CN107567225B - Center production method, center, electronic equipment and center matrix - Google Patents

Center production method, center, electronic equipment and center matrix Download PDF

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Publication number
CN107567225B
CN107567225B CN201710779093.6A CN201710779093A CN107567225B CN 107567225 B CN107567225 B CN 107567225B CN 201710779093 A CN201710779093 A CN 201710779093A CN 107567225 B CN107567225 B CN 107567225B
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China
Prior art keywords
substrate
nut
center
side frame
production method
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CN201710779093.6A
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CN107567225A (en
Inventor
苏会军
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201710779093.6A priority Critical patent/CN107567225B/en
Publication of CN107567225A publication Critical patent/CN107567225A/en
Priority to PCT/CN2018/099103 priority patent/WO2019042094A1/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The embodiment of the present application discloses a kind of center production method, center, electronic equipment and center matrix, wherein, center production method is the following steps are included: provide a center matrix, the center matrix includes side frame, first substrate and an at least nut, a notch is formed between side frame and first substrate connection side frame and first substrate, nut is located at gap position, nut and one or two of side frame, first substrate integrally connected, forms at least one interconnecting piece;It is molded in gap position, forms the second substrate, the second substrate is connect with nut periphery;Milling interconnecting piece, so that nut and side frame, first substrate disconnect.The embodiment of the present application the second substrate and nut periphery are fixedly connected by injection molding as a result, so that the second substrate and nut are fixedly connected with that intensity is big, increase the second substrate and nut is fixedly connected with intensity.

Description

Center production method, center, electronic equipment and center matrix
Technical field
This application involves technical field of electronic equipment, and in particular to a kind of production method of center, center, electronic equipment and Center matrix.
Background technique
With the development of network technology and the raising of electronic equipment intelligence degree, user can be realized by electronic equipment More and more functions, such as call, chat, object for appreciation game etc..
Wherein, the components such as the printed circuit board of electronic equipment, side frame generally pass through the center that screw is installed on electronic equipment On, it is corresponding, nut is set on center and is spirally connected with screw realization.In the prior art, the mode that nut is arranged on center is main It is to be achieved a fixed connection on screw nut hot melting to center by nut periphery and center by way of hot melt.But work as center Be arranged the position thickness of nut than it is relatively thin when, the intensity being fixedly connected with nut periphery is inadequate, and nut is easy therefrom in stress It is detached from frame.
Summary of the invention
The embodiment of the present application provides production method, center and the electronic equipment of a kind of center, can increase nut and center The intensity being fixedly connected.
In a first aspect, the embodiment of the present application provides a kind of center production method, comprising the following steps:
There is provided a center matrix, the center matrix includes first substrate, side frame and an at least nut by side frame, the first base Plate and an at least nut are integrally formed, and the side frame side frame is connected with the first substrate, and the side frame and first base Form a notch between plate, the nut is located at the gap position, in the nut and the side frame side frame, first substrate One or two integrally connected forms at least one interconnecting piece;
It is molded in the gap position, forms the second substrate, the second substrate is connect with the nut periphery;
Interconnecting piece described in milling, so that the nut and the side frame, the second substrate disconnect.
Second aspect, the embodiment of the present application also provide a kind of center, and the center uses center production side as described above Method is made.
The third aspect, the embodiment of the present application also provide a kind of center, including an at least nut, side frame, first substrate and Two substrates, the side frame and the first substrate are integrally formed, and the side frame and the first substrate form a notch, and described the Two substrates are filled in the gap position, and the second substrate is fixedly connected with the side frame, the first substrate respectively, described Nut is set to the gap position, and the nut is set in the second substrate, and the nut includes being located at described second The first half-connection portion and the second half-connection portion inside substrate.
Fourth aspect, the embodiment of the present application also provides a kind of electronic equipment, including center, the center is as described above Center.
5th aspect, the embodiment of the present application also provides a kind of center matrixes, including first substrate, side frame and an at least spiral shell Mother, the side frame are connected with the first substrate, and a notch is formed between the side frame and the first substrate, the nut Positioned at the gap position, the nut and one or two of the side frame, first substrate integrally connected form at least one A interconnecting piece.
Center production method provided by the embodiments of the present application provides a center matrix, the first base of the center matrix first Plate, side frame and an at least nut are connected with each other;Then, the gap position injection molding around nut, the second substrate is by nut periphery Package, nut periphery are fixedly connected with the second substrate;Last milling interconnecting piece again, so that nut and side frame, that is, the second substrate are disconnected It opens.The embodiment of the present application the second substrate and nut periphery are fixedly connected by injection molding as a result, so that the second substrate and nut are consolidated Determine that bonding strength is big, increase the second substrate and nut is fixedly connected with intensity.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached Figure.
Fig. 1 is the structural schematic diagram of electronic equipment provided by the embodiments of the present application.
Fig. 2 is another structural schematic diagram of electronic equipment provided by the embodiments of the present application.
Fig. 3 is the structural schematic diagram of center matrix provided by the embodiments of the present application.
Fig. 4 is the partial structure diagram of center provided by the embodiments of the present application.
Fig. 5 is another part structural schematic diagram of center provided by the embodiments of the present application.
Fig. 6 is the schematic diagram that nut provided by the embodiments of the present application and first substrate, side frame are split.
Fig. 7 is the structural schematic diagram of nut provided by the embodiments of the present application.
Fig. 8 is the flow diagram of center production method provided by the embodiments of the present application.
Fig. 9 is the processing procedure schematic diagram of center production method provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete Site preparation description.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on Embodiment in the application, those skilled in the art's every other implementation obtained without creative efforts Example, shall fall in the protection scope of this application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of It describes the application and simplifies description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with spy Fixed orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, term " first ", " second " are only used for Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic. " first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.? In the description of the present application, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected or can mutually communicate;It can be directly connected, it can also be by between intermediary It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application unless specifically defined or limited otherwise, fisrt feature second feature "upper" or "lower" It may include that the first and second features directly contact, also may include that the first and second features are not direct contacts but pass through it Between other characterisation contact.Moreover, fisrt feature includes the first spy above the second feature " above ", " above " and " above " Sign is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " include that fisrt feature is directly below and diagonally below the second feature, or is merely representative of First feature horizontal height is less than second feature.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to Simplify disclosure herein, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting Relationship.In addition, this application provides various specific techniques and material example, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides production method, center, electronic equipment and the center matrix of a kind of center.It will divide below It is not described in detail.
In the present embodiment, will be described from the angle of center, the center specifically can be set in the electronic device, than Such as mobile phone, tablet computer, palm PC (Personal Digital Assistant, PDA) etc..
Please refer to the structural schematic diagram that 1, Fig. 1 is electronic equipment provided by the embodiments of the present application.The electronic equipment 1 includes shell Body 10, display screen 20, printed circuit board 30, battery 40, side frame 124.
Wherein, which may include cover board 11, center 12 and rear cover 13, and cover board 11, center 12 and rear cover 13 are mutual Combination forms the shell 10, which has the confined space formed by cover board 11, center 12 and rear cover 13, aobvious to accommodate The devices such as display screen 20, printed circuit board 30, battery 40.In some embodiments, the lid of cover board 11 is set on center 12, and rear cover 13 covers It is set on center 12, cover board 11 and rear cover 13 are located at the opposite face of center 12, and cover board 11 and rear cover 13 are oppositely arranged, shell 10 Confined space between cover board 11 and rear cover 13.
In some embodiments, shell 10 can be metal shell.It should be noted that the embodiment of the present application shell 10 Material is not limited to this, and can also use other way, such as: shell 10 may include plastic portions and metal part.Compare again Such as: shell 10 can be plastic casing.Also such as: shell 10 can be metal and the mutually matched shell structure of plastic cement.Its In, cover board 11 can be transparent glass cover plate.In some embodiments, cover board 11 can be with materials systems such as sapphires At glass cover-plate.
It should be noted that the structure of the embodiment of the present application shell is not limited to this, and such as: rear cover and center are integrally formed Form 12 structure of a center.Specifically, the shell 10 includes cover board 11 and center 12, cover board 11 and center 12 are fixed to each other to be formed One confined space, for storing the devices such as display screen 20, printed circuit board 30, battery 40, side frame 124.
Wherein, in the housing 10, which can be the master of electronic equipment 1 for the printed circuit board 30 installation Plate can integrate side frame 124, motor, microphone, camera, light sensor, receiver and place on printed circuit board 30 Manage the functional units such as device.
In some embodiments, which is fixed in shell 10.Specifically, the printed circuit board 30 can be with It is screwed on center 12, card can also be fitted on center 12 by the way of buckle by screw.It should be noted that this Shen Please embodiment printed circuit board 30 be specifically not limited to this fixed to the mode on center 12, can be such as logical with other way Cross the mode that buckle and screw are fixed jointly.
Wherein, in the housing 10, battery 40 is electrically connected with the printed circuit board 30 for the battery 40 installation, with to electronics Equipment 1 provides power supply.Shell 10 can be used as the battery cover of battery 40.Shell 10 covers battery 40 to protect battery 40, specifically Be rear cover covering battery 40 to protect battery 40, reduce collision of the battery 40 due to electronic equipment 1, the damage falling etc. and be subject to It is bad.
Wherein, which installs in the housing 10, meanwhile, which is electrically connected on printed circuit board 30, To form the display surface of electronic equipment 1.The display screen 20 includes display area 111 and non-display area 112.The display area 111 can be used to show the picture of electronic equipment 1 or carry out touching manipulation etc. for user.The top of the non-display area 112 Region opens up the aperture for sound and light conduction, can be set on 112 bottom of non-display area fingerprint mould group, touch-control by The functional units such as key.Wherein the cover board 11 is installed on display screen 20, to cover display screen 20, is formed identical with display screen 20 Display area and non-display area, specifically can display area refering to display screen 20 and non-display area.
It should be noted that the structure of the display screen 20 is not limited to this.For example, the display screen can be comprehensive screen or different Property screen, specifically, referring to Fig. 2, Fig. 2 be electronic equipment provided by the embodiments of the present application another structural schematic diagram.In Fig. 2 The difference of electronic equipment and the electronic equipment in Fig. 1 is: the non-display area is formed directly on display screen 20, such as aobvious The non-display area of display screen 20 is arranged to transparent configuration, so that optical signal passes through, or directly in the non-display area of display screen 20 Domain is opened up for structures such as the aperture of light conduction or notches, front camera, photoelectric sensor etc. can be set to non-display Regional location, so that front camera is taken pictures, photoelectric sensor detection.
It is described below from the angle of center matrix.
Referring to Fig. 3, Fig. 3 is the structural schematic diagram of center matrix provided by the embodiments of the present application.The center matrix 200 packet Include first substrate 121, side frame 124 and an at least nut 123.Wherein, the side frame 124 and first substrate 121 connect, side frame 124 A notch 125 is formed between first substrate 121.Nut 123 is located at 125 position of notch, and nut 123 connects by one first Socket part 126 and first substrate 121 connect, and nut 123 is connected by a second connecting portion 127 and side frame 124.It needs to illustrate It is that connection type of the embodiment of the present application nut 123 respectively with side frame 124, first substrate 121 is not limited to this, for example only will Nut 123 and side frame 124 connect, and first substrate 121 of getting along well is fixedly connected.For another example only by nut 123 and first substrate 121 connections, and side frame 124 of getting along well is fixedly connected.
In some embodiments, center matrix 200 can be integrally formed, for example be molded to be formed using metal material, center Matrix 200 can be molded to be formed using magnesium alloy materials.It should be noted that the embodiment of the present application center matrix 200 is molding Mode is not limited to the mode of injection molding, for example carries out milling on a metal plate by way of milling and formed.Pass through for another example Together with first substrate 121, side frame 124 are welded to each other by the mode of welding with nut 123.
It is described below from the angle of center.
Fig. 4 and Fig. 5 are please referred to, Fig. 4 is the partial structure diagram of center provided by the embodiments of the present application, and Fig. 5 is this Shen Please embodiment provide center another part structural schematic diagram.In some embodiments, center 12 include first substrate 121, The second substrate 122, side frame 124 and at least one nut 123.
Wherein, first substrate 121 can be made of metal material, for example be made of magnesium alloy materials.It needs to illustrate , the embodiment of the present application first substrate 121 can also be made of other metal materials.
Wherein, side frame 124 is made of metal material, for example is made of magnesium alloy materials.It should be noted that this Shen Please embodiment side frame 124 can also be made of other materials.In some embodiments, which can be used as an antenna Radiator is used for receiving and transmitting signal.
Wherein, nut 123 can be one, or multiple.The nut 123 can be made of metal material, tool Body is made of using magnesium alloy materials.It should be noted that the nut 123 can also be made of other metal materials.
Wherein, the second substrate 122 can be made of plastic material.It should be noted that the second of the embodiment of the present application The material of substrate 122 is not limited to plastic cement, can also use other nonmetallic materials.In some embodiments, the second substrate 122 It can be formed in by plastic-injection on first substrate 121, first substrate 121 is fixedly connected with the second substrate 122.
In some embodiments, the side frame 124 and first substrate 121 connect, shape between side frame 124 and first substrate 121 At a notch 125.The nut 123 is located at 125 position of notch;Specifically, nut 123 is close to the end of side frame 124.The nut 123 can connect with side frame 124 and first substrate 121, specifically, first substrate 121, side frame 124 and nut 123 can be integrated Molding.For example be molded to be formed using metal material, more specifically it can be molded to be formed using magnesium alloy materials.It needs to illustrate It is that first substrate 121, side frame 124 and the integrally formed mode of nut 123 are not limited to the side of injection molding in the embodiment of the present application Formula, for example carry out milling on a metal plate by way of milling and formed.For another example by welding by first substrate 121, together with side frame 124 is welded to each other with nut 123.
It should be noted that the embodiment of the present application nut 123 respectively with side frame 124, first substrate 121 connection type simultaneously It is without being limited thereto, such as only by 124 integrally connected of nut 123 and side frame, and first substrate 121 of getting along well is fixedly connected.For another example only By 121 integrally connected of nut 123 and first substrate, and side frame 124 of getting along well is fixedly connected.
It is understood that the present embodiment is by 124 integrally connected of nut 123 and side frame, due to side frame 124, nut 123 and First substrate 121 is all made of magnesium alloy materials and is made, and nut 123 and 124 integrally connected of side frame will affect side frame 124 as day The performance of beta radiation body.For this purpose, the embodiment of the present application, in order to improve performance of the side frame 124 as antenna radiator, the application is real The position that nut 123 and first substrate 121 or/and side frame 124 connect can be disconnected by applying example.Specifically, referring to Fig. 6, figure 6 schematic diagrames split for nut provided by the embodiments of the present application and first substrate, side frame.The embodiment of the present application can be with milling second Interconnecting piece 127, and nut 123 and side frame 124 are disconnected, so that 123 one of a part of second connecting portion 127 and nut Connection.And the embodiment of the present application can be disconnected nut 123 and first substrate 121 with milling first connecting portion 126, so that 123 integrally connected of a part and nut of first connecting portion 126.
In some embodiments, referring to Fig. 7, Fig. 7 is the structural schematic diagram of nut provided by the embodiments of the present application.The spiral shell Mother 123 includes one first half-connection portion 1231, the second half-connection portion 1232,1,233 1 ontology 1234 of a pedestal, multiple link blocks 1235, first end 1236 and second segment 1237.
Wherein, the first half-connection portion 1231 after 126 milling of first connecting portion by forming.In some embodiments, this first The surface in half-connection portion 1231 is arc, and from its two sides, portion is recessed the curved surfaces in the first half-connection portion 1231 thereto. Wherein, the second half-connection portion 1232 after 127 milling of second connecting portion by forming.In some embodiments, the second half-connection portion 1232 length is greater than the length in the first half-connection portion 1231.
Wherein, first end 1236 and second end 1237 are oppositely arranged.Wherein, ontology 1234 is located at first end 1236.This One end 1236 is provided with chamfering.Wherein, pedestal 1233 is located at second end 1237.In some embodiments, the ontology 1234 is most Major diameter is less than the maximum gauge of pedestal 1233.
Wherein, link block 1235 is located at the periphery of ontology 1234.The embodiment of the present application link block 1235 can be one, Can be to be multiple, such as two, and be uniformly arranged.It should be noted that the number of the embodiment of the present application link block 1235 is not It is limited to this, such as three, and is uniformly arranged.
In some embodiments, the second substrate 122 can be filled into 125 position of notch, so that the second substrate 122 and first The plate structure of an entirety is formed between substrate 121.Specifically, the second substrate 122 can by way of plastic-injection shape At a part of the second substrate 122 is filled into 125 position of notch, and the second substrate 122 wraps up the periphery of nut 123, the second base Plate 122 is fixedly connected with side frame 124 and the second substrate 122 is fixedly connected with first substrate 121.
The embodiment of the present application can be molded directly on integrally formed side frame 124, nut 123 and first substrate 121 with The second substrate 122 is formed, can finally be disconnected first connecting portion 126 and second connecting portion 127 by way of milling, thus So that pedestal 1233, link block 1235 and the first half-connection portion 1231 and the second half-connection portion 1232 are embedded in the second base Inside plate 122, it is fixedly connected with the second substrate 122.The embodiment of the present application is due to pedestal 1233, link block 1235 and the first half Interconnecting piece 1231 and the second half-connection portion 1232 are respectively positioned on inside the second substrate 122, it is thus possible to increase nut 123 and second The bonding strength of substrate 122, so that nut 123 increases with the intensity that is fixedly connected of the second substrate 122.Namely 123 He of nut The bonding strength of center 12 increases.
In order to preferably describe the middle frame structure of the embodiment of the present application, will be retouched below from the direction of center production method It states.
Fig. 8 and Fig. 9 are please referred to, Fig. 8 is the flow diagram of center production method provided by the embodiments of the present application, and Fig. 9 is The processing procedure schematic diagram of center production method provided by the embodiments of the present application.The center production method the following steps are included:
In step s101, a center matrix 200 is provided, which includes side frame 124,121 and of first substrate An at least nut 123, side frame 124 and first substrate 121 connect, and a notch 125 is formed between side frame 124 and first substrate 121, Nut 123 is located at 125 position of notch, and nut 123 is connect with one or two of side frame 124, first substrate 121, is formed extremely A few interconnecting piece.It should be noted that the connection type of the embodiment of the present application nut 123 and first substrate 121, side frame 124 Can be refering to the above content, details are not described herein.
In step s 102, it is molded in 125 position of notch, forms the second substrate 122, the second substrate 122 and nut 123 Periphery connection.Specifically, carrying out plastic-injection in 125 position of notch, the second substrate 122 wraps up the periphery of nut 123, specifically Can be refering to the above content, details are not described herein.
In step s 103, milling interconnecting piece, so that nut 123 and side frame 124, first substrate 121 disconnect.Specifically, Milling first connecting portion 126 and second connecting portion 127, so that nut 123 and side frame 124, first substrate 121 disconnect, and then make The the first half-connection portion 1231 for obtaining first connecting portion 126 is located at 123 periphery of nut, and makes the second of second connecting portion 127 Half-connection portion 1232 is located at 123 periphery of nut.First half-connection portion 1231, the second half-connection portion 1232 specifically can refering to Upper content.
In some embodiments, in milling process, an ontology 1234 and a pedestal 1233, base are formed in 123 periphery of nut Seat 1233 and ontology 1234 are integrally formed, and pedestal 1233 and ontology 1234 can be refering to the above contents, and details are not described herein.
In some embodiments, in milling process, the periphery of ontology 1234 be formed with one or two or it is multiple uniformly distributed Link block 1235, link block 1235 is fixedly connected with the second substrate 122, specifically can be no longer superfluous herein refering to the above content It states.
From the foregoing, it will be observed that the embodiment of the present application using metal material nut 123 respectively with the side frame of metal material 124, the One substrate 121 mutually disconnects, and realizes that nut 123 insulate with side frame 124, first substrate 121 respectively, side frame is as aerial radiation When body, nut 123 is avoided to influence antenna radiator or antenna headroom region.In the actual production process, the of 123 position of nut The thinner thickness of two substrates 122, easy in a screw nut hot melting to the second substrate 122 will be loosened according to hot melt or other modes, Or be easy to be drawn out, hot-melting nut cannot provide enough pulling capacities and torsion, and fixing intensity is inadequate.And the embodiment of the present application will Nut 123 and its peripheral structure are embedded into inside the second substrate 122, can increase by 122 contact surface of nut 123 and the second substrate Product, and then increase the bonding strength of nut 123 and the second substrate 122, so that nut 123 and the second substrate 122 are fixedly connected Intensity increases.Namely the bonding strength of nut 123 and center 12 increases.To which the embodiment of the present application will be on 123 periphery of nut Component be embedded into inside the second substrate 122, be not easy to loosen, be not easy to be drawn out even if the second substrate 122 is relatively thin.
It should be noted that the above center 12 is set in electronic equipment 1, it is only illustrating for the embodiment of the present application Bright, which is not limited to electronic equipment 1, and the structure that has of the center 12 is also not limited to this.
It will be understood by those skilled in the art that the structure of Fig. 1 and electronic equipment shown in Figure 21 not structure paired electrons The restriction of equipment 1.Electronic equipment 1 may include perhaps combining certain components or difference than illustrating more or fewer components Component layout.Electronic equipment 1 can also include processor, memory, bluetooth module etc., and details are not described herein.
Center production method provided by the embodiments of the present application, center, electronic equipment and center matrix have been carried out in detail above Thin to introduce, specific examples are used herein to illustrate the principle and implementation manner of the present application, and above embodiments are said It is bright to be merely used to help understand the application.Meanwhile for those skilled in the art, according to the thought of the application, specific real Apply in mode and application range that there will be changes, in conclusion the content of the present specification should not be construed as the limit to the application System.

Claims (17)

1. a kind of center production method, which comprises the following steps:
A center matrix is provided, the center matrix includes first substrate, side frame and an at least nut, the side frame and described The connection of one substrate, and a notch is formed between the side frame and the first substrate, the nut is located at the gap position, institute Nut and one or two of the side frame, first substrate integrally connected are stated, at least one interconnecting piece is formed;
It is molded in the gap position, forms the second substrate, the second substrate is connect with the nut periphery;
Interconnecting piece described in milling, so that the nut and the side frame, first substrate disconnect.
2. center production method according to claim 1, which is characterized in that the nut includes the first end being oppositely arranged And second end, the step of interconnecting piece described in the milling, include:
Milling is carried out from the first end of the nut, so that the first end of the nut forms an ontology and the nut Second end forms a pedestal, and the maximum gauge of the ontology is less than the maximum gauge of the pedestal.
3. center production method according to claim 2, which is characterized in that milling is carried out from the first end of the nut, The ontology periphery is also made to be formed with one or more link blocks, the link block is fixedly connected with the second substrate.
4. center production method according to claim 1, which is characterized in that the interconnecting piece includes first connecting portion and Two interconnecting pieces, the first connecting portion and the first substrate integrally connected, the second connecting portion and the side frame integrally connect It connects, the step of interconnecting piece described in the milling includes:
First connector described in milling forms the first half with the nut integrally connected so that first connector disconnects Interconnecting piece;
Second connector described in milling forms the second half with the nut integrally connected so that second connector disconnects Interconnecting piece.
5. center production method according to claim 4, which is characterized in that the length in second half-connection portion is greater than institute State the length in the first half-connection portion.
6. center production method according to claim 4, which is characterized in that the surface in first half-connection portion is arc Shape, from its two sides, portion is recessed the curved surfaces in first half-connection portion thereto.
7. center production method according to any one of claim 1 to 6, which is characterized in that one center base of the offer The step of body includes: to form the center matrix by injection molding manner, by the first substrate, side frame and an at least nut one It is body formed.
8. center production method according to any one of claim 1 to 6, which is characterized in that one center base of the offer The step of body includes: that the center matrix is formed by way of milling, by the first substrate, side frame and an at least nut Integrally connected.
9. a kind of center, which is characterized in that the center uses the center production method system such as any one of claims 1 to 8 At.
10. a kind of center characterized by comprising at least a nut, side frame, first substrate and the second substrate, the side frame and The first substrate connection, the side frame and the first substrate form a notch, and the second substrate is filled in the notch Position, the second substrate are fixedly connected with the side frame, the first substrate respectively, and the nut is set to the notch position It sets, the nut is set in the second substrate, and the nut includes the first half-connection inside the second substrate Portion and the second half-connection portion, first half-connection portion and second half-connection portion by with the first substrate and the side Frame disconnects being formed.
11. center according to claim 10, which is characterized in that the length in second half-connection portion is greater than described first The length in half-connection portion.
12. center according to claim 11, which is characterized in that the surface in first half-connection portion is arc, described From its two sides, portion is recessed the curved surfaces in the first half-connection portion thereto.
13. center according to claim 10, which is characterized in that the nut includes the first end being oppositely arranged and second End, the nut include the pedestal positioned at an ontology of the first end and positioned at the second end, and the ontology is most Major diameter is less than the maximum gauge of the pedestal.
14. center according to claim 13, which is characterized in that the nut further includes being set to the ontology periphery One or more link blocks, the link block are fixedly connected with the second substrate.
15. a kind of electronic equipment, which is characterized in that including center, the center is as claim 9 to 14 is described in any item Center.
16. a kind of center matrix, which is characterized in that including first substrate, side frame and an at least nut, the side frame and described The connection of one substrate, and a notch is formed between the side frame and the first substrate, the nut is located at the gap position, institute Nut and one or two of the side frame, first substrate integrally connected are stated, at least one interconnecting piece, the interconnecting piece are formed It is formed by being disconnected at least one of the first substrate and the side frame.
17. center matrix according to claim 16, which is characterized in that the interconnecting piece includes first connecting portion and second Interconnecting piece, the first connecting portion and the first substrate integrally connected, the second connecting portion and the side frame integrally connected.
CN201710779093.6A 2017-08-31 2017-08-31 Center production method, center, electronic equipment and center matrix Active CN107567225B (en)

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CN108513469A (en) * 2018-03-09 2018-09-07 广东欧珀移动通信有限公司 A kind of center production method, center and electronic device
CN110434376B (en) * 2019-08-06 2021-02-02 东莞长盈精密技术有限公司 Middle frame processing method
CN110667033B (en) * 2019-09-19 2021-07-27 广东长盈精密技术有限公司 Fingerprint hole machining method

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