wire 141 and
Two line width W2 setting is identical, specifically can be refering to the above content.It is thus possible to further decrease impedance, impedance is further promoted
Consistency.
Further, Figure 20 is please referred to, Figure 20 is the sectional view of another printed circuit board provided in an embodiment of the present invention,
Rectangular structure also can be set in the section of the first ground wire 143 in the printed circuit board 14, specifically can refering to the above content,
Details are not described herein.
It should be noted that the embodiment of the present invention can also believed while 141 position of signal wire is not provided with soldermask layer
Boss is arranged in number 141 position of line, and having can be refering to the above content, and details are not described herein.
Figure 21 is please referred to, Figure 21 is the sectional view of another printed circuit board provided in an embodiment of the present invention.The printed circuit
The minimum spacing C1 of signal wire 141 and the first ground wire 143 adjacent thereto is greater than or equal to twice of the second line width W2 in plate 14,
At this point, the impedance of signal wire 141 has 0.5 ohm of difference, the resistance difference of signal wire 141 is greatly reduced.Further, believe
The minimum spacing C1 of number line 141 and the first ground wire 143 adjacent thereto is greater than or equal to three times of the second line width W2, at this point, letter
The impedance of number line 141 has 0.14 ohm of difference.To which the signal wire 141 of the embodiment of the present invention can reduce impedance, so that resistance
Anti- control is more preferable, so that the impedance consistency of promotion signal line, the stability of 141 signal of promotion signal line transmission, reduce loss.
It should be noted that minimum of the embodiment of the present invention in setting signal line 141 and the first ground wire 143 adjacent thereto
While the specific value range of spacing C1, soldermask layer can also be not provided in 141 position of signal wire, set in 141 position of signal wire
Set boss, the first line width W1 of signal wire 141 and the second line width W2 setting is at least one of identical.With can refering to
Upper content, details are not described herein.
Figure 22 is please referred to, Figure 22 is the sectional view of another printed circuit board provided in an embodiment of the present invention.The printed circuit
Plate 14 further includes electroplated layer 149.
Wherein, which can be copper foil, and copper foil can be formed in printed circuit board 14 by the way of plating
On each layer conductor.
Wherein, it is provided with via hole 148 on the first medium layer 142, which runs through first medium layer 142, makes
It obtains the first signals layer 147 and reference layer 146 positioned at 142 two sides of first medium layer and realizes electric connection.Specifically, in some realities
It applies in example, electroplated layer 149 is respectively set on the two sidewalls of the via hole 147 and 143 surface of the first ground wire is provided with plating
Layer 149, the not set electroplated layer in 141 position of signal wire, electroplated layer and the setting of the interval of signal wire 141, electroplated layer 149 extend to signal
The first side 1413 and second side 1414 of line 141, and be arranged with first side 1413, the interval of second side 1414.So that
The thickness of signal wire 141 reduces, and can reduce the impedance of signal wire, can specifically reduce the 2% of impedance tolerance, so that impedance control
System is more preferable, to promote impedance consistency, the stability of 141 signal of promotion signal line transmission reduces loss.
It should be noted that the embodiment of the present invention can also believed not while electroplated layer is arranged in 141 position of signal wire
Number 141 position of line is not provided with soldermask layer, boss is arranged, by the first line width W1 of signal wire 141 and second in 141 position of signal wire
The minimum spacing C1 that the first ground wire 143 identical, that signal wire 141 is adjacent thereto is arranged in line width W2 is greater than or equal to the second line width W2
At least one of twice.With can be refering to the above content, details are not described herein.
Figure 23 is please referred to, Figure 23 is the structural schematic diagram that pad provided in an embodiment of the present invention and signal wire cooperate.The print
Circuit board 14 processed can also include pad 1410,
Wherein, the pad 1410 and signal wire 141 are set to same layer, i.e. the first signals layer, which can be with
Refering to above first signals layer 147, details are not described herein.The pad 1410 and signal wire 141 are adjacent, realize and are electrically connected, and one
The both ends of a signal wire 147 connect two pads 1410.Specifically, two pads 1410 are adjacent to the of signal wire 141 respectively
One side 1413 and second side 1414.In some embodiments, the width of the pad 1410 is greater than the width of signal wire 141,
The impedance of signal wire 141 is greater than the impedance of pad 1410.
In order to reduce the impedance contrast between pad 1410 and signal wire 141, impedance consistency is promoted, Figure 24 is please referred to, is schemed
24 be another sectional view of printed circuit board provided in an embodiment of the present invention.Wherein, at least two layers of reference layer 146, generally
Multilayer, signal wire 141, first medium layer 142 and reference layer 146 are layered on top of each other setting, and first medium layer 142 is located at signal wire
Between 141 and reference layer 146.The reference layer 146 includes the first reference layer 1461 and the second reference layer 1462, the first reference layer
1461 are located at the bottom of all reference layers 146, the second reference layer 1462 be located at the first reference layer 1461 and signal wire 141 it
Between, signal wire 141 is by the second reference layer 1462 as reference.In some embodiments, the second reference layer 1462, which is provided with, runs through
The first through hole 1463 of second reference layer 1462, first through hole 1463 are greater than pad 1410, and pad 1410 is upper in vertical space
In in first through hole 1463, so that the reference layer of 1462 lower layers of the second reference layer is referred to for pad 1410, to increase weldering
Disk 1410 and then increases the impedance of pad 1410, reduces impedance between pad 1410 and signal wire 141 to the distance of its reference layer
Difference, prevent to be mutated, promoted impedance consistency.
It should be noted that at least having one layer of medium in Figure 24 between the first reference layer 1461 and the second reference layer 1462
Layer, can also have other media layer and other reference layers between the first reference layer 1461 and the second reference layer 1462.Also need
Illustrate, the second reference layer 1462 of the embodiment of the present invention can be adjacent with first medium layer, and the embodiment of the present invention is with this
For be illustrated, specifically can be refering to the above content, details are not described herein.Second reference layer 1462 of the embodiment of the present invention is also
It can be any one layer of reference layer between signal wire 141 and the first reference layer 1461, no longer illustrate one by one herein.
In some embodiments, corresponding 1410 position of pad, the corresponding first through hole 1463 of a pad 1410.Specifically
, the shape of first through hole 1463 is identical with the shape of pad 1410, and the size of first through hole 1463 and pad 1410 is big
It is small identical.And in the actual production process, the size setting of first through hole 1463 is slightly larger than to the size of pad 1410.
It should be noted that the mode that the embodiment of the present invention promotes impedance consistency is not limited to this, there can also be it
Its mode has and please refers to Figure 25, and Figure 25 is another structural representation that pad provided in an embodiment of the present invention and signal wire cooperate
Figure.The width of the pad 1410 is equal to the width of signal wire 141, and the impedance of signal wire 141 is greater than the impedance of pad 1410, can be with
Reduce the difference of impedance between pad 1410 and signal wire 141, promotes impedance consistency.
In some embodiments, Figure 26 is please referred to, Figure 26 is that the another of printed circuit board provided in an embodiment of the present invention cuts open
Face figure.Signal wire 141 also is located in first through hole 1461 on vertical space, can reduce pad 1410 and signal wire 141 it
Between impedance difference, promoted impedance consistency.
It should be noted that can be combined with each other between the above various embodiments of the embodiment of the present invention, collective effect is to reduce
The impedance operator of signal wire 141 promotes impedance consistency, no longer illustrates one by one herein.
The above are the embodiment of the present invention to be described from the angle of printed circuit board, below will be from the production of printed circuit board
The angle of method is described.
Figure 27 is please referred to, Figure 27 is the flow diagram of the production method of printed circuit board provided in an embodiment of the present invention.
The production method of the printed circuit board the following steps are included:
In step s101, first medium layer is provided.
Wherein the first medium layer can be refering to the above first medium layer 142, and details are not described herein.
In step s 102, accommodating groove is opened up on first medium layer.
Wherein the accommodating groove can be refering to the above accommodating groove 1421, and details are not described herein.
In step s 103, copper powder is filled in accommodating groove.
In step S104, solidify the copper powder in accommodating groove, to form signal wire.
Wherein the signal wire can be refering to the above signal wire 141, and details are not described herein.
The embodiment of the present invention can make the wide W1 of First Line and the second line width W2 identical, can reduce the impedance of signal wire,
Promote impedance consistency.
Figure 28 is please referred to, Figure 28 is another process signal of the production method of printed circuit board provided in an embodiment of the present invention
Figure.The production method of the printed circuit board the following steps are included:
In step s 201, first medium layer is provided.
Wherein the first medium layer can be refering to the above first medium layer 142, and details are not described herein.
In step S202, a mold is set on first medium layer.
Wherein the mold can be refering to upper mold 200, and details are not described herein.
In step S203, copper powder is filled in the strip shape gob of mold.
Wherein the strip shape gob can be refering to the above strip shape gob 210, and details are not described herein.
In step S204, solidify the copper powder in strip shape gob, to form signal wire.
Wherein the signal wire can be refering to the above signal wire 141, and details are not described herein.
The embodiment of the present invention can make the wide W1 of First Line and the second line width W2 identical, can reduce the impedance of signal wire,
Promote impedance consistency.
It will be understood by those skilled in the art that the structure of Fig. 1 and electronic equipment shown in Figure 21 not structure paired electrons
The restriction of equipment 1.Electronic equipment 1 may include perhaps combining certain components or difference than illustrating more or fewer components
Component layout.Electronic equipment 1 can also include processor, memory, bluetooth module etc., and details are not described herein.
The production method to printed circuit board provided in an embodiment of the present invention, printed circuit board and electronic equipment carry out above
It is discussed in detail, used herein a specific example illustrates the principle and implementation of the invention, above embodiments
Explanation be merely used to help understand the present invention.Meanwhile for those skilled in the art, according to the thought of the present invention, having
There will be changes in body embodiment and application range, in conclusion the content of the present specification should not be construed as to the present invention
Limitation.
Claims (10)
1. a kind of printed circuit board, which is characterized in that signal wire, first medium layer and reference layer including being layered on top of each other setting,
The first medium layer is provided with boss away from the reference layer on one side, and the boss protrudes from the first medium layer table
Face, the signal wire are set on the boss, to increase the spacing of the signal wire Yu the reference layer, the width of the boss
Degree is slightly wider than the maximum width of the signal wire, and the boss two sides are provided with the ground wire of the printed circuit board.
2. printed circuit board according to claim 1, which is characterized in that the boss and the first medium layer are integrally set
It sets.
3. printed circuit board according to claim 1, which is characterized in that the boss is stacked in the first medium layer table
Face.
4. printed circuit board according to claim 1, which is characterized in that the minimum widith of the boss is equal to the signal
The maximum width of line.
5. printed circuit board according to claim 1, which is characterized in that the vertical section of the boss is rectangular configuration or waits
Waist trapezium structure.
6. printed circuit board according to claim 1, which is characterized in that the printed circuit board further includes pad and at least
Two layers of reference layer, the signal wire, the first medium layer and the reference layer are layered on top of each other setting, at least two layers reference
Layer includes the first reference layer and the second reference layer, and first reference layer is located at the bottom of all reference layers, second ginseng
Layer is examined between first reference layer and the signal wire；The pad and the signal wire are adjacent, second reference
Layer is provided with the first through hole through second reference layer, and the pad is located in the first through hole on vertical space.
7. printed circuit board according to claim 1, which is characterized in that the printed circuit board further includes the first ground wire,
First ground wire and the signal wire are located on the same floor, and are formed the first signals layer, are provided with conducting on the first medium layer
Hole, the via hole run through the first medium layer so that be located at first medium layer two sides first signals layer and
The reference layer, which is realized, to be electrically connected；Electroplated layer and first ground wire are respectively set on the two sidewalls of the via hole
Surface is provided with electroplated layer, and the not set electroplated layer of signal line position, the electroplated layer and the signal wire interval are set
It sets, the electroplated layer extends to the first side and second side of the signal wire, and between the first side, second side
Every setting, the first side and the second side are oppositely arranged.
8. printed circuit board according to claim 1, which is characterized in that the printed circuit board further includes soldermask layer and
One ground wire, first ground wire and the signal wire are located on the same floor, and form the first signals layer, and the soldermask layer is arranged first
On signals layer, and the soldermask layer is not set on the signal line, and the soldermask layer extends to the first side of the signal wire
Face and second side, and be arranged with the first side, second side interval, the first side and the second side are opposite
Setting.
9. printed circuit board according to any one of claim 1 to 8, which is characterized in that Jie of the first medium layer
Electric constant is 2.0-2.6.
10. a kind of electronic equipment, which is characterized in that including shell and printed circuit board, the printed circuit board is arranged described
In shell, the printed circuit board is printed circuit board described in power requires any one of 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710722837.0A CN107318220B (en) | 2017-08-21 | 2017-08-21 | Printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710722837.0A CN107318220B (en) | 2017-08-21 | 2017-08-21 | Printed circuit board and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN107318220A CN107318220A (en) | 2017-11-03 |
| CN107318220B true CN107318220B (en) | 2019-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710722837.0A Active CN107318220B (en) | 2017-08-21 | 2017-08-21 | Printed circuit board and electronic equipment |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1568131A (en) * | 2003-06-18 | 2005-01-19 | 华为技术有限公司 | Method for compensating characteristic impedance of meter adhibitted bonding pad and printed circuit board employing same method |
| CN102413629A (en) * | 2011-07-27 | 2012-04-11 | 大唐移动通信设备有限公司 | Printed circuit board and manufacturing method thereof |
| CN102802341A (en) * | 2011-05-27 | 2012-11-28 | 太阳诱电株式会社 | Multilayer substrate |
| JP2015173248A (en) * | 2014-02-21 | 2015-10-01 | 三菱電機株式会社 | Multilayer circuit board |
| CN206061276U (en) * | 2016-08-18 | 2017-03-29 | 重庆蓝岸通讯技术有限公司 | Printed circuit board (PCB) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1780536A (en) * | 2004-11-25 | 2006-05-31 | 华为技术有限公司 | Impedance adjustment of multi-layer printing circuit board |
-
2017
- 2017-08-21 CN CN201710722837.0A patent/CN107318220B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1568131A (en) * | 2003-06-18 | 2005-01-19 | 华为技术有限公司 | Method for compensating characteristic impedance of meter adhibitted bonding pad and printed circuit board employing same method |
| CN102802341A (en) * | 2011-05-27 | 2012-11-28 | 太阳诱电株式会社 | Multilayer substrate |
| CN102413629A (en) * | 2011-07-27 | 2012-04-11 | 大唐移动通信设备有限公司 | Printed circuit board and manufacturing method thereof |
| JP2015173248A (en) * | 2014-02-21 | 2015-10-01 | 三菱電機株式会社 | Multilayer circuit board |
| CN206061276U (en) * | 2016-08-18 | 2017-03-29 | 重庆蓝岸通讯技术有限公司 | Printed circuit board (PCB) |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107318220A (en) | 2017-11-03 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: Guangdong Opel Mobile Communications Co., Ltd. |
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