CN217825507U - PCB with blind slot and terminal equipment - Google Patents

Abstract

The application relates to a PCB board and terminal equipment with blind groove, this PCB board with blind groove includes: the laminated core comprises a first copper foil layer, a first core plate layer, a second core plate layer, a third core plate layer, a fourth core plate layer, a second copper foil layer and a PP layer; first blind grooves are formed in the first copper foil layer and the first core plate layer, second blind grooves are formed in the fourth core plate layer and the second copper foil layer, and the diameter of each first blind groove is larger than that of each second blind groove. The application provides an above-mentioned scheme all sets up a plurality of blind grooves through the upper and lower two sides at the PCB board to can satisfy the installation demand of more components and parts of PCB, promote high frequency signal's transmission rate and sensitivity moreover.

Description

PCB with blind slot and terminal equipment

Technical Field

The utility model relates to a PCB board technical field especially relates to a PCB board and terminal equipment with blind groove.

Background

A Printed Circuit Board (PCB) is an important electronic component, is a support for an electronic component, and is a provider for connecting electronic components to circuits. It is called a "printed" circuit board because it is made using electronic printing techniques.

Along with the development trend requirements of the electronic product that the size is smaller and the power is larger, the high frequency and RF designs are more and more extensive, the PCB is more and more designed to relate to the high-speed material blind slot design and the design of manufacturing a conductive pattern at the bottom of the blind slot, the application requirements of the corresponding blind slot structure design are increased along with the higher density of components mounted on the PCB substrate, and the traditional blind slot PCB is single in structure and can not well meet the installation requirements of the components and the high-frequency signal transmission speed and sensitivity.

SUMMERY OF THE UTILITY MODEL

Therefore, the PCB with the blind slot and the terminal equipment are needed to be provided aiming at the problems that the existing blind slot PCB is single in structure and cannot well meet the installation requirements of components.

The application provides a PCB board with blind groove, includes: the laminated core comprises a first copper foil layer, a first core plate layer, a second core plate layer, a third core plate layer, a fourth core plate layer, a second copper foil layer and a PP layer; the PP layers are arranged between the first copper foil layer and the first core plate layer, between the first core plate layer and the second core plate layer, between the second core plate layer and the third core plate layer, between the third core plate layer and the fourth core plate layer and between the fourth core plate layer and the second copper foil layer;

the first copper foil layer, the first core plate layer, the second core plate layer, the third core plate layer, the fourth core plate layer and the second copper foil layer are all provided with penetrating conductive through holes; first blind holes are formed in the first copper foil layer and the first core plate layer, second blind holes are formed in the third core plate layer, the fourth core plate layer and the second copper foil layer, and buried holes are formed in the fourth core plate layer;

the first copper foil layer and the first core plate layer are provided with first blind grooves, the fourth core plate layer and the second copper foil layer are provided with second blind grooves, and the diameter of each first blind groove is larger than that of each second blind groove.

In one embodiment, the distance between the first blind groove and the second blind groove is less than or equal to 5mm.

In one embodiment, the number of the first blind grooves and the number of the second blind grooves are both more than or equal to 1.

In one embodiment, the PCB board with the blind groove further comprises a solder resist layer coated on the bottom of the first blind groove.

In one embodiment, the solder mask layer is any one of green ink, black ink, red ink, blue ink, white ink or yellow ink.

In one embodiment, the thickness of the first core layer is 0.5-0.8 mm, and the two sides of the first core layer are correspondingly provided with first reverse copper foils, and the thickness of the first reverse copper foils is 15 μm; the thickness of the second core board layer is 0.5-0.8 mm, and the thickness of the copper layer on the second core board layer is 30 micrometers; the thickness of the third core plate layer is 0.5-0.8 mm, second reverse copper foils are correspondingly arranged on two sides of the third core plate layer, and the thickness of each second reverse copper foil is 15 micrometers; the thickness of the fourth core plate layer is 0.5-0.8 mm, and the thickness of the copper layer on the fourth core plate layer is 30 microns.

In one embodiment, the PP layer between the first copper foil layer and the first core layer is a 2116 type prepreg; the PP layer between the first core plate layer and the second core plate layer is a 2116 type prepreg; the PP layer between the second core plate layer and the third core plate layer is 106 type prepreg; the PP layer between the third core plate layer and the fourth core plate layer is a 2116 type prepreg; the PP layer between the fourth core plate layer and the second copper foil layer is a 2116 type prepreg.

In one embodiment, the number of the conductive through holes is more than or equal to 1.

In one embodiment, the first and second copper foil layers are routing or shielding layers on which PCBA devices are soldered.

The application also provides a terminal device, which comprises the PCB with the blind slot as described in any one of the embodiment description of the application.

The beneficial effect of this application includes:

the application provides a PCB board with blind groove all sets up a plurality of blind grooves through the upper and lower two sides at the PCB board to can satisfy the installation demand of more components and parts of PCB, promoted high frequency signal's transmission speed and sensitivity moreover.

Drawings

Fig. 1 is a schematic structural diagram of a PCB having blind slots according to an embodiment of the present disclosure.

The figures are labeled as follows:

101. a first copper foil layer; 102. a first core layer; 103. a second core layer; 104. a third core layer; 105. a fourth core layer; 106. a second copper foil layer; 107. a solder resist layer; 201. a first blind slot; 202. a second blind slot; 301. a conductive via; 302. a first blind hole; 303. a second blind hole; 304. and (6) burying holes.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, in an embodiment of the present application, there is provided a PCB board with a blind slot, including: a first copper foil layer 101, a first core layer 102, a second core layer 103, a third core layer 104, a fourth core layer 105, a second copper foil layer 106, and a PP layer; PP layers are arranged between the first copper foil layer 101 and the first core plate layer 102, between the first core plate layer 102 and the second core plate layer 103, between the second core plate layer 103 and the third core plate layer 104, between the third core plate layer 104 and the fourth core plate layer 105, and between the fourth core plate layer 105 and the second copper foil layer 106; meanwhile, the first copper foil layer 101, the first core layer 102, the second core layer 103, the third core layer 104, the fourth core layer 105 and the second copper foil layer 106 are all provided with a through conductive through hole 301; first blind holes 302 are formed in the first copper foil layer 101 and the first core layer 102, second blind holes 303 are formed in the third core layer 104, the fourth core layer 105 and the second copper foil layer 106, and buried holes 304 are formed in the fourth core layer 105; furthermore, a first blind slot 201 is formed on the first copper foil layer 101 and the first core layer 102, a second blind slot 202 is formed on the fourth core layer 105 and the second copper foil layer 106, and the diameter of the first blind slot 201 is greater than that of the second blind slot 202.

THE thickness of THE copper foil in THE first copper foil layer 101 and THE second copper foil layer 106 of THE PCB board with THE blind grooves is 1.0 oz; the PP layer is a prepreg layer, and the prepreg can be used as a bonding layer and an insulating layer under high-temperature and high-pressure vacuum pressing, so that the functions of glue filling and insulation are achieved.

The manufacturing process flow of the PCB with the blind slot comprises the following steps:

step 1: according to the design of the laminated structure and the process flow, cutting, primary drilling, electroplating, hole filling and hole plugging are carried out on main materials such as a core plate, a prepreg and copper foil and auxiliary materials required by the manufacture of the PCB, wherein the primary drilling is to drill the buried hole 304 required on the fourth core plate layer 105 in a mechanical drilling mode.

Step 2: the first core plate layer 102, the second core plate layer 103, the third core plate layer 104 and the fourth core plate layer 105 are all subjected to inner layer pretreatment, inner layer coating, inner layer exposure, inner layer development and etching to complete inner layer circuit manufacturing.

And step 3: according to the process design, the second core plate layer 103 is subjected to full-page screen printing solder mask, then a solder mask negative film is used for removing redundant solder mask through exposure and development, and a layer of high-temperature adhesive tape is covered on the plate surface after high-temperature curing. Because the bottom of the first blind groove 201 is provided with the solder mask layer 107, the outermost layer of the blind groove plate and the bottom of the groove have a height difference, and the silk-screen solder mask is performed on a plane. If the solder mask is manufactured before the coating mode, the solder mask cannot be printed at the bottom of the blind groove in a silk-screen mode, so the solder mask is manufactured before lamination.

And 4, step 4: laminating, namely laminating a core board and a prepreg required for manufacturing the first core board layer 102, the second core board layer 103, the third core board layer 104 and the fourth core board layer 105, forming a laminated board through hot pressing, and simultaneously laminating the solder resist and the high-temperature adhesive tape of the second core board layer 103 in the middle of the dielectric board; further, the first core plate layer 102, the second core plate layer 103, the third core plate layer 104, the fourth core plate layer 105, the two 2116 prepregs (with a resin content of 52%), the first copper foil layer 101 and the second copper foil layer 106 are positioned by hot melting and symmetrically typeset, and a vacuum laminating process is used until the laminating manufacturing of the whole layers is completed.

And 5: removing unneeded media and prepregs at preset positions of blind grooves of an upper board surface and a lower board surface of the PCB according to the size of the grooves by adopting a cover opening method through a mechanical depth control grooving technology, and exposing a high-temperature adhesive tape at the bottom of the upper board surface; further manually removing the high-temperature adhesive tape, removing the blackening layer through a microetching liquid production line, and exposing the metal pattern on the bottom of the blind groove; and further electroplating and filling the blind grooves of the upper plate surface and the lower plate surface to meet the requirement of hole copper.

Step 6: and (4) drilling the PCB subjected to the blind slot manufacturing for the second time, and finishing all blind holes required by the product structure design in a mechanical or laser depth control mode.

And 7: and (4) carrying out outer-layer electroplating, outer-layer circuit, solder mask and electrical measurement on the PCB subjected to secondary drilling according to a normal flow, and manufacturing until packaging and shipment.

The application provides a PCB board with blind groove all sets up a plurality of blind grooves through the upper and lower two sides at the PCB board to can satisfy the installation demand of more components and parts of PCB, promoted high frequency signal's transmission speed and sensitivity moreover.

This application adopts the mode of uncapping method to process the preparation to upper and lower blind groove, does not fluting when porosing because of, hinders the pressfitting and can not touch porose solution in the inboard, effectively avoids filling in the gasket method and hinders after getting rid of the gasket after the lamination and hinder and weld and will expose outside, and the later stage board hinders the problem that alkaline solution leads to the gasket to drop because of hindering when the through-hole is porose. Meanwhile, resistance welding is conducted on the bottom of the groove before lamination, high-temperature adhesive tape is pasted to achieve resistance welding, a mechanical depth control blind groove is adopted after lamination, the process flow is simple, and the product quality is reliable.

In some embodiments, the spacing between the first blind slot 201 and the second blind slot 202 is ≦ 5mm. And the number of the first blind grooves 201 and the number of the second blind grooves 202 are both more than or equal to 1.

In some embodiments, the PCB board with the blind groove further comprises a solder resist layer 107, and the solder resist layer 107 is coated on the bottom of the first blind groove 201.

The solder resist layer 107 may be any one of green ink, black ink, red ink, blue ink, white ink, and yellow ink. The solder mask layer 107 is used to prevent the wires from interfering with each other or getting tin during soldering, which may cause short circuits of different networks.

In some embodiments, the thickness of the first core layer 102 is 0.5-0.8 mm, and first inverse copper foils are correspondingly arranged on two sides of the first core layer 102, and the thickness of the first inverse copper foils is 15 μm; the thickness of the second core layer 103 is 0.5-0.8 mm, and the thickness of the copper layer on the second core layer 103 is 30 μm; the thickness of the third core plate layer 104 is 0.5-0.8 mm, and two sides of the third core plate layer 104 are correspondingly provided with second reverse copper foils, and the thickness of the second reverse copper foils is 15 μm; the thickness of the fourth core layer 105 is 0.5 to 0.8 mm and the thickness of the cu layer on the fourth core layer 105 is 30 μm.

In some embodiments, the PP layer between the first copper foil layer 101 and the first core layer 102 is a 2116 type prepreg; the PP layer between the first core board layer 102 and the second core board layer 103 is 2116 type prepreg; the PP layer between the second core layer 103 and the third core layer 104 is 106 type prepreg; the PP layer between the third core layer 104 and the fourth core layer 105 is a 2116 type prepreg; the PP layer between the fourth core layer 105 and the second copper foil layer 106 is a 2116 type prepreg.

In some embodiments, the number of conductive vias 301 is ≧ 1.

In some embodiments, the first and second copper foil layers 101 and 106 are routing or shielding layers, and the first and second copper foil layers 101 and 106 are used for soldering a PCBA device.

The application also provides a terminal device comprising a PCB board with a blind slot according to any one of the embodiments of the application.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A PCB board with blind slots, comprising: a first copper foil layer (101), a first core layer (102), a second core layer (103), a third core layer (104), a fourth core layer (105), a second copper foil layer (106), and a PP layer; the PP layers are arranged between the first copper foil layer (101) and the first core layer (102), between the first core layer (102) and the second core layer (103), between the second core layer (103) and the third core layer (104), between the third core layer (104) and the fourth core layer (105), and between the fourth core layer (105) and the second copper foil layer (106);

the first copper foil layer (101), the first core layer (102), the second core layer (103), the third core layer (104), the fourth core layer (105) and the second copper foil layer (106) are all provided with a through conductive through hole (301); first blind holes (302) are formed in the first copper foil layer (101) and the first core layer (102), second blind holes (303) are formed in the third core layer (104), the fourth core layer (105) and the second copper foil layer (106), and buried holes (304) are formed in the fourth core layer (105);

the first copper foil layer (101) and the first core layer (102) are provided with first blind grooves (201), the fourth core layer (105) and the second copper foil layer (106) are provided with second blind grooves (202), and the diameter of the first blind grooves (201) is larger than that of the second blind grooves (202).

2. The PCB board with the blind slot according to claim 1, wherein the distance between the first blind slot (201) and the second blind slot (202) is less than or equal to 5mm.

3. The PCB board with the blind grooves according to claim 1, wherein the number of the first blind grooves (201) and the second blind grooves (202) is more than or equal to 1.

4. The PCB with the blind slot as recited in claim 1, further comprising a solder resist layer (107), wherein the solder resist layer (107) is coated on the bottom of the first blind slot (201).

5. The PCB board with the blind slot of claim 4, wherein the solder mask layer (107) is any one of green ink, black ink, red ink, blue ink, white ink or yellow ink.

6. The PCB board with blind via according to claim 1, wherein the thickness of the first core layer (102) is 0.5-0.8 mm, and a first reverse copper foil is correspondingly disposed on both sides of the first core layer (102), and the thickness of the first reverse copper foil is 15 μm; the thickness of the second core layer (103) is 0.5-0.8 mm, and the thickness of the copper layer on the second core layer (103) is 30 μm; the thickness of the third core plate layer (104) is 0.5-0.8 mm, second reverse copper foils are correspondingly arranged on two sides of the third core plate layer (104), and the thickness of the second reverse copper foils is 15 micrometers; the thickness of the fourth core layer (105) is between 0.5 mm and 0.8 mm and the thickness of the copper layer on the fourth core layer (105) is 30 μm.

7. The PCB board with blind grooves according to claim 1, wherein the PP layer between the first copper foil layer (101) and the first core layer (102) is a 2116 type prepreg; the PP layer between the first core layer (102) and the second core layer (103) is a 2116 type prepreg; the PP layer between the second core plate layer (103) and the third core plate layer (104) is 106 type prepreg; the PP layer between the third core layer (104) and the fourth core layer (105) is a 2116 type prepreg; the PP layer between the fourth core layer (105) and the second copper foil layer (106) is a 2116 type prepreg.

8. The PCB board with the blind slot as claimed in claim 1, wherein the number of the conductive through holes (301) is more than or equal to 1.

9. The PCB board with blind slots of claim 1, wherein the first and second copper foil layers (101, 106) are routing or shielding layers, the first and second copper foil layers (101, 106) being used for soldering PCBA devices thereon.

10. A terminal device, characterized in that it comprises a PCB board with blind slots according to any of claims 1-9.

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