CN101754571B - Flexible multilayer wiring plate and its manufacturing method - Google Patents
Flexible multilayer wiring plate and its manufacturing method Download PDFInfo
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- CN101754571B CN101754571B CN200910163346.2A CN200910163346A CN101754571B CN 101754571 B CN101754571 B CN 101754571B CN 200910163346 A CN200910163346 A CN 200910163346A CN 101754571 B CN101754571 B CN 101754571B
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Abstract
Provided is a multilayer flexible printing wiring plate having a cable portion with excellent bending resistance and dealing with the installation of a thin and high-density part, and its manufacturing method. The multilayer flexible wiring plate and its manufacturing method is characterized in that In the multilayer flexible wiring plate formed by internal wiring bodies (111, 121, 131) using at least one surface of the insulated matrix material (5) to form a conductive pattern (6), and having an installation part and a cable part, the installation part is formed in the way that a rigid material and adhesive resin compound layer (4) covers the conductive pattern (1), the cable part is formed with an adhesive layer (3) contained no rigid materials, the surfaces having no contact with the conductive patterns in the compound layer and the adhesive layer are covered by a continuous insulating film (2).
Description
Technical field
The present invention relates to have the cable section of bending resistance excellence and can tackle multilayer flexible printed wiring plate and the manufacture method thereof that both thin and highdensity parts are installed.
Background technology
For the typical mobile electronic device such as portable phone, digital camera or notebook computer, especially earnestly need compactization.For by compactization of mobile electronic device and be easy to use, often adopt the design of the framework such as collapsible or slidingtype.
Realize the design of this excellence, hinge (hinge) structure that need to turn round and wiring inner through this hinge arrangement and that can transmit the signal of telecommunication under jackknife action or sliding action.
Transmit the signal of telecommunication for the hinge in running is inner, even if mainly adopt the flexible printing wiring board that also can transmit signal under dynamic bending state, for the flexible printing wiring board using in hinge part, require to guarantee its machinery, electrical characteristic in the alternating bending action of 100,000 left and right.
On the other hand, because the data size to be processed such as the still image/animation data of high image quality increase rapidly, also require the high speed of information processing for mobile electronic device.On the other hand, to there is the semiconductor of Premium Features and carry out semi-conductive becoming more meticulous in order to provide with low cost, simultaneously also by the semiconductor packages such as BGA, CSP (package) miniaturization.The bump pitch (bump pitch) of BGACSP also reduces to 0.5mm, 0.4mm, 0.3mm gradually from spacing 0.8mm, on the wiring plate that comprises flexible printing wiring board, the semi-conductive semiconductor packages of above-mentioned thin space also must be able to be installed.
And, for mobile electronic device, require very consumingly compactization for mobile object, also often require the slim lightweight in 0.1mm unit, 1g unit's situation for used substrate itself.
Sum up above-mentioned truth, now and in the future flexible printing wiring board need to meet following 3 conditions.
1) will there is soft electric wiring cable portion, and this electric wiring cable portion to have bending resistance.
2) semiconductor packages that will highdensity thin space can be installed.
3) want slim light weight.
At present, there is the flexible cable portion of bending resistance and for the structure of multi-layer FPC of highdensity CSP is installed, adopt the structure shown in Fig. 6 as formation.
As shown in Figure 6; in the structure of traditional multilayer flexible wiring plate; in order to form the flexible cable portion with bending resistance; and covering becomes the internal layer FPC of cable portion; and use diaphragm (cover film); form again enhancing (built-up) layer of the high-density packages such as CSP can be installed ground designing wiring; utilize the lamination bonding agent of prepreg (pre preg) layer etc.; also by one side FPC or two-sided FPC at aforesaid internal layer diaphragm superimposed layer, and carry out via hole (via) processing.
But, in above-mentioned traditional structure, there is following problem.
(1) become the thickness thickening of the enhancing portion of installation portion, hinder compactization of substrate.
(2) because enhancing portion is thick, in the time forming via hole with laser, not only laser processing spended time, and also it is also darker to cross hole depth, and therefore via hole is electroplated also spended time.
(3) while not doing in addition via hole filling (via fill) plating, cave volume in via hole increases, thereby carry out the via hole level chip (via on chip) of parts installation on mistake hole time, the scolding tin that should be attached to parts is gulped down by mistake hole, easily there is the inhomogeneous phenomenon of welding, or be easily called residual clearance (void), the unsatisfactory phenomenon of installation quality.
Patent documentation 1: No. 2708980 communique of Japanese Patent
In above-mentioned patent documentation 1, the invention that makes multilayer flexible wiring plate attenuation and cost degradation is disclosed.But, do not mention at all and take into account the slim rigidity of the desired mounting portion of multilayer flexible wiring plate and the problem of the flexibility of cable section and bending resistance, do not provide again solution countermeasure.
Summary of the invention
The present invention has considered that the design of above-mentioned aspect forms, and its object is to provide to be had the cable section of bending resistance excellence and can tackle multilayer flexible printed wiring plate and the manufacture method thereof that both thin and highdensity parts are installed.
In order to reach above-mentioned purpose, the application provides the invention of following thing and method for making.
First as the invention of the thing a kind of multilayer flexible wiring plate recorded in requirement 1 of having the right, there is installation portion and cable portion, this installation portion and cable portion are that the internal layer Wiring body that utilization is formed with conductive pattern at least one face of insulating body material forms, and it is characterized in that:
So that covering the mode of described conductive pattern, the complex layer of rigid material and adhesive resin forms described installation portion,
Described cable portion is formed with the not bond layer containing described rigid material,
The face not joining with the described conductive pattern in described complex layer and described bond layer is covered by a continuous dielectric film.
Then, as the invention of the method for making invention that requirement 4,6 and 8 records of having the right.
That is, the manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of recording in claim 4, wherein,
Prepare outer layer laminate material, this outer layer laminate material has formed conductive pattern on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and not containing the adhesive linkage of the described adhesive resin of employing of described rigid material
Prepare to have formed the internal layer Wiring body of conductive layer at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by outer layer laminate material described at least one is overlapped onto have the face of described complex and described adhesive linkage and in addition lamination form laminated wiring plate,
On described laminated wiring plate, form at least one of via hole and through hole (through hole),
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage is removed and formed cable portion.
The manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of recording in claim 6, wherein,
Prepare to form the outer layer laminate material of conductive layer on a face of dielectric film,
Prepare internal layer Wiring body, this internal layer Wiring body has formed conductive pattern at least one face of insulating body material, and form overlappingly the complex layer of rigid material and adhesive resin with this conductive pattern and not containing the adhesive linkage of the described adhesive resin of employing of described rigid material
On at least one face of described internal layer Wiring body, by outer layer laminate material described at least one is overlapped onto have the face of described complex and described adhesive linkage and in addition lamination form laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage is removed and formed cable portion.
The manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of recording in claim 8, wherein,
Prepare outer layer laminate material, this outer layer laminate material is provided with conductive layer and covers the strippable covering (cover) of this conductive layer on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and not containing the adhesive linkage of the described adhesive resin of employing of described rigid material
Prepare to form the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by lamination, described outer layer laminate material and the face with described complex and described adhesive linkage are joined, form laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage is removed and formed cable portion.
(invention effect)
As mentioned above, in the present invention, can reduce and form the dielectric film of installation portion and the number of plies of bonding agent, be easy to substrate slimming.This result, can reduce for the via hole of interlayer conduction and process the laser beam drilling processing of use or fill for via hole plating, via hole process time and the cost electroplated.
Accompanying drawing explanation
Fig. 1 is the cutaway view that represents the structure of the first embodiment of multilayer flexible wiring plate of the present invention.
Fig. 2 is the cutaway view that represents the structure of the second embodiment of multilayer flexible wiring plate of the present invention.
Fig. 3 is the process chart that represents the first embodiment of manufacture method of the present invention.
Fig. 4 is the process chart that represents the second embodiment of manufacture method of the present invention.
Fig. 5 is the process chart that represents the 3rd embodiment of manufacture method of the present invention.
Fig. 6 is the process chart that represents the 4th embodiment of manufacture method of the present invention.
Fig. 7 is the sectional structure chart that represents traditional structure.
(symbol description)
1 conductive pattern (conductive foil), 2 dielectric films, 3 bond layers, 4 layer of prepreg, 5 insulating body materials, 6 conductive patterns, 7 via hole prebored holes, 8 conductive patterns, 9 conductive patterns, 100 laminated wiring plates, 111,121,131,141 outer layer laminate materials, 112,122,132,142 internal layer Wiring bodies.
Embodiment
Below, based on Fig. 1 to Fig. 6, describe with regard to embodiments of the present invention.Fig. 1 and Fig. 2 represent 2 structure example of multilayer flexible wiring plate of the present invention.Fig. 3 to Fig. 6 represents 4 manufacturer's rules of the present invention.
(the first structure example)
The cross-section structure of multilayer flexible printed wiring plates one of basic structure of the present invention shown in Fig. 1,4 layers of structure.
(the second structure example)
The cross-section structure of multilayer flexible printed wiring plates another basic structure of the present invention shown in Fig. 2,6 layers of structure.
(manufacture method)
In the manufacture method of multilayer flexible printed wiring plate of the present invention shown in Fig. 3 to Fig. 6.
(manufacture method 1)
The first embodiment of manufacture method of the present invention shown in Fig. 3.This first embodiment is made up of following operation (1) to (5).
(1) prepare outer layer laminate material 111, this outer layer laminate material 111 is formed with conductive metal foil 1 in a side of dielectric film 2, clip dielectric film 2 ground on the face of a side contrary to conductive metal foil 1, at least in the part of inscape that becomes installation portion, form glass cloth (glass cloth) and the layer of prepreg 4 take adhesive resin as inscape as rigid material, and in the part of inscape that becomes cable portion, form organic adhesive 3, in its inscape, do not comprise glass cloth.
As the material of dielectric film 2, can adopt the dielectric film that is used in flexible printing wiring board of polyimides, polyamide, LCP (liquid crystal polymer), PEN (PEN) etc.The material of conductive metal foil 1 can be various rolled copper foils or electrolytic copper foil.
As the material of bonding agent 3, can utilize the adhesives diaphragm bonding agent that uses etc., be not easy to bending and bending resistance excellence containing glass cloth in the time manufacturing one side FPC or two-sided FPC.Layer of prepreg 4 can be utilized the prepreg containing the epoxies of glass cloth or acid imide, BT resin (BT レ ジ Application (login trade mark)) class etc.
(2) preparation is formed with the internal layer Wiring body 112 of conductive pattern 6 on insulating body material 5.
(3) make the conductive pattern face of this internal layer Wiring body 112, overlapping opposite to each other with the adhesive side in Kaifeng (release) of peeling off the outer layer laminate material 111 forming through above-mentioned operation (1), by internal layer Wiring body 112 and outer layer laminate material 111, utilize vacuum lamination to carry out lamination, thereby form laminated wiring plate 100.
(4) certain one side of the conductive layer 1 of the laminated wiring plate 100 of making from above-mentioned operation (3), utilizes CO
2 conductive layer 1, dielectric film 2 and layer of prepreg 4 are removed in the parts such as laser, and expose on the surface that makes to be formed at the conductive pattern 6 on internal layer Wiring body 112.
Then,, through necessary cleaning (cleaning) operations such as desmearing (desmear) processing, form the prebored hole 7 as via hole.In the front and back of laser processing, also can carry out processing and the desmearing processing of the prebored hole 7 of the through hole of processing by perforation (drill).
(5) in above-mentioned operation (4) afterwards, the face that exposes of laminated wiring plate 100 is carried out to conductive treatment and cathode copper plating etc., form electrodeposited coating 8.This electrodeposited coating 8 carries out via hole or connects the interlayer conduction in hole.
At this, electroplate adopt via hole to fill to electroplate or through hole fill electroplate etc. fill up (filled) electroplating technology, cross hole and connect inside, hole thereby can carry out landfill with conducting metal.
On the electrodeposited coating 8 of the cable portion that is equivalent to laminated wiring plate 100 of above-mentioned operation (5), be formed for etched dry film (not shown), remove unwanted metal part by etching, thereby form conductive layer 8.
As the formation method of this outermost conductive layer 8, also can be in operation (4) before afterwards, form anti-pattern by the resist plating for half addition (Semi-additive) (め つ I レ ジ ス ト), utilize copper to electroplate and form conductive pattern and interlayer conduction road simultaneously, utilize soft etching to remove previous metal level 1.
, on the conductive layer 8 of installation portion form solder resist (solder resist), after implementing the surface treatment of the necessity such as gold plating or scolding tin plating, carry out parts installation thereafter.
(effect of manufacture method 1)
By these features, manufacture method 1 has following effect.
First, the material that can reduce the insulating material that becomes the enhancing of installation portion portion forms the number of plies, easily carries out the slimming of substrate.
In addition, owing to making, enhancing portion insulating material is thinner, can reduce for the via hole of interlayer conduction and processes the laser beam drilling processing of use or fill for via hole plating, via hole process time and the cost electroplated.
And, can reduce and not carry out via hole and fill and electroplate or the volume in cave when filling perforation, in via hole, and can expect that the effect of following phenomenon occurs in minimizing,, crossing while carrying out the via hole level chip of parts installation on hole, should be attached to scolding tin on parts by cross hole gulp down and weld inhomogeneous phenomenon or be called residual clearance, be not desirable phenomenon to quality is installed.
And in this manufacture method, by by the thickness of the high rigidity layer of prepreg that comprises glass cloth and application site optimization, manufacturing process's volume to volume of multilayer flexible substrate (Roll to Roll) can be changed, can accomplish automation, rate of finished products improvement and the cost degradation of the manufacturing process of multilayer flexible wiring plate.
(manufacture method 2)
Fig. 4 illustrates the second embodiment of manufacture method of the present invention.This second embodiment is made up of following operation (1a) to (6).
(1a) prepare outer layer laminate material 121, this outer layer laminate material 121 has formed the metal forming as conductive pattern 1 in a side of dielectric film 2.As the material of dielectric film 2, can adopt the insulating film material using of polyimides, polyamide, LCP, PEN etc. in flexible printing wiring board.The material of conductive metal foil 1 can be various rolled copper foils or electrolytic copper foil.
(2a) prepare internal layer Wiring body 122, in this internal layer Wiring body 122, in part conductive pattern face, that at least become installation portion of internal layer Wiring body 122 that forms conductive pattern 1, form as the glass cloth of rigid material and the layer of prepreg take adhesive resin as inscape 4, and at least in the part of inscape that becomes cable portion, form adhesive resin 3, this adhesive resin 3 is not take glass cloth as inscape, so do not comprise glass cloth.
(3) on above-mentioned internal layer Wiring body 122, utilize the lamination outer layer laminate materials 121 such as vacuum hotpressing.
(4) face of the outermost conductive layer 1 of outer layer laminate material 122 from above-mentioned operation (3), utilizes CO
2conductive layer (metal forming) 1, dielectric film 2 and bond layer 3 are removed in the parts such as laser, and expose on the surface that makes to be formed at the conductive pattern 6 on internal layer Wiring body 122, become the prebored hole 7 of via hole.In the front and back of laser processing, also can carry out the prebored hole processing by the through hole of perforation processing.
(5) in above-mentioned operation (4) afterwards, implement the necessary cleaning processes such as desmearing processing, then, then carry out conductive treatment and cathode copper is electroplated, form electrodeposited coating 8, and to form interlayer conductive structure be via hole or through hole.As electro-plating method, adopt so-called via hole to fill the electroplating technology of filling up of plating or through hole filling plating etc., cross hole and connect inside, hole thereby can carry out landfill with conducting metal.
(6) on the electrodeposited coating 8 of the laminated wiring plate 100 of above-mentioned operation (5), be formed for etched dry film, remove partially-etched unwanted metal, form conductive pattern 8.
(effect of manufacture method 2)
, can on the conductive pattern of parts installation portion 8 form solder resist, and after implementing the needed surface treatments such as gold plating or scolding tin plating, carry out parts installation thereafter.By these features, there is the equal effect of manufacture method 1 describing by Fig. 3.
(manufacture method 3)
Fig. 5 illustrates the 3rd embodiment of manufacture method of the present invention.The 3rd embodiment is made up of following operation.
In the embodiment shown in this Fig. 5, adopt so-called strippable (being called " Peelable ") metal forming, to replace the conductive pattern 1 using in the operation (1) of Fig. 3.In order to improve operation (handling) property of thinner conductive metal foil, this metal foil laminates thinner metal forming and thicker metal forming as its covering, be configured to the lamination metal paper tinsel that can easily peel off as required the sandwich construction of removing thicker metal forming.
In operation (1b), prepare outer layer laminate material 131, this outer layer laminate material 131 is on a face of dielectric film 2, lamination become the thinner metal forming of conductive pattern 1 and the thicker metal forming as covering 9, on another side, at least in the part of inscape that becomes installation portion, form as the glass cloth of rigid material and the layer of prepreg take adhesive resin as inscape 4, again, in the part of inscape that becomes cable portion, forming as inscape is not the organic adhesive 3 of glass cloth containing rigid material.
Operation (2) is the operation that forms internal layer Wiring body 132, identical with the operation (2) in manufacture method 1.
Operation (3-1) and the operation (3) (3-2) and in manufacture method 1 and manufacture method 2 are suitable, but adopt strippable material as outer layer laminate material 131, illustrated in the mode of 2 operations in order to show it to peel off front and back.
The operation (4) of Fig. 5 afterwards the operation (4) of operation and Fig. 3 and Fig. 4 operation is identical afterwards.
(effect of manufacture method 3)
Compared with manufacture method 1, in manufacture method 3, the thickness of the outermost layer Copper Foil before the plating that can make can form through operation in manufacturing process is thinner, therefore can reduce laser processing burden, reduce electroplate after conductor gross thickness, thereby can improve the processability that deducts the fine pattern in (subtractive) method.In addition,, by seed (seed) layer as semi-additive process by the Copper Foil before electroplating, more effectively utilize galvanoplastic to form by soft etching after the forming fine wiring of semi-additive process and via hole, Seed Layer simultaneously and remove.
Fig. 6 illustrates the 4th embodiment of manufacture method of the present invention.The 4th embodiment is made up of following operation.
In operation (1), prepare the outer layer laminate material 141 identical with the operation (1) of manufacture method 1.
In operation (2b), prepare to form with through hole the internal layer Wiring body 142 of interlayer conduction, to replace the internal layer Wiring body 112 of the manufacture method 1 shown in Fig. 3.
In operation (3), the similarly lamination outer layer laminate material 141 and internal layer Wiring body 142 of operation 3 with manufacture method 1, forms laminated wiring plate 100.
In operation (4b), with form laminated wiring plate 100 internal layer Wiring body 142 through hole center as one man, on outer layer laminate material 141, to be similarly formed for the prebored hole 7 of interlayer conduction by laser processing with the operation 4 of the manufacture method 1 shown in Fig. 3.
Operation (5) afterwards the operation (5) of operation and Fig. 3 to Fig. 5 operation is identical afterwards.
(effect of manufacture method 4)
In manufacture method 4, can bore a hole processing and form prebored hole with laser processing, this prebored hole has as interlayer conduction structure makes through hole structure outermost interlayer conduction, so-called with through hole.Thereby, also can do the Mixed Design of via hole and through hole, can increase wiring plate design freedom.
Claims (10)
1. a multilayer flexible wiring plate, has installation portion and cable portion, and this installation portion and cable portion are that the internal layer Wiring body that utilization is formed with conductive pattern at least one face of dielectric film forms, and it is characterized in that:
So that covering the mode of described conductive pattern, the complex layer of rigid material and adhesive resin forms described installation portion,
Described cable portion is formed with the bond layer that does not conform to described rigid material,
The face not joining with the described conductive pattern in described complex layer and described bond layer is covered by a continuous dielectric film,
At each interlayer across dielectric film.
2. multilayer flexible wiring plate as claimed in claim 1, is characterized in that:
Described complex layer is the layer of prepreg as the complex of glass cloth and adhesive resin.
3. multilayer flexible wiring plate as claimed in claim 2, is characterized in that:
Between described layer of prepreg and described dielectric film, also form internal layer conductive pattern.
4. there is a manufacture method for the multilayer flexible wiring plate of installation portion and cable portion, wherein,
Prepare outer layer laminate material, this outer layer laminate material has formed conductive layer on a face of dielectric film, and on another face, has formed the complex layer of rigid material and adhesive resin and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material,
Prepare to have formed the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by outer layer laminate material described at least one is overlapped onto have the face of described complex and described adhesive linkage and in addition lamination form laminated wiring plate,
On described laminated wiring plate, form at least one of via hole and through hole,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage removed and formed cable portion,
At each interlayer across dielectric film.
5. the manufacture method of multilayer flexible wiring plate as claimed in claim 4, is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
6. there is a manufacture method for the multilayer flexible wiring plate of installation portion and cable portion, wherein,
Prepare to form the outer layer laminate material of conductive layer on a face of dielectric film,
Prepare internal layer Wiring body, this internal layer Wiring body has formed conductive pattern at least one face of insulating body material, and form overlappingly the complex layer of rigid material and adhesive resin with this conductive pattern and do not conformed to the adhesive linkage of the described adhesive resin of employing of described rigid material
On at least one face of described internal layer Wiring body, by outer layer laminate material described at least one is overlapped onto have the face of described complex and described adhesive linkage and in addition lamination form laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage removed and formed cable portion,
At each interlayer across dielectric film.
7. the manufacture method of multilayer flexible wiring plate as claimed in claim 6, is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
8. there is a manufacture method for the multilayer flexible wiring plate of installation portion and cable portion, wherein,
. prepare outer layer laminate material, this outer layer laminate material is provided with conductive layer and covers the strippable covering of this conductive layer on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and not containing the adhesive linkage of the described adhesive resin of employing of described rigid material
Prepare to form the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by lamination, described outer layer laminate material and the face with described complex and described adhesive linkage are joined, form laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of the part corresponding with forming the part of described adhesive linkage removed and formed cable portion,
At each interlayer across dielectric film.
9. the manufacture method of multilayer flexible wiring plate as claimed in claim 8, is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
10. the manufacture method of multilayer flexible wiring plate as claimed in claim 7, is characterized in that:
Between described layer of prepreg and described dielectric film, also configure conductive pattern and form described laminated wiring plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314074A JP5275001B2 (en) | 2008-12-10 | 2008-12-10 | Manufacturing method of multilayer flexible wiring board |
| JP2008-314074 | 2008-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101754571A CN101754571A (en) | 2010-06-23 |
| CN101754571B true CN101754571B (en) | 2014-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910163346.2A Expired - Fee Related CN101754571B (en) | 2008-12-10 | 2009-08-07 | Flexible multilayer wiring plate and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5275001B2 (en) |
| CN (1) | CN101754571B (en) |
| TW (1) | TWI433630B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197675A (en) * | 2015-04-06 | 2016-11-24 | 大日本印刷株式会社 | Flexible multilayer circuit board for LED element |
| CN109844699A (en) * | 2016-12-28 | 2019-06-04 | 株式会社藤仓 | Wiring body, circuit board and touch sensor |
| CN110662342B (en) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863115A (en) * | 1956-08-02 | 1961-03-15 | Fairey Co Ltd | Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils |
| CN1504067A (en) * | 2001-09-28 | 2004-06-09 | 钟渊化学工业株式会社 | Polyimide film for flexible printed board and flexible printed board using same |
| CN1517749A (en) * | 2003-01-10 | 2004-08-04 | 日本电气株式会社 | Flexible electronic device and its manufacturing method |
| CN1525804A (en) * | 2002-12-06 | 2004-09-01 | 松下电器产业株式会社 | Circuit board and its manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3680321B2 (en) * | 1994-06-28 | 2005-08-10 | 日立化成工業株式会社 | Manufacturing method of multilayer printed wiring board |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
-
2008
- 2008-12-10 JP JP2008314074A patent/JP5275001B2/en active Active
-
2009
- 2009-08-07 CN CN200910163346.2A patent/CN101754571B/en not_active Expired - Fee Related
- 2009-08-10 TW TW98126739A patent/TWI433630B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863115A (en) * | 1956-08-02 | 1961-03-15 | Fairey Co Ltd | Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils |
| CN1504067A (en) * | 2001-09-28 | 2004-06-09 | 钟渊化学工业株式会社 | Polyimide film for flexible printed board and flexible printed board using same |
| CN1525804A (en) * | 2002-12-06 | 2004-09-01 | 松下电器产业株式会社 | Circuit board and its manufacturing method |
| CN1517749A (en) * | 2003-01-10 | 2004-08-04 | 日本电气株式会社 | Flexible electronic device and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI433630B (en) | 2014-04-01 |
| TW201023713A (en) | 2010-06-16 |
| JP5275001B2 (en) | 2013-08-28 |
| CN101754571A (en) | 2010-06-23 |
| JP2010140989A (en) | 2010-06-24 |
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