CN111818740A - Method for manufacturing circuit board with circuit height difference rigid-flexible circuit - Google Patents
Method for manufacturing circuit board with circuit height difference rigid-flexible circuit Download PDFInfo
- Publication number
- CN111818740A CN111818740A CN202010650362.0A CN202010650362A CN111818740A CN 111818740 A CN111818740 A CN 111818740A CN 202010650362 A CN202010650362 A CN 202010650362A CN 111818740 A CN111818740 A CN 111818740A
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- board
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- height difference
- control step
- circuit
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000003139 buffering effect Effects 0.000 claims abstract description 7
- 239000003822 epoxy resin Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 6
- 238000003475 lamination Methods 0.000 claims abstract description 6
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 5
- 238000004880 explosion Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 10
- 239000003814 drug Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 19
- 238000005530 etching Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000005708 Sodium hypochlorite Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 235000001892 vitamin D2 Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a method for manufacturing a circuit board with a circuit height difference rigid-flexible circuit, which comprises the following steps: the method comprises a soft and hard combination board pressing control step, a line control step of a high-low falling position difference position and a laser uncapping control step; the soft and hard combined board pressing control step comprises the following steps: step 11, before lamination, designing an exhaust hole in the soft board area to avoid board explosion caused by incapability of vacuumizing; step 12, selecting a release film material with the pressure buffering effect, wherein the thickness of the release film material is 200-; and step 13, before lamination, cleaning the soft board by using plasma, wherein gas components are mainly N2, 02, CF4 and H2, so that the bonding force between the soft board and a prepreg mainly comprising epoxy resin is stronger, and the flowing glue of the prepreg is controlled to be less than 0.2 mm. The invention can overcome the influence caused by the height difference of the positions, and the plating thickness, the line size, the impedance size, the appearance and the like of the board surface completely meet the requirements of customers.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a circuit board with a circuit height difference rigid-flexible circuit.
Background
Many soft and hard combination boards at present, the design structure is symmetrical, and thickness is the same, and the hot pressing of back process can not appear height drop problem, and this kind of board production satisfies customer's requirement relatively more easily. If there is a position difference, the plating thickness, the line size, the impedance, the appearance and the like of the board surface are difficult to meet the requirements of customers.
Disclosure of Invention
The invention provides a method for manufacturing a circuit board with a soft and hard combined circuit with a high-low difference, which aims to solve at least one technical problem.
In order to solve the above problems, according to an aspect of the present invention, there is provided a method for manufacturing a board of a line level difference rigid-flex circuit, including: the method comprises a soft and hard combination board pressing control step, a line control step of a high-low falling position difference position and a laser uncapping control step;
the soft and hard combined board pressing control step comprises the following steps:
step 11, before lamination, designing an exhaust hole in the soft board area to avoid board explosion caused by incapability of vacuumizing;
step 12, selecting a release film material with the pressure buffering effect, wherein the thickness of the release film material is 200-;
step 13, before lamination, cleaning the soft board by using plasma, wherein gas components mainly comprise N2, 02, CF4 and H2, so that the bonding force between the soft board and a prepreg mainly comprising epoxy resin is stronger, and the gummosis of the prepreg is controlled to be less than 0.2 mm;
step 14, before formal pressing, vacuumizing for 5-10 minutes;
step 15, using the following press fit parameters: the temperature of the furnace is 120 ℃, the pressing temperature is 190-.
Preferably, the line control step of the high-low head position includes:
step 21, printing ink by using a polyester screen printing plate, drying a graph, namely drying an area with height difference, and then printing in the area;
step 22, silk-screen printing photosensitive ink to enable the connection position with the height difference to be covered by the ink, so that the liquid medicine is prevented from permeating into the corrosion coating, the thickness of the ink is 5-10um, and then drying is carried out for X (30-40) min at the temperature of 75 ℃;
step 23, pasting a layer of dry film on the board surface, and then carrying out pattern transfer;
24, corroding all the graphs required by the customer by using an acidic corrosive liquid medicine;
step 25, pressing a covering film on the line pavement, wherein the thickness can not be selected to be thin, the thickness is selected to be 50-100um, and red silicon rubber is placed on the board surface to play a role in buffering when the board is pressed, so that the covering film at the high-low falling position has uniform glue flowing.
Preferably, the laser decap controlling step includes:
step 31, the laser uncapping position is that the window opening position of the prepreg is increased by 0.1-0.2mm on one side during design;
and 32, when the cover is opened by the laser, controlling the energy of the laser, wherein the energy is small, the cutting depth is insufficient, the cover cannot be opened, and the line on the second layer can be damaged when the energy is too large.
The invention can overcome the influence caused by the height difference of the positions, and the plating thickness, the line size, the impedance size, the appearance and the like of the board surface completely meet the requirements of customers.
Drawings
Figure 1 schematically shows a process flow diagram of the present invention.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
The invention provides a method for manufacturing a circuit height difference rigid-flex board, which is used for overcoming the influence caused by position height difference and enabling the plating thickness, the circuit size, the impedance size, the appearance and the like of the board surface to completely meet the requirements of customers. The present invention mainly implements control of the following three aspects to solve the problems proposed in the background art: (1) controlling the lamination of the rigid-flex board; (2) line control of high and low falling potential difference positions; (3) and (5) laser cover opening control.
Each technical point is explained in detail below:
(1) soft and hard combined board pressing control
A. Before pressing, the soft board area needs to be designed with an exhaust hole, so that the board explosion caused by the incapability of vacuumizing is avoided.
B. The thickness of the release film material with the pressure buffering function needs 200-400 mu m.
C. Before pressing, the soft board is plasma cleaned, and the gas components are mainly N2, 02, CF4 and H2, so that the soft board and the epoxy resin have stronger bonding force.
D. The main component is a prepreg of epoxy resin, and the flowing glue is controlled to be less than 0.2 mm.
E. Before formal pressing, vacuum pumping is carried out for 5-10 minutes.
F. Using special pressing parameters [ the temperature of the furnace (120 ℃), the pressing temperature (190-.
(2) Line control of high and low fall position
Because of the position drop, the dry film can not be directly pasted for pattern transfer, otherwise, the drop position has a cavity, and etching liquid medicine seeps into the cavity to bite the circuit.
A. The 43-77T polyester screen printing ink is used to print out the pattern, i.e. the area with height difference, and then the area is printed.
B. Printing photosensitive ink by silk screen printing to cover the joint with the difference of height of the ink, so as to prevent the liquid medicine from infiltrating into the joint to corrode the coating, wherein the thickness of the ink is 5-10um, and then drying for 75 ℃ X (30-40) min.
C. A dry film (mainly comprising three parts of photoresist, polyester film and polyethylene protective film) is pasted on the plate surface, and then pattern transfer is carried out.
D. And (3) completely corroding the patterns required by the customers by using acidic corrosive liquid (sodium hypochlorite, hydrochloric acid and additives).
E. The covering film (mainly comprising polyimide and glue) is pressed on the line pavement, the thickness cannot be selected to be thin, the thickness is selected to be 50-100 mu m, red silicon rubber (the hardness is 60 +/-5 ℃) is placed on the board surface to play a role in buffering when the board is pressed, and the covering film at the high-low falling position is uniform in glue flowing.
(3) Laser uncap control
A. The laser uncapping position is that the window opening position of a prepreg (the main component is epoxy resin) is increased by 0.1-0.2mm on one side during design.
B. When the cover is opened by the laser, the energy of the laser is controlled, the energy is small, the cutting depth is insufficient, the cover cannot be opened, the energy is too large, and the line on the second layer is damaged.
The overall process flow of the present invention is further illustrated by the following specific example.
Step 1, cutting: the size of the working plate is set according to the processing capacity of the equipment and the utilization rate of the plate, and then the hard plate and the soft plate are cut into corresponding sizes.
And 2, transferring the pattern to a working plate according to the data of a client by using the inner layer wet film, and mainly controlling the line width/distance after exposure.
Step 3, vacuum etching, namely using a vacuum etching machine, and using acidic etching liquid medicine (sodium hypochlorite, hydrochloric acid and additives) to bite and etch all the patterns required by a customer, wherein the quality of the process is mainly controlled, and the line width/line distance must be controlled within a qualified range; the interlayer deviation of the upper layer and the lower layer is controlled within 25 um. (vacuum etching machine can ensure the uniformity of the circuit after the whole working plate is etched)
Step 4, inner layer detection: the quality of the etched lines was checked using an automated scanning inspection instrument.
Step 5, browning: and the surface is roughened by using a chemical mode, so that the bonding force between materials is increased.
And 6, plasma cleaning, namely, etching and cleaning the part of the flexible board at a certain temperature and time according to different proportions by N2, O2, H2, CF4 and four gases, so that the surface is rougher and the binding force is stronger.
Step 7, laminating: through the vacuum hot press, use corresponding clamp plate form, laminate different circuit together, the quality main points: the thickness and the tolerance of the plate are qualified, and the thermal shock and reflow soldering have no delamination/blistering problem.
Step 8, drilling: the purpose of the process is to drill a through hole on the board surface, and then the post process can be used for electroless copper plating to realize the electrical conduction of upper and lower layers of copper, and in the process, the drilling quality is strictly controlled. The roughness in the hole is not allowed to be too large, and the problems of burrs, substrate damage/deformation and the like are not allowed.
Step 9, copper deposition: namely, a layer of thin copper is plated in the hole of the drilled hole, so that the electrical performance conduction of the upper layer and the lower layer of the board is realized.
Step 10, copper electroplating: and thickening the copper in the hole and the copper on the surface to meet the requirements of customers so as to ensure the electrical performance requirements of terminal customers.
Step 11, screen printing photosensitive oil, namely screen printing a layer of photosensitive oil at the position with high and low fall difference to ensure that the fall is protected by ink and cannot be corroded by liquid medicine.
Step 12, pattern transfer: according to the data of a client, the graph is transferred from the negative film to the working plate, and the quality key points are as follows: the line width/pitch must be acceptable.
Step 13, acid etching, namely using a vacuum etching machine, and using acid etching liquid medicine (sodium hypochlorite, hydrochloric acid and additives) to bite and etch all the patterns required by a customer, wherein the quality of the process is mainly controlled, and the line width/line distance must be controlled within a qualified range; the interlayer deviation of the upper layer and the lower layer is controlled within 25 um. (vacuum etching machine can ensure the uniformity of the circuit after the whole working plate is etched)
Step 14, outer layer detection: the quality of the etched lines was checked using an automated scanning inspection instrument.
And step 15, pressing a covering film, namely pressing the covering film on one surface of the flexible printed circuit board to protect the flexible printed circuit board, wherein the flexible printed circuit board has the key points of quality that no air bubbles exist, no foreign matters exist under the covering film, the bonding force is good, and no delamination exists in three times of thermal shock.
Step 16, solder resist: according to the requirements of customers, a layer of insulating ink is printed on the hard board, but the pads of the plug-in and the patch are exposed completely.
And step 17, performing gold immersion, namely depositing a nickel layer on the bonding pad on the board surface to facilitate subsequent component assembly, wherein the quality key points are that the thickness of the nickel layer, the thickness of the gold layer and the welding performance are controlled to be good.
Step 18, testing: and (4) carrying out open-short circuit test on the working plate, and if open-short circuit is found, discarding the working plate.
Step 19, forming: and producing the effective units by using a numerical control gong machine or CNC. The quality key points are as follows: the overall dimensions must meet the requirements.
And 20, laser uncapping, namely cutting off the hard plate part which is not needed in the soft-hard combination area by using a UV laser cutting machine to expose the soft plate part, wherein the quality point is that the cutting depth is too shallow or too deep.
Step 11, final inspection: and inspecting the product according to IPC standard or customer standard, and packaging the qualified plate.
Step 22, packaging: the packaging is carried out according to the packaging mode required by a client, and generally comprises two types of thermoplastic packaging and aluminum foil packaging.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. A method for manufacturing a board of a line height difference rigid-flex circuit is characterized by comprising the following steps: the method comprises a soft and hard combination board pressing control step, a line control step of a high-low falling position difference position and a laser uncapping control step;
the soft and hard combined board pressing control step comprises the following steps:
step 11, before lamination, designing an exhaust hole in the soft board area to avoid board explosion caused by incapability of vacuumizing;
step 12, selecting a release film material with the pressure buffering effect, wherein the thickness of the release film material is 200-;
step 13, before pressing, cleaning the soft board by using plasma, wherein the gas component is mainly N2、02、CF4And H2So that the bonding force between the soft board and the prepreg mainly containing epoxy resin is stronger, and the gummosis of the prepreg is controlled to be less than 0.2 mm;
step 14, before formal pressing, vacuumizing for 5-10 minutes;
step 15, using the following press fit parameters: the temperature of the furnace is 120 ℃, the pressing temperature is 190-.
2. The method for manufacturing a board of a line height difference rigid-flex circuit according to claim 1, wherein the line control step of the height difference position comprises:
step 21, printing ink by using a polyester screen printing plate, drying a graph, namely drying an area with height difference, and then printing in the area;
step, screen printing photosensitive ink to enable the connection position with the height difference to be covered by the ink, so that liquid medicine is prevented from permeating into a corrosion coating, the thickness of the ink is 5-10 mu m, and then drying is carried out for X (30-40) min at the temperature of 75 ℃;
step 23, pasting a layer of dry film on the board surface, and then carrying out pattern transfer;
24, corroding all the graphs required by the customer by using an acidic corrosive liquid medicine;
step 25, pressing a covering film on the line pavement, wherein the thickness can not be selected to be thin, the thickness is selected to be 50-100um, and red silicon rubber is placed on the board surface to play a role in buffering when the board is pressed, so that the covering film at the high-low falling position has uniform glue flowing.
3. The method for manufacturing a board of a line level difference rigid-flex circuit according to claim 1, wherein the laser cover opening control step comprises:
step 31, the laser uncapping position is that the window opening position of the prepreg is increased by 0.1-0.2mm on one side during design;
and 32, when the cover is opened by the laser, controlling the energy of the laser, wherein the energy is small, the cutting depth is insufficient, the cover cannot be opened, and the line on the second layer can be damaged when the energy is too large.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010650362.0A CN111818740A (en) | 2020-07-08 | 2020-07-08 | Method for manufacturing circuit board with circuit height difference rigid-flexible circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010650362.0A CN111818740A (en) | 2020-07-08 | 2020-07-08 | Method for manufacturing circuit board with circuit height difference rigid-flexible circuit |
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| Publication Number | Publication Date |
|---|---|
| CN111818740A true CN111818740A (en) | 2020-10-23 |
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|---|---|---|---|
| CN202010650362.0A Pending CN111818740A (en) | 2020-07-08 | 2020-07-08 | Method for manufacturing circuit board with circuit height difference rigid-flexible circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438819A (en) * | 2021-06-23 | 2021-09-24 | 金禄电子科技股份有限公司 | Processing method of circuit board and radio frequency rigid-flex board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN106793587A (en) * | 2016-12-21 | 2017-05-31 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board with blind slot and preparation method thereof |
| CN110505749A (en) * | 2019-08-01 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of improvement band Air-gap FPC open circuit undesirable structure of notch |
-
2020
- 2020-07-08 CN CN202010650362.0A patent/CN111818740A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595795A (en) * | 2012-03-05 | 2012-07-18 | 同扬光电（江苏）有限公司 | Method for making double-sided flexible printed circuit board by using pure copper plate as base material |
| CN106793587A (en) * | 2016-12-21 | 2017-05-31 | 深圳市景旺电子股份有限公司 | A kind of rigid-flex combined board with blind slot and preparation method thereof |
| CN110505749A (en) * | 2019-08-01 | 2019-11-26 | 隽美经纬电路有限公司 | A kind of improvement band Air-gap FPC open circuit undesirable structure of notch |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438819A (en) * | 2021-06-23 | 2021-09-24 | 金禄电子科技股份有限公司 | Processing method of circuit board and radio frequency rigid-flex board |
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