CN112437545A - Novel double-layer wire guide plate and manufacturing method thereof - Google Patents
Novel double-layer wire guide plate and manufacturing method thereof Download PDFInfo
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- CN112437545A CN112437545A CN201910813262.2A CN201910813262A CN112437545A CN 112437545 A CN112437545 A CN 112437545A CN 201910813262 A CN201910813262 A CN 201910813262A CN 112437545 A CN112437545 A CN 112437545A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 47
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000005530 etching Methods 0.000 claims abstract description 40
- 239000013039 cover film Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 238000009990 desizing Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 77
- 239000004020 conductor Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- 229960003280 cupric chloride Drugs 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 208000001491 myopia Diseases 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a novel double-layer lead board and a manufacturing method thereof, in particular to a novel double-layer lead board which is characterized in that leads are arranged in parallel and covered on a substrate with glue, a front cover film is drilled and then attached to the leads arranged in parallel, holes are formed in the position, where the leads need to be disconnected, of the cover film, the leads are exposed and convenient to etch, etching-resistant ink is printed and dried at the positions of a bonding pad and a metal connecting point on the circuit to protect the bonding pad, then the exposed copper-clad aluminum leads are etched and disconnected, the etching-resistant ink is removed by alkaline desizing ink to prepare a front single-face lead circuit board, a conducting hole is formed, a back parallel lead is covered on another layer of back film with glue, then the back parallel leads are attached to the back of the single-face lead circuit board in an aligned mode, the back parallel leads are exposed from the front face at the positions of the holes, and the front, the holes can be connected and conducted, and the glue layer is baked and solidified, so that the novel double-layer wire circuit board is manufactured.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a novel double-layer wire guide plate and a manufacturing method thereof.
Background
A series of prior wire guide plate patents by the present inventors, for example: patent numbers: 201010232487.8, patent name: a single-sided circuit board manufactured by juxtaposing flat wires and a manufacturing method thereof are disclosed in the patent number: 201010232506.7, patent name: the method for manufacturing the single-sided circuit board by adopting the juxtaposed leads has the following patent numbers: 201010232506.7, patent name: the method comprises the following steps of respectively using insulating layers to simultaneously carry out hot pressing on two surfaces of a flat wire to manufacture a single-sided circuit board, wherein the method comprises the following steps: 201010232526.4, patent name: the single-sided circuit board is manufactured by bonding juxtaposed flat leads by using a thermosetting adhesive film, and the patent number is as follows: 201010232547.6, patent name: the method for manufacturing the single-sided circuit board by using the reprinting adhesive film and the juxtaposed flat wires is a single-sided circuit board, the circuit board needs to be made very wide due to the limitation of the arrangement of the circuit and the wires, the current-carrying capacity is small, the market requirements cannot be met, the wires are disconnected by using a die punching mode or a drilling mode, the die has the defects of high die sinking cost and inflexible design, the wire is difficult to change once the die is opened, the drilling mode adopts a heavy drilling mode, the cost is high, the alignment precision is insufficient, and the wire is easy to drill and deviate to cause poor scrap height.
In order to overcome the defects and the shortcomings, the invention adopts the steps that the leads are arranged in parallel and covered on the base material with the adhesive, the front cover film with holes is adhered to the leads arranged in parallel, one part of the holes are welding spot windows, the welding spots are protected by the anti-etching ink, the other part of the holes are windows at the disconnected positions of the leads, the leads are exposed in the windows, the leads exposed in the windows are etched and disconnected by adopting an etching mode to manufacture the front single-side lead circuit board, and then the back parallel leads are adhered on the back of the single-side lead circuit board to manufacture the double-layer lead board.
Disclosure of Invention
The invention relates to a novel double-layer lead board and a manufacturing method thereof, in particular to a novel double-layer lead board which is characterized in that leads are arranged in parallel and covered on a substrate with glue, a front cover film is drilled and then attached to the leads arranged in parallel, holes are formed in the position, where the leads need to be disconnected, of the cover film, the leads are exposed and convenient to etch, etching-resistant ink is printed and dried at the positions of a bonding pad and a metal connecting point on the circuit to protect the bonding pad, then the exposed copper-clad aluminum leads are etched and disconnected, the etching-resistant ink is removed by alkaline desizing ink to prepare a front single-face lead circuit board, a conducting hole is formed, a back parallel lead is covered on another layer of back film with glue, then the back parallel leads are attached to the back of the single-face lead circuit board in an aligned mode, the back parallel leads are exposed from the front face at the positions of the holes, and the front, the holes can be connected and conducted, and the glue layer is baked and solidified, so that the novel double-layer wire circuit board is manufactured.
The invention provides a method for manufacturing a novel double-layer wire guide plate, which comprises the following steps of arranging wires in parallel, covering the wires on a substrate with glue, drilling holes in a front cover film or punching the holes and attaching the holes to the wires arranged in parallel to form a solder mask layer and an etching-resistant layer, wherein holes are formed in the cover film at positions where a circuit needs to be disconnected, so that the wires are exposed and are convenient to etch, etching-resistant ink is printed and dried at the positions of a pad and a metal connecting point on the circuit, the pad is used for welding a component, the metal connecting point is used for connecting a circuit board and a power circuit or interconnecting circuit boards, the etching-resistant layer comprises two materials, the cover film is the etching-resistant layer at some positions, the ink is superposed on the cover film to form the etching-resistant layer at some positions, then using aqueous solution whose main components are hydrochloric acid, copper dichloride and aluminium trichloride as etching liquor, chemically etching the exposed copper-clad aluminium conductor to make it break, because the etching speed of aluminium is higher than that of copper, at the position of cross-section after etching break, the conductor can be cut towards longitudinal direction (length direction) and can be formed into "C" type structure, the aluminium in the middle of copper-clad aluminium conductor can be formed into depression, after etching, using alkaline desizing ink to remove etching-resisting ink to make single-side conductor circuit board, drilling through hole on the single-side conductor circuit board or sticking adhesive tape on the local position of back of single-side conductor circuit board, then covering the back parallel conductor on another layer of back surface film with adhesive, then making the back parallel conductor face to the back of single-side conductor circuit board, i.e. making it be aligned with intermediate insulating layer, and sticking the adhesive layer of back surface film together with intermediate insulating film in the gap of back conductor, the back line is fixed and insulated in a closed mode, the parallel wires on the back are exposed out of the front face at the hole positions, conduction between the parallel wires and the front face is facilitated when the circuit board is used at the hole positions, and the glue layer is baked and solidified, so that the double-layer wire circuit board is manufactured.
According to the present invention, there is also provided a novel double-layered wire guide plate, comprising: a front single-sided wire circuit board; a back side parallel conductor circuit; a film with adhesive on the back; a via hole disposed on the front single-sided wire circuit board; it is characterized in that the front single-side lead circuit board comprises: the substrate with the adhesive is a substrate layer with the adhesive of the single-sided conducting wire circuit board and is also an intermediate insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; covering a solder mask layer on the front side; the break opening is arranged on the lead circuit of the front parallel lead circuit layer; a bonding pad and a metal connection point on the front parallel lead; specifically, on all the leads or part of the leads of the lead circuit, a plurality of disconnection openings disconnected from the middle are formed, the leads disconnected from the middle are all copper-clad aluminum wires, the disconnection openings of the copper-clad aluminum wires disconnected from the middle are formed, the section of the leads cut towards the longitudinal direction (the long direction) shows a near-sighted C-shaped structure, aluminum in the middle of the leads forms a recess, a hole is formed in the front cover film at the disconnection opening in the middle of the copper-clad aluminum wires, the position of the disconnection of the leads is at the hole edge position of the hole of the front cover film, the disconnection surface of the leads and the edge surface of the cover film hole are on one section or close to one section, or the disconnection position of the leads is in the hole of the cover film, the leads at the disconnection position of the leads are exposed out of the cover film hole, the pads of the welding element are arranged on two leads or are arranged on two sides of one lead disconnection opening, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for being interconnected between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are a pad window and a metal connection point window, a part of the holes are windows at the disconnection positions of the leads, the via holes arranged on the front single-side lead circuit board are positions where the back parallel leads need to be conducted and the front side needs to be conducted, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer and the substrate with glue (namely the middle insulating layer) or adhesive tapes are arranged at the local positions of the back side of the single-side lead circuit board, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer, the substrate with glue (namely the middle insulating layer) and the adhesive tapes, the parallel lead circuit on the back side and, the back parallel wires are exposed from the front side at the positions of the via holes, so that the back wires at the hole positions are convenient to be connected and conducted with the front side when in use, and the double-layer wire circuit board is formed.
According to a preferred embodiment of the present invention, the novel double-layer wire guide plate is characterized in that the cover film is a polyimide film with glue or a PET film with glue.
According to a preferred embodiment of the present invention, the novel double-layer wire guide plate is characterized in that the substrate with glue is a polyimide PI substrate with glue, or a PET substrate, or an epoxy glass fiber substrate, or a phenolic substrate, or a ceramic substrate with glue.
According to a preferred embodiment of the present invention, the novel double-layer wire guide plate is characterized in that all the parallel wires are copper-clad aluminum wires, or a part of the parallel wires is copper-clad aluminum wires and a part of the parallel wires is copper wires, and only the copper-clad aluminum wires are completely etched.
According to a preferred embodiment of the present invention, the novel double-layer wire guide plate is characterized in that insulating ink can be printed at the cut-off position of the etched copper clad aluminum wire, so that the cut-off opening forms insulation protection.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the description set forth below when taken in conjunction with the drawings, a brief description of which follows.
Fig. 1 is a schematic plan view of a tape base material with wires arranged in parallel.
Fig. 2 is a schematic plan view of the front cover film.
Fig. 3 is a schematic plan view of the front cover film attached to the wires in alignment.
Fig. 4 is a schematic plan view of the solder joint window after printing resist ink thereon.
FIG. 5 is a schematic cross-sectional view of a copper-clad aluminum wire at an etching break, a break surface of the copper-clad aluminum wire and an edge surface of a covering film hole on a cross section.
Fig. 6 is a schematic cross-sectional view of the copper-clad aluminum wire at the etching break, the break position of the copper-clad aluminum wire in the hole of the cover film, and the lead at the break position of the lead exposed from the hole of the cover film.
Fig. 7 is a schematic cross-sectional view of applying insulating ink to the cut-off portion after copper clad aluminum wire etching to form insulation protection at the cut-off portion.
Fig. 8 is a schematic plan view of a front side single-sided wire circuit board.
Fig. 9 is a schematic plan view of a front side single-sided wire circuit board with vias.
Fig. 10 is a schematic cross-sectional view of a front side single-sided wire circuit board with vias.
FIG. 11 is a schematic plan view of a backside parallel conductive line overlaid on another layer of adhesive backside film.
Fig. 12 is a schematic plan view of a double-layer wiring board formed by attaching back parallel wires to the back of a single-sided wiring board in a aligned manner, with the back parallel wires exposed from the front at the via holes.
Fig. 13 is a schematic cross-sectional view of a double-layer wire guide plate at the location of a via hole.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
A plurality of coils of copper-clad aluminum conductors 2 are placed on a pay-off rack of a wire covering machine, and are positioned and distributed through a spacing rod mould arranged on the wire covering machine to be covered and adhered with a PI substrate 1 with glue at the bottom layer (as shown in figure 1).
The PI film is punched with solder joint windows 3.1, 3.2, 3.3, 3.4 and windows 3.5, 3.6 at the positions where the wires need to be cut off by using a designed and manufactured die to manufacture a front cover film 3 (as shown in fig. 2).
The front cover film 3 is oppositely mounted on the copper-clad aluminum conductor 2, the copper-clad aluminum conductor 2 is exposed from the punched windows 3.1, 3.2, 3.3 and 3.4 of the front cover film 3 to form welding spots 3.1a, 3.2a, 3.3a and 3.4a, meanwhile, the copper-clad aluminum conductor 2 is also exposed from the punched windows 3.5 and 3.6 of the front cover film 3 (as shown in figure 3), hot pressing is carried out at 180 ℃ for 60 seconds under the pressure of 150kg, so that the front cover film 3, the copper-clad aluminum conductor 2 and the PI base material 1 with glue at the bottom layer are firmly bonded together, and baking and curing are carried out in an oven at the temperature of 150 ℃ for 60 minutes.
Printing a layer of anti-corrosion ink 3.1b, 3.2b, 3.3b and 3.4b on a screen printing machine by using a silk screen manufactured according to design data to protect welding spots (as shown in figure 4) by using a layer of anti-corrosion ink 3.1a, 3.2a, 3.3a and 3.4a on a screen printing machine respectively, drying after printing, then etching and removing the copper-clad aluminum conductor 2 exposed at the windows 3.5 and 3.6 at an etching section on an etching film removing production line by using an aqueous solution mainly containing hydrochloric acid, copper dichloride and aluminum trichloride as an etching solution to form a circuit, wherein the aluminum etching speed in the copper-clad aluminum conductor 2 is higher than that of copper, so that the section of the conductor cut towards the longitudinal direction at the section position after etching and cutting is formed to be a short-sight C-shaped structure 2.1, the aluminum in the middle of the copper-clad aluminum conductor is formed to be a recess, and the cutting surface of the copper-clad aluminum conductor 2 and the edge surface of the window 3.5 or the window 3.6 of the cover film 3 are cut at the section position (as shown in figure 5) at the section of the copper-clad aluminum conductor, Or, the copper-clad aluminum wire 2 is in the etched broken position, the broken surface of the copper-clad aluminum wire 2 and the hole of the window 3.5 or 3.6 punched by the covering film 3, the copper-clad aluminum wire 2 at the broken position is exposed from the window 3.5 or/and 3.6 (as shown in fig. 6), the anti-etching line ink 3.1b, 3.2b, 3.3b, 3.4b printed on the welding spots 3.1a, 3.2a, 3.3a, 3.4a is removed by caustic soda aqueous solution at the film removing section, and then the insulating ink 4 is printed at the broken position after the copper-clad aluminum wire is etched, so that the broken opening forms insulating protection (as shown in fig. 7), thus the front single-sided wire circuit board as shown in fig. 8 is manufactured.
On the front-side single-conductor circuit board, a via hole 5 is drilled at a position where the front-side parallel conductor 2 and the back-side parallel conductor 6 need to be conducted, or after an adhesive tape is pasted at a local position on the back side of the single-conductor circuit board, the via hole 5 is drilled, the via hole 5 penetrates through the front-side cover film solder resist 3, the front-side parallel conductor 2, the substrate 1 with the adhesive, or the adhesive tape (as shown in fig. 9 and 10).
And then the back parallel wires 6 are covered on another layer of back film 7 with glue (as shown in figure 11), then the back parallel wires 6 and the front single-sided wire circuit board are aligned and hot-pressed and bonded together, the glue layer of the back film 7 is arranged at the gap of the back wires 6 and an intermediate insulating film, namely the substrate 1 with glue is bonded together, so that the back parallel wires 6 are fixed and sealed and insulated, the back parallel wires 6 are exposed from the front at the positions of the via holes 5 (as shown in figures 12 and 13), so that the front parallel wires 2 and the back parallel wires 6 at the positions of the via holes 5 can be connected and conducted at the via holes 5 when in use, the glue layer is baked and cured, and then the novel double-layer wire circuit board is manufactured through the processes of silk-screen character printing, OSP surface oxidation resistance treatment, molding, FQC inspection, packaging.
The present invention has been described in detail with reference to the accompanying drawings, which illustrate specific embodiments of a novel double-layer wire guide plate and a method for manufacturing the same. It will be understood by those skilled in the art, however, that the foregoing is merely illustrative and descriptive of some specific embodiments and is not to be construed as limiting the scope of the invention, especially the scope of the claims.
Claims (6)
1. A method for manufacturing a novel double-layer wire guide plate comprises arranging wires in parallel and covering on a substrate with adhesive, drilling holes on a front cover film or punching the holes and attaching the holes to the wires arranged in parallel to form a solder mask layer and an anti-etching layer, forming holes on the cover film at positions where the wires need to be disconnected to expose the wires for etching, printing anti-etching ink at the positions of pads and metal connection points on the wires (but not limited to) and drying the anti-etching ink to protect the pads and the metal connection points, wherein the pads are used for welding elements, the metal connection points are used for connecting a circuit board and a power circuit or interconnecting circuit boards, the anti-etching layer comprises two materials, the cover film is the anti-etching layer at some positions, the ink anti-etching layer at some positions, and the ink is superposed on the cover film layer to form the anti-etching layer at some positions, then using aqueous solution whose main components are hydrochloric acid, copper dichloride and aluminium trichloride as etching liquor, chemically etching the exposed copper-clad aluminium conductor to make it break, because the etching speed of aluminium is higher than that of copper, at the position of cross-section after etching break, the conductor can be cut towards longitudinal direction (length direction) and can be formed into "C" type structure, the aluminium in the middle of copper-clad aluminium conductor can be formed into depression, after etching, using alkaline desizing ink to remove etching-resisting ink to make single-side conductor circuit board, drilling through hole on the single-side conductor circuit board or sticking adhesive tape on the local position of back of single-side conductor circuit board, then covering the back parallel conductor on another layer of back surface film with adhesive, then making the back parallel conductor face to the back of single-side conductor circuit board, i.e. making it be aligned with intermediate insulating layer, and sticking the adhesive layer of back surface film together with intermediate insulating film in the gap of back conductor, the back line is fixed and insulated in a closed mode, the parallel wires on the back are exposed out of the front face at the hole positions, conduction between the parallel wires and the front face is facilitated when the circuit board is used at the hole positions, and the glue layer is baked and solidified, so that the double-layer wire circuit board is manufactured.
2. A novel double layer wire guide plate comprising:
a front single-sided wire circuit board;
a back side parallel conductor circuit;
a film with adhesive on the back;
a via hole disposed on the front single-sided wire circuit board;
it is characterized in that the front single-side lead circuit board comprises: the substrate with the adhesive is a substrate layer with the adhesive of the single-sided conducting wire circuit board and is also an intermediate insulating layer of the double-layer conducting wire board; a front parallel conductor circuit layer; covering a solder mask layer on the front side; the break opening is arranged on the lead circuit of the front parallel lead circuit layer; a bonding pad and a metal connection point on the front parallel lead; specifically, on all the leads or part of the leads of the lead circuit, a plurality of disconnection openings disconnected from the middle are formed, the leads disconnected from the middle are all copper-clad aluminum wires, the disconnection openings of the copper-clad aluminum wires disconnected from the middle are formed, the section of the leads cut towards the longitudinal direction (the long direction) shows a near-sighted C-shaped structure, aluminum in the middle of the leads forms a recess, a hole is formed in the front cover film at the disconnection opening in the middle of the copper-clad aluminum wires, the position of the disconnection of the leads is at the hole edge position of the hole of the front cover film, the disconnection surface of the leads and the edge surface of the cover film hole are on one section or close to one section, or the disconnection position of the leads is in the hole of the cover film, the leads at the disconnection position of the leads are exposed out of the cover film hole, the pads of the welding element are arranged on two leads or are arranged on two sides of one lead disconnection opening, the metal connection points are connection points used for being connected with a power supply circuit or connection points used for being interconnected between circuit boards, a plurality of holes are arranged on the covering film, wherein a part of the holes are a pad window and a metal connection point window, a part of the holes are windows at the disconnection positions of the leads, the via holes arranged on the front single-side lead circuit board are positions where the back parallel leads need to be conducted and the front side needs to be conducted, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer and the substrate with glue (namely the middle insulating layer) or adhesive tapes are arranged at the local positions of the back side of the single-side lead circuit board, the via holes penetrate through the front covering film solder mask layer, the front parallel lead circuit layer, the substrate with glue (namely the middle insulating layer) and the adhesive tapes, the parallel lead circuit on the back side and, the back parallel wires are exposed from the front side at the positions of the via holes, so that the back wires at the hole positions are convenient to be connected and conducted with the front side when in use, and the double-layer wire circuit board is formed.
3. A novel double-layered wire guide plate according to claim 1 or 2, wherein said cover film is a polyimide film with adhesive or a PET film with adhesive.
4. The novel double-layer wire guide plate according to claim 1 or 2, wherein the substrate with glue is a polyimide PI substrate with glue, or a PET substrate, or an epoxy glass fiber substrate, or a phenolic substrate, or a ceramic substrate.
5. A novel double-layer wire board according to claim 1 or 2, characterized in that the parallel wires are all copper-clad aluminum wires, or a part of the parallel wires are copper-clad aluminum wires, a part of the parallel wires are copper wires, and only the copper-clad aluminum wires are completely etched and disconnected.
6. The novel double-layer wire board as claimed in claim 1 or 2, wherein an insulating ink is printed on the cut-off portion of the copper clad aluminum wire after etching, so that the cut-off portion forms an insulating protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813262.2A CN112437545A (en) | 2019-08-24 | 2019-08-24 | Novel double-layer wire guide plate and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813262.2A CN112437545A (en) | 2019-08-24 | 2019-08-24 | Novel double-layer wire guide plate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112437545A true CN112437545A (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910813262.2A Withdrawn CN112437545A (en) | 2019-08-24 | 2019-08-24 | Novel double-layer wire guide plate and manufacturing method thereof |
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|---|---|
| CN (1) | CN112437545A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905543A (en) * | 2021-10-11 | 2022-01-07 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
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| US5464662A (en) * | 1993-09-03 | 1995-11-07 | Nec Corporation | Fabrication method of printed wiring board |
| JP2003273510A (en) * | 2002-03-12 | 2003-09-26 | Hitachi Kokusai Electric Inc | Manufacturing method for printed substrate |
| KR20060088144A (en) * | 2005-02-01 | 2006-08-04 | 주식회사 신협전자 | Manufacturing process of printed circuit board for double side hccl |
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN201928519U (en) * | 2010-08-24 | 2011-08-10 | 王定锋 | Double-sided circuit board manufactured by adhering juxtaposed flat leads with thermosetting adhesive film |
| CN102917542A (en) * | 2012-10-17 | 2013-02-06 | 无锡江南计算技术研究所 | Method for manufacturing copper PCB (Printed Circuit Board) circuit |
| WO2018028214A1 (en) * | 2016-08-09 | 2018-02-15 | 王定锋 | Led light strip circuit board module comprising multifunctional aluminum foil |
| CN206674305U (en) * | 2017-03-02 | 2017-11-24 | 东莞市五株电子科技有限公司 | Soft or hard combination printed circuit board (PCB) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905543A (en) * | 2021-10-11 | 2022-01-07 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
| CN113905543B (en) * | 2021-10-11 | 2024-05-28 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
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