WO2022088413A1

WO2022088413A1 - Battery protection board, machining method therefor, and electronic device

Info

Publication number: WO2022088413A1
Application number: PCT/CN2020/135810
Authority: WO
Inventors: 向付羽
Original assignee: 深南电路股份有限公司
Priority date: 2020-10-29
Filing date: 2020-12-11
Publication date: 2022-05-05
Also published as: CN114430609B; CN114430609A

Abstract

A battery protection board (10), a machining method therefor, and an electronic device. The battery protection board (10) comprises: a substrate (11), and a first signal layer (12), a first ground electric layer (13), and a first metal layer (14) which are sequentially provided on the surface of the substrate (11) from bottom to top, and a side metal layer (15) perpendicular to one side of the substrate (11). The first ground electric layer (13) is in metallized connection to the side metal layer (15). By means of the structure, the first ground electric layer (13) is in metallized connection to the side metal layer (15), and the heat generated by the ground electric layer can be transferred to the side of the substrate (11) by means of copper by using the heat conduction principle of copper, so that the heat-dissipation problem of the protection board is solved, the performance of the battery protection board (10) is improved, and the service life thereof is prolonged.

Description

A kind of battery protection board, processing method and electronic equipment

【Technical field】

The present application relates to the technical field of battery protection boards, and in particular, to a battery protection board, a processing method and an electronic device.

【Background technique】

With the advancement of technology and the arrival of 5G, smart phones are becoming more and more close to people's daily life, bringing users a faster Internet experience and more smart applications, and the energy consumption of mobile phones has also become larger and larger. . However, at present, there has not been a major breakthrough in the design of the printed circuit board (printed circuit board, printed circuit board) for the heat dissipation solution of the battery protection board. In recent years, mobile phone explosion incidents have also emerged one after another. Therefore, how to design a battery protection board to effectively solve the heat dissipation requirements of the battery protection board and improve the life and reliability of the battery protection board has become a hot issue.

[Content of the invention]

The present application provides a battery protection board, a processing method and an electronic device, so as to solve the heat dissipation requirement of the battery protection board, thereby improving the life and reliability of the battery protection board.

In order to solve the above technical problems, a technical solution adopted in this application is to provide a battery protection board. The battery protection board includes: a substrate, the surface of which is provided with a first signal layer, a first ground layer, and a first metal layer; and a side metal layer, which is arranged on one side of the substrate and perpendicular to the substrate; The signal layer is arranged above the substrate; the first ground layer is arranged above the first signal layer; the first metal layer is arranged above the first ground layer; wherein, the first ground layer is metallized and connected to the side metal layer.

Optionally, the battery protection board further includes: a second signal layer, a second ground layer and a second metal layer, a first signal layer, a first ground layer, a first metal layer and a second signal layer, a second ground layer The electrical layer and the second metal layer are respectively arranged below the substrate with the substrate as the axis of symmetry; wherein, the second signal layer is arranged below the substrate adjacent to the substrate; the second ground electrical layer is arranged below the second signal layer, and the second signal layer is arranged below the substrate. The two ground electrical layers are metallized and connected with the side metal layer; the second metal layer is arranged under the second ground electrical layer.

Wherein, the first ground electric layer is copper or aluminum, and is connected with the metal layer on the side of the substrate through copper or aluminum.

The first metal layer, the first ground layer, and the first signal layer are blocked by insulating materials; the second metal layer, the second ground layer, and the second signal layer are blocked by insulating materials.

In order to solve the above technical problem, another technical solution adopted in the present application is to provide a processing method of a battery protection plate. The processing method includes: providing a PCB board, the PCB board including a first metal layer, a first ground electrical layer, and a first signal layer that are stacked and arranged above the substrate from top to bottom; and metallizing the side surface of the PCB board to form Side metal layer; copper-plating the edge of the first ground electrical layer and electroplating connection with the metal layer on the same side.

Wherein, the step of providing the PCB board includes: performing board matching: providing a first metal layer, a first ground layer, a first signal layer, a second metal layer, a second ground layer, and a second signal layer; layer, the second ground layer and the second metal layer are arranged under the substrate, and the second signal layer, the second ground layer and the second metal layer and the first signal layer, the first ground layer and the first metal layer They are respectively set with the base plate as the axis of symmetry; the first metal layer to the second metal layer are laminated together by lamination; the edge of the second ground electric layer is plated with copper and the metal layer on the side is connected by electroplating.

Wherein, the step of metallizing and electroplating the side of the PCB board to form the side metal layer specifically includes: drilling target, edge milling, drilling, contour milling, and electroplating to form the side metal layer on the PCB board.

Wherein, before the step of performing the distribution of the first metal layer, the first ground layer, the second ground layer and the second metal layer, the steps include the following steps: cutting the material, cutting out the required first metal layer, the first ground layer and the second metal layer. layer, the second ground layer and the second metal layer, according to the circuit requirements, the first metal layer, the first ground layer, the second ground layer and the second metal layer are arranged in the inner layer pattern, and the first metal layer is The metal layer, the first ground layer, the second ground layer, and the unnecessary part of the surface pattern of the second metal layer are etched and removed, and then the inner layer is inspected. Finally, the inner layer is punched and the inner layer is browned on the substrate. .

Wherein, before the step of assembling the first signal layer and the second signal layer, the steps include the following steps: cutting the material, cutting out the required first signal layer and the second signal layer, and then aligning the first signal layer and the second signal layer according to the circuit requirements. The inner layer pattern is arranged for the second signal layer, and the unnecessary parts of the surface patterns of the first signal layer and the second signal layer are etched and removed by using liquid medicine, and then the inner layer is inspected, covered with film, and finally the inner layer of the substrate is punched. The grooves and inner layers are browned.

In order to solve the above technical problem, another technical solution adopted in this application is to provide an electronic device. The electronic equipment includes: a power supply device and the above-mentioned battery protection board, and the battery protection board is arranged on any side of the power supply device.

The beneficial effects of the present application are: different from the situation in the prior art, the present application provides a battery protection board, the surface of the substrate of the battery protection board is sequentially provided with a first signal layer, a first ground layer, a first Metal layer, and a side metal layer is arranged perpendicular to the substrate on one side of the substrate, and the first ground electric layer is metallized and connected to the side metal layer. The side of the base plate can solve the problem of heat dissipation of the protection board and improve the performance and life of the battery protection board.

【Description of drawings】

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, under the premise of no creative work, other drawings can also be obtained from these drawings, wherein:

1 is a schematic structural diagram of an embodiment of a battery protection board provided by the present application;

2 is a schematic structural diagram of another embodiment of the battery protection board provided by the present application;

3 is a schematic flowchart of an embodiment of a method for processing a battery protection plate of the present application;

Fig. 4 is the specific processing flow schematic diagram of step S100 in Fig. 3;

5 is a schematic diagram of the specific processing flow of the first metal layer, the ground electrical layer, and the second metal layer before step S110 in FIG. 4 is matched;

FIG. 6 is a schematic diagram of the specific processing flow of the signal layer before the board configuration in step S110 in FIG. 4;

Fig. 7 is the concrete processing flow schematic diagram of step S200 in Fig. 3;

Fig. 8 is the processing flow schematic diagram after step S300 electroplating in Fig. 3 is completed;

FIG. 9 is a schematic structural diagram of an embodiment of an electronic device provided by the present application.

【Detailed ways】

Embodiments of the present application provide a battery protection board, a processing method, and an electronic device, so as to meet the heat dissipation requirements of the battery protection board, thereby improving the life and reliability of the battery protection board.

In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", "third" may expressly or implicitly include at least one of that feature. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined. All directional indications (such as up, down, left, right, front, rear...) in the embodiments of the present application are only used to explain the relative positional relationship between components under a certain posture (as shown in the accompanying drawings). , motion situation, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally also includes For other steps or units inherent to these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments without conflict. The following detailed descriptions are given respectively through specific embodiments.

In recent years, the focus of the printed circuit board market has shifted from computers to communications. In the past two years, it has turned to mobile terminals such as smartphones and tablet computers. All printed circuit boards are developing towards high-density and fine lines. Therefore, in the field of printed circuit boards There are also many problems that need to be paid attention to in terms of processing technology. Among them, the problem of heat generation is the most important. At present, the widely used printed circuit board (PCB) sheet is copper clad/epoxy glass cloth substrate or phenolic resin glass cloth substrate, and a small amount of paper-based copper clad sheet is used. Although these substrates have excellent electrical properties and processing properties, they have poor heat dissipation. As a heat dissipation path for high-heating components, it is almost impossible to expect heat to be conducted by the resin of the PCB itself, but to dissipate heat from the surface of the component to the surrounding air. Electronic products have entered the era of component miniaturization, high-density installation, and high-heating assembly. It is not enough to rely on the surface of components with very small surface area to dissipate heat. At the same time, due to the square flat packaging technology, ball grid array packaging technology, etc. With the extensive use of surface-mounted components, a large amount of heat generated by the components is transferred to the PCB board. Therefore, the best way to solve heat dissipation is to improve the heat dissipation capacity of the PCB itself that is in direct contact with the heating element, and conduct or dissipate it through the PCB board. In this regard, the present applicant provides a battery protection board 10 , a processing method and an electronic device. details as follows:

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an embodiment of a battery protection board provided by the present application.

In this embodiment, the battery protection board 10 includes: a substrate 11 , a first signal layer 12 , a first ground layer 13 , a first metal layer 14 , and a side metal layer 15 .

Specifically, the first signal layer 12 is disposed above the substrate 11, and is disposed in close contact with the substrate 11. The material is copper or aluminum, and the thickness is 30-100 μm. The material and thickness of the first signal layer 12 can be selected according to actual needs; A ground layer 13 is disposed above the first signal layer 12, and its material is also copper or aluminum, with a thickness of 30-100 μm, and is blocked by an insulating material between the first ground layer 13 and the first signal layer 12. Specifically, it can be The prepreg is used for blocking, and its thickness is 60-200 μm. When the epoxy resin of the prepreg melts, flows, and solidifies, the layers of circuits can be pressed together to form a reliable insulating layer; then the first metal layer 14 is arranged on the first metal layer. Above the ground layer 13, the material is also copper or aluminum, and the thickness is 30-100 μm, and the first metal layer 14 and the first ground layer 13 are also blocked by insulating materials, and the thickness is 75-300 μm; and A solder resist layer (not shown in the figure) is provided above the first metal layer 14. The solder resist layer can be coated with green oil, and the thickness is less than 50 μm. Extend the life of the PCB board.

Further, a side metal layer 15 is arranged perpendicular to the substrate 11 on one side of the substrate 11, and the first ground layer 13 is metallized and connected to the side metal layer 15, wherein the side metal layer 15 is copper or aluminum, and the width is 20 ~50 μm, which can be set according to the size of the actual substrate 11 . The edge of the first ground layer 13 is plated with copper or aluminum and the side metal layer 15 is connected by electroplating. Using the heat conduction principle of copper, the heat generated by the first ground layer 13 of the PCB board is conducted to the side wall of the PCB board through copper. Heat dissipation, and the side metal layer 15 of the PCB board can also be connected to the heat dissipation device in the mobile phone or other battery electrical equipment, so as to solve the problem of heat dissipation of the protection board and improve the performance and life of the battery protection board 10 .

To sum up, the battery protection board 10 in this embodiment includes the substrate 11 , the first signal layer 12 , the first ground layer 13 , the first metal layer 14 , and the side metal layer 15 , and the first ground layer 13 and the side metal layer are connected together. 15 is metallized and connected, using the heat conduction principle of copper, the heat generated by the first ground layer 13 of the PCB board is conducted to the side wall of the PCB board through copper, so as to solve the problem of heat dissipation of the protection board and improve the performance and life of the battery protection board 10.

Please continue to refer to FIG. 2 , which is a schematic structural diagram of another embodiment of the battery protection board provided by the present application.

In this embodiment, the battery protection board 20 includes: a substrate 21 , a first signal layer 22 , a first ground layer 23 , a first metal layer 24 , a side metal layer 25 , a second signal layer 26 , and a second ground layer 27 and the second metal layer 28 . The first signal layer 22 , the first ground layer 23 , the first metal layer 24 , the second signal layer 26 , the second ground layer 27 , and the second metal layer 28 are respectively disposed symmetrically with the substrate 21 as the axis of symmetry. The first signal layer 22 , the first ground layer 23 , and the first metal layer 24 are correspondingly disposed above the substrate 21 , and the second signal layer 26 , the second ground layer 27 , and the second metal layer 28 are correspondingly disposed below the substrate 21 .

Specifically, the thickness of the substrate 21 is 25-100 μm, and the second signal layer 26 is disposed under the substrate 21 next to the substrate 21 . The material of the second signal layer 26 is copper or aluminum, and the thickness is 30-100 μm; the second ground layer 27 It is arranged under the second signal layer 26 , the material is copper or aluminum, the thickness is 30-100 μm, and the second ground layer 27 and the second signal layer 26 are also blocked by insulating materials. Specifically, the prepreg can be used for blocking. , its thickness is 60-200μm; the second metal layer 28 is arranged under the second ground layer 27, its material is copper or aluminum, the thickness is 30-100μm, and the second metal layer 28 and the second ground layer 27 It is also blocked by insulating materials, with a thickness of 75-300μm; a solder mask layer is provided under the second metal layer 28, and the solder mask layer can be coated with green oil, and the thickness is less than 50μm, green oil and other solder mask layers can avoid PCB Soldering short circuit during the use of the board, which can prolong the service life of the PCB board. The specific conditions of the first signal layer 22 , the first ground layer 23 and the first metal layer 24 are the same as those of the first signal layer 12 , the first ground layer 13 and the first metal layer 14 in the above-mentioned embodiment, which are not repeated here. Repeat.

Further, a side metal layer 25 is arranged substantially perpendicular to one side of the substrate 21 , and the first ground layer 23 and the second ground layer 27 are both metallized and connected to the side metal layer 25 . In this embodiment, the side metal layer 25 directly extends from the first metal layer 24 to the bottom second metal layer 28 , and is made of copper or aluminum and has a width of 20-50 μm, which can be adjusted according to the size of the actual substrate 21 . set up. The side metal layers 25 can also be distributed intermittently, and can extend from the places where the side metal layers 25 are connected to the first ground layer 23 and the second ground layer 27 to the first metal layer 24 and the second metal layer 28 respectively.

To sum up, the battery protection board 20 in this embodiment further includes the second signal layer 26 , the second ground layer 27 and the second metal layer 28 , and the first ground layer 23 and the second ground layer 27 are all connected to the side metal layer 28 . The layers 25 are metallized and connected. Using the heat conduction principle of copper, the heat generated by the first ground layer 23 and the second ground layer 27 of the PCB is conducted to the side metal layer 25 of the PCB through copper, so as to solve the problem of heat dissipation of the protection board. , to improve the performance and life of the battery protection board 20 .

Please continue to refer to FIG. 3 , which is a schematic flowchart of an embodiment of a method for processing a battery protection board of the present application. It includes steps S100-S300, as follows:

S100: Provide a PCB board, where the PCB board includes a first metal layer, a first ground electrical layer, and a first signal layer that are stacked and disposed above the substrate from top to bottom.

Almost every electronic device, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, PCB boards must be used. . The PCB board is composed of an insulating base plate, connecting wires and pads for assembling and soldering electronic components, and has the dual functions of a conductive circuit and an insulating base plate.

The specific processing flow of the PCB board of the battery protection board 10 provided in this embodiment includes steps S110-S140. Please refer to FIG. 4, which is a schematic diagram of the specific processing flow of step S100 in FIG. 3 . details as follows:

S110 : Perform board configuration: provide a first metal layer, a first ground layer, a first signal layer, a second metal layer, a second ground layer, and a second signal layer.

Among them, before the board distribution, the first metal layer, the first ground layer, the second metal layer, and the second ground layer need to be processed in steps S101-S104. For details, please refer to FIG. 5, which is FIG. 4. Step S110 is a schematic diagram of a specific processing flow of the first metal layer, the first ground electrical layer, the second ground electrical layer, and the second metal layer before board configuration.

S101 : cutting out the required first metal layer, first ground layer, second ground layer, and second metal layer.

Take the raw materials and place them on the cutting machine, and cut out the required first metal layer, first ground layer, second metal layer and second ground layer according to the size required by the production instruction sheet.

S102: Perform inner-layer pattern arrangement on the first metal layer, the first ground layer, the second ground layer and the second metal layer according to circuit requirements.

The inner layer structure of the multi-layer circuit board is made of a whole copper foil substrate, and then the surface of the copper foil is cleaned by pickling to ensure that there is no other dust or impurities on it, and then mechanical grinding is used to roughen the copper foil. surface to enhance the adhesion between the dry film and the copper foil, and apply a layer of dry film on the surface of the copper foil. Paste an inner-layer circuit film on both sides of the copper foil substrate and set it up on the exposure machine. Use positioning holes and vacuum to precisely fit the film to the copper foil substrate, and use ultraviolet light in the yellow light area to make the film. The unshaded dry film is chemically changed and cured on the copper foil substrate. Finally, the unexposed dry film is removed with a developer to obtain the required first metal layer, ground layer and second metal layer. inner graphics.

S103: Etching and removing unnecessary parts in the surface patterns of the first metal layer, the first electrical ground layer, the second electrical ground layer and the second metal layer by using a liquid medicine, and inspects the inner layer.

Use a strong alkaline solution to dissolve the exposed copper surface, remove the copper surface that is not covered by dry film, and pay attention to the potion formula and time when etching. The thicker the copper foil, the longer the time and the wider the gap. And keep wider lines, because the etching will not only corrode the exposed copper foil, but also the copper surface at the edge of the dry film will be corroded more or less. Then, the cured dry film originally covered on the copper foil is removed with the film removal liquid. Finally, only the circuit copper foil that should be in the design will be left on the copper foil substrate, so as to realize the separation of the first metal layer, the first ground layer, the third The unnecessary parts of the surface pattern of the second ground layer and the second metal layer are etched and removed, and electronic testing is carried out to detect the open circuit, short circuit and other defects affecting the function that are not easy to be found visually.

S104: Perform inner layer grooving and inner layer browning on the substrate.

The inner layer of the substrate is punched and the inner layer is browned to roughen the copper surface, increase the bonding area, and increase the surface bonding force.

In addition, the signal layer needs to be processed in steps S105-S108 before the board configuration. Please refer to FIG. 6 . FIG. details as follows:

S105: cutting out the material, and cutting out the required signal layer.

S106: The inner layer pattern is then arranged on the signal layer according to the line requirements.

S107: And use the potion to etch and remove the unnecessary part of the surface pattern of the signal layer, and then inspect the inner layer and cover it with a film.

S108: Perform inner layer punching and inner layer browning on the substrate.

The steps S105-S108 of processing the signal layer before the board configuration is the same as the above-mentioned steps S101-S104, which are not repeated here. In the signal layer step S107, in addition to etching and removing the unnecessary part of the surface pattern of the signal layer by using the liquid medicine, and then inspecting the inner layer, the signal layer also needs to be covered with a film to ensure that the signal layer is transmitted correctly.

The steps of processing the first metal layer, the first ground electrical layer, the second metal layer and the second electrical ground layer and the processing steps of the signal layer can be performed at the same time, or they can be performed sequentially, and can be selected according to the actual processing conditions. This does not limit.

After step S110 is completed to perform board arrangement, step S120 is then performed.

S120: Disposing the second signal layer, the second ground layer and the second metal layer under the substrate, and the second signal layer, the second ground layer and the second metal layer and the first signal layer and the first ground layer The layer and the first metal layer are respectively arranged correspondingly with the substrate as the axis of symmetry.

Taking the substrate as the axis of symmetry, above the substrate, from top to bottom, are the first metal layer, the first ground layer, and the first signal layer; below the substrate, from bottom to top, are the second metal layer, the second ground layer, and the first signal layer. The second signal layer. Specifically, the first signal layer and the second signal layer are respectively arranged above and below the substrate, and are arranged in close contact with the substrate; the first electrical ground layer is arranged above the first signal layer, and the second electrical ground layer is arranged on the second signal layer Below, and between the ground electrical layer and the signal layer, it is blocked by insulating materials. Specifically, it can be blocked by a prepreg. When the epoxy resin of the prepreg melts, flows, and solidifies, the layers of circuits can be pressed together to form a reliable circuit. an insulating layer; the first metal layer is arranged above the first ground layer, the second metal layer is arranged below the second ground layer, and the metal layer and the ground layer are also blocked by insulating materials; The green oil is coated above the first metal layer and below the second metal layer, and the green oil can avoid welding short circuit during the use of the PCB board, thereby prolonging the service life of the PCB board.

S130: Laminate the first metal layer to the second metal layer together by lamination.

Use a prepreg to connect the outer copper foil and the inner layer, as well as the first metal layer, the first ground layer, the first signal layer, the second signal layer, the second ground layer and the second metal layer between the inner layer and the inner layer. The layers are connected as a whole and become a multi-layer PCB board.

S140: Electroplating and connecting the copper plating on the side of the second ground electrical layer to the metal layer on the side.

The side of the PCB board is metallized and electroplated, and the copper-plated edge of the second ground layer is plated with the side of the PCB board to solve the problem of heat dissipation of the ground layer.

After step S100 is completed in this embodiment, step S200 is then performed.

S200: Perform metallization and electroplating on the side of the PCB board to form a side metal layer.

The specific steps of step S200 can be seen in FIG. 7 , which is a schematic diagram of a specific processing flow of step S200 in FIG. 3 . Drill target, edge milling, drilling, profile milling, and electroplating to form a side metal layer on the PCB board respectively. The specific steps are as follows:

S201: Turn the target.

Use the target drilling machine to automatically locate and drill the target hole through the target to provide positioning holes for drilling.

S202: Edge milling.

Use a target milling machine to mill out the copper skin of the target position to reveal the target used when drilling the target.

S203: Drilling holes.

Several alignment holes are drilled on the substrate by in-line drilling equipment.

S204: Outline milling groove.

According to the size requirements, the side of the substrate is milled to form a side metal groove structure.

S205: Electroplating.

Copper plating is performed on the side metal groove structure to form a side metal layer.

After the step S200 is completed, the side surface of the PCB board is metallized and electroplated to form the side metal layer, and then the step S300 is performed.

S300: The edge of the first ground electrical layer is plated with copper and connected to the metal layer on the same side by electroplating.

The side of the PCB board is metallized and electroplated, and the copper-plated sides of the first ground layer and the second ground layer are electroplated to the side of the PCB board, so as to solve the problem of heat dissipation of the ground layer.

After completing steps S100-S300, the present example further includes steps S410-S440. Please refer to FIG. 8, which is a schematic diagram of the processing flow after the electroplating in step S300 in FIG. 3 is completed. Specifically include:

S410: Outer layer graphics.

The outer layer pattern is arranged on the first metal layer and the second metal layer.

S420: Outer layer etching, outer layer inspection.

Use the potion to etch and remove the unnecessary part of copper in the surface patterns of the first metal layer and the second metal layer, and place the battery protection board on the inspection equipment for inspection.

S430: Solder mask.

Apply solder resist ink to the first metal layer and the second metal layer, for example, apply green oil.

S440: Character, shape, cover opening.

Print the required characters, trademarks or part symbols on the surface of the first metal layer and the second metal layer by screen printing, and then place the whole board on the processing platform, and print the required characters, trademarks or symbols on the surface of the first metal layer and the second metal layer. The part symbol is printed on the surface of the first metal layer and the second metal layer, and the outer shape is also processed, and the laser beam is used to cut along the boundary of the open area.

In this embodiment, the ground electrical layer is connected to the side metallization of the edge of the board, and the heat generated by the ground electrical layer of the PCB is conducted to the side wall of the PCB through the copper by using the heat conduction principle of copper, and the metallization of the side of the PCB can be further connected with the mobile phone or the mobile phone or the side wall. The heat dissipation devices in other battery electrical equipment are connected, so as to solve the problem of heat dissipation of the protection board and improve the performance and life of the battery protection board.

In addition, the present application also provides an electronic device. Please refer to FIG. 9 for details. FIG. 9 is a schematic structural diagram of an embodiment of the electronic device provided by the present application.

The electronic devices in this embodiment are mainly electronic devices that can use rechargeable batteries, such as walkmans, electric toys, mobile phones, and the like. The electronic device includes a power supply device 920 and the above-mentioned battery protection board 910. The battery protection board 910 can be arranged on any side of the power supply device 920, and the metal layer on the side of the battery protection board 910 is further connected with the mobile phone or other battery powered devices. The heat dissipation device is connected, so as to solve the problem of heat dissipation of the protection board and improve the performance and life of the battery protection board.

The above descriptions are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims

A battery protection board, characterized in that the battery protection board comprises:

a substrate, the surface of the substrate is provided with a first signal layer, a first ground layer, and a first metal layer; and a side metal layer is provided on one side of the substrate and is vertically arranged with the substrate;

Wherein, the first signal layer is disposed above the substrate;

the first ground electrical layer is disposed above the first signal layer;

the first metal layer is disposed above the first ground layer;

Wherein, the first ground electrical layer is metallized and connected to the side metal layer.
The battery protection board according to claim 1, wherein the battery protection board further comprises: a second signal layer, a second ground layer and a second metal layer, the first signal layer, the first ground layer The layer, the first metal layer, the second signal layer, the second ground layer and the second metal layer are respectively disposed below the substrate with the substrate as the axis of symmetry;

Wherein, the second signal layer is disposed under the substrate next to the substrate;

The second ground electrical layer is disposed under the second signal layer, and the second ground electrical layer is metallized and connected to the side metal layer;

The second metal layer is disposed under the second ground layer.
The battery protection board according to claim 1 or 2, wherein the first ground layer is copper or aluminum, and is connected to the side metal layer of the substrate through copper or aluminum.
The battery protection board according to claim 2, wherein the first metal layer, the first ground layer, and the first signal layer are blocked by insulating materials; the second metal layer The layers, the second ground electrical layer, and the second signal layer are blocked by insulating materials.
The battery protection board according to claim 4, wherein the insulating material is a prepreg.
The battery protection board according to claim 5, wherein the prepreg has a thickness of 60-200 μm.
The battery protection board according to claim 1 or 2, wherein a solder resist layer is provided above the first metal layer.
The battery protection board according to claim 7, wherein the solder resist layer is a green oil coating layer.
The battery protection plate according to claim 1 or 2, wherein the width of the side metal layer is 20-50 μm.
The battery protection board according to claim 1 or 2, wherein the thickness of the first signal layer is 30-100µm.
The battery protection board according to claim 1 or 2, wherein the thickness of the first ground layer is 30-100 μm.
The battery protection plate according to claim 1 or 2, wherein the thickness of the first metal layer is 30-100 μm.
The battery protection board according to claim 1 or 2, wherein the side metal layer is connected to an external heat sink, so as to speed up the heat dissipation of the battery protection board.
A method for processing a battery protection plate as claimed in any one of claims 1-4, characterized in that, comprising the steps of:

A PCB board is provided, the PCB board includes a first metal layer, a first ground electrical layer, and a first signal layer that are stacked on top of the substrate from top to bottom; and

Metallizing and electroplating the side of the PCB board to form a side metal layer;

The edge of the first ground electrical layer is plated with copper and connected to the side metal layer by electroplating.
The method for processing a battery protection board according to claim 14, wherein the step of providing the PCB board comprises:

Performing board configuration: providing the first metal layer, the first ground layer, the first signal layer, the second metal layer, the second ground layer, and the second signal layer;

The second signal layer, the second ground layer and the second metal layer are arranged under the substrate, and the second signal layer, the second ground layer and the second The metal layer, the first signal layer, the first ground electrical layer, and the first metal layer are respectively disposed correspondingly with the substrate as the axis of symmetry;

bonding the first metal layer to the second metal layer together by lamination;

The side of the second ground electrical layer is plated with copper and connected to the side metal layer by electroplating.
The method for processing a battery protection board according to claim 14, wherein the step of metallizing the side surface of the PCB board to form a side metal layer specifically comprises:

The PCB board is subjected to target drilling, edge milling, drilling, contour milling, and electroplating to form the side metal layer.
The method for processing a battery protection plate according to claim 15, wherein the first metal layer, the first ground layer, the second ground layer, and the second metal layer are arranged The steps before include the following steps:

Cut the material, cut out the required first metal layer, the first ground layer, the second ground layer, and the second metal layer, according to the circuit requirements The first ground layer, the second ground layer, and the second metal layer are arranged in inner layer patterns, and the first metal layer, the first ground layer, the second metal layer, and the second The ground layer and the unnecessary part of the surface pattern of the second metal layer are removed by etching, then the inner layer is inspected, and finally the inner layer is punched and the inner layer is browned.
The method for processing a battery protection board according to claim 15, wherein the step of performing the board configuration on the first signal layer and the second signal layer includes the following steps:

Cut the material, cut out the required first signal layer and the second signal layer, and then arrange the inner layer pattern of the first signal layer and the second signal layer according to the circuit requirements, and use the syrup to The unnecessary parts in the surface patterns of the first signal layer and the second signal layer are removed by etching, and then the inner layer is inspected, covered with a film, and finally the inner layer is punched and the inner layer is browned on the substrate.
The method for processing a battery protection board according to claim 14, wherein the step of plating the edge of the first ground electrical layer with copper and galvanically connecting it to the metal layer on the side surface includes the following steps:

Perform outer layer patterning, outer layer etching, outer layer inspection, solder mask, character, shape, and cover opening on the first metal layer, so that the surface of the first metal layer on the side away from the first ground electric layer is to be processed.
An electronic device, characterized in that it comprises a power supply device and the battery protection board according to any one of claims 1-4, wherein the battery protection board is arranged on any side of the power supply device.