CN112437544A - Double-layer wire guide plate and manufacturing method thereof - Google Patents
Double-layer wire guide plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN112437544A CN112437544A CN201910813129.7A CN201910813129A CN112437544A CN 112437544 A CN112437544 A CN 112437544A CN 201910813129 A CN201910813129 A CN 201910813129A CN 112437544 A CN112437544 A CN 112437544A
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- Prior art keywords
- layer
- leads
- parallel
- copper
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Abstract
The invention relates to a double-layer wire guide plate and a manufacturing method thereof, in particular to a double-layer wire guide plate which is characterized in that wires are arranged in parallel and covered on a base material with glue, a front cover film is drilled and then adhered on the wires arranged in parallel, at the position where the circuit needs to be disconnected, the covering film is provided with a hole to expose the lead for etching, etching-resistant ink is printed and dried at the position of the bonding pad and the position of the metal connection point on the circuit to protect the bonding pad, then etching the exposed copper-clad aluminum conductor to cut off the copper-clad aluminum conductor, removing the anti-etching ink by using alkaline de-inking liquid to manufacture a circuit board with a front single-sided conductor, and then, after the back side is coated with glue, punching a through hole, covering the back side parallel lead on the back side glue layer, exposing the back side parallel lead at the position of the through hole from the front side, enabling the front side lead and the back side lead at the hole position to be connected and communicated at the hole position when in use, and baking and curing the glue layer to obtain the double-layer lead circuit board.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a double-layer wire guide plate and a manufacturing method thereof.
Background
A series of prior wire guide plate patents by the present inventors, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the reprinting adhesive film and the juxtaposed flat wires is a single-sided circuit board, the circuit board needs to be made very wide due to the limitation of the arrangement of the circuit and the wires, the current-carrying capacity is small, the market requirements cannot be met, the wires are disconnected by using a die punching mode or a drilling mode, the die has the defects of high die sinking cost and inflexible design, the wire is difficult to change once the die is opened, the drilling mode adopts a heavy drilling mode, the cost is high, the alignment precision is insufficient, and the wire is easy to drill and deviate to cause poor scrap height.
In order to overcome the defects and the shortcomings, the invention adopts the steps that the leads are arranged in parallel and covered on the base material with the adhesive, the front cover film with holes is adhered to the leads arranged in parallel, one part of the holes are welding spot windows, the welding spots are protected by the anti-etching ink, the other part of the holes are windows at the disconnected positions of the leads, the leads are exposed in the windows, the leads exposed in the windows are etched and disconnected by adopting an etching mode to manufacture the front single-side lead circuit board, and then the back parallel leads are adhered on the back of the single-side lead circuit board to manufacture the double-layer lead board.
Disclosure of Invention
The invention relates to a double-layer wire guide plate and a manufacturing method thereof, in particular to a double-layer wire guide plate which is characterized in that wires are arranged in parallel and covered on a base material with glue, a front cover film is drilled and then adhered on the wires arranged in parallel, at the position where the circuit needs to be disconnected, the covering film is provided with a hole to expose the lead for etching, etching-resistant ink is printed and dried at the position of the bonding pad and the position of the metal connection point on the circuit to protect the bonding pad, then etching the exposed copper-clad aluminum conductor to cut off the copper-clad aluminum conductor, removing the anti-etching ink by using alkaline de-inking liquid to manufacture a circuit board with a front single-sided conductor, and then, after the back side is coated with glue, punching a through hole, covering the back side parallel lead on the back side glue layer, exposing the back side parallel lead at the position of the through hole from the front side, enabling the front side lead and the back side lead at the hole position to be connected and communicated at the hole position when in use, and baking and curing the glue layer to obtain the double-layer lead circuit board.
The invention provides a method for manufacturing a double-layer lead plate, which comprises the following steps of arranging leads in parallel and covering the leads on a substrate with glue, drilling holes in a covering film on the front surface, or punching the covering film and attaching the covering film to the leads arranged in parallel to form a solder mask and an etching-resistant layer, wherein holes are formed in the covering film at positions where a circuit needs to be disconnected, so that the leads are exposed and are convenient to etch, etching-resistant ink is printed and dried at the positions of pads and metal connection points on the circuit (but not limited to the positions of the pads and the metal connection points, the pads are used for welding elements, the metal connection points are used for connecting a circuit board and a power circuit or interconnecting circuit boards, the etching-resistant layer comprises two materials, the covering film is the etching-resistant layer at some positions, the ink etching-resistant layer is arranged at some positions, and the ink is superposed on the covering film layer to form the etching-resistant layer, then using aqueous solution whose main components are hydrochloric acid, copper dichloride and aluminium trichloride as etching liquor, chemically etching the exposed copper-clad aluminium conductor to make it break, and making the exposed copper-clad aluminium conductor show short-sighted section to form "C" type structure at the position of cross section cut towards longitudinal direction (length direction) and the aluminium in the middle of copper-clad aluminium conductor be formed into depression, after etching, using alkaline desizing ink to remove etching-resistant ink to make single-side conductor circuit board, after coating adhesive on back side, making the back side parallel conductor be covered on back side adhesive layer, and making the back side parallel conductor be exposed from front side at the position of said via hole, so that when it is used, it can be conveniently formed into conduction with front side, baking and solidifying adhesive layer so as to obtain the invented double-layer conductor circuit board.
According to the present invention, there is also provided a double-layered wire guide plate, comprising: a front single-sided wire circuit board; the adhesive layer is arranged on the back surface of the single-side lead circuit board; a via hole disposed on the front single-sided wire circuit board; a back side parallel conductor circuit; it is characterized in that the front single-side lead circuit board comprises: the substrate with the adhesive is a substrate layer with the adhesive of the single-sided conducting wire circuit board and is also an intermediate insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; covering a solder mask layer on the front side; the break opening is arranged on the lead circuit of the front parallel lead circuit layer; a bonding pad and a metal connection point on the front parallel lead; specifically, on all the leads or part of the leads of the lead circuit, a plurality of disconnection openings disconnected from the middle are formed, the leads disconnected from the middle are all copper-clad aluminum wires, the disconnection openings of the copper-clad aluminum wires disconnected from the middle are in a C-shaped structure with near vision on the section of the leads cut towards the longitudinal direction (the long direction), the aluminum in the middle of the leads is formed with a recess, the front cover film is provided with a hole at the disconnection opening of the copper-clad aluminum middle wire, the disconnection position of the leads is at the hole edge position of the opening of the front cover film, the disconnection surface of the leads and the edge surface of the cover film hole are on one section or close to one section, or the disconnection position of the leads is in the opening of the cover film, the leads at the disconnection position of the leads are exposed from the cover film hole, the bonding pads of the element are arranged on the two leads, or are arranged on two sides of one lead disconnection opening, the metal connection points are connection points used for being connected with a power circuit or connection points used for being interconnected between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are a pad window and a metal connection point window, a part of the holes are windows at the disconnection positions of the leads, the adhesive layer is arranged on the back surface of the front single-sided lead circuit board, namely on the middle insulating layer, the via holes are arranged at the positions where the back parallel leads need to be conducted on the front surface, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer, the glued base material (namely the middle insulating layer), the adhesive layer and the formed holes, the back parallel lead circuit is formed by sticking the back parallel leads on the adhesive layer, the back parallel lead circuit is overlapped and adhered with the front single-sided lead circuit board in a contraposition, and the back parallel leads are exposed from the front surface at, when in use, the back surface wire and the front surface can be conveniently connected and conducted at the hole, and the double-layer wire circuit board is formed.
According to a preferred embodiment of the present invention, the double-layered wire guide plate is characterized in that the cover film is a polyimide film with glue or a PET film with glue.
According to a preferred embodiment of the present invention, the double-layer wire guide plate is characterized in that the substrate with glue is a polyimide PI substrate with glue, or a PET substrate with glue, or an epoxy glass fiber substrate with glue, or a phenolic substrate with glue, or a ceramic substrate with glue.
According to a preferred embodiment of the present invention, the double-layer wire guide plate is characterized in that all the parallel wires are copper-clad aluminum wires, or a part of the parallel wires is copper-clad aluminum wires and a part of the parallel wires is copper wires, and only the copper-clad aluminum wires are completely etched and disconnected.
According to a preferred embodiment of the present invention, the double-layer wire guide plate is characterized in that an insulating ink is printed at a cut-off portion of the copper clad aluminum wire after etching, so that the cut-off portion forms an insulating protection.
According to a preferred embodiment of the present invention, the double-layer wiring board is characterized in that an insulating ink or an insulating film can be formed on the back surface to protect the back circuit.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.
Fig. 2 is a schematic plan view of the front cover film.
Fig. 3 is a schematic plan view of the front cover film attached to the wires in alignment.
Fig. 4 is a schematic plan view of the solder joint window after printing resist ink thereon.
FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching break, a break surface of the copper-clad aluminum wire and an edge surface of a covering film hole on a cross section.
Fig. 6 is a schematic cross-sectional view of the copper-clad aluminum wire at the etching break, the break position of the copper-clad aluminum wire in the hole of the cover film, and the lead at the break position of the lead exposed from the hole of the cover film.
Fig. 7 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after copper clad aluminum wire etching to form insulation protection at the cut-off portion.
Fig. 8 is a schematic plan view of a front side single-sided wire circuit board.
Fig. 9 is a schematic plan view of a front single-sided circuit board with vias after glue is applied to the back surface of the circuit board.
Fig. 10 is a schematic cross-sectional view of a front single-sided circuit board after glue is applied to the back surface and vias are formed.
Fig. 11 is a schematic plan view of a double-layer wire board formed by covering a back-side parallel wire on a back-side glue layer and exposing the back-side parallel wire from the front side at a via hole position.
Fig. 12 is a schematic plan view of the double-layered wire guide plate viewed from the back.
Fig. 13 is a schematic cross-sectional view of a double-layer wire guide plate at the location of a via hole.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).
The PI film is punched with solder joint windows 3.1, 3.2, 3.3, 3.4 and windows 3.5, 3.6 at the positions where the wires need to be cut off by using a designed and manufactured die to manufacture a front cover film 3 (as shown in fig. 2).
The front cover film 3 is oppositely mounted on the copper-clad aluminum conductor 2, the copper-clad aluminum conductor 2 is exposed from the punched windows 3.1, 3.2, 3.3 and 3.4 of the front cover film 3 to form welding spots 3.1a, 3.2a, 3.3a and 3.4a, meanwhile, the copper-clad aluminum conductor 2 is also exposed from the punched windows 3.5 and 3.6 of the front cover film 3 (as shown in figure 3), hot pressing is carried out at 180 ℃ for 60 seconds under the pressure of 150kg, so that the front cover film 3, the copper-clad aluminum conductor 2 and the PI base material 1 with glue at the bottom layer are firmly bonded together, and baking and curing are carried out in an oven at the temperature of 150 ℃ for 60 minutes.
Printing a layer of anti-corrosion ink 3.1b, 3.2b, 3.3b and 3.4b on a screen printing machine by using a silk screen manufactured according to design data to protect welding spots (as shown in figure 4) by using a layer of anti-corrosion ink 3.1a, 3.2a, 3.3a and 3.4a on a screen printing machine respectively, drying after printing, then etching and removing the copper-clad aluminum conductor 2 exposed at the windows 3.5 and 3.6 at an etching section on an etching film removing production line by using an aqueous solution mainly containing hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, wherein the aluminum etching speed in the copper-clad aluminum conductor 2 is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction at the section position after etching and cutting is formed to be a short-sight C-shaped structure 2.1, the aluminum in the middle of the copper-clad aluminum conductor is formed to be a recess, and the cutting surface of the copper-clad aluminum conductor 2 and the edge surface of the window 3.5 or the window 3.6 of the cover film 3 are cut at the section position (as shown in figure 5) at the section of the copper-clad aluminum conductor, Or, the copper-clad aluminum wire 2 is in the etched broken position, the broken surface of the copper-clad aluminum wire 2 and the hole of the window 3.5 or 3.6 punched by the covering film 3, the copper-clad aluminum wire 2 at the broken position is exposed from the window 3.5 or/and 3.6 (as shown in fig. 6), the anti-etching line ink 3.1b, 3.2b, 3.3b, 3.4b printed on the welding spots 3.1a, 3.2a, 3.3a, 3.4a is removed by caustic soda aqueous solution at the film removing section, and then the insulating ink 4 is printed at the broken position after the copper-clad aluminum wire is etched, so that the broken opening forms insulating protection (as shown in fig. 7), thus the front single-sided wire circuit board as shown in fig. 8 is manufactured.
Gluing the back of a front single-sided lead circuit board, drilling a through hole 5 at the position where a front parallel lead 2 and a back parallel lead 6 need to be communicated, wherein the through hole 5 penetrates through a front cover film solder resist 3, the front parallel lead 2, a substrate 1 with glue and glue coated on the back of the front single-sided lead circuit board (shown in figures 9 and 10), then coating and adhering the back parallel lead 6 on the glue coated on the back of the front single-sided lead circuit board, the back parallel lead circuit 6 and the front single-sided lead circuit board are aligned, overlapped and adhered together, the back parallel lead 6 is exposed from the front at the position of the through hole 5 (shown in figures 11 and 13), so that the front lead and the back lead at the hole position can be connected and communicated at the hole when in use, the back parallel lead 6 is adhered on the glue on the back of the single-sided lead circuit board when viewed from the back and is exposed outside (, and then the double-layer lead circuit board is manufactured through the processes of silk-screen character printing, OSP surface antioxidation treatment, forming, FQC inspection, packaging and the like.
The present invention has been described in detail with reference to the accompanying drawings in which a double-layered wire guide plate and a method for manufacturing the same are illustrated. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (7)
1. A method for preparing double-layer wire guide plate includes such steps as arranging wires in parallel, covering them on substrate with adhesive, drilling holes on the front cover film, punching holes on said front cover film, sticking them to said wires, printing etching-resistant ink on the positions of pads and metal connecting points, baking, protecting pads, welding elements, connecting circuit board to power supply or connecting circuit board to each other, using two materials as etching-resistant layer, covering the cover film with said etching-resistant layer, using said ink to cover the etching-resistant layer, using hydrochloric acid as main component, the copper chloride and aluminium trichloride aqueous solution is used as etching solution, the exposed copper-clad aluminium conductor is etched by a chemical method to be disconnected, the etching speed of aluminium is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction (long direction) shows a short sight to form a C-shaped structure at the position of the disconnected section, aluminium in the middle of the copper-clad aluminium conductor forms a recess, after etching, alkali de-printing ink is used for removing anti-etching ink to manufacture a single-sided conductor circuit board, a conducting hole is formed after back glue coating, then a back parallel conductor is covered on a back glue layer, the back parallel conductor is exposed from the front side at the position of the conducting hole, so that the conducting hole is convenient to form conduction with the front side when in use, and the glue layer is baked and solidified, thus the double-layer conductor circuit board is.
2. A double-layer wire guide plate comprising:
a front single-sided wire circuit board;
the adhesive layer is arranged on the back surface of the single-side lead circuit board;
a via hole disposed on the front single-sided wire circuit board;
a back side parallel conductor circuit;
it is characterized in that the front single-side lead circuit board comprises: the substrate with the adhesive is a substrate layer with the adhesive of the single-sided conducting wire circuit board and is also an intermediate insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; covering a solder mask layer on the front side; the break opening is arranged on the lead circuit of the front parallel lead circuit layer; a bonding pad and a metal connection point on the front parallel lead; specifically, on all the leads or part of the leads of the lead circuit, a plurality of disconnection openings disconnected from the middle are formed, the leads disconnected from the middle are all copper-clad aluminum wires, the disconnection openings of the copper-clad aluminum wires disconnected from the middle are in a C-shaped structure with near vision on the section of the leads cut towards the longitudinal direction (the long direction), the aluminum in the middle of the leads is formed with a recess, the front cover film is provided with a hole at the disconnection opening of the copper-clad aluminum middle wire, the disconnection position of the leads is at the hole edge position of the opening of the front cover film, the disconnection surface of the leads and the edge surface of the cover film hole are on one section or close to one section, or the disconnection position of the leads is in the opening of the cover film, the leads at the disconnection position of the leads are exposed from the cover film hole, the bonding pads of the element are arranged on the two leads, or are arranged on two sides of one lead disconnection opening, the metal connection points are connection points used for being connected with a power circuit or connection points used for being interconnected between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are a pad window and a metal connection point window, a part of the holes are windows at the disconnection positions of the leads, the adhesive layer is arranged on the back surface of the front single-sided lead circuit board, namely on the middle insulating layer, the via holes are arranged at the positions where the back parallel leads need to be conducted on the front surface, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer, the glued base material (namely the middle insulating layer), the adhesive layer and the formed holes, the back parallel lead circuit is formed by sticking the back parallel leads on the adhesive layer, the back parallel lead circuit is overlapped and adhered with the front single-sided lead circuit board in a contraposition, and the back parallel leads are exposed from the front surface at, when in use, the back surface wire and the front surface can be conveniently connected and conducted at the hole, and the double-layer wire circuit board is formed.
3. The double-layered wire guide plate according to claim 1 or 2, wherein the cover film is a polyimide film with a glue or a PET film with a glue.
4. The double-layer wire guide plate according to claim 1 or 2, wherein the glued substrate is a glued polyimide PI substrate, a PET substrate, an epoxy glass fiber substrate, a phenolic aldehyde substrate or a ceramic substrate.
5. The double-layer wire board according to claim 1 or 2, wherein the parallel wires are all copper-clad aluminum wires, or a part of the parallel wires are copper-clad aluminum wires, a part of the parallel wires are copper wires, and only the copper-clad aluminum wires are completely etched and disconnected.
6. The double-layer wire board according to claim 1 or 2, wherein an insulating ink is printed at the cut-off position of the copper-clad aluminum wire after etching, so that the cut-off port forms insulation protection.
7. A double layer wiring board according to claim 1 or 2, wherein an insulating ink or film is applied to the back side to protect the back side circuitry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813129.7A CN112437544A (en) | 2019-08-24 | 2019-08-24 | Double-layer wire guide plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813129.7A CN112437544A (en) | 2019-08-24 | 2019-08-24 | Double-layer wire guide plate and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112437544A true CN112437544A (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910813129.7A Pending CN112437544A (en) | 2019-08-24 | 2019-08-24 | Double-layer wire guide plate and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286454A (en) * | 2021-05-06 | 2021-08-20 | 深圳崇达多层线路板有限公司 | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board |
-
2019
- 2019-08-24 CN CN201910813129.7A patent/CN112437544A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113286454A (en) * | 2021-05-06 | 2021-08-20 | 深圳崇达多层线路板有限公司 | Method for improving Air-gap structure bonding of FPC (Flexible printed Circuit) board |
| CN113286454B (en) * | 2021-05-06 | 2023-05-12 | 深圳崇达多层线路板有限公司 | Method for improving adhesion of Air-gap structure of FPC board |
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