CN113286454B - Method for improving adhesion of Air-gap structure of FPC board - Google Patents
Method for improving adhesion of Air-gap structure of FPC board Download PDFInfo
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- CN113286454B CN113286454B CN202110491943.9A CN202110491943A CN113286454B CN 113286454 B CN113286454 B CN 113286454B CN 202110491943 A CN202110491943 A CN 202110491943A CN 113286454 B CN113286454 B CN 113286454B
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000010408 film Substances 0.000 claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 claims abstract description 29
- 238000003825 pressing Methods 0.000 claims abstract description 26
- 239000013039 cover film Substances 0.000 claims abstract description 12
- 238000005488 sandblasting Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 239000011889 copper foil Substances 0.000 claims description 30
- 238000003475 lamination Methods 0.000 claims description 30
- 239000010949 copper Substances 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000005553 drilling Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 8
- 230000009969 flowable effect Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 6
- 238000003698 laser cutting Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 77
- 239000004743 Polypropylene Substances 0.000 description 43
- 238000007747 plating Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- -1 Polypropylene Polymers 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003487 electrochemical reaction Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for improving the adhesion of an Air-gap structure of an FPC board, which comprises the following steps: respectively manufacturing inner-layer circuits on at least two soft board core boards; the soft board core board comprises a soft board area and a soft and hard combination area; attaching a cover film to a soft board area on the soft board core board; opening the non-gummosis PP, and opening a window on the non-gummosis PP at a position corresponding to the soft board area; pressing a piece of non-gummosis PP on the two surfaces of the soft board core plate in a para-position way to form an inner layer sub-board; the window on the non-gumming PP corresponds to the soft board area on the soft board core board up and down so as to expose the covering film; performing sand blasting treatment on the inner layer sub-board to remove the surface tension of the covering film; separating two adjacent inner-layer sub-boards through the non-gumming PP, sequentially overlapping and pressing to form an inner-layer soft board; the window on the non-gumming PP corresponds to the soft board area on the soft board core board up and down. The method solves the problem of bonding the Air-gap type multi-layer soft and hard combined plate soft plate area, improves the flexibility of the soft plate area, and prolongs the service life of the soft and hard combined plate.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for improving the adhesion of an Air-gap structure of an FPC board.
Background
The soft and hard combined board is also called soft and hard combined board and is formed by selectively laminating a rigid hard board and a flexible soft board together, and the soft and hard combined board is compact in structure and forms conductive connection through metallized holes. The soft and hard combined plate combines the rule and toughness of the conventional hard plate with the flexibility and the flexibility of the soft plate, can be folded in half, bent, reduced in space, meets the requirement of three-dimensional dynamic assembly, can be welded with complex components, reduces the electric and signal transmission loss, and ensures the integrity of the soft plate. Along with the development of intelligent equipment to high integration, light weight and miniaturization, the requirements on the manufacturing process of the rigid-flex printed circuit board are higher and higher. The soft and hard combined board of the multi-layer soft board gradually becomes an important part of the printed circuit board, and the product has the advantages of saving more design space, reducing assembly, enabling signal transmission to be faster, stabilizing and the like.
The soft and hard combined board of the multi-layer soft board has two stacked structures, one is that the bending part of the soft board is only protected by a covering film, and a plurality of soft boards are not pressed together, namely Air-gap (Air layer), and the other is that the bending part of the soft board is not only protected by the covering film, but also pressed together, namely non-Ari-gap (no Air layer).
The production process flow of the existing inner layer soft board comprises the following steps: cutting a soft board core plate, inner layer pattern, inner layer etching, inner layer AOI, soft board browning, covering film windowing, attaching a protective film, quick pressing, drying a plate, riveting holes of the soft board, soft board browning, laminating two soft board core plates, targeting holes, inner layer drilling, OPE punching, inner layer AOI, attaching a protective tape, quick pressing and soft board browning.
Aiming at the technical scheme that an Air-gap structure exists among a plurality of soft boards, the Air-gap structure is produced according to the original inner soft board process flow, the plurality of soft boards are formed into an inner soft board through one-time lamination, the cover films on the two soft boards are stressed towards the center and are influenced by factors such as surface tension of the cover films, so that the two cover films are mutually close to each other during lamination, the problem that adhesion is difficult to separate easily occurs in a plurality of soft board areas is solved, the flexible boards are adhered together, the flexibility of the soft board areas is reduced, the bending force is increased, the service life of the soft and hard board is reduced, and when the non-adhesive PP corresponding to the soft board areas is laminated between the two soft boards for one-time lamination, the lamination stress is uneven due to large window opening fall in the middle of the non-adhesive PP, the quality problems such as board sinking, layering and board bursting are easily caused after lamination, and the yield is influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a method for improving the bonding of an Air-gap structure of an FPC board, which adopts twice pressing to form an inner layer soft board and releases the surface tension of a covering film before pressing, solves the problem of bonding a soft board region of an Air-gap type multilayer soft and hard combined board, improves the flexibility of the soft board region, prolongs the service life of the soft and hard combined board, and improves the quality and yield after pressing.
In order to solve the technical problems, the invention provides a method for improving the adhesion of an Air-gap structure of an FPC board, which comprises the following steps:
s1, respectively manufacturing inner-layer circuits on at least two soft board core boards; the soft board core board comprises a soft board area and a soft and hard combination area;
s2, aligning and attaching a covering film to a soft board area on the soft board core board;
s3, opening the non-gummosis PP according to the size of the soft board core board, and opening a window on the non-gummosis PP corresponding to the soft board area;
s4, respectively pressing a piece of non-gummosis PP on the two surfaces of all the soft board core plates in a counterpoint way to form an inner layer sub-board; wherein, the window on the non-gumming PP corresponds to the soft board area on the soft board core board up and down so as to expose the covering film;
s5, carrying out sand blasting treatment on the inner layer sub-board to remove the surface tension of the covering film;
s6, separating two adjacent inner layer sub-boards through the non-gumming PP, sequentially overlapping and pressing to form an inner layer soft board; wherein, the window on the non-gummosis PP corresponds to the soft board area on the soft board core board up and down.
Further, in step S2, the single side of the cover film is 0.5mm larger than the soft board area.
Further, in step S2, the model of the cover film is FR0110.
Further, in step S3, the single side of the window is smaller than the soft board area by 0.15mm.
Further, the following steps are included between the steps S2 and S3:
s21, completely bonding the covering film and the soft board core board in a rapid lamination mode; the parameters of the rapid lamination are as follows: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 15-16s;
s22, baking the soft board core board to enable the covering film to be solidified.
Further, in step S4, copper foil, a coating film and a steel plate are sequentially laminated from inside to outside on the outer sides of the non-adhesive PP on the two sides of the soft board core board as a laminated board structure, and after lamination, the copper foil on the outer layer is removed by etching, so that the coating film at the window is exposed.
Further, the following steps are included between the steps S4 and S5:
s41, respectively drilling rivet holes in the corresponding positions of the inner-layer sub-board and the non-gummosis PP;
s42, performing plasma photoresist removal treatment on the inner-layer daughter board.
In step S6, the inner sub-board and the non-adhesive PP are riveted and fixed by rivets and then pressed together.
Further, the step S6 further includes the following steps:
s7, sticking a protective adhesive tape on the covering film on the surface of the inner soft board;
s8, laminating the inner soft board and the outer copper foil in sequence through flowable PP, and then pressing the laminated inner soft board and the laminated outer copper foil into a production board;
s9, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
s10, removing a part to be removed corresponding to the soft board area in the production board by laser cutting to expose the soft board area in the inner soft board, and removing the protective adhesive tape;
s11, carrying out molding treatment on the production plate to obtain the rigid-flex board.
Further, in step S9, the production board is further subjected to the steps of drilling the outer layer, copper deposition and full-board electroplating in sequence before the outer layer circuit is manufactured.
Further, in step S10, the shape of the board is milled through a molding process before laser cutting.
Further, in step S11, the forming process is an inner groove of the gong-out plate.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through optimizing the process flow, firstly, aligning and laminating one piece of non-gummosis PP on two surfaces of a soft board core board, and filling the windowed window by using an aligned covering film after lamination, firstly, reducing the drop at the windowed position between two soft boards during secondary lamination, reducing the drop at the windowed position from the thickness of three pieces of non-gummosis PP in the prior art to the thickness of one piece of non-gummosis PP, reducing the condition of uneven lamination stress, and avoiding the quality problems of board sinking, layering, board explosion and the like after secondary lamination; secondly, the performance of the laminated non-adhesive PP is stabilized, and a good isolation force can be provided for the cover film between two soft boards during secondary lamination, so that the surface of the cover film is not protruded out of the surface of the non-adhesive PP on the soft board but is close to the cover film on the other soft board, and a good Air-gap fall exists between the cover films of the two soft boards; the method solves the problem of bonding between the Air-gap type multilayer soft and hard combination board soft board areas, improves the flexibility of the soft board areas, prolongs the service life of the soft and hard combination board, and improves the quality and yield after lamination.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to specific embodiments.
Example 1
The embodiment provides a method for manufacturing a soft and hard combined board, which comprises a method for improving the adhesion of an Air-gap structure of an FPC board, and comprises the following specific processes:
(1) And (3) cutting: two soft board core boards, a plurality of non-gummosis PP and a plurality of gummosis PP are cut according to the jointed board size of 520mm multiplied by 620mm, the thickness of the soft board core boards is 0.075mm, the thickness of the outer copper foil is 0.5oz, and the soft board core boards comprise a soft board area and a soft and hard combination area.
(2) Inner layer circuit fabrication (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and respectively completing inner layer circuit exposure on two soft board core boards by using a full-automatic exposure machine by using 5-6 grid exposure rules (21 grid exposure rules); etching the inner layer, namely etching the soft board core board after exposure and development into an inner layer circuit, wherein the line width of the inner layer is measured to be 3mil; and (3) inner-layer AOI, and then checking defects such as open and short circuit, line notch, line pinhole and the like of the inner-layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(3) Brown-oxide: a brown oxide layer is generated on the surface of the copper layer of the soft board core plate in a chemical reaction mode, so that the roughness of the copper surface is increased, and the binding force between the copper surface and the covering film during lamination is enhanced.
(4) And (3) sticking a covering film: attaching a covering film to a soft board area on the soft board core board in an alignment way, wherein the single side of the covering film is 0.5mm larger than the soft board area; the type of the covering film is FR0110, and compared with the covering film adopting the type of FR0210 in the prior art, the thickness of the FR0110 covering film is smaller, so that the Air-gap drop between the soft boards is increased to a certain extent, and the problem of adhesion between the two soft board covering films is further reduced.
Before the lamination, window opening treatment is performed on the covering film with the same size as the soft board core plate corresponding to the soft and hard combination area according to the shape of the soft board area.
(5) And (3) quick pressing: completely bonding the adhesive layer (epoxy resin) of the covering film with the soft board area of the soft board core board in a short time in a high-temperature and high-pressure mode, so as to achieve the effect of protecting the soft board area; the parameters of the rapid lamination are as follows: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 15-16s.
(6) And (3) baking: the soft board core board is baked for 1h at 150 ℃ to completely cure the covering film.
(7) And (3) windowing the non-gummosis PP: the window is formed in the position, corresponding to the soft board region, of the non-gummosis PP, the single side of the window is 0.15mm smaller than the soft board region, the edge of the cover film is pressed by the non-gummosis PP after lamination through the size fit of the cover film, and the problems that soft and hard bonding positions are not firmly bonded and the bending process is easy to tear due to the fact that the cover film and the PP are not laminated are solved.
(8) And (3) primary pressing: respectively pressing a piece of non-gummosis PP on the two surfaces of the two soft board core plates in a para-position manner to form an inner layer sub-board; wherein, the window on the non-gumming PP corresponds to the soft board area on the soft board core board up and down so as to expose the covering film; copper foil, a coating film and a steel plate are sequentially laminated from inside to outside on the outer side of the non-gummosis PP during lamination to form a lamination structure, the rough surface of the copper foil faces the non-gummosis PP during lamination, the bonding force between the copper foil and the non-gummosis PP is improved, the outer copper foil is removed through etching after lamination, and a light plate is formed, so that the coating film at the window opening is exposed, and the coating film is filled in the window opening of the non-gummosis PP.
(9) Drilling: rivet holes for pressing are drilled at corresponding positions of the inner-layer sub-board and the non-gumming PP.
(10) And (3) removing glue: and performing plasma photoresist removal treatment on the inner layer sub-board.
(11) Sand blasting: the inner layer sub-board is sandblasted to remove the surface tension of the cover film.
(12) And (3) secondary pressing: separating and sequentially overlapping two inner-layer sub-boards through the non-gummosis PP, and then pressing to form an inner-layer soft board, namely forming a medium layer structure consisting of three non-gummosis PP between two soft board core boards; wherein, the window on the non-gummosis PP corresponds to the soft board area on the soft board core board up and down; and during lamination, copper foil, a coating film and a steel plate are sequentially laminated from inside to outside on the outer side of the inner-layer sub-board to form a lamination laminated board structure, the rough surface of the copper foil faces the non-gummosis PP during lamination, the binding force between the copper foil and the non-gummosis PP is improved, the outer-layer copper foil is removed through etching after lamination, and the light board is formed, so that the coating film at the window opening position is exposed.
(13) And (3) film sticking: and protective tapes are adhered to the cover films on the two surfaces of the inner soft board, so that the cover films can be conveniently uncovered and protected in the later period.
(14) Pressing: after the inner soft board and the outer copper foil are pre-laminated together by using the flowable PP (Polypropylene), the outer copper foil, the flowable PP, the inner soft board, the flowable PP and the outer copper foil are sequentially arranged from top to bottom, and then the boards are synthesized by high-temperature and high-pressure pressing.
(15) Drilling the inner layer: according to the drilling data, a mechanical drilling mode is used for drilling holes on the production plate.
(16) Copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode, a foundation is provided for the subsequent full-plate electroplating, the backlight test is carried out for 10 stages, and the thickness of the copper deposit in the hole is 0.5 mu m.
(17) Full plate plating: and electroplating a layer of copper on the basis of copper deposition according to the electrochemical reaction mechanism, ensuring that the thickness of the hole copper reaches the product requirement, and setting electroplating parameters according to the thickness of the finished hole copper.
(18) Resin plug hole: and filling resin in the holes, and leveling the plate surface by a grinding plate.
(19) Inner layer circuit fabrication (negative film process): transferring the inner layer pattern, coating a photosensitive film by using a vertical coating machine, controlling the film thickness of the photosensitive film to be 8 mu m, and respectively completing inner layer circuit exposure on a production board by using a full-automatic exposure machine by using 5-6 grid exposure scales (21 grid exposure scales); etching the inner layer, namely etching the exposed and developed production plate into an inner layer circuit, wherein the line width of the inner layer is measured to be 3mil; and (3) inner-layer AOI, and then checking defects such as open and short circuit, line notch, line pinhole and the like of the inner-layer line, carrying out defective scrapping treatment, and outputting a defect-free product to the next flow.
(20) Pressing: after the production board and the outer copper foil are pre-laminated together by using the flowable PP (Polypropylene), the outer copper foil, the flowable PP, the production board, the flowable PP and the outer copper foil are laminated in sequence from top to bottom, and then the multilayer board is pressed by a high-temperature and high-pressure mode.
(21) Outer layer drilling: according to the drilling data, a mechanical drilling mode is used for drilling holes on the multilayer board.
(22) Copper deposition: a layer of thin copper is deposited on the hole wall in a chemical reaction mode, a foundation is provided for the subsequent full-plate electroplating, the backlight test is carried out for 10 stages, and the thickness of the copper deposit in the hole is 0.5 mu m.
(23) Full plate plating: and electroplating a layer of copper on the basis of copper deposition according to the electrochemical reaction mechanism, ensuring that the thickness of the hole copper reaches the product requirement, and setting electroplating parameters according to the thickness of the finished hole copper.
(24) Outer layer circuit (positive process) is manufactured: transferring the outer layer pattern, completing the outer layer line exposure by using a full-automatic exposure machine and a positive line film and using a 5-7-grid exposure rule (a 21-grid exposure rule), and developing to form the outer layer line pattern on the multilayer board; plating an outer layer pattern, then plating copper and tin on the multilayer board respectively, setting plating parameters according to the required copper thickness, wherein the copper plating is to plate the whole board for 60min at a current density of 1.8ASD, the tin plating is to plate the whole board for 10min at a current density of 1.2ASD, and the tin thickness is 3-5 μm; then sequentially removing the film, etching and removing tin, and etching an outer layer circuit on the multilayer board; and the outer layer AOI is used for detecting whether the outer layer circuit has defects such as open circuit, notch, incomplete etching, short circuit and the like by comparing with CAM data by using an automatic optical detection system.
(25) Solder resist, silk-screen character: the green oil layer is manufactured on the outer layer of the production plate, characters are silk-screened, and the thickness of the green oil is as follows: 10-50 mu m, thereby reducing the influence of environmental change on the multilayer board in the subsequent use process.
(26) Surface treatment (nickel-gold plating): the chemical principle is communicated with the copper surface of the welding pad of the solder mask windowing position, a nickel layer and a gold layer with certain required thickness are uniformly deposited, and the thickness of the nickel layer is as follows: 3-5 μm; the thickness of the gold layer is as follows: 0.05-0.1 μm.
(27) Electric test: the electrical conductivity of the finished board is tested, and the board is tested by the following steps: and (5) flying probe testing.
(28) Gong shape: according to the prior art and according to design requirements, the appearance tolerance is +/-0.05mm.
(29) Laser cutting: and removing the part to be removed of the corresponding soft board area on the surface of the multilayer board by laser cutting so as to expose the soft board area in the inner layer soft board, and then removing the protective adhesive tape.
(30) And (5) forming: and according to the prior art and according to design requirements, the soft and hard combined plate is manufactured.
(31) FQC: and checking the appearance of the circuit board according to the customer acceptance standard and the I department inspection standard, and if the circuit board is defective, repairing the circuit board in time, thereby ensuring that the circuit board provides excellent quality control for customers.
(32) FQA: and (5) measuring whether the appearance, the hole copper thickness, the dielectric layer thickness, the green oil thickness, the inner layer copper thickness and the like of the circuit board meet the requirements of customers or not.
(33) Packaging: and (5) sealing and packaging the circuit board according to the packaging mode and the packaging quantity required by the customer, placing the drier and the humidity card, and then delivering.
Example 2
The present embodiment provides a method for manufacturing a rigid-flex board, which has a process substantially the same as that described in embodiment 1, and is different from the steps (8) and (12), specifically as follows:
in the step (8), the etching after lamination only removes the copper foil on one side of the inner layer sub-board, and the copper foil on the other side is remained.
In the step (10), one surface of the copper foil is etched when the two inner-layer sub-boards are stacked, the copper foil is oppositely arranged, the inner-layer sub-boards are sequentially stacked with the coating film and the steel plate from inside to outside, the copper foil surface remained in the step (8) is used as an outer-side pressing surface, the use of the copper foil is reduced, the working procedure is simplified, the cost is reduced, the production efficiency is improved, and then the copper foil on the two surfaces of the inner-layer soft board is removed through etching.
The foregoing has described in detail the technical solutions provided by the embodiments of the present invention, and specific examples have been applied to illustrate the principles and implementations of the embodiments of the present invention, where the above description of the embodiments is only suitable for helping to understand the principles of the embodiments of the present invention; meanwhile, as for those skilled in the art, according to the embodiments of the present invention, there are variations in the specific embodiments and the application scope, and the present description should not be construed as limiting the present invention.
Claims (10)
1. A method for improving the adhesion of an Air-gap structure of an FPC board, comprising the steps of:
s1, respectively manufacturing inner-layer circuits on at least two soft board core boards; the soft board core board comprises a soft board area and a soft and hard combination area;
s2, aligning and attaching a covering film to a soft board area on the soft board core board;
s3, opening the non-gummosis PP according to the size of the soft board core board, and opening a window on the non-gummosis PP corresponding to the soft board area;
s4, respectively pressing a piece of non-gummosis PP on the two surfaces of all the soft board core plates in a counterpoint way to form an inner layer sub-board; wherein, the window on the non-gumming PP corresponds to the soft board area on the soft board core board up and down so as to expose the covering film;
s5, carrying out sand blasting treatment on the inner layer sub-board to remove the surface tension of the covering film;
s6, separating two adjacent inner layer sub-boards through the non-gumming PP, sequentially overlapping and pressing to form an inner layer soft board; wherein, the window on the non-gummosis PP corresponds to the soft board area on the soft board core board up and down.
2. The method for improving adhesion of Air-gap structures of FPC boards according to claim 1, wherein in step S2, the cover film has a single side 0.5mm larger than the soft board area; in step S3, the single side of the window is 0.15mm smaller than the soft board area.
3. The method for improving the adhesion of Air-gap structures of FPC boards according to claim 1, wherein in step S2, the cover film is of the type FR0110.
4. The method for improving the adhesion of Air-gap structures of FPC boards according to claim 1, further comprising the steps of:
s21, completely bonding the covering film and the soft board core board in a rapid lamination mode; the parameters of the rapid lamination are as follows: the temperature is 180 ℃, the pressure is 100KG, and the pressing time is 15-16s;
s22, baking the soft board core board to enable the covering film to be solidified.
5. The method for improving the adhesion of an Air-gap structure of an FPC board according to claim 1, wherein in the step S4, copper foil, a coating film and a steel plate are sequentially laminated from inside to outside on the outer sides of the non-adhesive PP on two sides of the core board of the FPC board as a laminated board structure, and after lamination, the copper foil on the outer layer is removed by etching, thereby exposing the coating film at the window opening.
6. The method for improving the adhesion of Air-gap structures of FPC boards according to claim 1, further comprising the steps of, between steps S4 and S5:
s41, respectively drilling rivet holes in the corresponding positions of the inner-layer sub-board and the non-gummosis PP;
s42, performing plasma photoresist removal treatment on the inner-layer daughter board.
7. The method for improving Air-gap structural adhesion of FPC board according to claim 6, wherein in step S6, the inner sub-board and the non-adhesive PP are riveted and fixed by rivets and then pressed together.
8. The method for improving the adhesion of Air-gap structures of FPC boards according to any one of claims 1 to 7, further comprising the steps of, after step S6:
s7, sticking a protective adhesive tape on the covering film on the surface of the inner soft board;
s8, laminating the inner soft board and the outer copper foil in sequence through flowable PP, and then pressing the laminated inner soft board and the laminated outer copper foil into a production board;
s9, sequentially manufacturing an outer layer circuit and a solder mask layer on the production board, and then carrying out surface treatment;
s10, removing a part to be removed corresponding to the soft board area in the production board by laser cutting to expose the soft board area in the inner soft board, and removing the protective adhesive tape;
s11, carrying out molding treatment on the production plate to obtain the rigid-flex board.
9. The method for improving the adhesion of Air-gap structures of FPC board according to claim 8, wherein in step S9, the production board is further subjected to the steps of outer layer drilling, copper deposition and full board electroplating in sequence before the outer layer circuit is manufactured.
10. The method for improving the adhesion of Air-gap structures of FPC board according to claim 8, wherein in step S10, the shape of the board is milled through a molding process before laser cutting; in step S11, the forming process is an inner groove of the gong-out plate.
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| CN114206023A (en) * | 2021-12-08 | 2022-03-18 | 江门崇达电路技术有限公司 | Rigid-flex printed circuit board, manufacturing method, PCB electronic product and application |
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
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| CN104105349A (en) * | 2014-07-02 | 2014-10-15 | 中国航天科技集团公司第九研究院第七七一研究所 | Method for processing rigid-flex printed board by cover laminating and lining filling method |
| CN110139505B (en) * | 2019-04-10 | 2021-06-25 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex board with local flexible board layering |
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