CN114786368A - Printed board pressing plate structure with laser blind holes, manufacturing method and application thereof - Google Patents
Printed board pressing plate structure with laser blind holes, manufacturing method and application thereof Download PDFInfo
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- CN114786368A CN114786368A CN202210391600.XA CN202210391600A CN114786368A CN 114786368 A CN114786368 A CN 114786368A CN 202210391600 A CN202210391600 A CN 202210391600A CN 114786368 A CN114786368 A CN 114786368A
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- 238000003825 pressing Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
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- 239000002131 composite material Substances 0.000 claims abstract description 100
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 115
- 229910052802 copper Inorganic materials 0.000 claims description 59
- 239000010949 copper Substances 0.000 claims description 59
- 239000011889 copper foil Substances 0.000 claims description 47
- 230000003287 optical effect Effects 0.000 claims description 33
- 238000007747 plating Methods 0.000 claims description 23
- 238000009713 electroplating Methods 0.000 claims description 16
- 238000011282 treatment Methods 0.000 claims description 14
- 238000003475 lamination Methods 0.000 claims description 13
- 230000008054 signal transmission Effects 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 7
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- 238000012546 transfer Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 9
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- 238000010030 laminating Methods 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
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- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention belongs to the technical field of printed circuit boards, and discloses a printed board pressing plate structure with laser blind holes, a manufacturing method and application thereof. The printed board laminated board structure with the laser blind holes comprises a plurality of substrate composite units from outside to inside; bonding sheets are pressed between the different substrate composite units; the substrate composite units positioned on the outermost layer are provided with outer layer blind holes; outer layer through holes penetrating through the substrate composite units and the bonding sheets are formed in the substrate composite units and the bonding sheets; the outer blind holes and the outer through holes are connected with the inner wiring layer to form interconnection. The invention adopts core-lam type pressing with a blind hole structure, and solves the design problems of the integrity, the stability and the high-density interconnection of multiple channels of product signals.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a printed board pressing plate structure with laser blind holes, a manufacturing method, a first-order 5G optical module printed board, an electrical interface of an optical module, an optical interface carrier, an electrical signal transmission carrier and a power supply provider of an electronic device.
Background
With the deployment and implementation of a 5G communication 2020 commercial plan, the demand of data transmission networks and data centers such as a backbone network and an access network for high-end optical modules is increasing, which becomes a core driving force for optical module development, and mainly needs to match the rate development trend in the fields of transmission networks, data centers, security monitoring and smart power grids.
The Printed Circuit Board (PCB) is an electrical interface of an optical module, an optical interface carrier, an electrical signal transmission carrier and a device power supply provider. 1 channel of the optical module corresponds to 2 pairs of differential lines on the PCB, the channel is generally only wired on the top layer and the bottom layer, and the multiple channels correspond to high wiring density; the single channel rate corresponds to the PCB rate. The 5G optical module develops towards multiple channels, namely 16 channels (32 pairs of differential lines) correspond to the requirements of 3/3mil line width/space of a PCB; the increase of the number of the channels inevitably brings the requirements of blind buried holes, increase of the number of the plate layers, multiple pressing, laser drilling and the like, and the conventional high multi-layer plate structure and the conventional plate material cannot meet the requirement of signal transmission of the 5G optical module plate.
Through the above analysis, the problems and defects of the prior art are as follows: in the prior art, a printed board structure pressed in a core lam mode is adopted to solve the problems of signal transmission of the 5G optical module board. However, the bandwidth requirement of the 5G is 10 times that of the 4G, the 5G optical module is often designed in a multi-channel mode to meet the bandwidth requirement, and is limited by the size of the optical module, the wiring must be routed in a blind hole structure, the wiring density is improved in a mode of adding layers and interconnecting blind holes, and the multi-channel design is met. A common through hole core lam structure printed board cannot meet the requirement of 5G high-frequency high-speed transmission, and a high-density interconnection printed board structure needs to be introduced. So that the related art manufacturing cost increases.
Disclosure of Invention
In order to overcome the problems in the related art, the disclosed embodiment of the invention provides a printed board pressing plate structure with laser blind holes, a manufacturing method, a first-order 5G optical module printed board, an electrical interface of an optical module, an optical interface carrier, an electrical signal transmission carrier and a power supply body of an electronic device.
The technical scheme is as follows: the printed board laminated board structure with the laser blind holes comprises a plurality of substrate composite units from outside to inside;
bonding sheets are pressed between the different substrate composite units;
outer layer blind holes are formed in the substrate composite unit positioned on the uppermost layer and the substrate composite unit positioned on the lowermost layer;
outer layer through holes penetrating through the substrate composite units and the bonding sheets are formed in the substrate composite units and the bonding sheets;
the outer layer blind holes and the outer layer through holes are connected with the inner layer wiring layer to form interconnection.
In one embodiment, the substrate composite unit includes a substrate, wherein upper and lower surfaces of the substrate are respectively plated with an inverted copper foil layer, and a surface of the inverted copper foil is plated with a copper plating layer.
In one embodiment, the thickness of the substrate is 0.075-0.15 mm; the thickness of the copper plating layer is 18-25 mu m.
In one embodiment, the inverse copper foil includes an upper layer inverse copper foil and a lower layer inverse copper foil, the upper layer inverse copper foil being disposed on an upper portion of the lower layer inverse copper foil;
the upper-layer reverse copper foil in the uppermost-layer substrate composite unit is electroplated with an upper-layer copper plating layer; the thickness of the upper layer reverse copper foil is 18-50 μm;
the lower-layer reverse copper foil in the lowest-layer substrate composite unit is electroplated with a lower-layer copper plating layer, and the thickness of the lower-layer reverse copper foil is 18-35 mu m.
In one embodiment, the bonding sheet is two sheets, and the thickness of the bonding sheet is 100-150 μm;
the aperture of the outer layer through hole is 200-600 μm;
the aperture of the outer layer blind hole is 100-130 μm.
The invention also aims to provide a manufacturing method for realizing the printed board pressing plate structure with the laser blind holes, which comprises the following steps:
firstly, performing line transfer on a second layer substrate composite unit and a third layer substrate composite unit in the inner layer by using wet films, exposure and etching; bonding sheets are pressed between the different substrate composite units;
and step two, adopting laser drilling blind holes and then filling holes to electroplate reverse copper foils for the uppermost substrate composite unit and the lowermost substrate composite unit.
In an embodiment, the manufacturing method of the printed board lamination structure with the laser blind hole specifically comprises the following steps:
(1) the second layer of substrate composite unit and the third layer of substrate composite unit firstly carry out inner layer circuit, the layers in the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are also directly transferred, the edges of the layers outside the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are marked by using a dummy film so as to be convenient for pressing and aligning, the copper surfaces are protected by using the dummy film in the plates, the second layer of substrate composite unit and the third layer of substrate composite unit use reverse copper foil as base copper and do not carry out electroplating treatment, and the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit also use reverse copper foil as base copper and do not carry out electroplating at first;
(2) after the uppermost substrate composite unit and the lowermost substrate composite unit are pressed, grinding the board by adopting a non-woven fabric 800# brush, wherein the current of the grinding board is 1.5-2A, and removing bonding sheet powder brought by pressing on the copper surface of the copper plating layer;
(3) thin copper treatment, namely performing brown oxidation treatment, wherein the control range of a copper-plated layer after thin copper is 8-10 um; the browning corrosion amount is controlled to be 0.8-1.5um, and the laser drilling blind holes, the drilling outer layer through holes, the copper deposition and the outer layer laser blind hole filling electroplating are respectively carried out after the browning;
(4) and after the outer blind hole is filled with the hole and electroplated, the circuit is manufactured and etched, so that the outer circuit is connected with the inner wiring layer through the outer blind hole and the outer through hole to form interconnection.
The invention also aims to provide a first-order 5G optical module printed board, wherein the first-order 5G optical module printed board is manufactured according to the pressing board structure of the printed board with the laser blind holes.
The invention also aims to provide an electrical interface, an optical interface carrier and an electrical signal transmission carrier of the optical module, wherein the electrical interface, the optical interface carrier and the electrical signal transmission carrier of the optical module are provided with the printed board pressing plate structure with the laser blind holes.
Another object of the present invention is to provide a power supply body of an electronic device, wherein the power supply body carrier of the electronic device carries the printed board pressing plate structure with laser blind holes.
Aiming at the technical problems in the prior art and the difficulty in solving the problems, the technical problems to be solved by the technical scheme of the invention are closely combined with the technical scheme to be protected and the results, data and the like in the research and development process, the technical problems to be solved by the technical scheme of the invention are deeply analyzed in detail, and some creative technical effects are brought after the problems are solved. The specific description is as follows: the requirement of the 5G on the bandwidth is 10 times that of the 4G, the 5G optical module is usually designed in a multi-channel mode for meeting the bandwidth, the 5G optical module is limited by the size of the light receiving module, the wiring is usually routed by adopting a blind hole structure, the wiring density is improved by adding layers and a blind hole interconnection mode, and the multi-channel design is met. However, the added layer mode is adopted, the uniformity of the thickness of the medium layer is poor after lamination, so that the flatness of the outer layer is low, and the integrity of 5G signal transmission is influenced. The invention adopts core-lam type pressing with a blind hole structure, reduces the difference of the thickness of the dielectric layer, improves the flatness tolerance of the outer layer from +/-0.1mm to +/-0.025mm, and solves the problems of the integrity and the stability of a product signal. And meanwhile, the blind hole design is added by adopting the outer-layer substrate composite unit, so that the high-density interconnection of multiple channels becomes possible.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic structural diagram of a printed board laminated board with laser blind holes, provided by an embodiment of the invention;
fig. 2 is a flowchart of a manufacturing method of a pressing plate structure of a printed board with laser blind holes according to an embodiment of the present invention;
FIG. 3 is a diagram showing the effect of comparing a prior art build-up blind via structure provided in example 10 of the present invention with a Core lam blind via structure employed in the present invention;
fig. 4 is an effect diagram of an 8-layer first-order optical module printed circuit board according to an embodiment of the present invention;
in the figure: 1. a substrate; 2. a bonding sheet; 3. inverting the copper foil; 3-1, upper-layer reversed copper foil; 3-2, lower layer reversal copper foil; 4. plating a copper layer; 4-1, plating a copper layer on the upper layer; 4-2, plating a copper layer on the lower layer; 5. outer layer blind holes; 6. and outer layer through holes.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms than those specifically described herein, and it will be apparent to those skilled in the art that many more modifications are possible without departing from the spirit and scope of the invention.
First, illustrative embodiments:
example 1
As shown in fig. 1, an embodiment of the present invention provides a printed board lamination structure with laser blind holes (core-lam printed board lamination structure with laser blind holes), which includes a plurality of substrate composite units from outside to inside;
outer layer blind holes 5 are formed in the substrate composite unit positioned on the uppermost layer and the substrate 1 composite unit positioned on the lowermost layer;
outer layer through holes 6 penetrating through the substrate composite units and the bonding sheets 2 are formed in the substrate composite units and the bonding sheets 2;
and the outer layer blind holes 5 and the outer layer through holes 6 are connected with the inner layer wiring layer to form interconnection.
Example 2
Based on the printed board laminating plate structure with the laser blind holes provided in embodiment 1, as shown in fig. 1, the substrate combining unit includes: a substrate 1; the upper surface and the lower surface of the substrate 1 are covered with reverse copper foils 3, and copper plating layers 4 are plated on the reverse copper foils 3.
Wherein, the thickness of the substrate 1 is 0.075 mm to 0.15 mm. The thickness of the copper plating layer is 18-25 μm. The thickness of the reverse copper foil 3 is 18-35 μm;
the sum of the thicknesses of the outer copper-plated layer 4 and the reversed copper foil 3 is 25 to 35 μm. Preferably, there is a thin copper treatment, after which the copper is 8-10um, and then browned to a copper level of 7-9um, plus a copper plating layer 4, and to a copper level of 8+18 to 26 um.
Example 3
Based on the printed board lamination plate structure with the laser blind hole provided in embodiment 1, as shown in fig. 1, the thickness of the adhesive in the bonding sheet 2 is 100 μm to 150 μm; so as to ensure that no adhesive shortage or cavity occurs during pressing.
Example 4
Based on the printed board laminated structure with the laser blind holes provided in embodiment 1, as shown in fig. 1, during copper plating of a copper plating layer 4, copper plating is completed through outer-layer copper deposition and electroplating of outer-layer through holes 6.
Example 4
Based on the printed board laminated board structure with the laser blind hole provided in embodiment 2, as shown in fig. 1, the reversed copper foil 3 includes:
the upper-layer reverse copper foil 3-1 (comprising L1, L3, L5 and L7) is 18-50 mu m thick; an upper-layer reverse copper foil 3-1 in the uppermost-layer substrate composite unit is electroplated with an upper-layer copper-plated layer 4-1;
the lower-layer reverse copper foil 3-2 (comprising L2, L4, L6 and L8) is 18-35 mu m thick; the lower-layer reverse copper foil 3-2 in the lowermost-layer substrate composite unit is electroplated with a lower-layer copper-plated layer 4-2.
Example 5
Based on the printed board lamination structure with laser blind holes provided in embodiment 2, as shown in fig. 1, the aperture of the outer layer through hole 6 is 200 μm to 600 μm. The outer layer blind holes 5 can be laser drilling blind holes with the aperture of 75-150 mu m.
Example 6
As shown in fig. 2, taking a four-layer substrate composite unit as an example, the method for manufacturing a printed board laminated structure with laser blind holes provided in the embodiment of the present invention includes:
s101, performing line transfer on a second-layer substrate composite unit and a third-layer substrate composite unit in the inner layer by using wet films, exposure and etching; bonding sheets 2 are pressed between the different substrate composite units;
and S102, drilling blind holes by adopting laser, filling holes and electroplating reverse copper foils 3 for the uppermost substrate composite unit and the lowermost substrate composite unit.
The method specifically comprises the following steps:
(1) the second layer of substrate composite unit and the third layer of substrate composite unit firstly carry out inner-layer circuits, the layers in the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are also directly transferred as circuits, the edges of the layers outside the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are targeted by using a dummy film so as to be convenient for pressing and aligning, the dummy film is used for protecting the copper surface in the plates, the reverse copper foil is used as base copper for the second layer of substrate composite unit and the third layer of substrate composite unit, electroplating treatment is not carried out, and the reverse copper foil 3 is used as the base copper for the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit, and electroplating is not carried out firstly;
(2) after the substrate composite unit on the uppermost layer and the substrate composite unit on the lowermost layer are pressed, grinding the board, wherein the grinding board adopts a non-woven fabric 800# grinding brush, the current of the grinding board is 1.5-2A, and adhesive sheet 2 powder brought by pressing on the copper surface of the copper-plated layer 4 is removed;
(3) thin copper treatment, namely performing brown oxidation treatment, wherein the control range of a copper-plated layer 4 after thin copper is 8-10 um; the browning corrosion amount is controlled to be 0.8-1.5um, and the laser drilling blind hole, the drilling outer layer through hole 6, the copper deposition and the filling electroplating treatment of the outer layer laser blind hole 5 are respectively carried out after the browning;
(4) and after the outer blind hole 5 is filled with holes and electroplated, a circuit is manufactured and etched, so that the outer circuit is connected with the inner wiring layer through the outer blind hole 5 and the outer through hole 6 to form interconnection.
Example 7
On the basis of the manufacturing method of the printed board lamination plate structure with the laser blind holes provided in embodiment 6, in step S101, 2 or more than 2 bonding sheets 2 are used, so as to ensure sufficient glue content, so as to ensure that no glue shortage occurs in the lamination process, and to achieve the purpose of stable signal transmission.
In step S102, the reversed copper foil 3 is used, and the thickness is as thin as possible, so as to prevent the stability of signal transmission from being affected by non-uniform copper surface caused by too much copper reduction before the upper copper plating layer 4-1 and the lower copper plating layer 4-2 in the uppermost substrate composite unit and the lowermost substrate composite unit are irradiated.
Example 8
On the basis of the manufacturing method of the printed board laminated board structure with the laser blind holes provided in embodiment 6, the manufacturing method of the printed board laminated board structure with the laser blind holes specifically includes:
(1) the second layer of substrate composite unit and the third layer of substrate composite unit are firstly subjected to reverse copper foil electroplating, the inner layers of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are not manufactured, only the edge fake layers of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are manufactured so as to facilitate pressing and alignment, and the reverse copper foil 3 electroplating is carried out on the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit after the reverse copper foil electroplating is carried out on the second layer of substrate composite unit and the third layer of substrate composite unit;
(2) after the uppermost substrate composite unit and the lowermost substrate composite unit are laminated, the board is ground once to remove the prepreg (adhesive sheet 2) powder brought by the lamination on the copper surface of the copper plating layer 4.
(3) Thin copper treatment is needed for facilitating outer layer laser after plate grinding, the thickness of a copper-plated layer 4 after thin copper is controlled to be 8-10um, and then browning treatment is carried out; and after the browning, respectively performing laser treatment, through hole drilling (outer layer through hole 6), copper deposition and hole filling electroplating treatment, wherein the hole filling electroplating is used for ensuring that the hole depression of the outer layer blind hole 5 meets the requirements of customers. For the laser plate, the smaller the depression is, the better the welding reliability is;
(4) after the outer blind hole 5 is electroplated, the circuit is made after the copper in the hole and the surface copper are plated, and the circuit is etched, so that the outer circuit is connected with the inner wiring layer through the outer blind hole 5 and the outer through hole 6 to form interconnection.
In the embodiment of the invention, the substrates in the uppermost substrate compound unit and the lowermost substrate compound unit need to be subjected to laser treatment, so that the substrates are not too thick, and the thickness is 0.075 mm to 0.1 mm.
The selection of radium hole size needs to combine aspect ratio and control of hole recess in outer layer blind hole 5, and aperture is 75-150 μm.
Because of the high density design, the copper is not too thick when the upper copper-plated layer 4-1 and the lower copper-plated layer 4-2 complete copper plating, otherwise, the etching is not facilitated and the shape of the circuit is ensured, and the thickness is 25-35 μm.
In order to ensure the integrity and stability of signals as much as possible during circuit design, corresponding compensation needs to be carried out on corner positions and sparse positions, the corner positions and the sparse positions are specific to some sharp corners or corner positions of a circuit pattern, and the shape of an original design pattern can be prevented from being changed due to etching after compensation, so that the purpose of ensuring the integrity of the signals is achieved.
When in solder mask, the thickness is ensured to be uniform, and the printing oil is only allowed once.
Example 9
The manufacturing method of the printed board laminated structure with the laser blind holes provided in embodiment 6 is also applicable to single-layer, two-layer, three-volume substrate composite units and more than four-layer substrate composite units, and the manufacturing principle is the same.
Example 10
Based on the printed board laminated board structure with the laser blind holes described in the above embodiments 1 to 9, the requirement of 5G for bandwidth is 10 times that of 4G, the 5G optical module is often designed by using multiple channels to meet the bandwidth, and is limited by the size of the light receiving module, the wiring is often routed by using a blind hole structure, the wiring density is improved by adding layers and interconnecting blind holes, and the multiple channel design is met. However, in the prior art, a layer adding mode is adopted, the uniformity of the thickness of the medium layer is poor after lamination, so that the flatness of the outer layer is low, and the integrity of 5G signal transmission is influenced.
According to the invention, core-lam type pressing with a blind hole structure is adopted, so that the difference of the thickness of the dielectric layer is reduced, the flatness tolerance of the outer layer is improved from +/-0.1mm to +/-0.025mm, and the problems of integrity and stability of product signals are solved. And meanwhile, the blind hole design is added by adopting the outer-layer substrate composite unit, so that the high-density interconnection of multiple channels becomes possible. As shown in fig. 3, the effect of comparing the layer-adding blind hole structure of the prior art with the Core lam blind hole structure of the present invention is shown.
II, application embodiment:
the specific manufacturing process of the 8-layer first-order optical module product PCB is as follows:
first step, L3-4& L5-6 layer flow:
cutting, inner layer wet film (making double-sided circuit, namely L3&4 or L5&6), inner layer acid etching, inner layer AOI, punching and browning;
second, L1-2& L7-8 layer procedure:
cutting, namely cutting an inner layer wet film (only an L2 or L7 layer circuit is manufactured, and outer layers L1 and L8 are used as fake layer protection films, and only plate edge alignment PATTERN is manufactured), etching the inner layer acid, punching the inner layer AOI, and browning the inner layer AOI;
thirdly, laminating and outer layer process:
stacking boards, pressing, routing edges, grinding the boards with resin, reducing copper, forming blind holes in the outer layer 5, forming through holes in the outer layer 6, baking the boards, depositing copper, plating an electric board, forming a dry film in the outer layer 1, forming a corrosion-AOI 1 in the outer layer, forming a dry film in the outer layer 2, forming thick gold, removing a film-AOI 2, testing impedance, forming a hole in a solder-resisting plug hole, welding resistance, characters, forming a dry film in the outer layer 3, forming gold, removing the film, performing V-CUT-electric milling, forming oblique edges, electrically testing, finally testing, packaging and delivering.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and the scope of the present invention should not be limited thereto, and any modifications, equivalents and improvements made by those skilled in the art within the technical scope of the present invention as disclosed in the present invention should be covered thereby.
Claims (10)
1. A printed board laminated board structure with laser blind holes is characterized by comprising a plurality of substrate composite units from outside to inside;
bonding sheets (2) are pressed between the different substrate composite units;
outer layer blind holes (5) are formed in the substrate composite unit positioned on the uppermost layer and the substrate composite unit positioned on the lowermost layer;
outer layer through holes (6) penetrating through the substrate composite units and the bonding sheets (2) are formed in the substrate composite units and the bonding sheets (2);
and the outer layer blind holes (5) and the outer layer through holes (6) are connected with the inner layer wiring layer to form interconnection.
2. The printed board lamination board structure with the laser blind holes according to claim 1, wherein the substrate combination unit comprises: the copper-clad plate comprises a substrate (1), wherein the upper surface and the lower surface of the substrate (1) are respectively electroplated with a reversed copper foil layer (3), and the surface of the reversed copper foil (3) is electroplated with a copper-clad layer (4).
3. The printed board lamination plate structure with the laser blind holes as claimed in claim 2, wherein the thickness of the substrate (1) is 0.075-0.15 mm; the thickness of the copper plating layer is 18-25 mu m.
4. The board bonding structure with laser blind via according to claim 2, wherein the reversed copper foil (3) comprises an upper reversed copper foil (3-1) and a lower reversed copper foil (3-2), the upper reversed copper foil (3-1) being disposed on the upper portion of the lower reversed copper foil (3-2);
the upper-layer reverse copper foil (3-1) in the uppermost-layer substrate composite unit is electroplated with an upper-layer copper plating layer (4-1); the thickness of the upper-layer reverse copper foil (3-1) is 18-50 mu m;
the lower-layer reverse copper foil (3-2) in the lowest-layer substrate composite unit is electroplated with a lower-layer copper plating layer (4-2), and the thickness of the lower-layer reverse copper foil (3-2) is 18-35 mu m.
5. The printed board laminated board structure with the laser blind holes as claimed in claim 1, wherein the adhesive sheets (2) are two sheets, and the thickness of the adhesive sheets (2) is 100 μm to 150 μm;
the aperture of the outer layer through hole (6) is 200-600 μm;
the aperture of the outer layer blind hole (5) is 100-130 μm.
6. The manufacturing method for realizing the printed board laminated plate structure with the laser blind holes, which is described in any one of claims 1 to 5, is characterized by comprising the following steps:
firstly, performing line transfer on a second layer substrate composite unit and a third layer substrate composite unit in the inner layer by using wet films, exposure and etching; bonding sheets (2) are pressed between the different substrate composite units;
and step two, adopting laser to drill blind holes and then fill holes to electroplate reverse copper foils (3) for the uppermost layer substrate composite unit and the lowermost layer substrate composite unit.
7. The manufacturing method of the printed board laminated board structure with the laser blind holes as claimed in claim 6, wherein the manufacturing method of the printed board laminated board structure with the laser blind holes specifically comprises the following steps:
(1) the second layer of substrate composite unit and the third layer of substrate composite unit firstly carry out inner layer circuit, the layers in the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are also directly transferred as circuits, the edges of the layers outside the backup plates of the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit are targeted by using a dummy film so as to be convenient for pressing and aligning, the dummy film is used for protecting the copper surface in the plates, the reverse copper foil is used as base copper for the second layer of substrate composite unit and the third layer of substrate composite unit, electroplating processing is not carried out, and the reverse copper foil (3) is used as the base copper for the uppermost layer of substrate composite unit and the lowermost layer of substrate composite unit, and electroplating is not carried out at first;
(2) after the substrate composite unit on the uppermost layer and the substrate composite unit on the lowermost layer are pressed, grinding the board, wherein the grinding board adopts a non-woven fabric 800# grinding brush, the current of the grinding board is 1.5-2A, and adhesive sheet (2) powder brought by pressing on the copper surface of the copper plating layer (4) is removed;
(3) thin copper treatment, namely performing brown oxidation treatment after the control range of the thin copper plated layer (4) is 8-10 um; the browning corrosion amount is controlled to be 0.8-1.5 mu m, and the laser drilling blind holes, the drilling outer layer through holes (6), the copper deposition and the filling electroplating treatment of the outer layer laser blind holes (5) are respectively carried out after the browning;
(4) and after the outer blind hole (5) is filled with holes and electroplated, the circuit is manufactured and etched, so that the outer circuit is connected with the inner wiring layer through the outer blind hole (5) and the outer through hole (6) to form interconnection.
8. A first-order 5G optical module printed board is characterized in that the first-order 5G optical module printed board is manufactured according to the printed board pressing plate structure with the laser blind holes of any one of claims 1 to 5.
9. An electrical interface, an optical interface carrier and an electrical signal transmission carrier of an optical module, which are characterized in that the electrical interface, the optical interface carrier and the electrical signal transmission carrier of the optical module are provided with the printed board pressing plate structure with the laser blind holes as claimed in any one of claims 1 to 5.
10. A power supply body of an electronic equipment device, characterized in that the power supply body carrier of the electronic equipment device is provided with the printed board lamination structure with the laser blind hole as claimed in any one of claims 1 to 5.
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| CN202210391600.XA CN114786368A (en) | 2022-04-14 | 2022-04-14 | Printed board pressing plate structure with laser blind holes, manufacturing method and application thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
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- 2022-04-14 CN CN202210391600.XA patent/CN114786368A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116156741A (en) * | 2023-04-23 | 2023-05-23 | 南昌龙旗信息技术有限公司 | Printed circuit board and mobile device |
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