CN108270071A - Antenna module, center component and electronic equipment - Google Patents

Antenna module, center component and electronic equipment Download PDF

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Publication number
CN108270071A
CN108270071A CN201810055703.2A CN201810055703A CN108270071A CN 108270071 A CN108270071 A CN 108270071A CN 201810055703 A CN201810055703 A CN 201810055703A CN 108270071 A CN108270071 A CN 108270071A
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China
Prior art keywords
radiator
metal frame
slot
opening
metal
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Granted
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CN201810055703.2A
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CN108270071B (en
Inventor
周林
向元彬
曾志敏
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201810055703.2A priority Critical patent/CN108270071B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请实施例提供一种天线组件、中框组件及电子设备,其中天线组件包基板、金属边框、辐射体,金属边框形成在基板周缘,天线组件还包括缝隙,缝隙位于金属边框和基板之间,且缝隙具有从基板至金属边框方向贯穿金属边框的开口,辐射体形成在金属边框上、且位于缝隙位置;其中,辐射体包括第一辐射体和第二辐射体,天线组件还包括第一接地点、第一馈电点和第二接地点,第一辐射体与第一接地点和第一馈电点电性连接,第二辐射体与第二接地点电性连接,且第二辐射体与第一辐射体耦合。本申请实施例提供的电子设备,通过第一辐射体耦合激励第二辐射体,从而提高天线的性能。

Embodiments of the present application provide an antenna assembly, a middle frame assembly, and an electronic device, wherein the antenna assembly includes a substrate, a metal frame, and a radiator, and the metal frame is formed on the periphery of the substrate, and the antenna assembly further includes a gap, and the gap is located between the metal frame and the substrate , and the slot has an opening through the metal frame from the substrate to the metal frame, and the radiator is formed on the metal frame and is located at the slot position; wherein, the radiator includes a first radiator and a second radiator, and the antenna assembly also includes a first a ground point, a first feed point and a second ground point, the first radiator is electrically connected to the first ground point and the first feed point, the second radiator is electrically connected to the second ground point, and the second radiation The body is coupled with the first radiator. In the electronic device provided by the embodiment of the present application, the performance of the antenna is improved by coupling and exciting the second radiator through the first radiator.

Description

天线组件、中框组件及电子设备Antenna components, middle frame components and electronic equipment

技术领域technical field

本申请涉及电子设备技术领域,特别涉及一种天线组件、中框组件及电子设备。The present application relates to the technical field of electronic equipment, in particular to an antenna assembly, a middle frame assembly and electronic equipment.

背景技术Background technique

随着网络技术的发展和电子设备智能化程度的提高,用户可以通过电子设备实现越来越多的功能,比如通话、聊天、玩游戏等。With the development of network technology and the improvement of the intelligence of electronic equipment, users can realize more and more functions through electronic equipment, such as calling, chatting, playing games and so on.

其中,用户在利用电子设备通话、聊天过程中通过电子设备的天线实现信号的传输。Wherein, the user implements signal transmission through the antenna of the electronic device during the process of talking or chatting with the electronic device.

发明内容Contents of the invention

本申请实施例提供一种天线组件、中框组件及电子设备,可以提高电子设备的天线性能。Embodiments of the present application provide an antenna component, a middle frame component, and an electronic device, which can improve the antenna performance of the electronic device.

本申请实施例提供一种天线组件,包括基板、金属边框、辐射体,所述金属边框形成在所述基板周缘,所述天线组件还包括缝隙,所述缝隙位于所述金属边框和所述基板之间,且所述缝隙具有从所述基板至所述金属边框方向贯穿所述金属边框的开口,所述辐射体形成在所述金属边框上、且位于所述缝隙位置;其中,An embodiment of the present application provides an antenna assembly, including a substrate, a metal frame, and a radiator. The metal frame is formed on the periphery of the substrate. The antenna assembly also includes a slot, and the gap is located between the metal frame and the substrate. Between, and the gap has an opening through the metal frame from the substrate to the metal frame, the radiator is formed on the metal frame and is located at the gap position; wherein,

所述辐射体包括第一辐射体和第二辐射体,所述天线组件还包括第一接地点、第一馈电点和第二接地点,所述第一辐射体与所述第一接地点和第一馈电点电性连接,所述第二辐射体与所述第二接地点电性连接,且所述第二辐射体与所述第一辐射体耦合。The radiator includes a first radiator and a second radiator, the antenna assembly further includes a first ground point, a first feeding point and a second ground point, the first radiator and the first ground point It is electrically connected to the first feeding point, the second radiator is electrically connected to the second ground point, and the second radiator is coupled to the first radiator.

本申请实施例还提供一种中框组件,包括金属基板、非金属基板、金属边框和辐射体,所述金属边框形成在所述金属基板周缘,所述中框组件还包括缝隙,所述缝隙位于所述金属边框和所述金属基板之间,且所述缝隙具有从所述金属基板至所述金属边框方向贯穿所述金属边框的开口,所述辐射体形成在所述金属边框上、且位于所述缝隙位置;其中,The embodiment of the present application also provides a middle frame assembly, including a metal substrate, a non-metal substrate, a metal frame and a radiator, the metal frame is formed on the periphery of the metal substrate, and the middle frame assembly also includes a gap, the gap Located between the metal frame and the metal substrate, and the gap has an opening through the metal frame from the metal substrate to the metal frame, the radiator is formed on the metal frame, and Located at the gap position; wherein,

所述辐射体包括第一辐射体和第二辐射体,所述天线组件还包括第一接地点、第一馈电点和第二接地点,所述第一辐射体与所述第一接地点和第一馈电点电性连接,所述第二辐射体与所述第二接地点电性连接,且所述第二辐射体与所述第一辐射体耦合。The radiator includes a first radiator and a second radiator, the antenna assembly further includes a first ground point, a first feeding point and a second ground point, the first radiator and the first ground point It is electrically connected to the first feeding point, the second radiator is electrically connected to the second ground point, and the second radiator is coupled to the first radiator.

本申请实施例还提供一种电子设备,包括电路板和中框组件,所述中框组件为上述中框组件,所述电路板和所述辐射体电性连接。An embodiment of the present application further provides an electronic device, including a circuit board and a middle frame assembly, the middle frame assembly is the above middle frame assembly, and the circuit board is electrically connected to the radiator.

本申请实施例提供的电子设备,第一辐射体和第二辐射体耦合,通过第一辐射体耦合激励第二辐射体,从而提高天线的性能。In the electronic device provided by the embodiment of the present application, the first radiator and the second radiator are coupled, and the coupling of the first radiator excites the second radiator, thereby improving the performance of the antenna.

附图说明Description of drawings

为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative efforts.

图1为本申请实施例提供的电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

图2为本申请实施例提供的电子设备的另一结构示意图。FIG. 2 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

图3为本申请实施例提供的电子设备的另一结构示意图。FIG. 3 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

图4为本申请实施例提供的电子设备的另一结构示意图。FIG. 4 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

图5为本申请实施例提供的电子设备的另一结构示意图。FIG. 5 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

图6为本申请实施例提供的中框组件的结构示意图。FIG. 6 is a schematic structural diagram of a middle frame assembly provided by an embodiment of the present application.

图7为本申请实施例提供的中框组件的部分结构示意图。FIG. 7 is a partial structural schematic diagram of a middle frame assembly provided by an embodiment of the present application.

图8为本申请实施例提供的中框组件的另一部分结构示意图。FIG. 8 is a schematic structural diagram of another part of the middle frame assembly provided by the embodiment of the present application.

图9为本申请实施例提供的中框组件的另一部分结构示意图。FIG. 9 is a schematic structural diagram of another part of the middle frame assembly provided by the embodiment of the present application.

图10为本申请实施例提供的天线组件的结构示意图。FIG. 10 is a schematic structural diagram of an antenna assembly provided by an embodiment of the present application.

具体实施方式Detailed ways

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

本申请实施例提供一种显示屏组件及电子设备。以下将分别进行详细说明。该显示屏组件可以设置在该电子设备中,该电子设备可以是智能手机、平板电脑等设备。Embodiments of the present application provide a display screen component and electronic equipment. The details will be described respectively below. The display screen component can be set in the electronic device, and the electronic device can be a smart phone, a tablet computer and the like.

请参阅图1和图2,图1为本申请实施例提供的电子设备的结构示意图,图2为本申请实施例提供的电子设备的另一结构示意图。该电子设备10可以包括盖板11、显示屏12、电路板13、电池14、壳体15、摄像头16以及指纹解锁模块17。需要说明的是,图1和图2所示的电子设备10并不限于以上内容,其还可以包括其他器件,或不包括摄像头16,或不包括指纹解锁模块17。Please refer to FIG. 1 and FIG. 2. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application, and FIG. 2 is a schematic structural diagram of another electronic device provided by an embodiment of the present application. The electronic device 10 may include a cover plate 11 , a display screen 12 , a circuit board 13 , a battery 14 , a housing 15 , a camera 16 and a fingerprint unlocking module 17 . It should be noted that the electronic device 10 shown in FIG. 1 and FIG. 2 is not limited to the above content, and it may also include other devices, or not include the camera 16 , or not include the fingerprint unlocking module 17 .

其中,盖板11安装到显示屏12上,以覆盖显示屏12。盖板1可以为透明玻璃盖板,以便显示屏透光盖板11进行显示。在一些实施例中,盖板11可以是用诸如蓝宝石等材料制成的玻璃盖板。Wherein, the cover plate 11 is installed on the display screen 12 to cover the display screen 12 . The cover plate 1 can be a transparent glass cover plate, so that the light-transmitting cover plate 11 of the display screen can display. In some embodiments, the cover plate 11 may be a glass cover plate made of materials such as sapphire.

其中,该壳体15可以包括中框151和后盖152,中框151和后盖152相互组合形成该壳体15,该中框151和后盖152可以形成收纳空间,以收纳印制电路板13、显示屏12、电池14等器件。进一步的,盖板11可以固定到壳体15上,该盖板11和壳体15形成密闭空间,以容纳印制电路板13、显示屏12、电池14等器件。在一些实施例中,盖板11盖设到中框151上,后盖152盖设到中框151上,盖板11和后盖152位于中框151的相对面,盖板11和后盖152相对设置。Wherein, the housing 15 may include a middle frame 151 and a rear cover 152, the middle frame 151 and the rear cover 152 are combined to form the housing 15, and the middle frame 151 and the rear cover 152 may form a storage space for accommodating the printed circuit board 13. Display screen 12, battery 14 and other components. Further, the cover plate 11 can be fixed on the housing 15, and the cover plate 11 and the housing 15 form a closed space for accommodating the printed circuit board 13, the display screen 12, the battery 14 and other components. In some embodiments, the cover plate 11 is set on the middle frame 151, and the rear cover 152 is set on the middle frame 151. The cover plate 11 and the rear cover 152 are located on the opposite sides of the middle frame 151. relative settings.

在一些实施例中,壳体15可以为金属壳体,比如镁合金、不锈钢等金属。需要说明的是,本申请实施例壳体15的材料并不限于此,还可以采用其它方式,比如:壳体15可以为塑胶壳体。还比如:壳体15为陶瓷壳体。再比如:壳体15可以包括塑胶部分和金属部分,壳体15可以为金属和塑胶相互配合的壳体结构,具体的,可以先成型金属部分,比如采用注塑的方式形成镁合金基板,在镁合金基板上再注塑塑胶,形成塑胶基板,则构成完整的壳体结构。In some embodiments, the shell 15 can be a metal shell, such as magnesium alloy, stainless steel and other metals. It should be noted that the material of the housing 15 in the embodiment of the present application is not limited thereto, and other methods may also be used, for example, the housing 15 may be a plastic housing. Another example: the shell 15 is a ceramic shell. Another example: the housing 15 can include a plastic part and a metal part, and the housing 15 can be a shell structure in which metal and plastic cooperate with each other. Specifically, the metal part can be formed first, such as forming a magnesium alloy substrate by injection molding. Plastic is then injected on the alloy substrate to form a plastic substrate, which constitutes a complete shell structure.

需要说明的是,本申请实施例壳体的结构并不限于此,比如:后盖和中框一体成型形成一完成的壳体15结构,该壳体直接具有一收纳空间,用于收纳印制电路板13、显示屏12、电池14等器件。It should be noted that the structure of the housing in the embodiment of the present application is not limited thereto. For example, the rear cover and the middle frame are integrally formed to form a completed housing 15 structure. The housing directly has a storage space for storing printed Circuit board 13, display screen 12, battery 14 and other devices.

其中,该印制电路板13安装在壳体15中,该印制电路板13可以为电子设备10的主板,印制电路板13上可以集成有马达、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头16、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。Wherein, the printed circuit board 13 is installed in the housing 15, the printed circuit board 13 can be the main board of the electronic device 10, and the printed circuit board 13 can be integrated with a motor, a microphone, a speaker, an earphone jack, a universal serial One, two or more of functional components such as bus interface, camera 16, distance sensor, ambient light sensor, receiver and processor.

在一些实施例中,该印制电路板13可以固定在壳体15内。具体的,该印制电路板13可以通过螺钉螺接到中框151上,也可以采用卡扣的方式卡配到中框151上。需要说明的是,本申请实施例印制电路板13具体固定到中框151上的方式并不限于此,还可以其它方式,比如通过卡扣和螺钉共同固定的方式。In some embodiments, the printed circuit board 13 can be fixed in the housing 15 . Specifically, the printed circuit board 13 can be screwed to the middle frame 151 by screws, or can be snapped to the middle frame 151 by buckling. It should be noted that, the method of fixing the printed circuit board 13 to the middle frame 151 in the embodiment of the present application is not limited to this, and other methods can also be used, such as fixing together by buckles and screws.

其中,该电池14安装在壳体15中,电池14与该印制电路板13进行电连接,以向电子设备10提供电源。壳体15可以作为电池14的电池盖。壳体15覆盖电池14以保护电池14,具体的是后盖覆盖电池14以保护电池14,减少电池14由于电子设备10的碰撞、跌落等而受到的损坏。Wherein, the battery 14 is installed in the housing 15 , and the battery 14 is electrically connected to the printed circuit board 13 to provide power to the electronic device 10 . The case 15 may serve as a battery cover for the battery 14 . The casing 15 covers the battery 14 to protect the battery 14 , specifically, the back cover covers the battery 14 to protect the battery 14 , so as to reduce the damage to the battery 14 due to the collision and drop of the electronic device 10 .

其中,该显示屏12安装在壳体15中,同时,该显示屏12电连接至印制电路板13上,以形成电子设备10的显示面。该显示屏12可以包括显示区域和非显示区域。该显示区域可以用来显示电子设备10的画面或者供用户进行触摸操控等。该非显示区域的顶部区域开设供声音、及光线传导的开孔,该非显示区域底部上可以设置指纹模组、触控按键等功能组件。其中该盖板11安装到显示屏12上,以覆盖显示屏12,可以形成与显示屏12相同的显示区域和非显示区域,也可以形成不同的显示区域和非显示区域。Wherein, the display screen 12 is installed in the housing 15 , and at the same time, the display screen 12 is electrically connected to the printed circuit board 13 to form the display surface of the electronic device 10 . The display screen 12 may include a display area and a non-display area. The display area may be used to display the screen of the electronic device 10 or provide touch manipulation by the user. The top area of the non-display area is provided with openings for sound and light transmission, and the bottom of the non-display area can be provided with functional components such as fingerprint modules and touch buttons. Wherein the cover plate 11 is installed on the display screen 12 to cover the display screen 12, and may form the same display area and non-display area as the display screen 12, or may form different display areas and non-display areas.

需要说明的是,该显示屏12的结构并不限于此。比如,该显示屏12可以为异形屏,具体的,请参阅图3,图3为本申请实施例提供的电子设备的另一结构示意图。图3中的电子设备与图1中的电子设备的区别在于:该电子设备20包括显示屏22、盖板21、印制电路板23、电池24和壳体25。其中显示屏22直接在其上形成有可透光区域28。具体的,比如:显示屏22设置有在厚度方向上贯穿显示屏22的通孔,该可透光区域28可以包括该通孔,通孔位置可以设置前置摄像头、听筒、传感器等功能组件。再比如:显示屏22设置有非显示区域,该可透光区域28可以包括该非显示区域。其中,该盖板21适合显示屏22的结构设置。需要说明的是,壳体25可以参阅以上壳体15,印制电路板23可以参阅以上印制电路板13,电池24可以参阅以上电池14,在此不再赘述。It should be noted that, the structure of the display screen 12 is not limited thereto. For example, the display screen 12 may be a special-shaped screen. For details, please refer to FIG. 3 , which is another schematic structural diagram of the electronic device provided by the embodiment of the present application. The difference between the electronic device in FIG. 3 and the electronic device in FIG. 1 is that the electronic device 20 includes a display screen 22 , a cover plate 21 , a printed circuit board 23 , a battery 24 and a casing 25 . Wherein the display screen 22 is directly formed with a light-permeable area 28 thereon. Specifically, for example: the display screen 22 is provided with a through hole penetrating through the display screen 22 in the thickness direction, the permeable area 28 may include the through hole, and functional components such as a front camera, an earpiece, and a sensor may be arranged at the position of the through hole. For another example: the display screen 22 is provided with a non-display area, and the permeable area 28 may include the non-display area. Wherein, the cover plate 21 is suitable for the structural setting of the display screen 22 . It should be noted that, for the case 25, refer to the above case 15, for the printed circuit board 23, refer to the above printed circuit board 13, and for the battery 24, refer to the above battery 14, which will not be repeated here.

请参阅图4,图4为本申请实施例提供的另一电子设备的结构示意图,图4中的电子设备与图1中的电子设备的区别在于:图4中的电子设备30包括显示屏32、盖板31、印制电路板33、电池34和壳体35。其中,显示屏32在其周缘设置有缺口121,该缺口121可以放置前置摄像头、听筒、传感器等功能组件。其中,盖板31适合显示屏11的结构设置,该盖板31可以在缺口121设置等大的缺口,该盖板31也可以覆盖到缺口121位置。需要说明的是,壳体3可以参阅以上壳体15,印制电路板33可以参阅以上印制电路板13,电池34可以参阅以上电池14,在此不再赘述。Please refer to FIG. 4. FIG. 4 is a schematic structural diagram of another electronic device provided by the embodiment of the present application. The difference between the electronic device in FIG. 4 and the electronic device in FIG. 1 is that the electronic device 30 in FIG. 4 includes a display screen 32 , cover plate 31 , printed circuit board 33 , battery 34 and housing 35 . Wherein, the display screen 32 is provided with a notch 121 on its periphery, and the notch 121 can place functional components such as a front camera, an earpiece, and a sensor. Wherein, the cover plate 31 is suitable for the structural setting of the display screen 11 , and the cover plate 31 can be provided with a gap of equal size in the notch 121 , and the cover plate 31 can also cover the position of the notch 121 . It should be noted that, for the housing 3, refer to the above housing 15, for the printed circuit board 33, refer to the above printed circuit board 13, and for the battery 34, refer to the above battery 14, which will not be repeated here.

还需要说明的是,在一些实施例中,显示屏12也可以不包括非显示区域,而设置成全面屏结构,可以将距离传感器、环境光传感器等功能组件设置于显示屏下方或其他位置处。具体的,请参阅图5,图5为本申请实施例提供的电子设备的另一结构示意图。该电子设备40包括显示屏42、盖板41、印制电路板43、电池44和壳体45。其中,显示屏42覆盖于壳体45上,而不具有非显示区域。其中,盖板41适合显示屏42的大小设置。需要说明的是,壳体45可以参阅以上壳体15,印制电路板43可以参阅以上印制电路板13,电池44可以参阅以上电池14,在此不再赘述。It should also be noted that, in some embodiments, the display screen 12 may not include a non-display area, but may be configured as a full-screen structure, and functional components such as a distance sensor and an ambient light sensor may be disposed under the display screen or at other positions. . Specifically, please refer to FIG. 5 . FIG. 5 is another schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 40 includes a display screen 42 , a cover plate 41 , a printed circuit board 43 , a battery 44 and a casing 45 . Wherein, the display screen 42 covers the casing 45 without a non-display area. Wherein, the cover plate 41 is suitable for the size setting of the display screen 42 . It should be noted that, for the case 45, refer to the above case 15, for the printed circuit board 43, refer to the above printed circuit board 13, and for the battery 44, refer to the above battery 14, which will not be repeated here.

在一些实施例中,显示屏12可以为液晶显示屏(Liquid Crystal Display,LCD)或有机发光二极管显示屏(Organic Light-Emitting Diode,OLED)等类型的显示屏。在一些实施例中,当显示屏12为液晶显示屏时,电子设备10还可以包括背光模组,图中未示出背光模组,该背光模组可以参阅现有技术中的背光模组。In some embodiments, the display screen 12 may be a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode display (Organic Light-Emitting Diode, OLED) or other type of display. In some embodiments, when the display screen 12 is a liquid crystal display screen, the electronic device 10 may further include a backlight module, which is not shown in the figure, and the backlight module may refer to backlight modules in the prior art.

在一些实施例中,电子设备10还可以包括辐射体,用于收发信号。该辐射体可以安装到壳体15上,比如中框151上。该辐射体可以与中框151形成一体式结构,定义为中框组件。下面以中框组件为例进行详细说明。In some embodiments, the electronic device 10 may further include a radiator for sending and receiving signals. The radiator can be installed on the casing 15 , such as the middle frame 151 . The radiator can form an integrated structure with the middle frame 151, which is defined as a middle frame component. The following takes the middle frame component as an example to describe in detail.

请参阅图6,图6为本申请实施例提供的中框组件的结构示意图。该中框组件100可以包括金属基板130、非金属基板140、金属边框120和辐射体110。Please refer to FIG. 6 . FIG. 6 is a schematic structural diagram of a middle frame assembly provided by an embodiment of the present application. The middle frame assembly 100 may include a metal substrate 130 , a non-metal substrate 140 , a metal frame 120 and a radiator 110 .

其中,金属基板130可以为镁合金基板,具体可以参阅以上中框151,在此不再赘述。Wherein, the metal substrate 130 may be a magnesium alloy substrate, for details, please refer to the above middle frame 151 , which will not be repeated here.

其中,金属边框120可以为镁合金边框,该金属边框120可以和金属基板130一体成型,比如采用金属注塑的方式在模具中注塑成型,再比如采用机械加工的方式一体成型,还比如通过焊接的方式固定连接。在一些实施例中,该金属边框120位于金属基板130的周缘。Wherein, the metal frame 120 can be a magnesium alloy frame, and the metal frame 120 can be integrally formed with the metal substrate 130, such as by metal injection molding in a mold, or by mechanical processing, or by welding fixed connection. In some embodiments, the metal frame 120 is located on the periphery of the metal substrate 130 .

在一些实施例中,请参阅图7,图7为本申请实施例提供的金属基板和金属边框配合的结构示意图。该金属基板130和金属边框120之间形成有多个缝隙,每一缝隙在金属边框120的厚度方向上贯穿金属边框120。且每一个缝隙包括至少一个开口,每一开口从金属基板130至金属边框120至外界方向贯穿金属边框120。In some embodiments, please refer to FIG. 7 . FIG. 7 is a schematic structural diagram of the cooperation between the metal substrate and the metal frame provided by the embodiment of the present application. A plurality of gaps are formed between the metal substrate 130 and the metal frame 120 , and each gap penetrates the metal frame 120 in the thickness direction of the metal frame 120 . And each gap includes at least one opening, and each opening penetrates the metal frame 120 from the metal substrate 130 to the metal frame 120 to the outside.

在一些实施例中,缝隙包括第一缝隙131和第二缝隙132。其中,第一缝隙131具有第一开口1311,第一缝隙131可以从第一开口1311一侧延伸形成,及第一缝隙131包括第一缺口1312;第二缝隙132具有第二开口1321,第三缝隙132可以从第二开口1321一侧延伸形成,及第二缝隙132包括第二缺口1322。In some embodiments, the slots include a first slot 131 and a second slot 132 . Wherein, the first slit 131 has a first opening 1311, the first slit 131 can be formed by extending from one side of the first opening 1311, and the first slit 131 includes a first notch 1312; the second slit 132 has a second opening 1321, the third The slit 132 can be formed extending from one side of the second opening 1321 , and the second slit 132 includes a second notch 1322 .

其中,非金属基板140设置于缝隙内,非金属基板140在缝隙内分别与金属基板130、辐射体110固定连接。具体的,该非金属基板140可以包括第一非金属基板141和第二非金属基板142。其中,第一非金属基板141可以设置于第一缝隙131内,第二非金属基板142可以设置于第二缝隙132内。该非金属基板140可以采用塑胶注塑的方式成型在缝隙内。Wherein, the non-metallic substrate 140 is arranged in the gap, and the non-metallic substrate 140 is fixedly connected with the metal substrate 130 and the radiator 110 in the gap respectively. Specifically, the non-metal substrate 140 may include a first non-metal substrate 141 and a second non-metal substrate 142 . Wherein, the first non-metallic substrate 141 can be disposed in the first gap 131 , and the second non-metallic substrate 142 can be disposed in the second gap 132 . The non-metal substrate 140 can be molded in the gap by plastic injection molding.

其中,辐射体110包括两个辐射体,两个辐射体通过耦合相互配合,进而提高电子设备的天线性能。其中一辐射体通过一馈电点150电性连接到印制电路板13以实现信号的传输,另一辐射体通过耦合以实现信号的传输,以及每一辐射体110均通过接地点160电性连接到金属基板130实现接地。Wherein, the radiator 110 includes two radiators, and the two radiators cooperate with each other through coupling, thereby improving the performance of the antenna of the electronic device. One of the radiators is electrically connected to the printed circuit board 13 through a feed point 150 to realize signal transmission, the other radiator is coupled to realize signal transmission, and each radiator 110 is electrically connected to the printed circuit board 13 through a ground point 160. Connect to metal substrate 130 for grounding.

在一些实施例中,辐射体110可以包括两个辐射体,包括:第一辐射体111和第二辐射体112。In some embodiments, the radiator 110 may include two radiators, including: a first radiator 111 and a second radiator 112 .

其中,第一辐射体111形成在第一缝隙131位置,具体的,第一辐射体111形成在第一缺口1312位置,该第一辐射体111与第一缺口1312相邻,该第一辐射体111与第一接地点161和第一馈电点150连接。该第一辐射体111可以收发低频段(700-960MHz)以及高频段(2300-2690MHz)的信号。需要说明的是,该第一辐射体111并不限于收发低频段以及高频段的信号,还可以收发其他信号。Wherein, the first radiator 111 is formed at the position of the first slot 131, specifically, the first radiator 111 is formed at the position of the first notch 1312, the first radiator 111 is adjacent to the first notch 1312, and the first radiator 111 is connected to the first ground point 161 and the first feeding point 150 . The first radiator 111 can send and receive signals in the low frequency band (700-960 MHz) and high frequency band (2300-2690 MHz). It should be noted that the first radiator 111 is not limited to sending and receiving low-frequency and high-frequency signals, and can also send and receive other signals.

其中,第二辐射体112形成在第二缝隙132位置,具体的,第二辐射体112形成在第二缺口1322位置,该第二辐射体112与第二缺口1322相邻,该第二辐射体112与第二接地点162连接。该第二辐射体112可以在第一辐射体111耦合激励下,收发中频段(1710-2170MHz)的信号。需要说明的是,该第二辐射体112并不限于收发低频段以及中频段的信号,还可以收发其他信号。Wherein, the second radiator 112 is formed at the position of the second slit 132, specifically, the second radiator 112 is formed at the position of the second notch 1322, the second radiator 112 is adjacent to the second notch 1322, the second radiator 112 is connected to the second ground point 162 . The second radiator 112 can transmit and receive signals in the middle frequency band (1710-2170 MHz) under the coupling excitation of the first radiator 111 . It should be noted that the second radiator 112 is not limited to sending and receiving low-frequency and mid-frequency signals, and can also send and receive other signals.

在一些实施例中,第一辐射体111和第二辐射体112位于金属边框120同一侧,第一辐射体111和第二辐射体112之间设有间隙孔113,其中,第一辐射体111和第二辐射体112通过该间隙孔113相互绝缘。进一步的,该间隙孔113位于第一开口1311和第二开口1321之间。In some embodiments, the first radiator 111 and the second radiator 112 are located on the same side of the metal frame 120, and a clearance hole 113 is provided between the first radiator 111 and the second radiator 112, wherein the first radiator 111 and the second radiator 112 are insulated from each other through the gap hole 113 . Further, the clearance hole 113 is located between the first opening 1311 and the second opening 1321 .

需要说明的是,该间隙孔113可以为耳机孔、或USB接口,其中,耳机孔可用于插接耳机,USB接口可用于插接USB接头。It should be noted that the gap hole 113 can be an earphone hole or a USB interface, wherein the earphone hole can be used to insert an earphone, and the USB interface can be used to insert a USB connector.

由上可知,本申请实施例设置两个辐射体,通过两个辐射体之间的相互配合,可以增加信号收发强度和频段,提高电子设备天线的性能。It can be known from the above that two radiators are provided in the embodiment of the present application, and through the mutual cooperation between the two radiators, the strength and frequency band of signal transmission and reception can be increased, and the performance of the antenna of the electronic device can be improved.

以上为本申请实施例提供的电子设备采用两个个辐射体为例进行示例性说明,需要说明的是,在其他一些实施例中,可通过在辐射体增加一些调节频段的电路器件,可进一步提高天线的性能。The above electronic equipment provided by the embodiment of the present application uses two radiators as an example for illustration. Improve the performance of the antenna.

比如,请参阅图8,图8为本申请实施例提供的中框组件的另一部分结构示意图。图8所示的中框组件可以包括金属边框120、金属基板130和辐射体110。其中金属基板130可以参阅以上内容,在此不再赘述。其中,金属边框120可以参阅以上内容,在此不再赘述。其中,辐射体110可以参阅以上内容,在此不再赘述.。For example, please refer to FIG. 8 , which is a schematic structural diagram of another part of the middle frame assembly provided by the embodiment of the present application. The middle frame assembly shown in FIG. 8 may include a metal frame 120 , a metal substrate 130 and a radiator 110 . For the metal substrate 130 , reference can be made to the above content, which will not be repeated here. Wherein, for the metal frame 120, reference may be made to the above content, which will not be repeated here. Wherein, for the radiator 110, reference may be made to the above content, which will not be repeated here.

需要说明的是,第二辐射体112和第二接地点162之间设有电感170,即第二辐射体112依次通过电感170、第二接地点162电性连接到金属基板130实现接地。用户可以根据需要选取合适的电感170,以提高天线的性能。It should be noted that an inductor 170 is provided between the second radiator 112 and the second ground point 162 , that is, the second radiator 112 is electrically connected to the metal substrate 130 through the inductor 170 and the second ground point 162 to achieve grounding. The user can select a suitable inductor 170 according to needs to improve the performance of the antenna.

比如,请参阅图9,图9为本申请实施例提供的中框组件的另一部分结构示意图。图9所示的中框组件均可以包括金属边框120、金属基板130和辐射体110。其中金属基板130可以参阅以上内容,在此不再赘述。其中,金属边框120可以参阅以上内容,在此不再赘述。其中,辐射体110可以参阅以上内容,在此不再赘述.。For example, please refer to FIG. 9 , which is a schematic structural diagram of another part of the middle frame assembly provided by the embodiment of the present application. Each of the middle frame components shown in FIG. 9 may include a metal frame 120 , a metal substrate 130 and a radiator 110 . For the metal substrate 130 , reference can be made to the above content, which will not be repeated here. Wherein, for the metal frame 120, reference may be made to the above content, which will not be repeated here. Wherein, for the radiator 110, reference may be made to the above content, which will not be repeated here.

需要说明的是,第二辐射体112和第二接地点162之间设有可变电感180,即第二辐射体112依次通过可变电感180、第二接地点162电性连接到金属基板130实现接地。用户可以根据需要调节可变电感180的值,以提高天线的性能。It should be noted that a variable inductor 180 is provided between the second radiator 112 and the second ground point 162, that is, the second radiator 112 is electrically connected to the metal via the variable inductor 180 and the second ground point 162 in turn. The substrate 130 is grounded. Users can adjust the value of the variable inductance 180 as required to improve the performance of the antenna.

请参阅图10,图10为本申请实施例提供的天线的结构示意图。该天线组件1可以包括基板130和金属边框120。Please refer to FIG. 10 . FIG. 10 is a schematic structural diagram of an antenna provided in an embodiment of the present application. The antenna assembly 1 may include a substrate 130 and a metal frame 120 .

其中,基板130可以为金属基板130,金属基板130可以为镁合金基板,具体可以参阅以上内容,在此不再赘述。Wherein, the substrate 130 may be a metal substrate 130 , and the metal substrate 130 may be a magnesium alloy substrate. For details, please refer to the above content, and details will not be repeated here.

其中,金属边框120可以为镁合金边框,具体可以参阅以上内容,在此不再赘述。Wherein, the metal frame 120 may be a magnesium alloy frame, for details, please refer to the above content, which will not be repeated here.

在一些实施例中,金属基板130和金属边框120可以通过注塑的方式一体成型,以形成多个缝隙和多个辐射体。其中,缝隙可以参阅以上内容,在此不再赘述。其中,辐射体可以参阅以上内容,在此不再赘述。In some embodiments, the metal substrate 130 and the metal frame 120 may be integrally formed by injection molding to form a plurality of slits and a plurality of radiators. Wherein, for the gap, reference may be made to the above content, and details are not repeated here. Wherein, for the radiator, reference may be made to the above contents, and details are not repeated here.

以上对本申请实施例提供的天线组件、中框组件及电子设备进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。The antenna assembly, middle frame assembly and electronic equipment provided by the embodiments of the present application are described above in detail. In this paper, specific examples are used to illustrate the principles and implementation methods of the present application. The descriptions of the above embodiments are only used to help understand this application. Application. At the same time, for those skilled in the art, based on the idea of this application, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as limiting the application.

Claims (15)

1. An antenna assembly, comprising a substrate, a metal frame, and a radiator, wherein the metal frame is formed on the periphery of the substrate, the antenna assembly further comprises a slot, the slot is located between the metal frame and the substrate, the slot has an opening penetrating through the metal frame in the direction from the substrate to the metal frame, and the radiator is formed on the metal frame and located at the slot; wherein,
the antenna assembly further comprises a first grounding point, a first feeding point and a second grounding point, the first radiating body is electrically connected with the first grounding point and the first feeding point, the second radiating body is electrically connected with the second grounding point, and the second radiating body is coupled with the first radiating body.
2. The antenna assembly of claim 1, wherein a clearance hole is provided between the first radiator and the second radiator, and the first radiator and the second radiator are insulated from each other by the clearance hole.
3. The antenna assembly of claim 2, wherein the slot comprises a first slot having a first opening and a second slot having a second opening, the first slot comprising a first notch on one side of the first opening, the second slot comprising a second notch on one side of the second opening; the first radiator is adjacent to the first gap, and the second radiator is adjacent to the second gap; wherein the clearance hole is located between the first opening and the second opening.
4. The antenna assembly of claim 2, wherein the clearance hole is an earphone hole, or a USB interface; the earphone hole is used for being plugged with an earphone, and the USB interface is used for being plugged with a USB connector.
5. The antenna assembly of claim 1, wherein the first radiator and the second radiator are located on a same side of the metal bezel.
6. The antenna assembly according to any one of claims 1-5, characterized in that an inductance is provided between the second ground point and the second radiator.
7. The antenna assembly of claim 6, wherein the inductance is a variable inductance.
8. A center frame assembly, comprising: the middle frame assembly further comprises a gap, the gap is located between the metal frame and the metal substrate, the gap is provided with an opening penetrating through the metal frame from the metal substrate to the metal frame in the direction of the metal frame, and the radiator is formed on the metal frame and located at the position of the gap; wherein,
the antenna assembly further comprises a first grounding point, a first feeding point and a second grounding point, the first radiating body is electrically connected with the first grounding point and the first feeding point, the second radiating body is electrically connected with the second grounding point, and the second radiating body is coupled with the first radiating body.
9. The middle frame assembly according to claim 8, wherein a clearance hole is provided between the first radiator and the second radiator, and the first radiator and the second radiator are insulated from each other by the clearance hole.
10. The center frame assembly of claim 9, wherein the slot includes a first slot having a first opening and a second slot having a second opening, the first slot including a first notch on one side of the first opening, the second slot including a second notch on one side of the second opening; the first radiator is adjacent to the first gap, and the second radiator is adjacent to the second gap; wherein the clearance hole is located between the first opening and the second opening.
11. The center frame assembly of claim 9, wherein the clearance hole is an earphone hole, or a USB interface; the earphone hole is used for being plugged with an earphone, and the USB interface is used for being plugged with a USB connector.
12. The middle frame assembly according to claim 8, wherein the first radiator and the second radiator are located on a same side of the metal bezel.
13. The center frame assembly according to any one of claims 8-12, wherein an inductance is provided between the second ground point and the second radiator.
14. The middle frame assembly of claim 13, wherein said inductor is a variable inductor.
15. An electronic device comprising a middle frame assembly according to any one of claims 8 to 14 and a circuit board electrically connected to the radiator.
CN201810055703.2A 2018-01-19 2018-01-19 Antenna module, middle frame module and electronic equipment Expired - Fee Related CN108270071B (en)

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CN110994158A (en) * 2019-12-26 2020-04-10 西安易朴通讯技术有限公司 Antenna assembly and electronic equipment
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