CN101754571A - Flexible multilayer wiring plate and its manufacturing method - Google Patents
Flexible multilayer wiring plate and its manufacturing method Download PDFInfo
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- CN101754571A CN101754571A CN200910163346A CN200910163346A CN101754571A CN 101754571 A CN101754571 A CN 101754571A CN 200910163346 A CN200910163346 A CN 200910163346A CN 200910163346 A CN200910163346 A CN 200910163346A CN 101754571 A CN101754571 A CN 101754571A
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Abstract
Provided is a multilayer flexible printing wiring plate having a cable portion with excellent bending resistance and dealing with the installation of a thin and high-density part, and its manufacturing method. The multilayer flexible wiring plate and its manufacturing method is characterized in that In the multilayer flexible wiring plate formed by internal wiring bodies (111, 121, 131) using at least one surface of the insulated matrix material (5) to form a conductive pattern (6), and having an installation part and a cable part, the installation part is formed in the way that a rigid material and adhesive resin compound layer (4) covers the conductive pattern (1), the cable part is formed with an adhesive layer (3) contained no rigid materials, the surfaces having no contact with the conductive patterns in the compound layer and the adhesive layer are covered by a continuous insulating film (2).
Description
Technical field
The present invention relates to have the cable section of bending resistance excellence and can tackle multilayer flexible printed wiring plate and manufacture method thereof both thin and that highdensity parts are installed.
Background technology
For typical mobile electronic device such as portable phone, digital camera or notebook computer, especially earnestly need compactization.For with compactization of mobile electronic device and be easy to use, often adopt frameworks designs such as collapsible or slidingtype.
Realize the design of this excellence, hinge (hinge) structure that need under jackknife action or sliding action, turn round and the wiring of passing this hinge arrangement inside and can transmit the signal of telecommunication.
For the inner transmission of the hinge signal of telecommunication in running, even mainly adopt the flexible printing wiring board that under the dynamic bending state, also can transmit signal, for employed flexible printing wiring board in hinge, require to guarantee its machinery, electrical characteristic in the alternating bending action about 100,000 times.
On the other hand, because the data size to be processed such as still image/animation data of high image quality increase rapidly, also require the high speed of information processing for mobile electronic device.On the other hand, carry out semi-conductive becoming more meticulous, simultaneously also with semiconductor packages such as BGA, CSP (package) miniaturization in order to provide semiconductor with Premium Features with low cost.The bump pitch of BGACSP (bump pitch) also reduces to 0.5mm, 0.4mm, 0.3mm gradually from spacing 0.8mm, is comprising on the wiring plate of flexible printing wiring board, and the semi-conductive semiconductor packages of above-mentioned thin space also must be able to be installed.
And, for mobile electronic device, require to be compactization of mobile purpose very consumingly, for the employed substrate also often slim lightweight of requirement under 0.1mm unit, 1g unit's situation itself.
Sum up above-mentioned truth, then reaching in the future now, flexible printing wiring board need satisfy following 3 conditions.
1) will have soft electric wiring cable portion, and this electric wiring cable portion to have bending resistance.
2) semiconductor packages that will highdensity thin space can be installed.
3) want slim light weight.
At present, have the flexible cable portion of bending resistance and be used to install the structure of the multi-layer FPC of highdensity CSP, adopt structure shown in Figure 6 as formation.
As shown in Figure 6; in the structure of traditional multilayer flexible wiring plate; in order to form flexible cable portion with bending resistance; and covering becomes the internal layer FPC of cable portion; and use diaphragm (cover film), and form enhancing (built-up) layer of high density such as CSP can be installed encapsulation ground designing wirings again, utilize the lamination bonding agent of prepreg (pre preg) layer etc.; also with single face FPC or two-sided FPC at aforesaid internal layer diaphragm superimposed layer, and carry out via hole (via) processing.
But, have following problem in the above-mentioned traditional structure.
(1) becomes the thickness thickening of the enhancing portion of installation portion, hinder compactization of substrate.
(2) because enhancing portion is thick, when forming via hole with laser, laser processing spended time not only, and also it is also darker to cross hole depth, so via hole is electroplated also spended time.
When (3) not doing via hole filling (via fill) plating in addition, cave volume in the via hole increases, thereby when on crossing the hole, carrying out the via hole level chip (via on chip) of parts installation, the scolding tin that should be attached to parts is gulped down by the mistake hole, the uneven phenomenon of welding takes place easily, perhaps be called easily residual clearance (void), the unsatisfactory phenomenon of installation quality.
Patent documentation 1: No. 2708980 communique of Japan's special permission
In above-mentioned patent documentation 1, the invention that makes multilayer flexible wiring plate attenuation and cost degradation is disclosed.But, do not mention rigidity and the flexibility of cable section and the problem of bending resistance of taking into account the slim desired mounting portion of multilayer flexible wiring plate at all, do not provide the solution countermeasure again.
Summary of the invention
The present invention has considered that the design of above-mentioned aspect forms, and its purpose is to provide the cable section with bending resistance excellence and can tackles multilayer flexible printed wiring plate and manufacture method thereof both thin and that highdensity parts are installed.
In order to reach above-mentioned purpose, the application provides the invention of following thing and method for making.
At first as have the right a kind of multilayer flexible wiring plate of record in the requirement 1 of the invention of thing, have installation portion and cable portion, this installation portion and cable portion are that the internal layer Wiring body that utilizes at least one face at the insulating body material to be formed with conductive pattern forms, and it is characterized in that:
So that covering the mode of described conductive pattern, the complex layer of rigid material and adhesive resin forms described installation portion,
Described cable portion is formed with the bond layer that does not contain described rigid material,
The face that does not join with described conductive pattern in described complex layer and the described bond layer is covered by a continuous dielectric film.
Then, as the invention of method for making have the right requirement 4,6 and 8 inventions of being put down in writing.
That is, the manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of record in the claim 4, wherein,
Prepare the outer layer laminate material, this outer layer laminate material has formed conductive pattern on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material
Preparation has formed the internal layer Wiring body of conductive layer at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by at least one described outer layer laminate material is overlapped onto face with described complex and described adhesive linkage and in addition lamination form the laminated wiring plate,
On described laminated wiring plate, form at least one of via hole and through hole (through hole),
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
The manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of record in the claim 6, wherein,
Preparation forms the outer layer laminate material of conductive layer on a face of dielectric film,
Prepare the internal layer Wiring body, this internal layer Wiring body has formed conductive pattern at least one face of insulating body material, and formed the complex layer of rigid material and adhesive resin overlappingly with this conductive pattern and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material
On at least one face of described internal layer Wiring body, by at least one described outer layer laminate material is overlapped onto face with described complex and described adhesive linkage and in addition lamination form the laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
The manufacture method of the multilayer flexible wiring plate with installation portion and cable portion of record in the claim 8, wherein,
Prepare the outer layer laminate material, this outer layer laminate material is provided with conductive layer and covers the peelable cover (cover) of this conductive layer on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material
Preparation forms the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by lamination described outer layer laminate material and the face with described complex and described adhesive linkage are joined, form the laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
(invention effect)
As mentioned above, can reduce the dielectric film of formation installation portion and the number of plies of bonding agent among the present invention, be easy to the substrate slimming.This result can reduce the laser beam drilling processing of the via hole processing usefulness that is used for interlayer conduction or be used for process time and the cost that via hole is electroplated, via hole is filled plating.
Description of drawings
Fig. 1 is the cutaway view of structure of first embodiment of expression multilayer flexible wiring plate of the present invention.
Fig. 2 is the cutaway view of structure of second embodiment of expression multilayer flexible wiring plate of the present invention.
Fig. 3 is the process chart of first embodiment of expression manufacture method of the present invention.
Fig. 4 is the process chart of second embodiment of expression manufacture method of the present invention.
Fig. 5 is the process chart of the 3rd embodiment of expression manufacture method of the present invention.
Fig. 6 is the process chart of the 4th embodiment of expression manufacture method of the present invention.
Fig. 7 is the sectional structure chart of expression traditional structure.
(symbol description)
1 conductive pattern (conductive foil), 2 dielectric films, 3 bond layers, 4 layer of prepreg, 5 insulating body materials, 6 conductive patterns, 7 via hole prebored holes, 8 conductive patterns, 9 conductive patterns, 100 laminated wiring plates, 111,121,131,141 outer layer laminate materials, 112,122,132,142 internal layer Wiring bodies.
Embodiment
Below, based on Fig. 1 to Fig. 6, describe with regard to embodiments of the present invention.Fig. 1 and Fig. 2 represent 2 structure example of multilayer flexible wiring plate of the present invention.Fig. 3 to Fig. 6 represents 4 manufacture method examples of the present invention.
(first structure example)
The cross-section structure of multilayer flexible printed wiring plates one of basic structure of the present invention shown in Fig. 1,4 layers of structure.
(second structure example)
The cross-section structure of multilayer flexible printed wiring plates another basic structure of the present invention shown in Fig. 2,6 layers of structure.
(manufacture method)
Manufacture method at multilayer flexible printed wiring plate of the present invention shown in Fig. 3 to Fig. 6.
(manufacture method 1)
First embodiment of manufacture method of the present invention shown in Fig. 3.This first embodiment is made of following operation (1) to (5).
(1) prepares outer layer laminate material 111, this outer layer laminate material 111 is formed with conductive metal foil 1 in a side of dielectric film 2, clip dielectric film 2 ground with the face of conductive metal foil 1 an opposite side on, at least forming as the glass cloth (glass cloth) of rigid material and with the adhesive resin on the part of the inscape that becomes installation portion is the layer of prepreg 4 of inscape, and on the part of the inscape that becomes cable portion, form organic adhesive 3, do not comprise glass cloth in its inscape.
As the material of dielectric film 2, can adopt the dielectric film that is used in flexible printing wiring board of polyimides, polyamide, LCP (liquid crystal polymer), PEN (PEN) etc.The material of conductive metal foil 1 can be various rolled copper foils or electrolytic copper foil.
As the material of bonding agent 3, can utilize the diaphragm that when making single face FPC or two-sided FPC, uses with bonding agent etc., do not contain glass cloth and be easy to the adhesives of bending and bending resistance excellence.Layer of prepreg 4 can be utilized the epoxies that contains glass cloth or the prepreg of acid imide, BT resin (BT レ ジ Application (login trade mark)) class etc.
(2) preparation is formed with the internal layer Wiring body 112 of conductive pattern 6 on insulating body material 5.
(3) make the conductive pattern face of this internal layer Wiring body 112, overlapping opposite to each other with the adhesive side in the Kaifeng (release) of peeling off the outer layer laminate material 111 that forms through above-mentioned operation (1), with internal layer Wiring body 112 and outer layer laminate material 111, utilize vacuum lamination to come lamination, thereby form laminated wiring plate 100.
(4) certain one side of the conductive layer 1 of the laminated wiring plate of making from above-mentioned operation (3) 100 is utilized CO
2Conductive layer 1, dielectric film 2 and layer of prepreg 4 are removed in parts such as laser, and the surface of the conductive pattern 6 that is formed on the internal layer Wiring body 112 is exposed.
Then, through necessary cleaning (cleaning) operations such as desmearing (desmear) processing, form prebored hole 7 as via hole.In the front and back of laser processing, also can carry out handling by the processing of prebored hole 7 and the desmearing of the through hole of perforation (drill) processing.
(5) afterwards in above-mentioned operation (4), to laminated wiring plate 100 expose processing of face conduction and cathode copper plating etc., form electrodeposited coating 8.This electrodeposited coating 8 carries out via hole or connects the interlayer conduction in hole.
At this, electroplate to adopt via hole to fill to electroplate or through hole fill electroplate etc. fill up (filled) electroplating technology, thereby can come landfill to cross the hole and connect inside, hole with conducting metal.
On the electrodeposited coating 8 of the cable portion that is equivalent to laminated wiring plate 100 of above-mentioned operation (5), be formed for etched dry film (not shown), remove unwanted metal part by etching, thereby form conductive layer 8.
Formation method as this outermost conductive layer 8, also can be afterwards in before operation (4), become the resist plating (め つ I レ ジ ス ト) of (Semi-additive) to form anti-pattern by being used for false add, utilize copper to electroplate and form conductive pattern and interlayer conduction road simultaneously, utilize soft etching to remove metal level 1 before.
, on the conductive layer 8 of installation portion form solder resist (solder resist), implement to carry out parts and install after the necessary surface treatment such as gold plating or scolding tin plating thereafter.
(effect of manufacture method 1)
By these features, manufacture method 1 has following effect.
At first, the material that can reduce the insulating material that becomes the enhancing of installation portion portion constitutes the number of plies, carries out the slimming of substrate easily.
In addition, owing to can make enhancing portion insulating material thinner, can reduce the laser beam drilling processing of the via hole processing usefulness that is used for interlayer conduction or be used for process time and the cost that via hole is electroplated, the via hole filling is electroplated.
And, can reduce and not carry out that via hole fill to be electroplated or the volume in cave during filling perforation, in the via hole, and can expect to reduce the effect that following phenomenon takes place, promptly, when on crossing the hole, carrying out via hole level chip that parts install, should be attached on the parts scolding tin by cross the hole gulp down and weld uneven phenomenon or be called residual clearance, be not desirable phenomenon to quality is installed.
And in this manufacture method, the thickness and the application site optimization of the high rigidity layer of prepreg by will comprising glass cloth, manufacturing process's volume to volume (Roll to Roll) of multilayer flexible substrate can be changed, can accomplish automation, rate of finished products improvement and the cost degradation of the manufacturing process of multilayer flexible wiring plate.
(manufacture method 2)
Fig. 4 illustrates second embodiment of manufacture method of the present invention.This second embodiment is made of following operation (1a) to (6).
(1a) prepare outer layer laminate material 121, this outer layer laminate material 121 has formed metal forming as conductive pattern 1 in a side of dielectric film 2.As the material of dielectric film 2, can adopt the employed insulating film material in flexible printing wiring board of polyimides, polyamide, LCP, PEN etc.The material of conductive metal foil 1 can be various rolled copper foils or electrolytic copper foil.
(2a) prepare internal layer Wiring body 122, in this internal layer Wiring body 122, the conductive pattern face of the internal layer Wiring body 122 that forms conductive pattern 1, become on the part of installation portion at least, formed as the glass cloth of rigid material and be the layer of prepreg 4 of inscape with the adhesive resin, and at least on the part of the inscape that becomes cable portion, form adhesive resin 3, this adhesive resin 3 is not inscape with the glass cloth, so do not comprise glass cloth.
(3) on above-mentioned internal layer Wiring body 122, utilize lamination outer layer laminate materials 121 such as vacuum hotpressing.
(4) face of the outer layer laminate material 122 outermost conductive layers 1 from above-mentioned operation (3) utilizes CO
2Conductive layer (metal forming) 1, dielectric film 2 and bond layer 3 are removed in parts such as laser, and the surface of the conductive pattern 6 that is formed on the internal layer Wiring body 122 is exposed, and become the prebored hole 7 of via hole.In the front and back of laser processing, also can carry out prebored hole processing by the through hole of perforation processing.
(5) afterwards, implement necessary cleaning processes such as desmearing processing, then, conduction processing and cathode copper are electroplated again, form electrodeposited coating 8, and conductive structure are via hole or through hole between cambium layer in above-mentioned operation (4).As electro-plating method, adopt so-called via hole to fill the electroplating technology of filling up of plating or through hole filling plating etc., thereby can come landfill to cross hole and perforation inside, hole with conducting metal.
(6) on the electrodeposited coating 8 of the laminated wiring plate 100 of above-mentioned operation (5), be formed for etched dry film, remove unwanted metal is partially-etched, form conductive pattern 8.
(effect of manufacture method 2)
, can on the conductive pattern 8 of parts installation portion form solder resist, and implement to carry out parts and install after the needed surface treatments such as gold plating or scolding tin plating thereafter.By these features, has the equal effect of the manufacture method that describes by Fig. 31.
(manufacture method 3)
Fig. 5 illustrates the 3rd embodiment of manufacture method of the present invention.The 3rd embodiment is made of following operation.
In this embodiment shown in Figure 5, adopt so-called strippable (being called " Peelable ") metal forming, with the conductive pattern 1 that uses in the operation (1) that replaces Fig. 3.In order to improve operation (handling) property of thin conductive metal foil, this metal foil laminates thin metal forming with as its obducent thicker metal forming, constitute the lamination metal paper tinsel that can peel off the sandwich construction of removing thicker metal forming as required easily.
In operation (1b), prepare outer layer laminate material 131, this outer layer laminate material 131 is on a face of dielectric film 2, lamination become the thin metal forming of conductive pattern 1 and as the thicker metal forming of covering 9, on another side, at least forming as the glass cloth of rigid material and with the adhesive resin on the part of the inscape that becomes installation portion is the layer of prepreg 4 of inscape, again, on the part of the inscape that becomes cable portion, formation does not contain the organic adhesive 3 that rigid material is a glass cloth as inscape.
Operation (2) is the operation that forms internal layer Wiring body 132, and is identical with operation (2) in the manufacture method 1.
Operation (3-1) and (3-2) suitable with the operation (3) in manufacture method 1 and the manufacture method 2, but adopt strippable material as outer layer laminate material 131, and the mode in order to show it to peel off front and back with 2 operations is illustrated.
The operation (4) of Fig. 5 afterwards the operation (4) of operation and Fig. 3 and Fig. 4 operation is identical afterwards.
(effect of manufacture method 3)
Compare with manufacture method 1, in manufacture method 3, can make the thickness of the outermost layer Copper Foil before the plating that operation can form in the manufacturing process thinner, therefore the burden of laser processing, the conductor gross thickness after the minimizing plating can be reduced, thereby the processability that deducts the fine pattern in (subtractive) method can be improved.In addition, by seed (seed) layer of the Copper Foil before will electroplating, utilize galvanoplastic to form simultaneously more effectively and remove by soft etching behind the forming fine wiring of semi-additive process and the via hole, Seed Layer as semi-additive process.
Fig. 6 illustrates the 4th embodiment of manufacture method of the present invention.The 4th embodiment is made of following operation.
In operation (1), prepare the outer layer laminate material 141 identical with the operation (1) of manufacture method 1.
In operation (2b), prepare to form the internal layer Wiring body 142 of interlayer conduction, to replace the internal layer Wiring body 112 of manufacture method shown in Figure 31 with through hole.
In operation (3),, form laminated wiring plate 100 with the operation 3 of manufacture method 1 similarly lamination outer layer laminate material 141 and internal layer Wiring body 142.
In operation (4b), with the center of the through hole of the internal layer Wiring body 142 that constitutes laminated wiring plate 100 as one man, on outer layer laminate material 141, similarly be formed for the prebored hole 7 of interlayer conduction by laser processing with operation 4 with manufacture method 1 shown in Figure 3.
Operation (5) afterwards the operation (5) of operation and Fig. 3 to Fig. 5 operation is identical afterwards.
(effect of manufacture method 4)
In manufacture method 4, can bore a hole processing and form prebored hole with laser processing, this prebored hole has as the interlayer conduction structure makes the through hole structure outermost interlayer conduction, so-called with through hole.Thereby, also can do the Mixed Design of via hole and through hole, can increase the wiring plate design freedom.
Claims (10)
1. a multilayer flexible wiring plate has installation portion and cable portion, and this installation portion and cable portion are that the internal layer Wiring body that utilizes at least one face at dielectric film to be formed with conductive pattern forms, and it is characterized in that:
So that covering the mode of described conductive pattern, the complex layer of rigid material and adhesive resin forms described installation portion,
Described cable portion is formed with the bond layer that does not contain described rigid material,
The face that does not join with described conductive pattern in described complex layer and the described bond layer is covered by a continuous dielectric film.
2. multilayer flexible wiring plate as claimed in claim 1 is characterized in that:
Described complex layer is the layer of prepreg as the complex of glass cloth and adhesive resin.
3. multilayer flexible wiring plate as claimed in claim 2 is characterized in that:
Between described layer of prepreg and described dielectric film, also form the internal layer conductive pattern.
4. manufacture method with multilayer flexible wiring plate of installation portion and cable portion, wherein,
Prepare the outer layer laminate material, this outer layer laminate material has formed conductive layer on a face of dielectric film, and has formed the complex layer of rigid material and adhesive resin and do not contain the adhesive linkage of the described adhesive resin of employing of described rigid material on another face,
Preparation has formed the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by at least one described outer layer laminate material is overlapped onto face with described complex and described adhesive linkage and in addition lamination form the laminated wiring plate,
On described laminated wiring plate, form at least one of via hole and through hole,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
5. the manufacture method of multilayer flexible wiring plate as claimed in claim 4 is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
6. manufacture method with multilayer flexible wiring plate of installation portion and cable portion, wherein,
Preparation forms the outer layer laminate material of conductive layer on a face of dielectric film,
Prepare the internal layer Wiring body, this internal layer Wiring body has formed conductive pattern at least one face of insulating body material, and formed the complex layer of rigid material and adhesive resin overlappingly with this conductive pattern and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material
On at least one face of described internal layer Wiring body, by at least one described outer layer laminate material is overlapped onto face with described complex and described adhesive linkage and in addition lamination form the laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
7. the manufacture method of multilayer flexible wiring plate as claimed in claim 6 is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
8. manufacture method with multilayer flexible wiring plate of installation portion and cable portion, wherein,
Prepare the outer layer laminate material, the peelable cover that this outer layer laminate material is provided with conductive layer and covers this conductive layer on a face of dielectric film, and on another face, formed the complex layer of rigid material and adhesive resin and do not contained the adhesive linkage of the described adhesive resin of employing of described rigid material
Preparation forms the internal layer Wiring body of conductive pattern at least one face of insulating body material,
On at least one face of described internal layer Wiring body, by lamination described outer layer laminate material and the face with described complex and described adhesive linkage are joined, form the laminated wiring plate,
Form at least one of via hole and through hole at described laminated wiring plate,
Form necessary electrodeposited coating at described laminated wiring plate,
The described electrodeposited coating of part that will be corresponding with the part that forms described adhesive linkage is removed and is formed cable portion.
9. the manufacture method of multilayer flexible wiring plate as claimed in claim 8 is characterized in that:
Adopt layer of prepreg as described complex layer, thereby form described outer layer laminate material, wherein, this layer of prepreg is the complex of glass cloth and adhesive resin.
10. the manufacture method of multilayer flexible wiring plate as claimed in claim 7 is characterized in that:
Between described layer of prepreg and described dielectric film, also dispose conductive pattern and form described laminated wiring plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314074A JP5275001B2 (en) | 2008-12-10 | 2008-12-10 | Manufacturing method of multilayer flexible wiring board |
| JP2008-314074 | 2008-12-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101754571A true CN101754571A (en) | 2010-06-23 |
| CN101754571B CN101754571B (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910163346.2A Expired - Fee Related CN101754571B (en) | 2008-12-10 | 2009-08-07 | Flexible multilayer wiring plate and its manufacturing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5275001B2 (en) |
| CN (1) | CN101754571B (en) |
| TW (1) | TWI433630B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109844699A (en) * | 2016-12-28 | 2019-06-04 | 株式会社藤仓 | Wiring body, circuit board and touch sensor |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197675A (en) * | 2015-04-06 | 2016-11-24 | 大日本印刷株式会社 | Flexible multilayer circuit board for LED element |
| CN110662342B (en) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863115A (en) * | 1956-08-02 | 1961-03-15 | Fairey Co Ltd | Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils |
| JP3680321B2 (en) * | 1994-06-28 | 2005-08-10 | 日立化成工業株式会社 | Manufacturing method of multilayer printed wiring board |
| US7018704B2 (en) * | 2001-09-28 | 2006-03-28 | Kaneka Corporation | Polyimide film for flexible printed board and flexible printed board using the same |
| JP4228677B2 (en) * | 2002-12-06 | 2009-02-25 | パナソニック株式会社 | Circuit board |
| JP4063082B2 (en) * | 2003-01-10 | 2008-03-19 | 日本電気株式会社 | Flexible electronic device and manufacturing method thereof |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
-
2008
- 2008-12-10 JP JP2008314074A patent/JP5275001B2/en active Active
-
2009
- 2009-08-07 CN CN200910163346.2A patent/CN101754571B/en not_active Expired - Fee Related
- 2009-08-10 TW TW98126739A patent/TWI433630B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109844699A (en) * | 2016-12-28 | 2019-06-04 | 株式会社藤仓 | Wiring body, circuit board and touch sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101754571B (en) | 2014-06-04 |
| JP5275001B2 (en) | 2013-08-28 |
| TWI433630B (en) | 2014-04-01 |
| JP2010140989A (en) | 2010-06-24 |
| TW201023713A (en) | 2010-06-16 |
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