WO2018028214A1 - Led light strip circuit board module comprising multifunctional aluminum foil - Google Patents

Led light strip circuit board module comprising multifunctional aluminum foil Download PDF

Info

Publication number
WO2018028214A1
WO2018028214A1 PCT/CN2017/078711 CN2017078711W WO2018028214A1 WO 2018028214 A1 WO2018028214 A1 WO 2018028214A1 CN 2017078711 W CN2017078711 W CN 2017078711W WO 2018028214 A1 WO2018028214 A1 WO 2018028214A1
Authority
WO
WIPO (PCT)
Prior art keywords
aluminum foil
circuit board
line
back line
wire
Prior art date
Application number
PCT/CN2017/078711
Other languages
French (fr)
Chinese (zh)
Inventor
王定锋
徐文红
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2018028214A1 publication Critical patent/WO2018028214A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Definitions

  • This application relates generally to the field of circuit boards, and more particularly to LED circuit boards and LED applications. More specifically, the present application relates to an LED lamp strip circuit board module including a multifunctional aluminum foil.
  • LED lamp with circuit board The prior art circuit board, because aluminum can not be soldered, has not used cheap aluminum for the circuit, although the high-voltage lamp belt uses cheap aluminum wire to conduct electricity outside the circuit board, but this aluminum wire and line The conduction between the two is not the conduction of the solder, and is electrically connected one by one by winding the thin wires one by one, and the efficiency is low.
  • the LED strips are usually provided with a periodically set shear position, they are cut at the shear position as needed during use, in order to avoid short-circuiting of the cross-section of the cross-section, and to meet the resistance
  • the voltage safety regulations stipulate that the lamp strip circuit board has not been able to replace the expensive PI with a cheap aluminum foil as a cover film to protect the back circuit, and the lamp strip circuit board has not been able to use aluminum foil instead of PI as a substrate to make a high heat dissipation aluminum-based flexible board. It is then made into a high-heat-dissipation aluminum-based soft LED strip.
  • an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are proposed, which are laminated on a single-sided flexible circuit board by an adhesive using at least a copper back line.
  • the aluminum foil with a width larger than the back line is covered with a certain safe distance to cover the back line and wrap the back line.
  • the adhesive on both sides of the back line is firmly adhered, and the back line is closely attached to the middle contact, so that
  • the back wire and the aluminum foil are electrically conductive, which not only increases the current load capacity of the lamp strip circuit board, but also replaces the PI with the aluminum foil to protect the back line from falling off and is not easy to break, and the large-area aluminum foil is attached to the back of the circuit board to provide a good heat dissipation effect.
  • the soldering of the front side circuit and the back line of at least the surface of the copper at the tin-conducting hole are soldered, and the aluminum circuit, the back line and the front side circuit of the back side are electrically connected to each other, thereby solving the difficulty of the aluminum circuit on the strip.
  • the copper circuit is connected to the conduction problem.
  • an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are disclosed. Specifically, a back side of a single-sided flexible circuit board is glued, and a tin hole is punched out by a mold, and then on the back side.
  • the alignment is covered with a metal backing wire having at least a surface of a solder metal, which includes copper and a copper alloy, or a metal nickel-plated wire, or a metal tinned wire, or a metal-plated wire, or a metal-plated wire, or a copper clad aluminum wire or a copper clad iron wire, wherein the metal back wire is correspondingly disposed at a position of the tin guiding hole, and the metal back wire is exposed from a tin guiding hole on the front side of the single-sided flexible circuit board;
  • the strip of aluminum foil has a width larger than the width of the back line, and then covers the back line and covers the back line at a certain distance, and is adhered to the adhesive on both sides of the back line, and the back line is closely attached to the middle contact, so that The current load capacity of the lamp strip circuit board is increased, and the aluminum foil replaces the PI to protect the back line from falling off, which is not easy to break, and the large-area aluminum foil is attached to
  • the solder paste is also printed on the tin-conducting hole.
  • the tin at the tin-conducting hole will be soldered to the surface of the solder wire and the front side of the solder joint, or / and the component leg is firm. Soldered together, the aluminum foil on the back side, the metal back line, the front side circuit are electrically connected to each other, or after SMT, two or more single short welded parts of the lighted strip are welded to the strip.
  • the utility model relates to an LED lamp with a multi-function aluminum foil with a circuit board module.
  • the application solves the problem that the aluminum circuit on the lamp strip is difficult to connect with the copper surface circuit.
  • an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are provided, comprising: coating a back side of a single-sided flexible circuit board, punching a tin-conducting hole with a mold, and then aligning the back side A metal backing wire having at least a surface of a solder metal, including copper and copper alloy, or metal nickel plating, or metal tin plating, or metal silver plating, or metal gold plating, or copper clad aluminum, or copper.
  • the iron backing wire is correspondingly covered at the position of the tin guiding hole, and the metal backing wire is exposed from the tin guiding hole of the front side of the single-sided flexible circuit board;
  • the aluminum foil is divided into a plurality of aluminum foil strips, the width of which is larger than the back Line width, then keep a certain distance covering the back line and wrap the back line, and at the same time be glued by the adhesive on both sides of the back line, and the back line is clamped in the middle contact conduction, which not only increases the current load of the strip circuit board Capability, at the same time, the aluminum foil replaces the PI to protect the backing wire from falling off the film and is not easy to break, and the large-area aluminum foil is attached to the back of the circuit board to play a good heat dissipation effect; the SMT patch soldering component, while printing the solder paste, The solder paste is also printed on the tin hole.
  • the tin at the tin-conducting hole will be soldered to the surface of the solder wire with the surface of the solder wire, or/and the component leg is firmly soldered to the back side.
  • Aluminum foil, metal backing, frontal circuits are conductive to each other; and/or after SMT, two or more singles
  • tin is applied to the tin-conducting hole, and the solder joints of the front and back of the strip of the front and rear strips are soldered and connected, so that the front and back solders of the board are electrically connected to each other.
  • the aluminum foil, the metal back wire and the front circuit are electrically connected together; through the above method, an LED lamp strip circuit board module containing a multifunctional aluminum foil is prepared.
  • a LED lamp strip circuit board module comprising a multifunctional aluminum foil, comprising: a component layer; a front solder mask layer; a front wiring layer; an insulating film layer; an adhesive layer; a back layer; an electrically conductive aluminum foil a protective layer; a tin-conducting hole disposed on the front solder resist layer, the front wiring layer, the insulating film layer, and the adhesive layer; wherein the tin-conducting hole penetrates the front solder resist layer, the front wiring layer, the insulating film layer, and An adhesive layer; the backing line is a metal wire having at least a surface of a solderable metal, the solderable metal being copper or a copper alloy, or other metal having only a surface of copper or nickel or tin or silver or gold, and At least two or more juxtaposed arrays are adhered to the back side of the circuit board by the adhesive layer, and exposed from the side of the front solder resist layer at the tin-conducting hole
  • the front and back sides of the circuit are conductive, the metal back line and the front circuit solder joint are welded together by solder at the tin hole to form a conduction, or the solder hole is passed through the tin hole
  • the metal back wire and the front component legs are soldered together to form a conduction, or the component leg, the front circuit, and the metal back wire are simultaneously welded together to form a conduction.
  • the back aluminum foil and the back line and the front circuit are turned on together.
  • a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that the back line is a round wire, or a flat wire, or a stranded wire; When the back line is a flat line, the back line is formed by calendering or by metal cutting.
  • a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that the back line is a copper wire, or a copper clad aluminum wire, or a copper clad wire. Or copper clad zinc wire.
  • a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that a layer of ink is printed on an aluminum foil surface on the back side of the circuit board, or an insulating resin is applied. Or attach a layer of insulating film with glue to form the insulation between the aluminum foil and the aluminum foil, and between the aluminum foil and the outside.
  • a multi-function aluminum foil-containing LED lamp strip circuit board module is characterized in that, when a low-voltage lamp strip is fabricated, a double-sided tape is directly attached to the back surface of the circuit board to form an aluminum foil and Insulation between aluminum foil and aluminum foil and the outside world.
  • a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that, when a high-voltage lamp strip is fabricated, the circuit board has been in contact with the aluminum foil on the back side. And at least the surface of the easy-to-solder metal back line has formed a positive and negative lead.
  • a multi-function aluminum foil-containing LED lamp strip circuit board module is characterized in that the lamp strip circuit board is provided with a periodic shear position so that it can be in any shear position. Cut and use.
  • a multi-function aluminum foil-containing LED lamp with a circuit board module when the lamp strip is made by a module, is characterized in that a double-sided surface is directly attached to the back of the LED strip Apply glue to the front side, that is, the side of the LED component, apply double-sided tape on the back side, or wrap the LED light strip in the glue.
  • FIG. 1 is a schematic cross-sectional view of a flat wire having a round copper clad aluminum wire crimped copper wire of a certain width and thickness in accordance with a preferred embodiment of the present application.
  • FIG. 2 is a schematic plan view of an aluminum foil slit into a plurality of aluminum foil strips having a width greater than the back, in accordance with a preferred embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional view of a single-sided flexible circuit board in accordance with a preferred embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a back side of a single-sided flexible circuit board after being glued according to a preferred embodiment of the present application.
  • FIG. 5 is a schematic diagram of a single-sided flexible circuit board after being glued according to a preferred embodiment of the present application. Schematic diagram of the cross section after the tin hole.
  • FIG. 6 is a schematic plan view showing the position of the top wire corresponding to the tin-cord hole and the single-sided flexible circuit board, and the back line is exposed from the side of the front solder resist layer, according to a preferred embodiment of the present application.
  • FIG. 7 illustrates a cross-corresponding tin-cord hole in a position corresponding to a single-sided flexible circuit board according to a preferred embodiment of the present application, the back-line being exposed from the side of the front solder resist layer, and a cross section at the position of the tin-conducting hole Schematic (also a schematic cross-sectional view of Figure 6 at the position of the tin-conducting hole).
  • FIG. 8 is an aluminum foil strip having a width greater than a back line, covering a back line and enclosing the back line, and being coated on both sides of the back line by a single-sided flexible circuit board adhesive according to a preferred embodiment of the present application. Sticky, the cross-section of the backing wire is placed in the middle contact, and the cross-section of the position of the tin-conducting hole is shown.
  • FIG. 9 is an aluminum foil strip having a width greater than a back line, covering a back line and enclosing the back line, and being coated on both sides of the back line by an adhesive on a single-sided flexible circuit board, according to a preferred embodiment of the present application.
  • Figure 10 is a cross-sectional view showing the entire back surface of the wiring board uniformly printed with a layer of ink on the back side of the wiring board, i.e., the side of the aluminum foil, in accordance with a preferred embodiment of the present application.
  • FIG. 11 is a SMT chip soldering component according to a preferred embodiment of the present application, and the tin at the tin-conducting hole is welded to the surface of the solderable metal and the front surface solder joint, so that the aluminum foil on the back side, A schematic cross-sectional view of a metal backing wire and a front side circuit being electrically connected to each other.
  • FIG. 12 is a schematic view of a preferred embodiment of the present application, a soldering hole is disposed on a circuit board at a component foot position of the soldering component, and the tin at the tin guiding hole directly solders the component leg to the backing wire to make the back surface thereof
  • FIG. 13 is a schematic view of a preferred embodiment of the present application, a soldering hole is disposed on a circuit board at a portion of the component leg of the soldering component, and the tin at the tin guiding hole directly solders the component leg, the front side line, and the back line.
  • a schematic cross-sectional view of the aluminum foil, the metal backing wire, and the front side circuit of the back side being electrically connected to each other.
  • FIG. 14 is a cross-sectional view showing the aluminum circuit, the back line, and the front side circuit of the back side being electrically connected to each other by soldering the front side circuit and the back side wire through the soldering hole according to a preferred embodiment of the present application.
  • circuitry and “circuit”, “circuit board” and “circuit board”, are used interchangeably.
  • a round copper clad aluminum wire (1) is rolled into a flat wire of a certain width and thickness by a calender to form a copper backing line (1.1).
  • Aluminum foil production for conducting, heat conducting and protective layers as shown in Fig. 2, the aluminum foil (2) is slit into a plurality of strips (2.1) with a width larger than the back line (1.1). .
  • the side of the single-sided flexible circuit board with the adhesive (3.4) of the single-sided flexible circuit board which is rolled and fabricated with the copper-clad aluminum flat back line (1.1) and the glue-coated tin hole (3.5) The top line (1.1) is respectively aligned with the position of the tin-conducting hole (3.5) (as shown in FIG. 6 and FIG. 7), and then the aluminum foil strip (2.1) having a width larger than that of the back line is cut. Cover the backing line (1.1) with a certain distance on the laminating machine, and wrap the backing line (1.1).
  • the aluminum foil strip (2.1) is coated on both sides of the backing line (1.1) on the single-sided flexible circuit board (3.4).
  • the backing wire (1.1) is tightly sandwiched between the aluminum foil tape (2.1) and the single-sided flexible circuit board coated with the adhesive (3.4), so that the aluminum foil tape (2.1) is in contact with the back wire (1.1). Pass (as shown in Figure 8, Figure 9).
  • the entire back surface of the circuit board is uniformly printed with a layer of ink (4) between the aluminum foil tape (2.1) and the aluminum foil tape (2.1). And the aluminum foil tape (2.1) is insulated from the outside (as shown in Figure 10).
  • the circuit board after the OSP surface anti-oxidation treatment is slit and formed into a LED light strip circuit board containing multifunctional aluminum foil.
  • solder paste (5.1) is printed on the component pads of the LED lamp strip circuit board made of multi-functional aluminum foil, and the solder paste is also printed on the tin-conducting hole. (3.6), placement The LED (5) is on the solder paste (5.1), and then the LED (5) component is soldered by reflow soldering. At the same time, the solder paste (3.6) at the solder via hole is the back line (1.1) and the front side circuit of the solderable metal. (3.2) Firmly solder together, and make the aluminum foil (2.1), metal back wire (1.1) and front circuit (3.2) on the back side conductive together (as shown in Figure 11), and make LED with multi-function aluminum foil. Light strip circuit board module.
  • solder conduction structure at the tin-conducting hole can also be designed as a solder-conducting structure as shown in FIG. 12, and a solder-conducting hole is provided on the circuit board at a part of the component leg of the soldering component (5).
  • the solder at the tin hole (5.2) directly solders the component leg to the back wire (1.1), and the aluminum foil (2.1), the metal back wire (1.1), and the front circuit phase (3.2) on the back side are electrically connected to each other.
  • solder conduction structure at the tin-conducting hole can also be designed as a solder-conducting structure as shown in FIG. 13, and a solder-conducting hole is provided on the circuit board at a part of the component leg of the soldering component (5).
  • the solder at the tin hole (5.3) directly solders a part of the component leg (5), the front side line (3.2) and the back line (1.1), so that the aluminum foil, the metal back line, and the front side circuit of the back side are electrically connected to each other. together.
  • Figure 14 shows the soldering of the front side circuit (3.2) and the back side line (1.1) at the tin-conducting hole at the tin-conducting hole, so that the aluminum circuit (2.1) and the back line (1.1) on the back side are connected.
  • the front side circuits (3.2) are electrically connected to each other.
  • the utility model relates to a multi-functional aluminum foil-containing LED lamp strip circuit board module, which adopts an aluminum foil strip (2.1) on three sides to clamp at least a copper back line (1.1), and at the same time, through solder (3.6) in the lead tin
  • the front side circuit (3.2) and the back line (1.1) are welded and turned on at the hole (3.5), and the back line (1.1) is in contact with the aluminum foil strip (2.1), so that the aluminum foil strip (2.1) on the back side and the back line are provided.
  • the front side circuit (3.2) is electrically connected to each other, or/and a part of the element (5) is directly soldered to the back line (1.1) by solder at a part of the element foot of the over part, or a part of the element of the element (5) is directly connected.
  • the front line (3.2) and the back line (1.1) are welded together, so that the aluminum foil, the metal back line and the front side circuit of the back side are electrically connected to each other, and the aluminum circuit on the strip is difficult to be connected with the copper surface circuit.
  • the current load capacity of the lamp strip circuit board is increased, and the aluminum foil replaces the PI to protect the back line from falling off and is not easy to break, and the large-area aluminum foil is attached to the back side of the circuit board to provide a good heat dissipation effect.

Abstract

The present application relates to an LED light strip circuit board module comprising a multifunctional aluminum foil. In one embodiment, a single-sided flexible circuit board is coated with an adhesive on the rear side, a lead tin via is pierced using a die, then a metal back line of an easy-to-solder metal at least on the surface is laid on the rear side in alignment to the lead tin via, and the metal back line is exposed at the lead tin via on the front side of the single-sided flexible circuit board; multiple aluminum foil strips greater in width than the back line are laid at a certain interval on the back line, cover the back line, are glued by the adhesive on either side of the back line, and tightly sandwich the back line in the middle for contact connection; an SMT chip soldering component solders together the back line at the lead tin via and a front side circuit, thus allowing the aluminum foil on the rear side, the metal back line, the front side circuit to be connected with each other, and forming the LED light strip circuit board module having the multifunctional aluminum foil. The present application solves the difficulty of connecting an aluminum circuit to a copper-plated circuit on a light strip.

Description

一种含多功能铝箔的LED灯带线路板模组LED lamp with circuit board module with multifunctional aluminum foil
本申请要求享有申请日为2016年8月9日、申请人为王定峰的中国专利申请“一种含多功能铝箔制成的LED灯带线路板模组”(申请号为No.201620869597.8)的优先权,该专利申请的全部内容通过引用而结合于本申请中。This application claims the priority of the Chinese patent application "A LED lamp strip circuit board module made of multi-function aluminum foil" (application No. 201620869597.8) with the application date of August 9, 2016 and the applicant is Wang Dingfeng. The entire contents of this patent application are incorporated herein by reference.
技术领域Technical field
本申请大体上涉及线路板领域,具体涉及LED线路板及LED应用产品。更具体而言,本申请涉及含多功能铝箔的LED灯带线路板模组。This application relates generally to the field of circuit boards, and more particularly to LED circuit boards and LED applications. More specifically, the present application relates to an LED lamp strip circuit board module including a multifunctional aluminum foil.
背景技术Background technique
LED灯带线路板现有技术的线路板,因为铝无法焊锡,一直未用便宜的铝做电路,虽然高压灯带在线路板之外使用了便宜的铝线导电,但是此铝线和线路之间的导通也不是焊锡导通,是通过人工一个一个缠绕细导线导通的,效率低成本高。LED lamp with circuit board The prior art circuit board, because aluminum can not be soldered, has not used cheap aluminum for the circuit, although the high-voltage lamp belt uses cheap aluminum wire to conduct electricity outside the circuit board, but this aluminum wire and line The conduction between the two is not the conduction of the solder, and is electrically connected one by one by winding the thin wires one by one, and the efficiency is low.
另外,因LED灯带通常都是有周期性设置的剪切位,在使用时会根据需要在剪切位剪开使用,为避免剪切位剪开造成截面正负极短路,以及为了符合耐电压安规规定,所以灯带线路板一直无法用便宜的铝箔代替昂贵的PI做覆盖膜保护背面电路,灯带线路板也一直无法用铝箔代替PI做基材制作高散热的铝基柔性板,再制成高散热的铝基软性LED灯带。In addition, since the LED strips are usually provided with a periodically set shear position, they are cut at the shear position as needed during use, in order to avoid short-circuiting of the cross-section of the cross-section, and to meet the resistance The voltage safety regulations stipulate that the lamp strip circuit board has not been able to replace the expensive PI with a cheap aluminum foil as a cover film to protect the back circuit, and the lamp strip circuit board has not been able to use aluminum foil instead of PI as a substrate to make a high heat dissipation aluminum-based flexible board. It is then made into a high-heat-dissipation aluminum-based soft LED strip.
为了克服以上的缺陷的不足,根据本申请,提出了一种含多功能铝箔的LED灯带线路板模组及制造方法,采用至少表面是铜的背线通过胶粘剂覆合在单面柔性线路板的背面,再用宽度大于背线的铝箔保持一定的安全间距覆盖在背线上并包住背线,同时被背线两边的胶粘剂粘牢,将背线紧贴夹在中间接触导通,这样背线和铝箔一起导电,不仅增加了灯带线路板电流负载能力,同时铝箔替代PI起到了覆盖膜保护背线不脱落不易断裂,而且大面积铝箔贴于线路板背面起到了很好的散热作用,通过焊锡在导锡孔处将正面电路和至少表面是铜的背线焊接导通,使其背面的铝电路、背线、正面电路相互导通,解决了灯带上的铝电路很难和铜面电路连接导通问题。In order to overcome the above deficiencies, according to the present application, an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are proposed, which are laminated on a single-sided flexible circuit board by an adhesive using at least a copper back line. On the back side, the aluminum foil with a width larger than the back line is covered with a certain safe distance to cover the back line and wrap the back line. At the same time, the adhesive on both sides of the back line is firmly adhered, and the back line is closely attached to the middle contact, so that The back wire and the aluminum foil are electrically conductive, which not only increases the current load capacity of the lamp strip circuit board, but also replaces the PI with the aluminum foil to protect the back line from falling off and is not easy to break, and the large-area aluminum foil is attached to the back of the circuit board to provide a good heat dissipation effect. The soldering of the front side circuit and the back line of at least the surface of the copper at the tin-conducting hole are soldered, and the aluminum circuit, the back line and the front side circuit of the back side are electrically connected to each other, thereby solving the difficulty of the aluminum circuit on the strip. The copper circuit is connected to the conduction problem.
发明概要Summary of invention
根据本申请,公开了一种含多功能铝箔的LED灯带线路板模组及制造方法,具体而言,将单面软性电路板背面涂胶,用模具冲出导锡孔,然后在背面对位覆上至少表面是易焊锡金属的金属背线,所述易焊锡金属包括铜及铜合金、或者金属镀镍线、或者金属镀锡线、或者金属镀银线、或者金属镀金线、或者铜包铝线、或者铜包铁线,所述的金属背线对应覆在导锡孔位置处,金属背线从单面软性电路板正面的导锡孔处露出;将铝箔分切成多条铝箔带,其宽度大于背线宽度,然后保持一定间距覆盖在背线上并包住背线,同时被背线两边的胶粘剂粘牢,将背线紧贴夹在中间接触导通,这样不仅增加了灯带线路板电流负载能力,同时铝箔替代PI起到了覆盖膜保护背线不脱落不易断裂,而且大面积铝箔贴于线路板背面起到了很好的散热作用;SMT贴片焊接元件,印刷锡膏的同时,在导锡孔处也印刷锡膏,过回流焊焊接元件时,同时导锡孔处的锡将表面是易焊锡金属的背线与正面电路焊点、或者/和元件脚牢固焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起、或者是在SMT后,将两条或两条以上的单条短的已焊有元件的灯条焊接成长灯带时,在导锡孔处施加锡,在前后线路板灯条首尾接口处焊接接长的同时,将板的正反面焊锡导通连通,使铝箔、金属背线及正面电路导通在一起,制成含多功能铝箔的LED灯带线路板模组,本申请解决了灯带上的铝电路很难和铜面电路连接导通问题。According to the present application, an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are disclosed. Specifically, a back side of a single-sided flexible circuit board is glued, and a tin hole is punched out by a mold, and then on the back side. The alignment is covered with a metal backing wire having at least a surface of a solder metal, which includes copper and a copper alloy, or a metal nickel-plated wire, or a metal tinned wire, or a metal-plated wire, or a metal-plated wire, or a copper clad aluminum wire or a copper clad iron wire, wherein the metal back wire is correspondingly disposed at a position of the tin guiding hole, and the metal back wire is exposed from a tin guiding hole on the front side of the single-sided flexible circuit board; The strip of aluminum foil has a width larger than the width of the back line, and then covers the back line and covers the back line at a certain distance, and is adhered to the adhesive on both sides of the back line, and the back line is closely attached to the middle contact, so that The current load capacity of the lamp strip circuit board is increased, and the aluminum foil replaces the PI to protect the back line from falling off, which is not easy to break, and the large-area aluminum foil is attached to the back side of the circuit board to perform a good heat dissipation function; the SMT patch soldering component is printed. At the same time as the solder paste, the solder paste is also printed on the tin-conducting hole. When the soldering component is reflowed, the tin at the tin-conducting hole will be soldered to the surface of the solder wire and the front side of the solder joint, or / and the component leg is firm. Soldered together, the aluminum foil on the back side, the metal back line, the front side circuit are electrically connected to each other, or after SMT, two or more single short welded parts of the lighted strip are welded to the strip. At the same time, tin is applied at the tin-conducting hole, and the soldering and connecting ends of the front and rear wiring strips are welded, and the front and back solders of the board are electrically connected to each other, so that the aluminum foil, the metal backing line and the front side circuit are electrically connected together. The utility model relates to an LED lamp with a multi-function aluminum foil with a circuit board module. The application solves the problem that the aluminum circuit on the lamp strip is difficult to connect with the copper surface circuit.
根据本申请,提供了一种含多功能铝箔的LED灯带线路板模组及制造方法,包括:将单面软性电路板背面涂胶,用模具冲出导锡孔,然后在背面对位覆上至少表面是易焊锡金属的金属背线,所述易焊锡金属包括铜及铜合金、或者金属镀镍、或者金属镀锡、或者金属镀银、或者金属镀金、或者铜包铝、或者铜包铁,所述的金属背线对应覆在导锡孔位置处,金属背线从单面软性电路板正面的导锡孔处露出;将铝箔分切成多条铝箔带,其宽度大于背线宽度,然后保持一定间距覆盖在背线上并包住背线,同时被背线两边的胶粘剂粘牢,将背线紧贴夹在中间接触导通,这样不仅增加了灯带线路板电流负载能力,同时铝箔替代PI起到了覆盖膜保护背线不脱落不易断裂,而且大面积铝箔贴于线路板背面起到了很好的散热作用;SMT贴片焊接元件,印刷锡膏的同时,在导锡孔处也印刷锡膏,过回流焊焊接元件时,同时导锡孔处的锡将表面是易焊锡金属的背线与正面电路焊点、或者/和元件脚牢固焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起;和/或者是在SMT后,将两条或两条以上的单 条短的已焊有元件的灯条焊接成长灯带时,在导锡孔处施加锡,在前后线路板灯条首尾接口处焊接接长的同时,将板的正反面焊锡导通连通,使铝箔、金属背线及正面电路导通在一起;通过以上方法,即制成了含多功能铝箔的LED灯带线路板模组。According to the present application, an LED lamp strip circuit board module comprising a multifunctional aluminum foil and a manufacturing method thereof are provided, comprising: coating a back side of a single-sided flexible circuit board, punching a tin-conducting hole with a mold, and then aligning the back side A metal backing wire having at least a surface of a solder metal, including copper and copper alloy, or metal nickel plating, or metal tin plating, or metal silver plating, or metal gold plating, or copper clad aluminum, or copper. The iron backing wire is correspondingly covered at the position of the tin guiding hole, and the metal backing wire is exposed from the tin guiding hole of the front side of the single-sided flexible circuit board; the aluminum foil is divided into a plurality of aluminum foil strips, the width of which is larger than the back Line width, then keep a certain distance covering the back line and wrap the back line, and at the same time be glued by the adhesive on both sides of the back line, and the back line is clamped in the middle contact conduction, which not only increases the current load of the strip circuit board Capability, at the same time, the aluminum foil replaces the PI to protect the backing wire from falling off the film and is not easy to break, and the large-area aluminum foil is attached to the back of the circuit board to play a good heat dissipation effect; the SMT patch soldering component, while printing the solder paste, The solder paste is also printed on the tin hole. When the soldering component is reflowed, the tin at the tin-conducting hole will be soldered to the surface of the solder wire with the surface of the solder wire, or/and the component leg is firmly soldered to the back side. Aluminum foil, metal backing, frontal circuits are conductive to each other; and/or after SMT, two or more singles When a short strip of welded component light is soldered to the lamp strip, tin is applied to the tin-conducting hole, and the solder joints of the front and back of the strip of the front and rear strips are soldered and connected, so that the front and back solders of the board are electrically connected to each other. The aluminum foil, the metal back wire and the front circuit are electrically connected together; through the above method, an LED lamp strip circuit board module containing a multifunctional aluminum foil is prepared.
根据本申请,还提供了一种含多功能铝箔的LED灯带线路板模组,包括:元件层;正面阻焊层;正面线路层;绝缘膜层;胶粘剂层;背线层;导电导热铝箔保护层;设置在正面阻焊层、正面线路层、绝缘膜层和胶粘剂层上的导锡孔;其特征在于,所述的导锡孔贯通正面阻焊层、正面线路层、绝缘膜层和胶粘剂层;所述的背线是至少是表面是易焊锡金属的金属线,所述易焊锡金属是铜或铜合金、或者仅是表面是铜或镍或锡或银或金的其它金属,并且至少是二条或二条以上并置排列,被胶粘层对位粘贴在线路板背面,在导锡孔处从正面阻焊层那一面露出;所述的导电导热铝箔保护层,至少是二条或二条以上的铝箔,其宽度大于背线宽度,保持一定间距覆盖在背线上并包住背线,同时被背线两边的胶粘剂粘牢,将背线紧贴夹在中间并和背线紧密接触相互导通,并形成对背线的保护;正反两面电路导通,是在导锡孔处通过焊锡将金属背线和正面电路焊点焊接在一起形成导通、或者是在导锡孔处通过焊锡将金属背线和正面的元件脚焊接在一起形成导通、或者是将元件脚、正面电路、金属背线三个同时焊接在一起形成导通。最终实现背面铝箔及背线及正面电路的一起导通。According to the application, there is also provided a LED lamp strip circuit board module comprising a multifunctional aluminum foil, comprising: a component layer; a front solder mask layer; a front wiring layer; an insulating film layer; an adhesive layer; a back layer; an electrically conductive aluminum foil a protective layer; a tin-conducting hole disposed on the front solder resist layer, the front wiring layer, the insulating film layer, and the adhesive layer; wherein the tin-conducting hole penetrates the front solder resist layer, the front wiring layer, the insulating film layer, and An adhesive layer; the backing line is a metal wire having at least a surface of a solderable metal, the solderable metal being copper or a copper alloy, or other metal having only a surface of copper or nickel or tin or silver or gold, and At least two or more juxtaposed arrays are adhered to the back side of the circuit board by the adhesive layer, and exposed from the side of the front solder resist layer at the tin-conducting hole; the conductive and heat-conductive aluminum foil protective layer is at least two or two The above aluminum foil has a width larger than the width of the back line, and covers the back line and covers the back line at a certain interval, and is adhered to the adhesive on both sides of the back line, and the back line is closely clamped in the middle and closely in contact with the back line. guide And forming a protection for the back line; the front and back sides of the circuit are conductive, the metal back line and the front circuit solder joint are welded together by solder at the tin hole to form a conduction, or the solder hole is passed through the tin hole The metal back wire and the front component legs are soldered together to form a conduction, or the component leg, the front circuit, and the metal back wire are simultaneously welded together to form a conduction. Finally, the back aluminum foil and the back line and the front circuit are turned on together.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,所述背线是圆线、或扁平线、或绞合导线;所述背线是扁平线时,背线是压延形成的、或者是金属箔分切形成的。According to a preferred embodiment of the present application, a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that the back line is a round wire, or a flat wire, or a stranded wire; When the back line is a flat line, the back line is formed by calendering or by metal cutting.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,所述背线是铜线、或者铜包铝线、或者铜包铁线、或者铜包锌线。According to a preferred embodiment of the present application, a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that the back line is a copper wire, or a copper clad aluminum wire, or a copper clad wire. Or copper clad zinc wire.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,在线路板背面的铝箔面印刷一层油墨、或者施加一层绝缘树脂,或者贴上一层带胶的绝缘膜,形成铝箔与铝箔之间,以及铝箔与外界之间的绝缘。According to a preferred embodiment of the present application, a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that a layer of ink is printed on an aluminum foil surface on the back side of the circuit board, or an insulating resin is applied. Or attach a layer of insulating film with glue to form the insulation between the aluminum foil and the aluminum foil, and between the aluminum foil and the outside.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,制作低压灯带时,直接在线路板背面贴双面胶,形成铝箔与铝箔之间,以及铝箔与外界之间的绝缘。 According to a preferred embodiment of the present application, a multi-function aluminum foil-containing LED lamp strip circuit board module is characterized in that, when a low-voltage lamp strip is fabricated, a double-sided tape is directly attached to the back surface of the circuit board to form an aluminum foil and Insulation between aluminum foil and aluminum foil and the outside world.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,制作高压灯带时,线路板已在背面通过接触导通在一起的铝箔和至少表面是易焊锡金属背线已形成正、负极主导线。According to a preferred embodiment of the present application, a multi-functional aluminum foil-containing LED lamp strip circuit board module is characterized in that, when a high-voltage lamp strip is fabricated, the circuit board has been in contact with the aluminum foil on the back side. And at least the surface of the easy-to-solder metal back line has formed a positive and negative lead.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,灯带线路板设置有周期性剪切位,使得可在任意剪切位剪断使用。According to a preferred embodiment of the present application, a multi-function aluminum foil-containing LED lamp strip circuit board module is characterized in that the lamp strip circuit board is provided with a periodic shear position so that it can be in any shear position. Cut and use.
根据本申请的一个优选实施例,所述的一种含多功能铝箔的LED灯带线路板模组,当用模组制作灯带时,其特征在于,直接在LED灯带的背面贴双面胶、或者在正面,即LED元件的那一面施加防水胶,背面贴双面胶、或者采用包胶的方式将LED灯带包裹在胶里面。According to a preferred embodiment of the present application, a multi-function aluminum foil-containing LED lamp with a circuit board module, when the lamp strip is made by a module, is characterized in that a double-sided surface is directly attached to the back of the LED strip Apply glue to the front side, that is, the side of the LED component, apply double-sided tape on the back side, or wrap the LED light strip in the glue.
在以下对附图和具体实施方式的描述中,将阐述本申请的一个或多个实施例的细节。本申请的多个方面和优点将在以下说明中部分地阐述,或者可由该说明而显而易见,或者可通过实践本申请而获悉。In the following description of the drawings and specific embodiments, details of one or more embodiments of the present application are set forth. The aspects and advantages of the present invention are set forth in part in the description which follows,
附图的简要说明BRIEF DESCRIPTION OF THE DRAWINGS
结合在说明书中并构成说明书一部分的附图图示了本申请的实施例,并且与说明一起用于解释和说明本申请的原理和一些具体实施方案。The accompanying drawings, which are incorporated in FIG
本说明书中描述了针对本领域普通技术人员的本申请的完整而能够实施的公开,包括其优选实施方式,其中引用了附图,这些附图仅仅是为了图示和辅助描述具体实施例起见,而不具有任何限制性,并且附图中的尺寸并非严格按照比例绘制。The complete and exemplifying disclosure of the present application, including the preferred embodiments thereof, which are described in the specification of the claims Without any limitation, the dimensions in the drawings are not drawn to scale.
通过结合以下附图阅读本说明书,本申请的特征、目的和优点将变得更加显而易见,对附图的简要说明如下。The features, objects, and advantages of the present invention will become more apparent from the aspects of the appended claims.
图1为根据本申请一优选实施例的,将圆的铜包铝线压延铜线成一定宽度和厚度的扁平导线的截面示意图。1 is a schematic cross-sectional view of a flat wire having a round copper clad aluminum wire crimped copper wire of a certain width and thickness in accordance with a preferred embodiment of the present application.
图2为根据本申请一优选实施例的,将铝箔分切成多条宽度大于背的铝箔带的平面示意图。2 is a schematic plan view of an aluminum foil slit into a plurality of aluminum foil strips having a width greater than the back, in accordance with a preferred embodiment of the present application.
图3为根据本申请一优选实施例的,单面软性线路板的截面示意图。3 is a schematic cross-sectional view of a single-sided flexible circuit board in accordance with a preferred embodiment of the present application.
图4为根据本申请一优选实施例的,在单面软性线路板的背面涂胶后的截面示意图。4 is a schematic cross-sectional view of a back side of a single-sided flexible circuit board after being glued according to a preferred embodiment of the present application.
图5为根据本申请一优选实施例的,在涂胶后的单面软性线路板上冲出导 锡孔后的截面示意图。FIG. 5 is a schematic diagram of a single-sided flexible circuit board after being glued according to a preferred embodiment of the present application. Schematic diagram of the cross section after the tin hole.
图6为根据本申请一优选实施例的,背线对应导锡孔的位置与单面软性线路板贴在一起,背线从正面阻焊层那一面露出的平面示意图。FIG. 6 is a schematic plan view showing the position of the top wire corresponding to the tin-cord hole and the single-sided flexible circuit board, and the back line is exposed from the side of the front solder resist layer, according to a preferred embodiment of the present application.
图7为根据本申请一优选实施例的,背线对应导锡孔的位置与单面软性线路板贴在一起,背线从正面阻焊层那一面露出,在导锡孔位置处的截面示意图(也就是“图6”在导锡孔位置处的截面示意图)。FIG. 7 illustrates a cross-corresponding tin-cord hole in a position corresponding to a single-sided flexible circuit board according to a preferred embodiment of the present application, the back-line being exposed from the side of the front solder resist layer, and a cross section at the position of the tin-conducting hole Schematic (also a schematic cross-sectional view of Figure 6 at the position of the tin-conducting hole).
图8为根据本申请一优选实施例的,宽度大于背线的铝箔带,保持一定间距覆盖在背线上并包住背线,同时被背线两边的涂在单面软性线路板上胶粘剂粘牢,将背线紧贴夹在中间接触导通的,在导锡孔位置处的截面示意图。8 is an aluminum foil strip having a width greater than a back line, covering a back line and enclosing the back line, and being coated on both sides of the back line by a single-sided flexible circuit board adhesive according to a preferred embodiment of the present application. Sticky, the cross-section of the backing wire is placed in the middle contact, and the cross-section of the position of the tin-conducting hole is shown.
图9为根据本申请一优选实施例的,宽度大于背线的铝箔带,保持一定间距覆盖在背线上并包住背线,同时被背线两边的涂在单面软性线路板上胶粘剂粘牢的层间结构的截面示意图。FIG. 9 is an aluminum foil strip having a width greater than a back line, covering a back line and enclosing the back line, and being coated on both sides of the back line by an adhesive on a single-sided flexible circuit board, according to a preferred embodiment of the present application. A schematic cross-sectional view of a bonded interlayer structure.
图10为根据本申请一优选实施例的,在线路板背面,即铝箔的那一面上,将线路板的整个背面均匀印刷上一层油墨后的截面示意图。Figure 10 is a cross-sectional view showing the entire back surface of the wiring board uniformly printed with a layer of ink on the back side of the wiring board, i.e., the side of the aluminum foil, in accordance with a preferred embodiment of the present application.
图11为根据本申请一优选实施例的,SMT贴片焊接元件,同时导锡孔处的锡将表面是易焊锡金属的背线与正面电路焊点牢固焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起的截面示意图。11 is a SMT chip soldering component according to a preferred embodiment of the present application, and the tin at the tin-conducting hole is welded to the surface of the solderable metal and the front surface solder joint, so that the aluminum foil on the back side, A schematic cross-sectional view of a metal backing wire and a front side circuit being electrically connected to each other.
图12为根据本申请一优选实施例的,焊接元件的一部分元件脚位置处的线路板上设置有导锡孔,导锡孔处的锡直接将元件脚焊接在背线上,使其背面的铝箔、金属背线、正面电路相互导通在一起的截面示意图。12 is a schematic view of a preferred embodiment of the present application, a soldering hole is disposed on a circuit board at a component foot position of the soldering component, and the tin at the tin guiding hole directly solders the component leg to the backing wire to make the back surface thereof A schematic cross-sectional view of aluminum foil, metal backing, and front side circuits being electrically connected to each other.
图13为根据本申请一优选实施例的,焊接元件的一部分元件脚位置处的线路板上设置有导锡孔,导锡孔处的锡直接将元件脚、正面线路和背线焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起的截面示意图。FIG. 13 is a schematic view of a preferred embodiment of the present application, a soldering hole is disposed on a circuit board at a portion of the component leg of the soldering component, and the tin at the tin guiding hole directly solders the component leg, the front side line, and the back line. A schematic cross-sectional view of the aluminum foil, the metal backing wire, and the front side circuit of the back side being electrically connected to each other.
图14为根据本申请一优选实施例的,通过焊锡在导锡孔处将正面电路和背线焊接导通,使其背面的铝电路、背线、正面电路相互导通的截面示意图。FIG. 14 is a cross-sectional view showing the aluminum circuit, the back line, and the front side circuit of the back side being electrically connected to each other by soldering the front side circuit and the back side wire through the soldering hole according to a preferred embodiment of the present application.
优选实施例的详细描述Detailed description of the preferred embodiment
为了方便描述本申请,下现在将参考附图对本申请的多个优选实施例做出详细描述。For the convenience of the description of the present application, a plurality of preferred embodiments of the present application will now be described in detail with reference to the accompanying drawings.
但是本领域技术人员应当理解,以下所述仅仅是举例说明和描述一些优选实施方式,对本申请的权利要求不具有任何限制。本说明书中的实施例仅意图 解释本申请的原理和部分具体实施方案,而并非限制本申请的范围。本申请的可专利范围仅由权利要求书所限定。However, those skilled in the art should understand that the following description is merely illustrative of the preferred embodiments of the invention, and the claims are not limited. The embodiments in this specification are only intended The principles and some specific embodiments of the present application are explained, and are not intended to limit the scope of the application. The patentable scope of the application is limited only by the claims.
本领域的技术人员可以理解,本发明中的部分术语,比如“电路”和“线路”,“电路板”和“线路板”,可以互换使用。Those skilled in the art will appreciate that some of the terms in the present invention, such as "circuitry" and "circuit", "circuit board" and "circuit board", are used interchangeably.
1、背线的制作:如图1所示,用压延机将圆的铜包铝线(1)压延铜线成一定宽度和厚度的扁平导线,制作成表面是铜的背线(1.1)。1. Fabrication of the backing line: As shown in Fig. 1, a round copper clad aluminum wire (1) is rolled into a flat wire of a certain width and thickness by a calender to form a copper backing line (1.1).
2、起作导电、导热、保护层作用的铝箔制作:如图2所示,用分条机将铝箔(2)分条切割制作成多条宽度大于背线(1.1)的铝箔带(2.1)。2. Aluminum foil production for conducting, heat conducting and protective layers: as shown in Fig. 2, the aluminum foil (2) is slit into a plurality of strips (2.1) with a width larger than the back line (1.1). .
3、单面软性线路板的制作:采用单面板制作工艺,用软性的单面覆铜基材丝印线路油墨、烘烤固化、蚀刻线路、退除线路油墨、丝印阻焊、烘烤固化制作成单面软性电路板(如图3所示),在图3中,标识(3.1)为绝缘膜层、标识(3.2)为正面线路层、标识(3.3)为正面阻焊层,此工艺为传统工艺,在此不作细述。3, single-sided flexible circuit board production: using a single-panel manufacturing process, using a soft single-sided copper-clad substrate silk screen line ink, baking curing, etching lines, retreating line ink, silk screen soldering, baking curing Made into a single-sided flexible circuit board (as shown in Figure 3), in Figure 3, the mark (3.1) is the insulating film layer, the mark (3.2) is the front circuit layer, and the mark (3.3) is the front solder resist layer. The process is a traditional process and will not be described in detail herein.
4、将制作好的单面软性电路板,在电路板的背面绝缘膜(3.1)的那一面涂上一层胶(3.4)(如图4所示),预烘烤将胶里的溶剂挥发掉,然后用预先根据工程资料设计制作好的冲导锡孔模具冲切,冲出如图5所示的导锡孔(3.5),导锡孔(3.5)贯通正面阻焊层(3.3)、正面线路层(3.2)、绝缘膜层(3.3)和胶粘剂层(3.4)。4. Place the fabricated single-sided flexible circuit board on the side of the back insulation film (3.1) of the circuit board with a layer of glue (3.4) (as shown in Figure 4). Pre-bake the solvent in the glue. Volatilize, and then die-cut with a punched tin hole die designed and manufactured according to engineering data, punch out the tin-conducting hole (3.5) as shown in Figure 5, and lead-through hole (3.5) through the front solder mask (3.3) , front wiring layer (3.2), insulating film layer (3.3) and adhesive layer (3.4).
5、在覆合机上,将压延制作好的铜包铝扁平背线(1.1)与涂胶后冲好导锡孔(3.5)的单面软性电路板的涂有胶粘剂(3.4)的那一面,背线(1.1)分别对准导锡孔(3.5)的位置覆合在一起(如图6、图7所示),然后将分切好的宽度大于背线的铝箔带(2.1),在覆合机上保持一定间距覆盖在背线(1.1)上,并包住背线(1.1),铝箔带(2.1)同时被背线(1.1)两边的涂在单面软性线路板上胶粘剂(3.4)粘牢,将背线(1.1)紧贴夹在铝箔带(2.1)与单面软性电路板涂有胶粘剂(3.4)的中间,使其铝箔带(2.1)与背线(1.1)接触导通(如图8、图9所示)。5. On the laminating machine, the side of the single-sided flexible circuit board with the adhesive (3.4) of the single-sided flexible circuit board which is rolled and fabricated with the copper-clad aluminum flat back line (1.1) and the glue-coated tin hole (3.5) The top line (1.1) is respectively aligned with the position of the tin-conducting hole (3.5) (as shown in FIG. 6 and FIG. 7), and then the aluminum foil strip (2.1) having a width larger than that of the back line is cut. Cover the backing line (1.1) with a certain distance on the laminating machine, and wrap the backing line (1.1). The aluminum foil strip (2.1) is coated on both sides of the backing line (1.1) on the single-sided flexible circuit board (3.4). Adhesively, the backing wire (1.1) is tightly sandwiched between the aluminum foil tape (2.1) and the single-sided flexible circuit board coated with the adhesive (3.4), so that the aluminum foil tape (2.1) is in contact with the back wire (1.1). Pass (as shown in Figure 8, Figure 9).
6、在线路板背面,即铝箔带(2.1)的那一面上,将线路板的整个背面均匀印刷上一层油墨(4),使其铝箔带(2.1)与铝箔带(2.1)之间,以及铝箔带(2.1)与外界绝缘(如图10所示)。6. On the back side of the circuit board, that is, the side of the aluminum foil tape (2.1), the entire back surface of the circuit board is uniformly printed with a layer of ink (4) between the aluminum foil tape (2.1) and the aluminum foil tape (2.1). And the aluminum foil tape (2.1) is insulated from the outside (as shown in Figure 10).
7、对焊点进行OSP表面防氧化处理。7. Perform OSP surface oxidation treatment on the solder joints.
8、用外形分条分切机,将经过OSP表面防氧化处理后的线路板进行分条分切成形,制作成一种含多功能铝箔的LED灯带线路板。8. Using the shape slitting and slitting machine, the circuit board after the OSP surface anti-oxidation treatment is slit and formed into a LED light strip circuit board containing multifunctional aluminum foil.
9、采用传统的SMT贴片方式,在制作好的多功能铝箔制成的LED灯带线路板上的元件焊盘上印刷锡膏(5.1),同时,在导锡孔处也印刷上锡膏(3.6),贴装 LED(5)在锡膏(5.1)上,然后过回流焊焊接LED(5)元件时,同时导锡孔处的锡膏(3.6)将表面是易焊锡金属的背线(1.1)与正面电路(3.2)牢固焊接在一起,使其背面的铝箔(2.1)、金属背线(1.1)、正面电路(3.2)相互导通在一起(如图11所示),制成含多功能铝箔的LED灯带线路板模组。9. Using the traditional SMT patch method, solder paste (5.1) is printed on the component pads of the LED lamp strip circuit board made of multi-functional aluminum foil, and the solder paste is also printed on the tin-conducting hole. (3.6), placement The LED (5) is on the solder paste (5.1), and then the LED (5) component is soldered by reflow soldering. At the same time, the solder paste (3.6) at the solder via hole is the back line (1.1) and the front side circuit of the solderable metal. (3.2) Firmly solder together, and make the aluminum foil (2.1), metal back wire (1.1) and front circuit (3.2) on the back side conductive together (as shown in Figure 11), and make LED with multi-function aluminum foil. Light strip circuit board module.
当然,导锡孔处的焊锡导通结构方式,也可设计成如图12所示焊锡导通结构方式,焊接元件(5)的一部分元件脚位置处的线路板上设置有导锡孔,导锡孔处的焊锡(5.2)直接将元件脚焊接在背线(1.1)上,使其背面的铝箔(2.1)、金属背线(1.1)、正面电路相(3.2)互导通在一起。Of course, the solder conduction structure at the tin-conducting hole can also be designed as a solder-conducting structure as shown in FIG. 12, and a solder-conducting hole is provided on the circuit board at a part of the component leg of the soldering component (5). The solder at the tin hole (5.2) directly solders the component leg to the back wire (1.1), and the aluminum foil (2.1), the metal back wire (1.1), and the front circuit phase (3.2) on the back side are electrically connected to each other.
当然,导锡孔处的焊锡导通结构方式,还可以设计成如图13所示焊锡导通结构方式,焊接元件(5)的一部分元件脚位置处的线路板上设置有导锡孔,导锡孔处的焊锡(5.3)直接将元件(5)的一部分元件脚、正面线路(3.2)和背线(1.1)焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起。Of course, the solder conduction structure at the tin-conducting hole can also be designed as a solder-conducting structure as shown in FIG. 13, and a solder-conducting hole is provided on the circuit board at a part of the component leg of the soldering component (5). The solder at the tin hole (5.3) directly solders a part of the component leg (5), the front side line (3.2) and the back line (1.1), so that the aluminum foil, the metal back line, and the front side circuit of the back side are electrically connected to each other. together.
图14为在导锡孔处,通过焊锡(3.6)在导锡孔处将正面电路(3.2)和背线(1.1)焊接导通,使其背面的铝电路(2.1)、背线(1.1)、正面电路(3.2)相互导通在一起。Figure 14 shows the soldering of the front side circuit (3.2) and the back side line (1.1) at the tin-conducting hole at the tin-conducting hole, so that the aluminum circuit (2.1) and the back line (1.1) on the back side are connected. The front side circuits (3.2) are electrically connected to each other.
本申请的一种含多功能铝箔的LED灯带线路板模组,采用铝箔带(2.1)三面紧贴夹紧至少表面是铜的背线(1.1),同时,通过焊锡(3.6)在导锡孔(3.5)处将正面电路(3.2)和背线(1.1)焊接导通,背线(1.1)又与铝箔带(2.1)接触导通,这样使其背面的铝箔带(2.1)、背线(1.1)、正面电路(3.2)相互导通、或者/和在过元件的一部分元件脚处通过焊锡直接将元件脚焊接在背线(1.1)上、或者直接将元件(5)的一部分元件脚、正面线路(3.2)和背线(1.1)焊接在一起,使其背面的铝箔、金属背线、正面电路相互导通在一起,解决了灯带上的铝电路很难和铜面电路连接导通问题,增加了灯带线路板电流负载能力,同时铝箔替代PI起到了覆盖膜保护背线不脱落不易断裂,而且大面积铝箔贴于线路板背面起到了很好的散热作用。The utility model relates to a multi-functional aluminum foil-containing LED lamp strip circuit board module, which adopts an aluminum foil strip (2.1) on three sides to clamp at least a copper back line (1.1), and at the same time, through solder (3.6) in the lead tin The front side circuit (3.2) and the back line (1.1) are welded and turned on at the hole (3.5), and the back line (1.1) is in contact with the aluminum foil strip (2.1), so that the aluminum foil strip (2.1) on the back side and the back line are provided. (1.1), the front side circuit (3.2) is electrically connected to each other, or/and a part of the element (5) is directly soldered to the back line (1.1) by solder at a part of the element foot of the over part, or a part of the element of the element (5) is directly connected. The front line (3.2) and the back line (1.1) are welded together, so that the aluminum foil, the metal back line and the front side circuit of the back side are electrically connected to each other, and the aluminum circuit on the strip is difficult to be connected with the copper surface circuit. Through the problem, the current load capacity of the lamp strip circuit board is increased, and the aluminum foil replaces the PI to protect the back line from falling off and is not easy to break, and the large-area aluminum foil is attached to the back side of the circuit board to provide a good heat dissipation effect.
以上结合附图和一些优选实施例对本申请的含多功能铝箔的LED灯带线路板模组及其制作方法的具体实施例对本申请进行了详细的描述。但是,本领域技术人员应当理解,以上所述仅仅是举例说明和描述一些具体实施方式,对本申请的权利要求的范围并不具有任何限制。The present application has been described in detail with reference to the accompanying drawings and some preferred embodiments of a specific embodiment of the multifunction aluminum foil-containing LED lamp strip circuit board module of the present application and a manufacturing method thereof. However, those skilled in the art should understand that the above description is only illustrative of the specific embodiments, and the scope of the claims of the present application is not limited.
本领域的普通技术人员能够想到许多改型和变化。因此,应该理解的是所附权利要求书旨在覆盖落入本申请的实质性构思内的全部此类改型和变化。本申请的保护范围仅由所附权利要求书来限定。 Many modifications and variations will occur to those skilled in the art. Therefore, it is to be understood that the appended claims are intended to cover all such modifications and modifications The scope of protection of this application is to be limited only by the appended claims.

Claims (8)

  1. 一种含多功能铝箔的LED灯带线路板模组,包括:A LED lamp with circuit board module with multifunctional aluminum foil, comprising:
    元件层;Component layer
    正面阻焊层;Front solder mask;
    正面线路层;Front line layer;
    绝缘膜层;Insulating film layer;
    胶粘剂层;Adhesive layer
    背线层;Topline layer
    导电导热铝箔保护层;Conductive and thermal conductive aluminum foil protective layer;
    设置在正面阻焊层、正面线路层、绝缘膜层和胶粘剂层上的导锡孔;a tin-conducting hole provided on the front solder resist layer, the front wiring layer, the insulating film layer and the adhesive layer;
    其特征在于,所述的导锡孔贯通正面阻焊层、正面线路层、绝缘膜层和胶粘剂层;所述的背线是至少是表面是易焊锡金属的金属线,所述易焊锡金属是铜或铜合金、或者仅是表面是铜或镍或锡或银或金的其它金属,并且至少是二条或二条以上并置排列,被胶粘层对位粘贴在线路板背面,在导锡孔处从正面阻焊层那一面露出;所述的导电导热铝箔保护层,至少是二条或二条以上的铝箔,其宽度大于背线宽度,保持一定间距覆盖在背线上并包住背线,同时被背线两边的胶粘剂粘牢,将背线紧贴夹在中间并和背线紧密接触相互导通,并形成对背线的保护;The conductive tin is penetrated through the front solder mask, the front wiring layer, the insulating film layer and the adhesive layer; the back wire is a metal wire having at least a surface of a solderable metal, and the solderable metal is Copper or copper alloy, or only other metals whose surface is copper or nickel or tin or silver or gold, and at least two or more of them are juxtaposed, and are adhered to the back side of the circuit board by the adhesive layer. The conductive heat conductive aluminum foil protective layer is at least two or more aluminum foils, the width of which is greater than the width of the back line, and a certain distance is covered on the back line and encloses the back line. The adhesive on both sides of the back line is firmly adhered, and the back line is closely clamped in the middle and is in close contact with the back line to be mutually conductive, and the protection of the back line is formed;
    正反两面电路导通,是在导锡孔处通过焊锡将金属背线和正面电路焊点焊接在一起形成导通、或者是在导锡孔处通过焊锡将金属背线和正面的元件脚焊接在一起形成导通、或者是将元件脚、正面电路、金属背线三个同时焊接在一起形成导通,最终实现背面铝箔及背线及正面电路的一起导通。The positive and negative two-sided circuit is conductive, and the metal back wire and the front circuit solder joint are welded together at the tin-conducting hole to form a conduction, or the metal back wire and the front component leg are soldered by the solder at the tin-conducting hole. The conduction is formed together, or the component legs, the front circuit, and the metal back wire are simultaneously soldered together to form a conduction, and finally, the back aluminum foil and the back line and the front circuit are electrically connected together.
  2. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,所述背线是圆线、或扁平线、或绞合导线;所述背线是扁平线时,背线是压延形成的或者是金属箔分切形成的。The multifunction aluminum foil-containing LED lamp strip circuit board module according to claim 1, wherein the back line is a round line, or a flat line, or a stranded wire; the back line is a flat line When the back line is formed by calendering or by metal cutting.
  3. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,所述背线是铜线、或者铜包铝线、或者铜包铁线、或者铜包锌线。The LED lamp strip circuit board module with multifunctional aluminum foil according to claim 1, wherein the back line is copper wire, or copper clad aluminum wire, or copper clad wire, or copper clad zinc. line.
  4. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,在线路板背面的铝箔面印刷一层油墨、或者施加一层绝缘树脂,或者 贴上一层带胶的绝缘膜,形成铝箔与铝箔之间,以及铝箔与外界之间的绝缘。The LED lamp strip circuit board module comprising the multifunctional aluminum foil according to claim 1, wherein a layer of ink is printed on the surface of the aluminum foil on the back side of the circuit board, or an insulating resin is applied, or A layer of insulating film is applied to form an insulation between the aluminum foil and the aluminum foil, and between the aluminum foil and the outside.
  5. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,制作低压灯带时,直接在线路板背面贴双面胶,形成铝箔与铝箔之间,以及铝箔与外界之间的绝缘。The LED lamp strip circuit board module comprising the multifunctional aluminum foil according to claim 1, wherein when the low voltage lamp strip is made, the double-sided adhesive is directly attached on the back side of the circuit board to form an aluminum foil and an aluminum foil, and Insulation between the aluminum foil and the outside world.
  6. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,制作高压灯带时,线路板已在背面通过接触导通在一起的铝箔和至少表面是易焊锡金属背线已形成正、负极主导线。The LED lamp strip circuit board module with multifunctional aluminum foil according to claim 1, wherein when the high voltage lamp strip is made, the circuit board has been contacted by the aluminum foil on the back side and at least the surface is easy. The solder metal back line has formed a positive and negative lead line.
  7. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,其特征在于,灯带线路板设置有周期性剪切位,使得可在任意剪切位剪断使用。The LED lamp strip circuit board module with multifunctional aluminum foil according to claim 1, wherein the strip circuit board is provided with a periodic shearing position so that it can be cut and used at any shear position.
  8. 根据权利要求1所述的一种含多功能铝箔的LED灯带线路板模组,当用模组制作灯带时,其特征在于,直接在LED灯带的背面贴双面胶、或者在正面,即LED元件的那一面施加防水胶,背面贴双面胶、或者采用包胶的方式将LED灯带包裹在胶里面。 The LED lamp strip circuit board module with multifunctional aluminum foil according to claim 1, wherein when the lamp strip is made by the module, the feature is that the double-sided adhesive is directly attached to the back of the LED strip, or on the front side. That is, the side of the LED component is coated with a waterproof glue, the back side is coated with double-sided tape, or the LED light strip is wrapped in the glue by means of encapsulation.
PCT/CN2017/078711 2016-08-09 2017-03-30 Led light strip circuit board module comprising multifunctional aluminum foil WO2018028214A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201620869597.8U CN206100596U (en) 2016-08-09 2016-08-09 Contain LED lamp band wire way matrix group that multi -functional aluminium foil was made
CN201620869597.8 2016-08-09

Publications (1)

Publication Number Publication Date
WO2018028214A1 true WO2018028214A1 (en) 2018-02-15

Family

ID=58468289

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/078711 WO2018028214A1 (en) 2016-08-09 2017-03-30 Led light strip circuit board module comprising multifunctional aluminum foil

Country Status (2)

Country Link
CN (1) CN206100596U (en)
WO (1) WO2018028214A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110360476A (en) * 2018-04-10 2019-10-22 铜陵国展电子有限公司 A kind of LED light strip and preparation method thereof for making resistance of ink
CN111534795A (en) * 2020-06-10 2020-08-14 深圳市乐工新技术有限公司 Manufacturing method of nano alloy material, nano alloy material and electronic product
CN112576963A (en) * 2019-09-27 2021-03-30 王定锋 Discontinuously layered flexible laminated circuit board lamp strip and manufacturing method thereof
CN112576961A (en) * 2019-09-27 2021-03-30 王定锋 Assembled LED long lamp strip and manufacturing method
CN113531420A (en) * 2021-06-28 2021-10-22 中山市松普电器照明有限公司 Flexible LED lamp strip with rectifier bridge

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106413249A (en) * 2016-08-09 2017-02-15 王定锋 LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method
CN110446342A (en) * 2018-05-05 2019-11-12 铜陵国展电子有限公司 A kind of LED circuit board and preparation method thereof of strip resistance line

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273321A (en) * 2006-03-31 2007-10-18 Matsushita Electric Ind Co Ltd Method of manufacturing moving contact body
CN201549500U (en) * 2009-12-17 2010-08-11 李亚平 All-metal heat conducting double-sided radiating LED substrate
CN104039079A (en) * 2013-12-01 2014-09-10 吴祖 Integrated circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273321A (en) * 2006-03-31 2007-10-18 Matsushita Electric Ind Co Ltd Method of manufacturing moving contact body
CN201549500U (en) * 2009-12-17 2010-08-11 李亚平 All-metal heat conducting double-sided radiating LED substrate
CN104039079A (en) * 2013-12-01 2014-09-10 吴祖 Integrated circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110360476A (en) * 2018-04-10 2019-10-22 铜陵国展电子有限公司 A kind of LED light strip and preparation method thereof for making resistance of ink
CN112576963A (en) * 2019-09-27 2021-03-30 王定锋 Discontinuously layered flexible laminated circuit board lamp strip and manufacturing method thereof
CN112576961A (en) * 2019-09-27 2021-03-30 王定锋 Assembled LED long lamp strip and manufacturing method
CN111534795A (en) * 2020-06-10 2020-08-14 深圳市乐工新技术有限公司 Manufacturing method of nano alloy material, nano alloy material and electronic product
CN113531420A (en) * 2021-06-28 2021-10-22 中山市松普电器照明有限公司 Flexible LED lamp strip with rectifier bridge
CN113531420B (en) * 2021-06-28 2023-05-02 中山市松普电器照明有限公司 Flexible LED lamp strip with rectifier bridge

Also Published As

Publication number Publication date
CN206100596U (en) 2017-04-12

Similar Documents

Publication Publication Date Title
WO2018028214A1 (en) Led light strip circuit board module comprising multifunctional aluminum foil
WO2018028213A1 (en) Led strip circuit board module having multi-functional aluminum foil and manufacturing method
CN103188882B (en) A kind of circuit board and preparation method thereof
CN211059848U (en) assembled L ED long lamp area
TW201509257A (en) Flexible printed circuit board and method for manufacturing same
JP2014146650A (en) Wiring board and manufacturing method of the same
CN203072249U (en) Aluminum substrate used for mounting LED lamps
CN103237410A (en) Non-etched aluminum substrate and manufacturing method thereof
JP2011258433A (en) Method of manufacturing shield flat cable, and shield tape used for the manufacturing method
CN211821838U (en) Discontinuous layered flexible laminated circuit board lamp strip
WO2019086014A1 (en) Circuit board fabrication method by compositing metal foil circuit and wire circuit
WO2021057311A1 (en) Light strip having discontinuously layered flexible laminated circuit board, and manufacturing method
CN210519001U (en) Ultra-long flexible circuit board for LED lamp strip
WO2021057320A1 (en) Thick-metal led long lamp strip and manufacturing method
CN212381469U (en) Double-layer circuit board manufactured by combining single-layer circuit board on flat cable
JPS5930555Y2 (en) Printed board
CN109757039B (en) Circuit board of composite metal circuit and manufacturing method thereof
JP6617505B2 (en) Flat cable connection structure
CN215636663U (en) LED lamp area of easy multidirectional turn installation
CN217816310U (en) LED lamp area of winding displacement preparation
CN219372675U (en) PCB board and display screen of wire jumper structure
CN209748929U (en) Printed circuit board with diversified assembly
WO2021057321A1 (en) Discontinuously layered flexible lamination lamp strip circuit board and manufacturing method therefor
CN212381452U (en) Discontinuous layered flexible laminated lamp strip circuit board
CN214507470U (en) Flexible double-layer circuit board with protection circuit and lamp strip using same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17838346

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17838346

Country of ref document: EP

Kind code of ref document: A1