CN104039079A - Integrated circuit board - Google Patents
Integrated circuit board Download PDFInfo
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- CN104039079A CN104039079A CN201410220254.4A CN201410220254A CN104039079A CN 104039079 A CN104039079 A CN 104039079A CN 201410220254 A CN201410220254 A CN 201410220254A CN 104039079 A CN104039079 A CN 104039079A
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Abstract
An integrated circuit board comprises an insulation substrate layer, circuit layers and insulation protective layers are respectively and sequentially arranged on an upper surface and a lower surface of the insulation substrate layer, integrated circuits are formed on the circuit layers, a vertical conducting connection point is arranged between the integrated circuits of the circuit layers on the upper surface and the lower surface, both of the circuit layers on the upper surface and the lower surface are made of aluminum foils, a bonding pad is reserved at a position, at which an electronic element is required to be surface-mounted, on the integrated circuit of the circuit layer, a cladding layer which is electroplated with copper or nickel or coated with copper or nickel or a combination of copper and nickelis arranged at the bonding pad position, and a hollow window is formed at the insulation protective layer opposite to the bonding pad position. With the adoption of double-sided aluminum circuit layers, the integrated circuit board in which safe and effective signal transmission is realized, heat conduction and dissipation is achieved and the service life of the electronic element is longer is obtained, and a scheme that conduction between a surface-mounted electronic component of single-sided integrated circuit board of the aluminum integrated circuit layer and a surface-mounted electronic component of the double-sided aluminum integrated circuit board and conduction between two integrated circuit layers of the double-sized aluminum integrated circuit board is proposed.
Description
Technical field
The present invention relates to a kind of LED wiring board, more particularly, relate in particular to a kind of integrated circuit board.
Background technology
Well-known, the best several metals of electric conductivity are respectively silver, copper, gold, aluminium.Their resistivity is respectively silver-colored 1.586Lp2 × 10
-8Ω .m, copper 1.678Lp2 × 10
-8Ω .m, golden 2.4Lp2 × 10
-8Ω .m, aluminium 2.6548Lp2 × 10
-8Ω .m.In electron trade, particularly, in integrated circuit board industry, in the metal of above several electric conductivity the bests, gold with high costs and silver are seldom used in integrated circuit board industry, although the little cost of aluminium density is low, but because aluminium is very easily oxidized, generate aluminium oxide, and aluminium oxide is non-conductive, run in the opposite direction with the effect of integrated circuit board, the chemical characteristic of aluminium is also very unstable in addition, is easily corroded by acid or alkaline material, therefore aluminium is not used in integrated circuit board industry.
In the heat conduction function of metal, the conductive coefficient W/ (m*K) of each metal is respectively silver 429, copper 401, gold 317, aluminium 237.Because the quality of aluminium is light, low price, the factors such as sharp processing is convenient, and become the preferred material of heat abstractor, in the application of LED, the heat abstractor of most LED light fixtures all adopts aluminum to do, as replaced the bulb lamp of incandescent lamp, replace T5, the T8 fluorescent tube of fluorescent tube, the Ceiling light of replacement ceiling light and flat lamp etc.Its structure substantially all adopts reserved location on aluminium heat abstractor, processes screw hole, dress is posted to the integrated circuit board of LED lamp pearl, coats or paste adhesive-layer.First pre-determined bit is on aluminium heat abstractor, then stamp screw fixed position, in industry, also have and to change integrated circuit into PFC integrated circuit board, upper adhesive-layer is coated or pasted to the FPC integrated circuit board that dress is posted to LED lamp pearl, directly stick on aluminium heat abstractor, because the thermal coefficient of expansion (10E-6/K) of aluminium is 23, and the thermal coefficient of expansion of copper is 17.5, and the main material of FPC integrated circuit board is copper, adopt the LED light fixture of FPC integrated circuit board after through thermal expansion shrinkage several times, FPC soft integration circuit separates with aluminium heat abstractor, cause and cannot use.
In current LED industry, solve the heat dissipation problem of LED light fixture, reduce costs to reach family's usage level and make becoming more meticulous of LED light fixture, lighting is with further improving product practical value and further reduce product cost, and raising use popularity rate etc. are old is successively the problem that in industry, the utmost point need solve.
In order to solve the problem points of above several respects, adopt PFC integrated circuit board, to solve the lighting that becomes more meticulous of LED light fixture, lighting problem, adopt aluminum to make integrated circuit board, to solve, the coefficient of thermal expansion inconsistence problems of integrated circuit board and LED heat abstractor, reduce the use of copper simultaneously, reduce manufacturing cost.
As previously mentioned, because the chemical characteristic of aluminium is very unstable, and very easily produce nonconducting alumina layer, and carry out manufacturing integration wiring board as material with aluminium, the problem that must solve is how at the surface mounted electronic devices and components of aluminium with allow the conducting between layers of integrated circuit board.
Summary of the invention
The technical problem to be solved in the present invention is the above-mentioned deficiency for prior art, and two-sided use aluminum line layer is at the technique effect that ensures that under safety, effectively signal transmission and heat conduction, prerequisite heat radiation and useful life electronic devices and components, realization effectively reduces costs.The present invention proposes in the surface mounted electronic devices and components solution of two-sided integrated circuit board of aluminum integrated circuit layer and the conducting scheme of the two-layer integrated circuit layer of the two-sided integrated circuit board of aluminum.
Technical scheme of the present invention is such: a kind of integrated circuit board, comprise insulated base material layer, upper in insulated base material layer, lower surface sets gradually respectively line layer and insulating protective layer, on line layer, form integrated circuit, on, between the integrated circuit of the line layer of lower surface, be provided with the tie point of vertical conducting, wherein: the line layer of upper and lower surface all uses aluminium foil to make, the integrated circuit of line layer pastes the reserved pad position, position of electronics unit device at need dress, and on pad position, make the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, in pad position, right insulating protective layer place forms and reveals empty window.
Above-mentioned a kind of integrated circuit board, the integrated circuit surface integral of line layer is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, and pad position is in the optional position of integrated circuit, and insulating protective layer is formed on laminating layer outside.
Above-mentioned a kind of integrated circuit board, tie point is arranged in pad.
Above-mentioned a kind of integrated circuit board, the insulated base material layer that tie point is corresponding is provided with the via of the line layer that is communicated with upper and lower surface, the line layer of upper surface stretches downwards and contacts the line layer of lower surface along via, fills welding medium conducting in surface stretches the pit forming in the time that dress pastes electronic component.
Above-mentioned a kind of integrated circuit board, the line layer of the upper surface that tie point is corresponding and insulated base material layer are provided with the via of the line layer that is communicated with lower surface, fill welding medium conducting in via in the time that dress pastes electronic component.
Above-mentioned a kind of integrated circuit board, insulated base material layer is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, it is two-sided with adhesive-layer formation, or the adhesive-layer of pure tacky film forms, and the line layer of upper and lower surface is bonded as one by adhesive-layer.
Above-mentioned a kind of integrated circuit board, the line layer of via below downward-extension penetrates, the line layer of upper surface pulls down in the via of the line layer that extends lower surface, and its bottom is connected with the sidewalls contact of the line layer of lower surface.
Above-mentioned a kind of integrated circuit board, the line layer of upper surface adopts conductive solder technique welding after via stretches the line layer of contact lower surface downwards.
Above-mentioned a kind of integrated circuit board, the upper surface line layer bottom that stretches downwards forms the via riveting of the line layer of die and lower surface.
Above-mentioned a kind of integrated circuit board, the line layer of the upper surface relative with via is provided with the perforate less than the via aperture of insulating barrier, and edge, the hole via of perforate stretches downwards and contacts the line layer of lower surface.
Above-mentioned a kind of integrated circuit board, is provided with one deck conductive viscose layer or conductive solder layer along via wall, and conductive viscose layer or conductive solder layer are that ring is all covered with or part making in whole via.Realize via wall and effectively connect the upper line layer stretching along via downwards.By being communicated with the space forming along upper line layer and the lower line layer of via stretching downwards after heating, can increase conducting sectional area and realize the better technique effect of conduction.Conductive solder layer by spending in the condition of heating 180～280 make it fused while spending and be integrated, when making physical contact conducting, realize the technique effect of sealing conducting.
Above-mentioned a kind of integrated circuit board, integrated circuit board gross thickness is below 800 microns; Wherein adhesive layer thickness is 6 microns～150 microns, and thickness of insulating layer is 10 microns～400 microns, and upper strata integrated circuit layer thickness is 6 microns～150 microns, 6 microns～400 microns, lower floor's integrated circuit layer.
Above-mentioned a kind of integrated circuit board, conductive solder technique is tin cream welding or laser welding or ultrasonic bonding.
Adopt the invention of technique scheme, insulating barrier by double-sided belt adhesive-layer and top and bottom thereof are bonded as respectively the line layer of the upper and lower surface of one by adhesive layer, wherein the line layer of upper and lower surface all adopts aluminium, on the integrated circuit that aluminium is made, need dress to paste the laminating layer of copper facing on electronics unit device position or nickel plating or coated copper or coated nickel or its combination, realize on integrated circuit board can two-sided use aluminium and solve simultaneously problem be how at the surface mounted electronic devices and components of aluminium with allow the technical problem of conducting between layers of integrated circuit board.The aluminium of its two-sided use can meet the carrier that power supply and signal transmission and heat conduction require, and make the effectively conducting of two-sided aluminium, realize effective cost-effective technique effect by adopting aluminium to realize to there is good heat-conducting effect and make the aluminium of two-sided use fully meet instructions for use when.Wherein, the insulating barrier of double-sided belt adhesive-layer is offered via, by making line layer line layer physical contact conducting with lower surface along via stretching downwards of upper surface.Effectively the upper and lower surface of conducting production method can enhance productivity, reduce energy resource consumption, strengthen electric conductivity.And then in surface stretches the pit forming, utilize at dress and paste and fill welding medium conducting when electronic component and allow upper and lower line layer together with electronic component permanent weld, form permanent conducting body, and then produce the integrated circuit board that conduction property is sound.Effectively extend the useful life of wiring board.The LED lamp band that the present invention is specially adapted to flexible circuit uses.The present invention adopts PFC integrated circuit board, to solve the lighting that becomes more meticulous of LED light fixture, lighting problem, adopt aluminum to make integrated circuit board, to solve, the coefficient of thermal expansion inconsistence problems of integrated circuit board and LED heat abstractor, reduce the use of copper simultaneously, reduce manufacturing cost.
The basic structure procedure of processing of integrated circuit board of the present invention is: upper and lower surface laminating aluminium foil respectively process via on the insulating barrier of double-sided belt adhesive-layer after, make after process circuit at two sides integrated circuit by known method in industry, make copper facing or nickel plating or coated copper or coated nickel in the position of need welding electronics unit device or it is in conjunction with the pad forming.Then make insulating protective layer at the line layer outer surface except pad locations, insulating protective layer forms and reveals empty window for welding electronics unit device in pad locations.Making copper facing or nickel plating or coated copper or coated nickel or its operation in conjunction with the pad forming can make after the operation of line layer outer surface making insulating protective layer.Its fabrication processing can be reduced to: insulating sticky glue-line is processed via, and-----------------------wireline inspection-----is made copper facing or nickel plating or-----insulating protective layer processing-----mark the processing-----moulding of coated copper or coated nickel or its pad in conjunction with formation to traditional printing ink to manufacture integrated circuit figure to hot pressing to insulating sticky glue-line cladded aluminum foil at two-sides in the position of need welding electronics unit device in corrosion.The surface of the integrated circuit of the line layer in above-mentioned steps also can whole installation copper facing or the laminating layer of nickel plating or coated copper or coated nickel or its combination, and pad is in the optional position of laminating layer.In above-mentioned steps, adopt manufacturing before operation can be arranged in printing ink to manufacture integrated graphics operation of the coated nickel of aluminium copper facing or aluminium nickel plating or aluminium coated copper or aluminium to make; or make before insulating protective layer manufacturing procedure or after insulating protective layer manufacturing procedure; or make after mark manufacturing procedure, there is the strong effect of flexibility.Above-mentioned copper facing, nickel plating process is to adopt the technique of chemical plating to make, and reduces the use of traditional electrical depositing process.
Concrete scheme of the present invention is as follows:
(1) line layer in above-mentioned integrated circuit board is owing to being two-sided employing aluminium foil, and the pad that the link tester of the aluminium foil line layer of upper surface is crossed aluminium copper facing or aluminium nickel plating or aluminium coated copper or the coated nickel making of aluminium pastes with the electronic devices and components dress that meets integrated circuit as electronic devices and components dress veneer.In the time of the circuit integral manufacturing aluminium copper facing of line layer or aluminium nickel plating or aluminium coated copper or the coated nickel of aluminium, pad can be in the optional position of laminating layer.
(2) above-mentioned integrated circuit board adopts the integrated circuit layer that aluminium foil is made, and is to play transmission of electricity and signal transmission and two functions of heat conduction simultaneously.
(3) above-mentioned integrated circuit board is not if needed heat conduction function, and its function is also complete and effective.
(4) in above-mentioned integrated circuit board, via is formed on the line layer of insulated base material layer and lower surface, the line layer of upper surface along via stretch downwards, its side wall surface forms contact conducting, the via riveting that forms the line layer of die and lower surface after the lower surface of line layer of lower surface can slightly be stretched out in its bottom.
(5) in above-mentioned integrated circuit board, the aperture of the perforate of the line layer of upper surface is less than the aperture of the via of insulated base material layer, in the time making base material, to play the effect of air guide and upper and lower two-layer physical contact conducting, computational methods: the radius that the perforate radius of the line layer of upper surface is less than insulating barrier via deducts the thickness of substrate layer, and (thickness of setting insulating barrier is A, the via radius of substrate layer is B, the perforate of the line layer of upper surface is C, C<B-A) radius of line layer perforate of upper surface just can as long as can meet the condition of " C<B-A " that exemplify above, its size just can be selected according to the adhesive property of selected insulated base material layer, without fixing requirement, if the perforate of the line layer of insulating layer perforating and upper surface is non-circular, perforate size can meet the above condition that exemplifies, make, the line layer of lower surface can contact conducting and just can.
(6) the conducting method of its upper and lower two-layer line layer in above-mentioned integrated circuit board can also be to allow the line layer extrusion outside wall surface of upper surface be bonded together and be formed conducting body by the line layer of conductive viscose and lower surface at interior orifice ring or inner hole wall making one deck conductive viscose layer of via.Conductive viscose layer can all be covered with by the interior ring of whole insulating barrier via, can be also that part is made conductive viscose, only need meet function needs and just can.
(7), in above-mentioned integrated circuit board, the upper and lower two-layer line layer of the conducting that contacts can be formed and is permanently fixed conducting by the method for welding, can adopt laser welding or ultrasonic bonding.Conductive solder technique in the time arranging as tin cream conductive viscose layer is therebetween tin cream welding.
(8) above-mentioned integrated circuit board, described insulated base material layer is the material such as the two-sided glass fabric with adhesive-layer or polyimide film or polycarbonate film or polyester film or pottery.
(9) insulated base material layer described in above-mentioned integrated circuit board can be not also to be with the pure tacky film of glass fabric or polyimide film or polycarbonate film or polyester film etc.
(10) adhesive layer on the insulating barrier two sides described in above-mentioned integrated circuit board or pure tacky film insulating barrier, can be heat conduction, can be also athermanous, and its conductive coefficient can be determined according to corresponding requirement of circuit board.
(11) line layer of upper surface can be also perforate at via place, it is little that Yao Bi upper strata, the aperture integrated circuit of perforate is led passing hole exterior open cell, it can fill soldering paste after connecing the line layer of stretching contact lower surface downwards in the pit of its formation, play the line layer on the upper and lower surface of sealing and form contact point, becoming permanent conducting body.
(12) welding medium of filling in the pit that forms when the line layer of upper surface stretches the line layer of contact lower surface downwards along via can be to be pre-charged with or to fill in the time that dress pastes electronic component, realizes the object of saving operation and disposable conducting and sealing and form permanent conduction.
(13) protective layer of the outer surface of the line layer on upper and lower surface can be diaphragm type, can be also dielectric ink, the materials such as paint and pure glue glued membrane.
(14) protective layer of the line layer outer surface on upper and lower surface, mentioned diaphragm, dielectric ink, paint, pure glued membrane etc., can be heat-conducting type, can be also non-heat-conducting type, its conductive coefficient can be set because of the requirement of integrated circuit board.
(15) protective layer of the line layer outer surface on upper and lower surface, mentioned diaphragm, its material can be polyimide film, can be also that poly-carbonic acid film can be also polyester film etc.
(16) above-mentioned integrated circuit board, it is a group or more less that the circuit of making on the line layer of upper surface or the line layer of lower surface causes.Every group of integrated circuit comprises respectively positive pole and negative pole.
(17) its preferred gross thickness of above-mentioned integrated circuit board is below 800 microns, more superior for the flexible circuit board of 400 microns of following gross thickness.
(18) the adhesive layer thickness of above-mentioned double-sided wiring board can be 6 microns～150 microns, is preferably 10 microns～100 microns.
(19) thickness of insulating layer of above-mentioned integrated circuit board is 10 microns～400 microns, is preferably 10 microns～250 microns;
(20) the aluminium foil line layer above of above-mentioned integrated circuit board and the thickness of copper facing aluminium foil or nickel plating aluminium foil or coated copper aluminium foil or coated nickel aluminium foil are 6 microns～150 microns, are preferably 10 microns～75 microns.
(21) thickness of the aluminium foil line layer below above-mentioned integrated circuit board is 6 microns～400 microns, is preferably 10 microns～300 microns.
(22) the upper line layer perforate described in above-mentioned integrated circuit board is less than base material via, and after base material pressing, upper line layer can form conducting in lower line layer physical property contact.
(23) above-mentioned integrated circuit board can increase line layer and forms the wiring board more than two-layer on the basis of two sandwich circuit boards forming on the line layer of upper surface line layer or lower surface; relative set insulating barrier between the line layer of corresponding increase and basic line layer, its protective layer is formed on corresponding outer surface.
The present invention is compared with traditional integrated circuit board, the operation of calculating traditional integrated circuit board needs by manufacture method in common knowledge in industry is 17 large basic operations, and heat-conducting type double sided board of the present invention only needs eight basic operations, greatly save the production time.In addition, traditional double-sided wiring board, also must use electroplating technology, and environment is caused damage, while making integrated circuit layer, also must use dry film imaging, cost costliness, and this double-sided wiring board, its operation is simplified, there is no electroplating technology, do not use dry film imaging, saved time and cost, reduce the destruction to environment.
Brief description of the drawings
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but do not form any limitation of the invention.
Cross-sectional view when Fig. 1 is the specific embodiment of the invention 1 encapsulation state;
Fig. 2 is the cross-sectional view after the specific embodiment of the invention 1 has encapsulated;
Cross-sectional view when Fig. 3 is the specific embodiment of the invention 2 encapsulation state;
Fig. 4 is the cross-sectional view after the specific embodiment of the invention 2 has encapsulated;
Cross-sectional view when Fig. 5 is the specific embodiment of the invention 2 further improvement project encapsulation state;
Cross-sectional view when Fig. 6 is the specific embodiment of the invention 3 encapsulation state;
Cross-sectional view when Fig. 7 is the specific embodiment of the invention 4 encapsulation state;
Fig. 8 is the cross-sectional view after the further improvement project of the specific embodiment of the invention 3 has encapsulated;
Cross-sectional view when Fig. 9 is the specific embodiment of the invention 4 encapsulation state;
Figure 10 is the cross-sectional view after the specific embodiment of the invention 5 has encapsulated;
Figure 11 is the structural representation of specific embodiment of the invention 1-5 upper surface.
In figure: insulated base material layer 1, via 11, line layer 2, pad 21, pit 22, die 23, insulating protective layer 3, electronics unit device 4, welding medium 5.
Embodiment
Embodiment 1, as shown in Fig. 1～2, the two-sided integrated circuit board of one of the present invention, comprise insulated base material layer 1, upper in insulated base material layer 1, lower surface sets gradually respectively line layer 2 and insulating protective layer 3, one group of integrated circuit of each formation on line layer 2, on, between the integrated circuit of the line layer 2 of lower surface, be provided with the tie point of vertical conducting, the line layer 2 of upper and lower surface all uses aluminium foil to make, the integrated circuit of line layer 2 pastes the reserved pad position, position of electronics unit device at need dress, and on pad position, make the laminating layer 21 of copper facing or nickel plating or coated copper or coated nickel or its combination, in pad position, right insulating protective layer 3 places form and reveal empty window 31.Tie point is arranged on pad position central part.The line layer 2 of the upper surface that tie point is corresponding and insulated base material layer 1 are provided with the via 11 of the line layer 2 that is communicated with lower surface, fill welding medium 5 conductings in via 11 in the time that dress pastes electronic component.Insulated base material layer 1 is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, and it is two-sided with adhesive-layer formation, or the adhesive-layer of pure tacky film forms, and the line layer 2 of upper and lower surface is bonded as one by adhesive-layer.
Embodiment 2, as shown in Fig. 3～4, the insulated base material layer 1 that tie point is corresponding is provided with the via 11 of the line layer 2 that is communicated with upper and lower surface, the line layer 2 of upper surface stretches downwards and contacts the line layer 2 of lower surface along via 11, fills welding medium conducting in surface stretches the pit 22 forming in the time that dress pastes electronic component.
In embodiment 1 or 2, the integral surface of the integrated circuit of line layer 2 is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination, and pad position is in the optional position of integrated circuit, and insulating protective layer 3 is formed on laminating layer outside.
Embodiment 3, as shown in Figure 6, on the basis of embodiment 1 or 2, the line layer 3 of the upper surface relative with via 11 is provided with the perforate 31 less than the via aperture of insulating barrier, and edge, the hole via 11 of perforate stretches downwards and contacts the line layer of lower surface.
Embodiment 4, as shown in Figure 7, on the basis of embodiment 2, the line layer 3 of via 11 below downward-extension penetrates, the line layer 2 of upper surface pulls down in the via 11 of the line layer 2 that extends lower surface, and its bottom is connected with via 11 sidewall contacts of the line layer 2 of lower surface.
Embodiment 5, as shown in Figure 9, Figure 10, on the basis of embodiment 4, upper surface line layer 2 downward stretching bottoms form via 11 rivetings of the line layer 2 of die 23 and lower surface.
On the basis of embodiment 1 or 2 or 3, the line layer 2 of upper surface stretches downwards and contacts the rear employing conductive solder of the line layer 2 technique welding of lower surface along via 11.Conductive solder technique is laser welding or ultrasonic bonding.
As shown in Figure 5 and Figure 8, on the basis of embodiment 3 or 4, be provided with one deck conductive viscose layer 12 or conductive solder layer along via 11 walls, conductive viscose layer 12 or conductive solder layer are that ring is all covered with or part making in whole via.Conductive solder technique is tin cream welding.
The gross thickness of the integrated circuit board of above-described embodiment is below 800 microns; Wherein adhesive layer thickness is 6 microns～150 microns, and thickness of insulating layer is 10 microns～400 microns, and upper strata integrated circuit layer thickness is 6 microns～150 microns, 6 microns～400 microns, lower floor's integrated circuit layer.
On the basis of two sandwich circuit boards of above-described embodiment, on the line layer of upper surface line layer or lower surface, can increase line layer and form the wiring board more than two-layer; relative set insulating barrier between the line layer of corresponding increase and basic line layer, its protective layer is formed on corresponding outer surface.
The present invention is at concrete production stage:
(1), according to the design data of double-sided wiring board, on insulating material 1, adopt digital control drilling machine to get out location and via 11;
(2) adopt same data to get out location hole on the aluminium foil 2 of top and bottom;
(3) will bore the insulating material 1 of via and bore the aluminium foil 2 of location hole, location is placed on pressing and forming on traditional pressing machine or fast press in order, its pressing condition is: pressure is 120KG/CM, temperature is 180 DEG C ± 10 DEG C, pressing time is 30～80 seconds, and after pressing, condition of cure is 165 DEG C ± 10 DEG C X60min
(4), according to the design data of double-sided wiring board, adopt institute's well-known process integrated circuit in industry;
(5) according to the design data of double-sided wiring board and location hole at the laminating protective layer of outer surface of double-deck integrated circuit layer, form and reveal empty window at right insulating protective layer 3 places of pad locations.Pressure is 120KG/CM, and temperature is 180 DEG C ± 10 DEG C, and pressing time is 30～80 seconds, and after pressing, condition of cure is 165 DEG C ± 10 DEG C X60min.
(6) make copper facing or nickel plating or coated copper or coated nickel or its pad 21 in conjunction with formation;
(7) reference lamina of double-sided wiring board is made;
(8) moulding of double-sided wiring board, shipment.
Material selection:
(1) selecting gross thickness is 75 microns, two-sided respectively with self thickness of 25 micron thickness adhesive layers be the polyimide film of 25 microns as insulating material, bore location hole and via, via diameter is 1000 microns;
(2) to select thickness be 35 microns for aluminium foil above, bores the perforate at location hole and via place according to design data, and the opening diameter at via place is 600 microns;
(3) aluminium foil below select thickness be 150 microns with bore the polyimide film of via and the aluminium foil of 35 microns and on pressing machine, locate pressing, condition is: pressure is that 120KG/CM temperature is 185 DEG C, time is 60 seconds, and pressing rear curing time is 165 DEG C of X60min;
(4) by the clean base material good pressing rear rust-proof oil ink print two sides integrated circuit that adopts;
(5) integrated circuit corrosion;
(6) computer test of integrated circuit;
(7) the laminating polyimide type diaphragm of integrated circuit two sides appearance, condition is: pressure is 120KG/CM, and temperature is 180 DEG C, and the time is 60 seconds, and condition of cure is 165 DEG C of X60min;
(8) make copper facing or nickel plating or coated copper or coated nickel or its pad 21 in conjunction with formation;
(9) make character marking;
(10) integrated circuit sheet metal forming.
From finding out for example above, traditional LED lamp band (integrated circuit board), calculates by manufacture method in common knowledge in industry, and its operation needing is 17 large basic operations, and this Novel heat-conducting type double sided board only needs eight basic operations, greatly save the production time.In addition, traditional double-sided wiring board, also must use electroplating technology, and environment is caused damage, while making integrated circuit layer, also must use dry film imaging, cost costliness, and this integrated circuit board, its operation is simplified, there is no electroplating technology, do not use dry film imaging, saved time and cost, reduce the destruction to environment.
In sum, the present invention is as specification and diagramatic content, makes actual sample and through repeatedly use test, from the effect of use test, provable the present invention can reach the object that it is expected, practical value is unquestionable.Above illustrated embodiment is only used for conveniently illustrating the present invention, not the present invention is done to any pro forma restriction, under any, in technical field, have and conventionally know the knowledgeable, if not departing from the scope of technical characterictic that the present invention carries, utilize disclosed technology contents to do the local equivalent embodiment that changes or modify, and do not depart from technical characterictic content of the present invention, all still belong in the scope of the technology of the present invention feature.
Claims (13)
1. an integrated circuit board, comprise insulated base material layer (1), upper in insulated base material layer (1), lower surface sets gradually respectively line layer (2) and insulating protective layer (3), at the upper integrated circuit that forms of line layer (2), on, between the integrated circuit of the line layer (2) of lower surface, be provided with the tie point of vertical conducting, it is characterized in that: the line layer (2) of upper and lower surface all uses aluminium foil to make, the integrated circuit of line layer (2) pastes the reserved pad position, position of electronics unit device at need dress, and laminating layer (21) on pad position, making copper facing or nickel plating or coated copper or coated nickel or its combination, locate to form the empty window (31) of dew at the right insulating protective layer in pad position (3).
2. a kind of integrated circuit board according to claim 1; it is characterized in that: the integral surface of the integrated circuit of line layer (2) is provided with the laminating layer of copper facing or nickel plating or coated copper or coated nickel or its combination; pad position is in the optional position of integrated circuit, and insulating protective layer (3) is formed on laminating layer outside.
3. a kind of integrated circuit board according to claim 1, is characterized in that: tie point is arranged in pad position.
4. a kind of integrated circuit board according to claim 3, it is characterized in that: the insulated base material layer (1) that tie point is corresponding is provided with the via (11) of the line layer (2) that is communicated with upper and lower surface, the line layer (2) of upper surface stretches downwards and contacts the line layer (2) of lower surface along via (11), fills welding medium conducting in surface stretches the pit forming in the time that dress pastes electronic component.
5. a kind of integrated circuit board according to claim 3, it is characterized in that: the line layer (2) of the upper surface that tie point is corresponding and insulated base material layer (1) are provided with the via (11) of the line layer (2) that is communicated with lower surface, in via (11), in the time that dress pastes electronic component, fill welding medium conducting.
6. a kind of integrated circuit board according to claim 1, it is characterized in that: insulated base material layer (1) is glass fabric or polyimide film or polycarbonate film or polyester film or ceramic material, it is two-sided forms with adhesive-layer, or the adhesive-layer of pure tacky film forms, the line layer (2) of upper and lower surface is bonded as one by adhesive-layer.
7. a kind of integrated circuit board according to claim 4, it is characterized in that: the line layer (2) of via (11) below downward-extension penetrates, the line layer (2) of upper surface pulls down in the via (11) of the line layer (2) that extends lower surface, and its bottom is connected with via (11) sidewall contact of the line layer (2) of lower surface.
8. according to a kind of integrated circuit board described in claim 4 or 7, it is characterized in that: the line layer (2) of upper surface stretches downwards and contacts the rear employing of line layer (2) the conductive solder technique welding of lower surface along via (11).
9. a kind of integrated circuit board according to claim 7, is characterized in that: upper surface line layer (2) bottom that stretches downwards forms via (11) riveting of die (23) and the line layer (2) of lower surface.
10. according to a kind of integrated circuit board described in claim 7 or 9, it is characterized in that: the line layer (2) of the upper surface relative with via (11) is provided with the perforate less than the via aperture of insulating barrier (24), edge, the hole via (11) of described perforate stretches downwards and contacts the line layer of lower surface.
11. according to a kind of integrated circuit board described in claim 4 or 7, it is characterized in that: be provided with one deck conductive viscose layer (12) or conductive solder layer along via (11) wall, conductive viscose layer (12) or conductive solder layer are that ring is all covered with or part making in whole via.
12. a kind of integrated circuit boards according to claim 2, is characterized in that: integrated circuit board gross thickness is below 800 microns; Wherein adhesive layer thickness is 6 microns～150 microns, and thickness of insulating layer is 10 microns～400 microns, and upper strata integrated circuit layer thickness is 6 microns～150 microns, 6 microns～400 microns, lower floor's integrated circuit layer.
13. a kind of integrated circuit boards according to claim 8, is characterized in that: conductive solder technique is tin cream welding or laser welding or ultrasonic bonding.
Integrated circuit board can increase line layer and form the wiring board more than two-layer on the basis of two sandwich circuit boards forming on the line layer of upper surface line layer or lower surface; relative set insulating barrier between the line layer of corresponding increase and basic line layer, its protective layer is formed on corresponding outer surface.
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| CN201410220254.4A CN104039079B (en) | 2013-12-01 | 2014-04-25 | Integrated circuit board |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| WO2015100711A1 (en) * | 2014-01-02 | 2015-07-09 | 俞宛伶 | Printed circuit board structure with high thermal conductivity |
| CN105407638A (en) * | 2015-12-01 | 2016-03-16 | 杨小荣 | High-thermal-conductivity low-cost flexible circuit board and production method thereof |
| CN106413249A (en) * | 2016-08-09 | 2017-02-15 | 王定锋 | LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method |
| WO2017113797A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| WO2018028214A1 (en) * | 2016-08-09 | 2018-02-15 | 王定锋 | Led light strip circuit board module comprising multifunctional aluminum foil |
| CN110964935A (en) * | 2019-12-04 | 2020-04-07 | 江苏鼎胜新能源材料股份有限公司 | Manufacturing method of aluminum material with good corrosion resistance for new energy automobile circuit board |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5227588A (en) * | 1991-03-25 | 1993-07-13 | Hughes Aircraft Company | Interconnection of opposite sides of a circuit board |
| JPH1117326A (en) * | 1997-06-24 | 1999-01-22 | Matsushita Electric Works Ltd | Method for soldering electronic parts |
| US6243946B1 (en) * | 1996-04-12 | 2001-06-12 | Yamaichi Electronics Co., Ltd. | Method of forming an interlayer connection structure |
| CN1437285A (en) * | 2002-02-08 | 2003-08-20 | W·C·贺利氏股份有限及两合公司 | Electric contact method for constituting two metal structure |
| CN1671274A (en) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | Flexible substrate having interlaminar junctions, and process for producing the same |
| CN201893997U (en) * | 2010-11-19 | 2011-07-06 | 上海光汇半导体照明有限公司 | Welding structure for plug-in components of LED driver on circuit board |
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| CN102740594A (en) * | 2011-04-15 | 2012-10-17 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN103228102A (en) * | 2012-01-25 | 2013-07-31 | 株式会社德山 | Metallized via-holed ceramic substrate, and method for manufacture thereof |
| CN204291576U (en) * | 2013-12-01 | 2015-04-22 | 吴祖 | A kind of integrated circuit board |
-
2014
- 2014-04-25 CN CN201410220254.4A patent/CN104039079B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5227588A (en) * | 1991-03-25 | 1993-07-13 | Hughes Aircraft Company | Interconnection of opposite sides of a circuit board |
| US6243946B1 (en) * | 1996-04-12 | 2001-06-12 | Yamaichi Electronics Co., Ltd. | Method of forming an interlayer connection structure |
| JPH1117326A (en) * | 1997-06-24 | 1999-01-22 | Matsushita Electric Works Ltd | Method for soldering electronic parts |
| CN1437285A (en) * | 2002-02-08 | 2003-08-20 | W·C·贺利氏股份有限及两合公司 | Electric contact method for constituting two metal structure |
| CN1671274A (en) * | 2004-03-19 | 2005-09-21 | 松下电器产业株式会社 | Flexible substrate having interlaminar junctions, and process for producing the same |
| CN102209429A (en) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Heat radiation type flexible circuit board |
| CN201893997U (en) * | 2010-11-19 | 2011-07-06 | 上海光汇半导体照明有限公司 | Welding structure for plug-in components of LED driver on circuit board |
| CN102740594A (en) * | 2011-04-15 | 2012-10-17 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN103228102A (en) * | 2012-01-25 | 2013-07-31 | 株式会社德山 | Metallized via-holed ceramic substrate, and method for manufacture thereof |
| CN204291576U (en) * | 2013-12-01 | 2015-04-22 | 吴祖 | A kind of integrated circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015100711A1 (en) * | 2014-01-02 | 2015-07-09 | 俞宛伶 | Printed circuit board structure with high thermal conductivity |
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN105407638A (en) * | 2015-12-01 | 2016-03-16 | 杨小荣 | High-thermal-conductivity low-cost flexible circuit board and production method thereof |
| WO2017113797A1 (en) * | 2015-12-29 | 2017-07-06 | 广东欧珀移动通信有限公司 | Flexible circuit board and mobile terminal |
| CN106413249A (en) * | 2016-08-09 | 2017-02-15 | 王定锋 | LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method |
| WO2018028214A1 (en) * | 2016-08-09 | 2018-02-15 | 王定锋 | Led light strip circuit board module comprising multifunctional aluminum foil |
| CN110964935A (en) * | 2019-12-04 | 2020-04-07 | 江苏鼎胜新能源材料股份有限公司 | Manufacturing method of aluminum material with good corrosion resistance for new energy automobile circuit board |
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