CN111683457A - Manufacturing method of rigid-flex board - Google Patents
Manufacturing method of rigid-flex board Download PDFInfo
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- CN111683457A CN111683457A CN202010397992.1A CN202010397992A CN111683457A CN 111683457 A CN111683457 A CN 111683457A CN 202010397992 A CN202010397992 A CN 202010397992A CN 111683457 A CN111683457 A CN 111683457A
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- board
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- hard
- area
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a rigid-flex board, which comprises the following steps: respectively manufacturing inner layer circuits of a soft board core board and a hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area; aligning and attaching a cover film to a soft board area on a soft board core board; cutting through the periphery of the hard board core plate corresponding to the soft board area by laser to separate the waste material part needing to be uncovered from the hard board core plate at the later stage; pressing the soft board core board and the hard board core board into a production board by using no-flow glue PP, putting the waste part on the original position of the hard board core board and pressing together during pressing, and windowing the non-flow glue PP at the position corresponding to the soft board area, wherein the size of the windowing is smaller than that of the waste part and the soft board area; and sequentially carrying out post-working procedures and uncovering to remove the cut waste material part on the production board to obtain the rigid-flexible board. The method can avoid the problem that the soft board is milled and damaged or the cover is opened badly in the later period, and simultaneously solves the problems that the soft and hard combination position is not firmly bonded and is easy to tear in the bending process.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a rigid-flex board.
Background
The rigid-flex board is also called a rigid-flex board and is formed by selectively laminating a rigid hard board and a flexible soft board, and the rigid-flex board and the flexible soft board are compact in structure and form conductive connection through metallized holes. The rigid-flexible combined board has the advantages that the rigid-flexible combined board has the rule and toughness of a conventional rigid board and the flexibility and flexibility of the flexible board, can move, bend, fold and twist, realizes three-dimensional wiring, greatly saves the installation space of electronic components, conforms to the development trend of light, thin, short and small electronic products, is widely applied to various fields of military industry, aerospace, automotive electronics, medical electronics, civil consumer electronics and the like in recent ten years, becomes the most rapidly developed PCB product at present, and is also one of the main development directions of PCBs in the future.
The pressing and windowing are core steps of the rigid-flexible board, the windowing has multiple modes, the most widely applied mode is mechanical depth control milling, a hard board and PP (polypropylene) in a windowing area are adjacent to the flexible board, the hard board is cut to a certain depth in advance by a mechanical method to form a blind groove, and the PP is cut through and windowed; and laminating the hard board layer and the soft board layer, normally performing other post procedures, finally butting the hard board layer and the soft board layer with a blind groove formed by precutting the hard board layer in a mechanical depth control milling mode, and taking the hard board layer at the window position to expose the soft board layer. A typical process flow comprises the following steps:
1. a soft plate part: cutting → inner layer pattern → inner layer etching → inner layer AOI → browning → cover film windowing → cover film laminating → cover film pressing → OPE punching → browning;
2. hard plate part: cutting → inner layer pattern → inner layer etching → OPE punching → inner layer AOI → gong blind groove → brown oxide;
3. bonding layer portion: PP cutting → OPE punching → PP windowing;
4. main flow: pressing → X-Ray drilling target hole → milling plate edge → drilling → copper deposition, plate electric → outer layer pattern → pattern plating → outer layer etching → outer layer AOI → resistance welding, character → surface treatment → electric test → forming → mechanical control deep milling → FQC → FQA → packaging and shipment.
The conventional mechanical depth control milling process has limitations, and for a hard plate with the thickness less than or equal to 0.2mm, due to the limitation of the precision of the mechanical depth control milling, the butt joint of the precise depth control and a reverse groove cannot be ensured, so that a soft plate is cut and damaged due to excessive depth control or a cover is opened badly due to insufficient depth control; in addition, in order to ensure the pressing effect between the soft board and the hard board and simultaneously avoid PP (polypropylene) glue overflow from the soft board, the soft board covering film (protecting the soft board circuit) generally needs to be designed to enter the unit by 0.5-1.0mm, PP needs to be designed to shrink inwards by 0.25mm, so that the PP and the covering film do not have overlapped parts, the cohesiveness of the soft and hard combination position can be influenced, and the soft and hard combination position is easily torn in the subsequent use process.
Disclosure of Invention
The invention provides a method for manufacturing a rigid-flexible printed circuit board, aiming at the defects of the prior art, the method can avoid the problem that the rigid-flexible printed circuit board is damaged by milling due to excessive depth control or the problem of poor uncovering due to insufficient depth control, and simultaneously solves the problems that the rigid-flexible printed circuit board is not firmly bonded and the flexible-flexible printed circuit board is easy to tear in the bending process due to no bonding between a covering film and PP.
In order to solve the technical problem, the invention provides a manufacturing method of a rigid-flex board, which comprises the following steps:
s1, respectively manufacturing inner layer circuits of the soft board core board and the hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
s2, aligning and attaching a cover film to the soft board area on the soft board core board;
s3, cutting through the periphery of the hard board core plate corresponding to the soft board area by laser to separate the waste material part needing to be uncovered from the hard board core plate at the later stage;
s4, pressing the soft board core board and the hard board core board into a production board by using no-flow adhesive PP, putting the waste material part cut and separated in the step S3 on the original position of the hard board core board and pressing together during pressing, and windowing the non-flow adhesive PP at the position corresponding to the soft board area, wherein the size of the windowing is smaller than that of the waste material part and the soft board area, so that the periphery of the inner side of the waste material part is pressed together with the no-flow adhesive PP;
s5, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
and S6, removing the cut waste part on the hard board core board by uncovering to obtain the rigid-flexible board.
Further, in step S2, the cover film is one side 0.5mm larger than the flexible board area.
Further, the steps between S2 and S3 further include the steps of:
s21, completely bonding the cover film and the soft board core board in a rapid pressing mode;
s22, baking the soft board core board to solidify the covering film.
Further, in step S21, the parameters of the rapid press fit are: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
Further, in step S3, the laser cutting parameters are controlled as follows: the speed is 150 mm/s, the frequency is 60-300KHz, and the times are 5-10.
Further, in step S4, before lamination, rivet holes are drilled at corresponding positions of the soft board core board and the hard board core board, and the soft board core board and the hard board core board are riveted and fixed by rivets and then laminated.
Further, in step S4, the one side of the window is smaller than the soft board area by 0.15 mm.
Further, in step S4, the one side of the window is smaller than the waste portion by 0.1-0.15 mm.
Further, in step S5, before the outer layer circuit is fabricated, the production board further sequentially goes through the processes of outer layer drilling, copper deposition and full board electroplating.
Further, in step S6, before the cover is opened, the outer shape of the board is routed through a molding process.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, before lamination, the periphery of the hard board core board corresponding to the soft board area is cut through by laser, so that the waste part needing to be uncovered at the later stage is separated from the hard board core board, thus the step of routing grooves in the later stage forming process can be reduced, the waste part is directly uncovered and removed, and the problem of bad uncovering caused by milling damage to the soft board or insufficient depth control due to excessive depth control is avoided; the size of the window on the no-flow adhesive PP is smaller than the sizes of the waste part and the soft plate area, so that a superposed part exists between the no-flow adhesive PP and the cover film, the problems that the soft and hard combination position is not firmly bonded and the bending process is easy to tear due to no-pressure combination of the cover film and the PP are solved, the periphery of the inner side of the waste part can be pressed together with the no-flow adhesive PP, the pressure during pressing is balanced, the uneven distribution of pressing force due to the existence of the window on a hard plate core plate is avoided, the smoothness of the whole plate during pressing is ensured, the processing liquid medicine in the subsequent process can be prevented from entering the soft plate area through the waste part, and the soft plate area is effectively protected from being bitten by the liquid medicine and rubbed off by mechanical; and the combination area of the waste material part and the non-flowing glue PP is small, the cover uncovering in the later period is not influenced, and the quality of the rigid-flexible printed circuit board is guaranteed.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
The embodiment provides a method for manufacturing a rigid-flex printed circuit board, which specifically comprises the following steps:
(1) cutting: cutting a soft board core board and a hard board core board according to the size of a jointed board of 520mm multiplied by 620mm, wherein the thickness of the soft board core board is 0.075mm, the thickness of an outer layer copper foil is 0.5OZ, and the soft board core board comprises a soft board area and a soft and hard combination area; the thickness of the hard board core board is 0.2mm, and the thickness of the outer layer copper foil is 0.5 OZ.
(2) And inner layer circuit manufacturing (negative film process): transferring inner layer patterns, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and respectively completing inner layer circuit exposure on a soft board core board and a hard board core board by using a full-automatic exposure machine and using 5-6 exposure rulers (21 exposure rulers); etching the inner layer, etching the exposed and developed soft board core board and hard board core board to form an inner layer circuit, wherein the line width of the inner layer is 3 mil; and (4) inner layer AOI, and then, detecting defects of an inner layer circuit, such as open short circuit, circuit notch, circuit pinhole and the like, and performing defect scrapping treatment, wherein a defect-free product is discharged to the next flow.
(3) And brown oxidation: through a chemical reaction mode, a brown oxide layer is generated on the surface of the copper layer of the core plate of the flexible printed circuit board, so that the roughness of the copper surface is increased, and the bonding force with the covering film during pressing is enhanced.
(4) And pasting a covering film: aligning and attaching a cover film to a soft board area on a soft board core board, wherein one side of the cover film is 0.5mm larger than the soft board area; the cover film is a polyimide (PI material).
Before the lamination, windowing is carried out on the cover film with the same size as the soft board core board corresponding to the soft and hard combination area according to the shape of the soft board area.
(5) And quick pressing: the glue layer (epoxy resin) of the cover film is completely bonded with the soft board area of the soft board core board in a short time in a high-temperature and high-pressure mode, so that the effect of protecting the soft board area is achieved; the parameters of the rapid pressing are as follows: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
(6) And baking the plate: baking the soft board core board for 1h at 150 ℃ to completely cure the covering film.
(7) And OPE punching: and punching rivet holes for pressing at corresponding positions of the soft board core board and the hard board core board.
(8) And laser cutting: cutting through the periphery of the hard board core plate corresponding to the soft board area in a laser cutting mode, so that the waste material part needing to be uncovered at the later stage is separated from the hard board core plate; specifically, an SP laser is adopted for cutting, and the laser cutting parameters are controlled as follows: the speed is 150 mm/s, the frequency is 60-300KHz, and the times are 5-10.
(9) And brown oxidation: through a chemical reaction mode, a brown oxide layer is generated on the surfaces of the copper layers of the soft board core board and the hard board core board, so that the roughness of the copper surface is increased, and the bonding force with PP during pressing is enhanced.
(10) And pressing: after the soft board core board and the hard board core board are pre-laminated together by using the no-flow adhesive PP (the hard board core board, the no-flow adhesive PP, the soft board core board, the no-flow adhesive PP and the hard board core board are arranged in sequence from top to bottom), riveting is firstly carried out by using rivets through rivet holes, then the production board is pressed and synthesized in a high-temperature and high-pressure mode, the waste material part cut and separated in the step (8) is placed on the original position of the hard board core board and pressed and laminated together during pressing, a window is opened on the no-flow adhesive PP corresponding to the soft board area, the size of the opened window is smaller than that of the waste material part and the soft board area, and the periphery of the inner side of the waste material part is pressed and combined with the no.
Before lamination, a non-flowing glue PP sheet is cut according to the size of the flexible printed circuit board core, a window is cut in the non-flowing glue PP sheet corresponding to the flexible printed circuit board area, one side of the window is 0.15mm smaller than the flexible printed circuit board area, the edge of the cover film is pressed by the non-flowing glue PP after lamination through the size matching with the cover film, and the problems that the soft-hard combination position is not firmly bonded and the bending process is easy to tear due to the fact that the cover film is not in pressure fit with the PP are solved; the single edge of the opening window is 0.1-0.15mm smaller than the waste part on the hard board core plate, so that the periphery of the inner side of the waste part is pressed together with the non-flowing glue PP, the pressure during pressing is balanced, the uneven distribution of the pressing force caused by the opening window on the hard board core plate is avoided, the smoothness of the whole board during pressing is ensured, and the processing liquid medicine in the subsequent process can be prevented from entering the soft board area through the waste part, so that the soft board area is effectively protected from being bitten by the liquid medicine and being rubbed and scratched by mechanical abrasion; and the combination area of the waste material part and the non-flowing glue PP is small (the maximum combination area width is 0.15mm), the cover uncovering in the later period is not influenced, and the quality of the rigid-flexible combined board is guaranteed.
(11) And outer layer drilling: and drilling holes on the production plate by using a mechanical drilling mode according to the drilling data.
(12) And copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode to provide a foundation for the subsequent full-board electroplating, the backlight test is 10 grades, and the thickness of the copper deposition in the hole is 0.5 mu m.
(13) And electroplating the whole plate, namely electroplating a layer of copper on the basis of copper deposition according to the mechanism of electrochemical reaction to ensure that the thickness of the hole copper meets the product requirement, and setting electroplating parameters according to the thickness of the finished hole copper.
(14) And manufacturing an outer layer circuit (positive process): transferring an outer layer pattern, completing outer layer line exposure by using a full-automatic exposure machine and a positive film line film with 5-7 exposure rulers (21 exposure rulers), and forming an outer layer line pattern on a production board through development; electroplating an outer layer pattern, then respectively plating copper and tin on the production plate, setting electroplating parameters according to the required finished copper thickness, wherein the copper plating is carried out for 60min at the current density of 1.8ASD, and the tin plating is carried out for 10min at the current density of 1.2ASD, and the tin thickness is 3-5 mu m; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the production board; and the outer layer AOI uses an automatic optical detection system to detect whether the outer layer circuit has the defects of open circuit, gap, incomplete etching, short circuit and the like by comparing with CAM data.
(15) Solder resist and silk screen printing of characters: by making a green oil layer on the outer layer of the production plate and silk-printing characters, the thickness of the green oil is as follows: 10-50 μm, so that the influence of environmental change on the production plate can be reduced in the subsequent use process.
(16) Surface treatment (nickel-gold deposition): the copper surface of the welding pad at the solder stop windowing position is communicated with a chemical principle, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(17) And electrical test: testing the electrical conduction performance of the finished board, wherein the board use testing method comprises the following steps: and (5) flying probe testing.
(18) And forming: according to the prior art and according to the design requirement, the shape is gong, and the tolerance of the shape is +/-0.05 mm; and then stripping the waste material part corresponding to the soft board area on the production board from the product by uncovering (namely removing the cut waste material part on the hard board core board after uncovering), exposing the inner soft board area part, and forming a platform to obtain the rigid-flexible board.
(19) FQC: according to the customer acceptance standard and the inspection standard of my department, the appearance of the circuit board is inspected, if a defect exists, the circuit board is repaired in time, and the excellent quality control is guaranteed to be provided for the customer.
(20) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not again.
(21) And packaging: and hermetically packaging the circuit boards according to the packaging mode and the packaging quantity required by customers, putting a drying agent and a humidity card, and then delivering.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A manufacturing method of a rigid-flex board is characterized by comprising the following steps:
s1, respectively manufacturing inner layer circuits of the soft board core board and the hard board core board; the soft board core board comprises a soft board area and a soft and hard combination area;
s2, aligning and attaching a cover film to the soft board area on the soft board core board;
s3, cutting through the periphery of the hard board core plate corresponding to the soft board area by laser to separate the waste material part needing to be uncovered from the hard board core plate at the later stage;
s4, pressing the soft board core board and the hard board core board into a production board by using no-flow adhesive PP, putting the waste material part cut and separated in the step S3 on the original position of the hard board core board and pressing together during pressing, and windowing the non-flow adhesive PP at the position corresponding to the soft board area, wherein the size of the windowing is smaller than that of the waste material part and the soft board area, so that the periphery of the inner side of the waste material part is pressed together with the no-flow adhesive PP;
s5, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
and S6, removing the cut waste part on the hard board core board by uncovering to obtain the rigid-flexible board.
2. The method for manufacturing a rigid-flex board according to claim 1, wherein in step S2, the cover film is one side 0.5mm larger than the flexible board area.
3. The method for manufacturing a rigid-flex board according to claim 1, further comprising the steps between steps S2 and S3:
s21, completely bonding the cover film and the soft board core board in a rapid pressing mode;
s22, baking the soft board core board to solidify the covering film.
4. The method for manufacturing a rigid-flex board according to claim 3, wherein in step S21, the parameters of the rapid press-fit are: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 1-2 min.
5. The method for manufacturing a rigid-flex board according to claim 1, wherein in step S3, the laser cutting parameters are controlled as follows: the speed is 150 mm/s, the frequency is 60-300KHz, and the times are 5-10.
6. The method for manufacturing a rigid-flexible board as claimed in claim 1, wherein in step S4, before the pressing, rivet holes are drilled at corresponding positions of the rigid-flexible board core board and the rigid board core board, and the rigid-flexible board core board and the rigid board core board are fixed by riveting with rivets and then pressed together.
7. The method for manufacturing a rigid-flex board according to claim 1, wherein in step S4, the one side of the window is smaller than the area of the flexible board by 0.15 mm.
8. The method for manufacturing a rigid-flex board according to claim 1, wherein in step S4, the one side of the window is 0.1-0.15mm smaller than the waste portion.
9. The method for manufacturing a rigid-flex board according to claim 1, wherein in step S5, before the outer layer circuit is manufactured, the production board further goes through the processes of outer layer drilling, copper deposition and full board electroplating in sequence.
10. The method of claim 1, wherein in step S6, before the cover is removed, the shape of the board is milled by a forming process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010397992.1A CN111683457A (en) | 2020-05-12 | 2020-05-12 | Manufacturing method of rigid-flex board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010397992.1A CN111683457A (en) | 2020-05-12 | 2020-05-12 | Manufacturing method of rigid-flex board |
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| CN111683457A true CN111683457A (en) | 2020-09-18 |
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| CN202010397992.1A Pending CN111683457A (en) | 2020-05-12 | 2020-05-12 | Manufacturing method of rigid-flex board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888200A (en) * | 2021-01-21 | 2021-06-01 | 盐城维信电子有限公司 | Flexible circuit board processing method |
| CN113573475A (en) * | 2021-07-27 | 2021-10-29 | 生益电子股份有限公司 | Rigid-flex board and manufacturing method thereof |
| CN114189997A (en) * | 2021-12-13 | 2022-03-15 | 欣强电子（清远）有限公司 | Method for opening cover of soft and hard board |
| CN114364128A (en) * | 2021-12-14 | 2022-04-15 | 鹤山市中富兴业电路有限公司 | Board milling method and board milling machine for PCB |
| WO2022088413A1 (en) * | 2020-10-29 | 2022-05-05 | 深南电路股份有限公司 | Battery protection board, machining method therefor, and electronic device |
| CN114521073A (en) * | 2022-02-24 | 2022-05-20 | 安捷利（番禺）电子实业有限公司 | Manufacturing method of rigid-flex board |
| CN115023068A (en) * | 2022-05-25 | 2022-09-06 | 景旺电子科技(龙川)有限公司 | Method for uncovering rigid-flex board and rigid-flex board |
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022088413A1 (en) * | 2020-10-29 | 2022-05-05 | 深南电路股份有限公司 | Battery protection board, machining method therefor, and electronic device |
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| CN114521073A (en) * | 2022-02-24 | 2022-05-20 | 安捷利（番禺）电子实业有限公司 | Manufacturing method of rigid-flex board |
| CN115023068A (en) * | 2022-05-25 | 2022-09-06 | 景旺电子科技(龙川)有限公司 | Method for uncovering rigid-flex board and rigid-flex board |
| CN115023068B (en) * | 2022-05-25 | 2024-01-30 | 景旺电子科技(龙川)有限公司 | Soft and hard combined plate uncovering method and soft and hard combined plate |
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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Application publication date: 20200918 |