CN1937891A

CN1937891A - Circuit board non-porous ring circuit manufacturing method

Info

Publication number: CN1937891A
Application number: CN 200510103071
Authority: CN
Inventors: 林定皓; 李志伟
Original assignee: JINXIANG ELECTRONICS CO Ltd
Current assignee: JINXIANG ELECTRONICS CO Ltd
Priority date: 2005-09-19
Filing date: 2005-09-19
Publication date: 2007-03-28
Anticipated expiration: 2025-09-19
Also published as: CN100477890C

Abstract

The invention relates to a kind of producing method of non-pored loop in the circuit board. There is a base with a few conduction holes. The copperized layer is on the upper and the lower surface of the base and the inner surface of the conduction hole. Stick the dry film with protecting film on the two surfaces of the base, corrode the material of the conduction hole corresponding to the dry film, expose and remove the protecting film and copperize the conduction hole of the base. Form pattern circuit on the copperized layer of the base surface by image shifting and etching. The copperized layer in the conduction hole connects two surfaces. So the non-pored loop is formed on the circuit board. It can control the quality of circuit production effectively and be used to produce the circuitry of thin circuit board.

Description

The non-porous ring circuit manufacturing method of circuit board

Technical field

The present invention discloses a kind of manufacture method of circuit board, refers to a kind of manufacture method that forms non-porous ring circuit on the circuit board that makes especially.

Background technology

The traditional type circuit board is installed on it for electronic building brick is provided, on this circuit board, be provided with most through holes, and the circuit of this circuit board forms the hole circle in those through hole peripheries, using provides the metal of this electronic building brick pin to plug in the through hole of this circuit board, and, constitute electric connection with this circuit to be welded in circle place, hole.

Recently, because of electronic product towards compact development trend, the employed circuit board of this electronic product, its copper wire also must be done the change of downsizing on live width and line-spacing, so, cause the obstruction in the configuration design, and be unfavorable for the downsizing of circuit board size because of the restriction of porose circle.

For solving the circuit question that the aforementioned circuit plate has the hole circle, the someone is otherwise designed forms non-porous ring circuit on circuit board design, is known in the method for making that forms non-porous ring circuit on the circuit board at present, and shown in Fig. 2 A～2F, it mainly comprises:

Substrate 40 is provided, and this substrate 40 comprises that up and down two surfaces, plural via 41 connect wherein, and copper plate 42 covers in this substrate 40 about in two surperficial and these via 41 holes, shown in Fig. 2 A;

Clog in this substrate 40 each via 41, shown in Fig. 2 B with photosensitive-ink 43;

With this substrate 40 of UV-irradiation, make the photosensitive-ink 43 of each via 41 be cured as embolism 44, shown in Fig. 2 B, and remove the part that this embolism 44 protrudes from substrate 40 surfaces, shown in Fig. 2 C with the brushing means;

In substrate 40 upper and lower surfaces coating photoresistance 46 (shown in Fig. 2 D), and with exposure imaging and etching means, make the copper plate 42 formed patterns circuits 45 of substrate 40 upper and lower surfaces, and be connected in 45 in levels circuit (shown in Fig. 2 E) by the copper plate in the via 41 42; And

Remove the photoresistance of substrate 40 upper and lower surfaces and the step (shown in Fig. 2 F) of embolism, finish the making that forms non-porous ring circuit on the circuit board.

The aforementioned circuit plate forms the method for making of non-porous ring circuit, though can solve the problem of the unfavorable configuration design of the circuit of the porose circle of traditional circuit-board, yet, this circuit board is in the processing procedure that forms non-porous ring circuit, because of inserting via with photosensitive-ink earlier, after UV-irradiation is solidified, remove the part of protruding plate face again with the brushing means, when wherein photosensitive-ink is inserted via, printing ink easily takes place insert unsubstantial filling up, or because of in the brushing process, the printing ink of part is damaged in this via, causes in the subsequent copper circuit etching process, because of etching liquid is invaded in the via, damage the copper plate in the hole, influence the reliability of this circuit board copper circuit, and be not suitable for the making of thin type circuit board.

Summary of the invention

The subject matter that the present invention will solve provides a kind of non-porous ring circuit manufacturing method of circuit board, design thus, solve in the previous circuit plate non-porous ring circuit shaping manufacture process, the copper plate in this via easily is etched damaged problem, reaches shortcomings such as unfavorable thin type circuit board manufacturing.

In order to address the above problem, the technical scheme of the non-porous ring circuit manufacturing method of circuit board of the present invention comprises:

Substrate is provided, which is provided with plural via and connect its plate body, and be provided with thin copper layer and cover in substrate up and down in two surfaces and this via hole;

First dry film of diaphragm is arranged in this substrate one side surface outside fitting;

Remove first dry film to porose area material that should each via of substrate with development ablation means;

First dry film is imposed step of exposure, divest the diaphragm in its outside again;

Second dry film that applying has a diaphragm is in this substrate side surface in addition;

Remove second dry film to porose area material that should each via of substrate with development ablation means;

Second dry film is imposed step of exposure, divest the diaphragm in its outside again;

Each via to substrate imposes copper-plated step; And

On substrate, form the step of patterned circuit, utilize this two dry film to carry out exposure imaging and etching for photoresistance, make the substrate circuit of two lip-deep copper plates formation patternings up and down, and the connection of the copper facing in the mat via therebetween, makes this circuit form the kenel of holeless.

Compared with prior art, the beneficial effect of the non-porous ring circuit manufacturing method of circuit board of the present invention is:

1, utilization of the present invention can sort the technological means of control, merges the technology that existing line is electroplated, and protects the copper plate in the via accurately, and does not need the hole circle design of traditional type circuit board.

2, the invention provides the design of a holeless, can reduce the contraposition requirement between through hole and exposure position on the plate, in addition holeless occupies the area on the circuit board, and design provides excellent benefiting for the configuration on the circuit board, and has also produced positive help for product.

3, the present invention can utilize the electroplating thickness on the locality plating means control board face, and the problem that can avoid the copper facing of previous non-porous ring circuit manufacturing technology in via easily to be deteriorated, the quality level of making of the fine rule road on the control board face and product effectively.

4, the present invention exempts the filling perforation printing means that previous non-porous ring circuit manufacturing technology must be used, and makes the present invention more can be applicable to the manufacturing of thin type circuit board.

Description of drawings

Figure 1A～I is the schematic flow sheet of preferred embodiment of the non-porous ring circuit manufacturing method of circuit board of the present invention.

Fig. 2 A～F prior art known circuit board forms the schematic flow sheet of non-porous ring circuit manufacturing method.

[primary clustering symbol description]

10: substrate 11: first surface

12: second surface 13: via

14: thin copper layer 141: copper facing

142: protective layer 15: circuit

21: the first diaphragms of 20: the first dry films

31: the second diaphragms of 30: the second dry films

40: substrate 41: via

42: copper plate 43: photosensitive-ink

44: embolism 45: circuit

46: photoresistance

Embodiment

Shown in Figure 1A～I, disclose a preferred embodiment of the non-porous ring circuit manufacturing method of circuit board of the present invention, its step comprises:

Substrate 10 is provided, this substrate 10 has first surface 11, second surface 12, and plural via 13 runs through 12 of first surface 11 and second surfaces, and this substrate 10 is provided with thin copper layer 14 and covers in this first surface 11 and second surface 12 and this via 13 internal surface of hole, shown in Figure 1A;

Fit first dry film 20 outside the thin copper layer 14 of these substrate 10 first surfaces 11, and this first dry film 20 has first diaphragm 21 with respect to these first surface 11 other outer surfaces of side, shown in Figure 1B;

Remove the porose area material that 20 pairs of first dry films should substrate 10 each via 13 with development ablation means, cleaned dried again, shown in Fig. 1 C;

First dry film 20 is imposed step of exposure, divest first diaphragm 21 of its outer surface again;

Fit second dry film 30 outside the thin copper layer 14 of these substrate 10 second surfaces 12, and this second dry film 30 has second diaphragm 31 with respect to these second surface 12 other side external surfaces, shown in Fig. 1 D;

Remove the porose area material that 30 pairs of second dry films should substrate 10 each via 13 with development ablation means, cleaned dried again, shown in Fig. 1 E;

Second dry film 30 is imposed step of exposure, divest second diaphragm 31 of its outer surface again, shown in Fig. 1 F;

Each via 13 of substrate 10 is imposed the step of electro-coppering 141, shown in Fig. 1 G, the copper facing thickness of those via 12 hole inner edges is increased, after this copper facing step, still can impose the step (or the metal that other is difficult for oxidation is established in plating) that pure tin is electroplated, outside these via 13 plating inner surface copper 141, form protective layer 142; And utilize first dry film 20 and second dry film 30 for photoresistance carries out exposure imaging and etched step, make the circuit 15 of the copper plate formation patterning on substrate 10 first surfaces 11 and the second surface 12, shown in Fig. 1 H and I.

The present invention is by the aforementioned techniques conceptual design, and main utilization can sort the technological means that circuit is shaped and controls, Merge again the existing line electroplating technology, can protect accurately the copper plate in the via, do not need the traditional type electricity The hole of road plate encloses according to the area on the circuit board, provides excellent benefiting to the configuration of circuit board, and, The present invention utilizes the electroplating thickness on the locality plating means control panel face, and can avoid previous non-porous ring circuit system The problem that the copper facing of the technology of doing in via is easily deteriorated, the fine rule road on the control panel face makes and produces effectively The quality level of product, and exempt the filling perforation printing means that previous non-porous ring circuit manufacturing technology must be used, and energy Be applicable to the manufacturing of thin circuit board, therefore, the present invention really can provide a kind of dark tool industrial utilization Design.

Claims

1, a kind of non-porous ring circuit manufacturing method of circuit board comprises:

Substrate is provided, has first, second surface on it, plural via runs through between first, second surface, and thin copper layer covers in this first, second surface and this via internal surface of hole;

First dry film of diaphragm is arranged in the first surface of this substrate outside fitting;

Applying has second dry film of diaphragm in the second surface of this substrate;

Each via to substrate imposes copper-plated step; And

Go up the step that forms patterned circuit in first, second surface of substrate, utilize first, second dry film to carry out exposure imaging and etching for photoresistance, make the circuit of first, second lip-deep copper plate formation patterning of substrate, and the copper facing in the mat via connects therebetween.

2, the non-porous ring circuit manufacturing method of circuit board as claimed in claim 1 wherein after each via of substrate imposes the copper facing step, still can comprise the step that pure tin is electroplated, and forms protective layer outside this internal surface of hole electro-coppering.