CN109348002B - Shell assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a shell assembly and electronic equipment, wherein the electronic equipment comprises the shell assembly and a circuit board, the circuit board is arranged on a shell, the shell assembly comprises a middle frame and a rear cover, and the middle frame is provided with a plurality of first radiating bodies; the rear cover is fixedly connected with the middle frame, the rear cover is provided with a plurality of second radiating bodies, and the projections of the second radiating bodies on the middle frame are not overlapped with the first radiating bodies.

Description

Shell assembly and electronic equipment

Technical Field

The present application relates to the field of electronic technologies, and in particular, to a housing assembly and an electronic device.

Background

With the development of communication technology, electronic devices such as smart phones are becoming more and more popular. In the using process of the electronic device, the electronic device can adopt the radiator thereof to transmit signals, so as to realize the communication of the electronic device.

In the related art, the radiator of the electronic device is disposed at the periphery of the middle frame of the electronic device, and the arrangement of the radiator at the periphery of the middle frame cannot meet the requirement of the electronic device along with the requirement of the electronic device on the performance of the radiator.

Disclosure of Invention

The embodiment of the application provides a shell assembly and an electronic device, which can meet the performance of a radiator in the electronic device.

An embodiment of the present application provides a housing assembly, which includes:

the middle frame is provided with a plurality of first radiating bodies; and

the rear cover is fixedly connected with the middle frame, the rear cover is provided with a plurality of second radiating bodies, and the projections of the second radiating bodies on the middle frame are not overlapped with the first radiating bodies.

An embodiment of the present application provides an electronic device, including:

a housing assembly, such as the housing assembly described above; and

the circuit board is arranged on the middle frame and provided with a plurality of first feed sources, a plurality of second feed sources, a plurality of first grounding points and a plurality of second grounding points, one first radiation body is connected with at least one first feed source, one first radiation body is connected with one first grounding point, one second radiation body is connected with at least one second feed source, and one second radiation body is connected with one second grounding point.

In the embodiment of the application, the first radiator on the middle frame and the second radiator on the rear cover can form a multi-radiator combination, and the requirement of multi-radiator design of the electronic device can be met. And the projection of the second radiator on the rear cover on the middle frame is not overlapped with the first radiator on the middle frame, so that the interference between the second radiator on the rear cover and the first radiator on the middle frame can be reduced, and the performance of each radiator in the electronic equipment can be met.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing assembly in an electronic device according to an embodiment of the present disclosure.

Fig. 3 is a schematic structural view of a middle frame of the housing assembly shown in fig. 2.

Fig. 4 is a schematic structural view of the middle frame of fig. 3 showing the matching between the frame and the substrate.

Fig. 5 is a schematic structural diagram of the circuit board and the middle frame in the electronic device according to the embodiment of the present application.

Fig. 6 is a schematic structural view of a rear cover in the housing assembly shown in fig. 2.

Fig. 7 is another schematic structural diagram of a rear cover in an electronic device according to an embodiment of the present application.

Fig. 8 is a schematic view showing the structure of the base in the rear cover shown in fig. 6.

Fig. 9 is a schematic structural diagram of a circuit board and a rear cover in an electronic device according to an embodiment of the present application.

Fig. 10 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 11 is a block diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The embodiment of the application provides a shell assembly and electronic equipment. The details will be described below separately. The shell assembly can be arranged in the electronic device, and the electronic device can be a smart phone, a tablet computer and the like.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. Electronic device 10 may include a housing assembly 11, a display 12, a circuit board 13, and a battery 14. It should be noted that the electronic device 10 is not limited to the above, and the electronic device 10 may include more devices, for example, the electronic device 10 may include a camera.

Wherein the housing assembly 11 may form an outer contour of the electronic device 10. In some embodiments, the housing component 11 may be a metal housing component, such as a metal such as magnesium alloy, stainless steel, and the like. It should be noted that the material of the housing assembly 11 according to the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the housing assembly 11 may be a plastic housing assembly, a ceramic housing assembly, a glass housing assembly, or the like. In some embodiments, the housing assembly 11 may be a regular structure, such as a rectangle, a rounded rectangle, or the like.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing assembly in an electronic device according to an embodiment of the present disclosure. The housing assembly 11 may include a middle frame 111 and a rear cover 112, and the rear cover 112 may be fixedly coupled to the middle frame 111. It should be noted that, in the description of the present application, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In some embodiments, the middle frame 111 is provided with a plurality of first radiators 1114, the rear cover 112 is provided with a plurality of second radiators 11212, and the first radiators 1114 on the middle frame 111 and the second radiators 11212 on the rear cover 112 may form a multi-radiator combination, which may meet the requirement of multi-radiator design of the electronic device 10. The projection of the second radiator 11212 on the middle frame 111 is not overlapped with the first radiator 1114, so that interference between the second radiator 11212 on the rear cover 112 and the first radiator 1114 on the middle frame 111 can be reduced, and the performance of each radiator in the electronic device 10 can be satisfied.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a middle frame of the housing assembly shown in fig. 2. The middle frame 111 may include a first end 11101, a second end 11102, a third end 11103, and a fourth end 11104. First end portion 11101 and second end portion 11102 may be disposed opposite to each other, third end portion 11103 and fourth end portion 11104 may be disposed opposite to each other, first end portion 1101 is connected between third end portion 11103 and fourth end portion 11104, and second end portion 11102 is connected between third end portion 11103 and fourth end portion 11104. It should be noted that each end of the middle frame 111 is not limited thereto, for example, the middle frame 111 has three ends, five ends, or more ends.

In some embodiments, the first end portion 11101 and the second end portion 11102 may be arranged at equal lengths, and the first end portion 11101 and the second end portion 11102 may also be arranged at different lengths, such as the length of the first end portion 11101 is greater than the length of the second end portion 11102. The third end portion 11103 and the fourth end portion 11104 may be arranged with equal length, and the third end portion 11103 and the fourth end portion 11104 may also be arranged with different lengths, for example, the length of the third end portion 11103 is greater than that of the fourth end portion 11104. Wherein, the length of the third end part 11103 can be greater than the length of the first end part 11101, and the length of the third end part 11103 can be greater than the length of the second end part 11102. Wherein, the length of the fourth end part 11104 may be greater than the length of the first end part 11101, and the length of the fourth end part 11104 may be greater than the length of the second end part 11102. The first end 11101 may be located at the top of the display screen 12, and the first end 11101 may also be located at the bottom of the display screen 12.

In some embodiments, the middle frame 111 may include a substrate 1111, a bezel 1112, and a first filling portion 1113. The substrate 1111 may be made of a metal material, such as a magnesium alloy, an aluminum alloy, or the like. The frame 1112 is disposed around a periphery of the substrate 1111, and the frame 1112 may be made of a metal material, such as magnesium alloy, aluminum alloy, or the like. The bezel 1112 and the substrate 1111 may be made of the same material, the bezel 1112 and the substrate 1111 may be integrally formed, and the bezel 1112 and the substrate 1111 may also be fixedly connected together by welding or other fixing means.

Referring to fig. 4, fig. 4 is a schematic view of a structure of the middle frame shown in fig. 3, in which the frame and the substrate are matched. A plurality of first slits 1115 may be disposed between the bezel 1112 and the substrate 1111, the first slits 1115 may penetrate through the substrate 1111 in the thickness direction of the substrate 1111, and the first slits 1115 may penetrate through the bezel 1112 in the thickness direction of the bezel 1112. First gap 1115 may block a portion of bezel 1112 from a portion of substrate 1111, forming a space. It is noted that, in the description of the present application, "a plurality" means two or more unless specifically defined otherwise.

In some embodiments, the first gap 1115 may be formed by machining, for example, a plate material to form the substrate 1111 and the bezel 1112, and a plurality of first gaps 1115 may be formed between the substrate 1111 and the bezel 1112. It should be noted that the forming manner of the first slots 1115 is not limited thereto, and the first slots 1115 may be formed by injection molding, for example, by injecting metal paste into a mold to form the substrate 1111 and the frame 1112, and forming the first slots 1115 between the substrate 1111 and the frame 1112.

In some embodiments, width L1 of bezel 1112 is 7.5 mm to 8.5 mm, width L1 of bezel 1112 may be 7.5 mm, width L1 of bezel 1112 may be 8 mm, and width L1 of bezel 1112 may be 8.5 mm. The width L2 of the first gap 1115 may be 1 mm to 2.5 mm, the width L2 of the first gap 1115 may be 1 mm, the width L2 of the first gap 1115 may be 2 mm, and the width L2 of the first gap 1115 may be 2.5 mm.

In some embodiments, a plurality of first radiators 1114 may be formed on the bezel 1112, where the first radiators 1114 are formed directly on the bezel 1112, or the first radiators 1114 are part of the bezel 1112. The first radiator 1114 is formed by first slots 1115, each first slot 1115 may form one or more first radiators 1114, the first radiators 1114 being located outside the first slots 1115. The first radiator 1114 may surround a circumference of the substrate 1111. The width of the first radiator 1114 may be equal to the width of the bezel 1112.

The one or more first radiators 1114 may transmit and receive 2G (2-Generation wireless telephone technology, second Generation mobile phone communication technology), 3G (3rd-Generation, third Generation mobile communication technology), or 4G (the 4th Generation mobile communication technology, fourth Generation mobile communication technology) signals. The one or more first radiators 1114 may transmit and receive 5G (5th-Generation, fifth Generation mobile communication technology) signals. The one or more first radiators 1114 may transmit and receive WIreless-Fidelity (WiFi) signals or Global Positioning System (GPS) signals.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a circuit board and a middle frame of an electronic device according to an embodiment of the present disclosure. A first radiator 1114 may be connected to a first feed 1301 on the circuit board 13 and a first radiator 1114 may be connected to a first ground 1302 on the circuit board 13. One first radiator 1114, one first feed 1302, and one first ground point 1302 may form one antenna structure, and one antenna structure formed by one first radiator 1114, one first feed 1301, and one first ground point 1302 may be used as a 2G antenna, a 3G antenna, a 4G antenna, a 5G antenna, a WiFi antenna, or a GPS antenna.

In some embodiments, the middle frame 111 may form ten first radiators 1114 on the bezel 1112. Three first radiators 1114 may be formed on the frame 1112 of the first end 11101, one first radiator 1114 in the middle of the first end 11101 may transmit and receive 2G signals, 3G signals or 4G signals, and one first radiator 1114 in the middle of the first end 11101 may also transmit and receive WiFi signals or GPS signals. The first radiators 1114 at the two ends of the first end 11101 may transmit and receive 5G signals, and the first radiators 1114 at the two ends of the first end 11101 may have switches, so as to implement switching of the frequency bands 3.3G to 3.6G and 4.8G to 5G.

It should be noted that the first radiator 1114 at both ends of the first end portion 11101 may be located at a corner of the middle frame 111, the first radiator 1114 at one end of the first end portion 11101 may extend to the third end portion 11103, and the first radiator 1114 at the other end of the first end portion 11101 may extend to the fourth end portion 11104.

Three first radiators 1114 may be formed on the frame 1112 of the second end portion 11102, one first radiator 1114 in the middle of the second end portion 11102 may transmit and receive a 2G signal, a 3G signal or a 4G signal, and one first radiator 1114 in the middle of the second end portion 11102 may also transmit and receive a WiFi signal or a GPS signal. The first radiators 1114 at the two ends of the second end portion 11102 may transmit and receive 5G signals, and the first radiators 1114 at the two ends of the second end portion 11101 may have switches, so that the switching of the frequency bands 3.3G to 3.6G and 4.8G to 5G may be achieved.

It should be noted that the first radiator 1114 at the two ends of the second end portion 11102 may be located at a corner position of the middle frame 111, the first radiator 1114 at one end of the second end portion 11102 may extend to the third end portion 11103, and the first radiator 1114 at the other end of the second end portion 11102 may extend to the fourth end portion 11104.

In some embodiments, a first radiator 1114 located in the middle of the first end 11101 receives and transmits signals different from a first radiator 1114 located in the middle of the second end 11102, such as: a first radiator 1114 of the middle position of the first end portion 11101 receives and transmits 2G signals, 3G signals or 4G signals, and a first radiator 1114 of the middle position of the second end portion 11102 receives and transmits WiFi signals or GPS signals.

Two first radiators 1114 may be formed on the frame 1112 of the third end portion 11103, the first radiator 1114 of the third end portion 11103 may transmit and receive 5G signals, and the first radiator 1114 of the third end portion 11103 may have a switch, which may implement switching of bands 3.3G to 3.6G and 4.8G to 5G.

Two first radiators 1114 may be formed on the frame 1112 of the fourth terminal 11104, the first radiator 1114 of the fourth terminal 11104 may receive and transmit 5G signals, and the first radiator 1114 of the fourth terminal 11104 may have a switch, so that switching between a frequency band 3.3G-3.6G and a frequency band 4.8G-5G may be achieved.

In some embodiments, referring to fig. 2, 3 and 5, the first filler 1113 may be disposed in the first slot 1115 to fixedly connect the plurality of first radiators 1114 and the substrate 1111 together. The number of the first filling parts 1113 may be the same as the number of the first slots 1115, one first filling part 1113 may be disposed in one first slot 1115, and the width of the first filling part 1113 may be the same as the width of the first slot 1115. The first filling portion 1113 may be made of a non-conductive material, for example, the first filling portion 1113 is made of a plastic material. The first filling part 1113 may be formed in the first gap 1115 by injection molding.

The electronic device 10 according to the embodiment of the present application may form an 8X 85G MIMO antenna on the middle frame 111, and the electronic device 10 may implement a multi-antenna layout.

Referring to fig. 6, fig. 6 is a schematic structural view of a rear cover in the housing assembly shown in fig. 2. The rear cover 112 may include a first side 11201, a second side 11202, a third side 11203, and a fourth side 11204, the first side 11201 and the second side 11202 may be disposed opposite to each other, the third side 11203 and the fourth side 11204 may be disposed opposite to each other, the first side 11201 is connected between the third side 11203 and the fourth side 11204, and the second side 11202 is connected between the third side 11203 and the fourth side 11204. It should be noted that the respective sides of the rear cover 112 are not limited thereto, for example, the rear cover 112 has three sides, five sides or more.

In some embodiments, the first side 11201 and the second side 11202 may be equally spaced, and the first side 11201 and the second side 11202 may be unequal, such as the first side 11201 having a length greater than the second side 11202. The third side 11203 and the fourth side 11204 may be equal in length, and the third side 11203 and the fourth side 11204 may or may not be equal in length, for example, the third side 11203 has a length greater than that of the fourth side 11204. Wherein the length of the third side 11203 is greater than the length of the first side 11201 and the length of the third side 11203 is greater than the length of the second side 11202. Wherein the length of the fourth side 11204 is greater than the length of the first side 11201, and the length of the fourth side 11204 is greater than the length of the second side 11202.

The first side portion 11201 may be far from the top of the display screen 12, and the first side portion 11201 may also be far from the bottom of the display screen 12. In some embodiments, referring to fig. 2, the first side 11201 is distal from the second end 11102, and the first side 11201 and the first end 11101 are located at the same end of the housing assembly 11. The first side portion 11201 and the first end portion 11101 may be spaced apart from each other, and a clearance area may be formed between the first side portion 11201 and the first end portion 11101. The three first radiators 1114 of the first end 11101 are located between the first end 11101 and the first side 11201. The three first radiators 1114 of the first end portion 11101 may be spaced apart from the first side portion 111201, and the distance between the three first radiators 1114 of the first end portion 11101 and the first side portion 111201 may be set according to actual requirements.

The second side 11202 may be far from the top of the display 12, and the second side 11202 may also be far from the bottom of the display 12. In some embodiments, referring to fig. 2, the second side 11202 is distal from the first end 11101, and the second side 11202 and the second end 11102 are at the same end of the housing assembly 11. The second side 11202 and the second end 11102 may be spaced apart from each other, and a clearance area may be formed between the second side 11202 and the second end 11102. Wherein the three first radiators 1114 of the second end 11102 are located between the second side 11202 and the second end 11102. The three first radiators 1114 of the second end portion 11102 may be spaced apart from the second side portion 111202, and the distance between the three first radiators 1114 of the second end portion 11102 and the second side portion 111202 may be set according to actual requirements.

Referring to fig. 7, fig. 7 is another schematic structural diagram of a rear cover in an electronic device according to an embodiment of the present disclosure. The rear cover 112 may also include a first protective cover 1123 and a second protective cover 1124.

The first protection cover 1123 is made of a non-metal material, for example, the first protection cover 1123 is made of a plastic material. First protecting cover 1123 and first side 11201 fixed connection, first protecting cover 1123 and first side 11201 can adopt the mode of moulding plastics to mould. The first protection cover 1123 is located between the first side portion 11201 and the first end portion 11101, a width of the first protection cover 1123 may be equal to a distance between the first side portion 11201 and the first end portion 11101, and a width of the first protection cover 1123 may be slightly smaller than a distance between the first side portion 11201 and the first end portion 11101.

The second protection cover 1124 is made of a non-metal material, for example, the second protection cover 1124 is made of a plastic material. The second protective cover 1124 is fixedly connected to the second side 11202, and the second protective cover 1124 and the second side 11202 may be formed by injection molding. The second protective cover 1124 is located between the second side portion 11202 and the second end portion 11102, and the width of the second protective cover 1124 may be equal to the distance between the second side portion 11202 and the second end portion 11102, or slightly smaller than the distance between the second side portion 11202 and the second end portion 11102.

In some embodiments, the rear cover 112 may include a base 1121 and a second filling portion 1122. The substrate 1121 may be made of a metal material, such as a magnesium alloy, an aluminum alloy, or the like. The second filling portion 1122 may be made of a non-metal material, such as a plastic material.

Referring to fig. 8, fig. 8 is a schematic structural diagram of the substrate in the back cover shown in fig. 6. The base 1121 is provided with a plurality of second slits 11211, and the second slits 11211 may penetrate the base 1121 in the thickness direction of the base 1121. In some embodiments, the second slits 11211 can be formed by machining, such as machining a plate to form the substrate 1121, and forming a plurality of second slits 11211 on the substrate 1121. It should be noted that the forming manner of the plurality of second gaps 11211 is not limited thereto, and the plurality of second gaps 11211 may be formed by injection molding, such as injection molding of metal paste in a mold to form the substrate 1121, and forming the plurality of second gaps 11211 on the substrate 1121.

The second filling portion 1122 may be disposed in the second gap 11211, and the second filling portion 1122 may be formed in the second gap 11211 by injection molding. The thickness of the second filling portion 1122 may be the same as the thickness of the base 1121.

In some embodiments, a plurality of second radiators 11212 are disposed on the rear cover 112, and the plurality of second radiators 11212 may be formed at a peripheral position of the substrate 1121. The second radiators 11212 are formed of second slots 11211, and each second slot 11211 may form one or more second radiators 11212, the second radiators 11212 being located outside the second analysis 11212.

In some embodiments, the width L3 of the second radiator 11212 may be 7.5 mm to 8.5 mm, the width L3 of the second radiator 11212 may be 7.5 mm, the width L3 of the second radiator 11212 may be 8 mm, and the width L3 of the second radiator 11212 may be 8.5 mm. The width L4 of the second gap 11211 may be 2.5 mm to 3.5 mm, the width L4 of the second gap 11211 may be 2.5 mm, the width L4 of the second gap 11211 may be 3 mm, and the width L4 of the second gap 11211 may be 3.5 mm. In some embodiments, the width L4 of the second gap 11211 may be greater than the width L2 of the first gap 1114.

The plurality of second radiators 11212 may transmit and receive 5G signals.

Referring to fig. 9, fig. 9 is a schematic structural diagram of a circuit board and a rear cover of an electronic device according to an embodiment of the present disclosure. A second radiator 11212 may be connected to a second feed 1303 on the circuit board 13, and a second radiator 11212 may be connected to a second ground point 1304 on the circuit board 13. One antenna structure can be formed by one second radiator 11212, one second feed 1303 and one second grounding point 1304, and one antenna structure formed by one second radiator 11212, one second feed 1303 and one second grounding point 1304 can be used as a 5G antenna.

In some embodiments, the rear cover 112 may have four second slots 1122 on the substrate 1121, the rear cover 112 may have four second radiators 11212 on the substrate 1121, and one second radiator 1121 may be formed by one second slot 1122.

Two second radiators 11212 are formed on the substrate 1121 of the first side portion 11201, and the two second radiators 11212 on the first side portion 11201 are spaced apart from each other. In some embodiments, a first spacer 11213 may be disposed on the first side 11201, a first spacer 11213 may be located between two second radiators 11212 on the first side 11201, and the two second radiators 11212 on the first side 11201 are spaced apart by the first spacer 11213. The two second radiators 11212 on the first side 11201 may be symmetrically disposed with respect to the first spacer 11213, and the two second slots 1122 on the first side 11201 may be symmetrically disposed with respect to the first spacer 11213.

In some embodiments, two second radiators 11212 on the first side portion 11201 and three first radiators 1114 on the first end portion 11101 are spaced apart from each other. Interference between the two second radiators 11212 on the first side portion 11201 and the three first radiators 1114 on the first end portion 11101 may be reduced.

In some embodiments, the two second radiators 11212 on the first side portion 11201 may transmit and receive 5G signals, and the two second radiators 11212 on the first side portion 11201 may have switches, respectively, so as to implement switching of bands 3.3G-3.6G and 4.8G-5G.

Two second radiators 11212 are formed on the substrate 1121 of the second side portion 11202, and the two second radiators 11212 on the second side portion 11202 are spaced apart from each other. In some embodiments, a second spacer 11214 may be disposed on the second side portion 11202, the second spacer 11214 may be located between two second radiators 11212 on the second side portion 11202, and the two second radiators 11212 on the second side portion 11202 are spaced apart by the second spacer 11214. The two second radiators 11212 on the second side 11202 may be symmetrically disposed with respect to the second spacer 11214, and the two second slots 1122 on the second side 11202 may be symmetrically disposed with respect to the second spacer 11214.

In some embodiments, two second radiators 11212 on the second side portion 11202 are spaced apart from three first radiators 1114 on the second end portion 11102. Interference between the two second radiators 11212 on the second side portion 11202 and the three first radiators 1114 on the second end portion 11103 may be reduced.

In some embodiments, the two second radiators 11212 on the second side 11202 may transmit and receive 5G signals, and the two second radiators 11212 on the second side 11202 may respectively have a switch, so as to respectively implement switching of the bands 3.3G-3.6G and 4.8G-5G.

In some embodiments, the two second radiators 11212 on the first side portion 11201 and the two first radiators 1114 on the third end portion 11103 are spaced apart from each other, and the two second radiators 11212 on the first side portion 11201 and the two first radiators 1114 on the fourth end portion 11104 are spaced apart from each other. The two second radiators 11212 on the second side portion 11202 and the two first radiators 1114 on the third end portion 11103 are spaced apart from each other, and the two second radiators 11212 on the second side portion 11202 and the two first radiators 1114 on the fourth end portion 11104 are spaced apart from each other. Interference between the first radiator 1114 on the middle frame 111 and the second radiator 11212 on the rear cover 112 may be reduced.

In the embodiment of the present application, the eight first radiators 1114 for transceiving 5G signals on the frame 111 and the four second radiators 11212 for transceiving 5G signals on the rear cover 112 may be combined to form a 12X 125G MIMO antenna, which may satisfy the arrangement of the radiators in the electronic device 10, be compatible with the interference of the radiators in the electronic device 10, and improve the performance of the radiators in the electronic device 10.

Wherein the display 12 is installed in the housing assembly 11, the display 12 may be installed on the middle frame 111 for displaying pictures. The display screen 12 is electrically connected to the circuit board 13 to form a display surface of the electronic device 10. In some embodiments, the display surface of the electronic device 10 may be provided with non-display areas, such as: the top end or/and the bottom end of the electronic device 10 may form a non-display area, that is, the electronic device 10 forms a non-display area on the upper portion or/and the lower portion of the display 12, and the electronic device 10 may mount a camera, a receiver, and the like on the non-display area. Note that the display surface of the electronic device 10 may not be provided with the non-display area, that is, the display 12 may be a full-screen. The display 12 may be tiled across the entire display surface of the electronic device 10 such that the display 12 may be displayed in full screen on the display surface of the electronic device 10.

The display 12 may be in a regular shape, such as a rectangular parallelepiped structure or a rounded rectangular structure, and the display 12 may also be in an irregular shape.

The display 12 may be one or a combination of liquid crystal display, organic light emitting diode display, electronic ink display, plasma display, and display using other display technologies. The display screen 12 may include an array of touch sensors (i.e., the display screen 12 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.

It should be noted that, in some embodiments, a cover plate may be disposed on the display 12, and the cover plate may cover the display 12 to protect the display 12. The cover may be a clear glass cover so that the display 12 is shown through the cover. In some embodiments, the cover plate may be a glass cover plate made of a material such as sapphire.

In some embodiments, when the display 12 is mounted on the housing assembly 11, a receiving space is formed between the housing assembly 11 and the display 12, and the receiving space can receive components of the electronic device 10, such as the circuit board 13, the battery 14, and the like.

The circuit board 13 is mounted in the housing assembly 11, the circuit board 13 may be mounted on the middle frame 111, and the circuit board 13 may be screwed to the middle frame 111 by screws or may be snapped to the middle frame 111 by means of a snap. It should be noted that the way in which the circuit board 13 is specifically fixed to the middle frame 111 according to the embodiment of the present application is not limited to this, and other ways such as a way of fixing by a snap and a screw together may also be used. The circuit board 13 may be located between the middle frame 111 and the rear cover 112. The circuit board 13 may be a main board of the electronic device 10, and one or more of a motor, a microphone, a speaker, an earphone interface, a universal serial bus interface, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor may be integrated on the circuit board 13.

Wherein the battery 14 is installed in the housing assembly 11, the battery 14 may be installed on the middle frame 111, the battery 14 may be located between the middle frame 111 and the rear cover 112, the rear cover 112 may serve as a battery cover for the battery 14, and the rear cover 112 may cover the battery 14 to protect the battery 14, thereby reducing damage to the battery 14 due to collision, falling, and the like of the electronic device 10. The battery 11 is electrically connected to the circuit board 13 to supply power to the electronic device 10.

In some embodiments, the battery 14 and the circuit board 13 in the electronic device 10 may be stacked. It should be noted that the arrangement of the battery 14 and the circuit board 13 is not limited to, for example: referring to fig. 10, fig. 10 is a schematic view of another structure of an electronic device according to an embodiment of the present disclosure. The battery 14 and the circuit board 13 may be disposed side-by-side within the housing assembly 11.

Referring to fig. 11, fig. 11 is a block diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 10 may include a storage and processing circuit 131, and the storage and processing circuit 131 may be integrated on the circuit board 13. The storage and processing circuit 131 may include a memory, such as a hard disk drive memory, a non-volatile memory (e.g., a flash memory or other electronically programmable read only memory used to form a solid state drive, etc.), a volatile memory (e.g., a static or dynamic random access memory, etc.), and so on, and embodiments of the present application are not limited thereto. Processing circuitry in the storage and processing circuitry 131 may be used to control the operation of the electronic device 10. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.

The storage and processing circuit 131 may be used to run software in the electronic device 10 such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) phone call application, an email application, a media playing application, operating system functions, etc. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) displays, operations associated with performing wireless communication functions, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in the electronic device 10, and the like, without limitation of the embodiments of the present application.

The electronic device 10 may include input-output circuitry 132, and the input-output circuitry 132 may be disposed on the circuit board 13. The input-output circuitry 132 may be used to enable the electronic device 10 to enable the input and output of data, i.e., to allow the electronic device 10 to receive data from external devices and also to allow the electronic device 10 to output data from the electronic device 10 to external devices. The input-output circuit 132 may further include a sensor 1321. The sensors 1321 can include ambient light sensors, optical and capacitive based proximity sensors, touch sensors (e.g., optical based touch sensors and/or capacitive touch sensors, where the touch sensors can be part of a touch display screen or used independently as a touch sensor structure), acceleration sensors, temperature sensors, and other sensors, among others.

The electronic device 10 may include communication circuitry 1322, and the communication circuitry 1322 may be disposed on the circuit board 13. The communication circuitry 1322 may be used to provide the electronic device 10 with the ability to communicate with external devices. The communication circuitry 1322 may include analog and digital input-output interface circuitry, as well as wireless communication circuitry based on radio frequency signals and/or optical signals. The wireless communication circuitry in communication circuitry 1322 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches and filters. For example, the wireless Communication circuitry in Communication circuitry 1322 may include circuitry for supporting Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuitry 1323 may include a near field communication antenna and a near field communication transceiver. The communications circuitry 1322 may also include cellular telephone transceiver, wireless local area network transceiver circuitry, or the like.

The housing assembly and the electronic device provided by the embodiments of the present application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (16)

1. A housing assembly, comprising:

the middle frame is provided with a plurality of first radiating bodies; and

the back lid, the back lid with center fixed connection, the back lid is provided with a plurality of second irradiators, the second irradiator is in projection on the center with first irradiator non-overlap setting, wherein, first irradiator on the center with the second irradiator that covers behind forms many irradiators combination, just first irradiator on the center with the second irradiator that covers behind sets up at an interval each other, in order to reduce first irradiator on the center with the interference between the second irradiator that covers behind.

2. The housing assembly of claim 1, wherein a projection of the second radiator on the middle frame is spaced apart from the first radiator.

3. The housing assembly of claim 2, wherein the middle frame includes a first end portion provided with at least one of the first radiators, the back cover includes a first side portion provided with at least one of the second radiators, the first side portion and the first end portion are located at a same end of the housing assembly, and the first side portion and the first end portion are spaced apart.

4. The housing assembly of claim 3, wherein the first end portion is provided with three first radiating bodies, the first radiating body located in the middle of the first end portion is configured to receive and transmit 2G, 3G, 4G signals or wireless fidelity signals, and the first radiating bodies located in the two end portions of the first end portion are configured to receive and transmit 5G signals; the first side portion is provided with two second radiating bodies, and the two second radiating bodies of the first side portion are used for receiving and transmitting 5G signals.

5. The housing assembly of claim 4, wherein the rear cover is provided with a first spacer disposed at the first side portion and located between two second radiators of the first side portion.

6. The housing assembly of claim 3, including a first protective cover, the first protective cover being a non-metallic material, the first protective cover being fixedly connected to the first side portion, the first protective cover being positioned between the first side portion and the first end portion.

7. The housing assembly of any one of claims 3 to 6, wherein the middle frame includes a second end portion disposed opposite the first end portion, the second end portion being provided with at least one of the first radiators, the rear cover includes a second side portion disposed opposite the first side portion, the second side portion being provided with at least one of the second radiators, the second side portion and the second end portion being located at a same end of the housing assembly, the second side portion and the second end portion being spaced apart.

8. The housing assembly of claim 7, wherein the second end portion is provided with three first radiators, the first radiator at the middle position of the second end portion is used for transceiving 2G, 3G, 4G signals or wireless fidelity signals, and the first radiators at the two end positions of the second end portion are used for transceiving 5G signals; the second side portion is provided with two second radiating bodies, and the two second radiating bodies of the second side portion are used for receiving and transmitting 5G signals.

9. The housing assembly of claim 8, wherein the rear cover is provided with a second spacer disposed at the second side portion between two second radiators of the second side portion.

10. The housing assembly of claim 7, wherein the housing assembly includes a second protective cover, the second protective cover being a non-metallic material, the second protective cover being fixedly attached to the second side portion, the second protective cover being positioned between the second side portion and the second end portion.

11. The housing assembly of claim 7, wherein a distance between the first end and the first side is equal to a distance between the second end and the second side.

12. The housing assembly of claim 7, wherein the middle frame comprises a third end and a fourth end, the third end and the fourth end are disposed opposite to each other, the third end is connected between the first end and the second end, the third end is provided with two first radiators, the two first radiators at the third end are used for transceiving 5G signals, the fourth end is connected between the first end and the second end, and the fourth end is provided with two first radiators, and the two first radiators at the fourth end are used for transceiving 5G signals.

13. The housing assembly according to claim 1 or 2, wherein the middle frame is provided with ten first radiators, one of the first radiators is used for transceiving 2G, 3G or 4G signals, one of the first radiators is used for transceiving wireless fidelity signals, and the rest of the first radiators are used for transceiving 5G signals; the rear cover is provided with four second radiating bodies, and the four second radiating bodies are used for receiving and transmitting 5G signals.

14. The shell assembly according to claim 1 or 2, wherein the middle frame is provided with a plurality of first slits, and the first radiator is formed at the first slits; the rear cover is provided with a plurality of second gaps, and the second radiators are formed at the positions of the second gaps.

15. The shell assembly of claim 14, wherein the shell comprises a plurality of first filling portions and a plurality of second filling portions, the first filling portions are made of non-metal materials, and the first filling portions are filled in the first gaps; the second filling part is made of non-metal materials and is filled in the second gap.

16. An electronic device, comprising:

a housing assembly as claimed in any one of claims 1 to 15; and

the circuit board is arranged on the middle frame and provided with a plurality of first feed sources, a plurality of second feed sources, a plurality of first grounding points and a plurality of second grounding points, one first radiation body is connected with at least one first feed source, one first radiation body is connected with one first grounding point, one second radiation body is connected with at least one second feed source, and one second radiation body is connected with one second grounding point.

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