CN201383900Y - Blind hole type circuit board - Google Patents
Blind hole type circuit board Download PDFInfo
- Publication number
- CN201383900Y CN201383900Y CN200920007377U CN200920007377U CN201383900Y CN 201383900 Y CN201383900 Y CN 201383900Y CN 200920007377 U CN200920007377 U CN 200920007377U CN 200920007377 U CN200920007377 U CN 200920007377U CN 201383900 Y CN201383900 Y CN 201383900Y
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- Prior art keywords
- blind hole
- layer
- hole type
- wiring board
- circuit board
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- Expired - Lifetime
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Abstract
The utility model relates to a blind hole type circuit board, in particular to a blind hole type double-face printed circuit board, comprising two circuit layers and an insulating film layer sandwiched between the two circuit layers. One or more through holes is/are arranged in the insulating film layer; the through holes penetrate through one of the two circuit layers; and conductive adhesive is filled in the through holes so as to ensure that the two circuit layers are mutually conductive and are communicated through the through holes filled with the conductive adhesive. The utility model has the advantages that a production method of the circuit board shortens the process period, reduces the production cost, improves the reliability and the quality, greatly enhances the production efficiency and avoids environment pollution caused by the traditional chemical plating and plating process.
Description
Technical field
The utility model relates to the field of printed substrate, is specifically related to novel blind hole type wiring board, and the new technology of coming production blind hole type printed on both sides wiring board with conducting resinl.
Background technology
In the manufacturing process of traditional blind hole type wiring board, generally adopt chemical plating, for example chemical-copper-plating process makes the through-hole wall on the double-sided flexible printed circuit board form conductive layer, thereby can conduct electricity.Like this, just realized the conductive communication of circuit surface of each layer of printed substrate.
But, in the production technology of traditional blind hole type wiring board, adopt first laser drill to form blind hole, increase the thick through hole conductionization treatment process of copper by re-plating after black holeization or the chemical plating then, cause the technological process complexity, process cycle is long, the cost height.The more important thing is; in whole through hole conduction metallization processes process; usually can relate to plating, chemical plating and graphite adsorption treatment; these technologies can be brought comparison serious environmental pollution problems; and the present whole world comprises China, to the manufacturing that relates to environmental pollution more and more severeer restriction can be arranged all on the one hand; and on the other hand, then encourage and support to alleviate or to eliminate the novel manufacturing process of environmental pollution or improve technology.
Therefore, need a kind ofly existing black holeization or chemical plating and plating manufacturing process can be substituted,, and environmental pollution problems can be eliminated so that can overcome the defective and the deficiency of above-mentioned technology.Also need corresponding circuit board structure, avoid using and electroplate and chemical plating process.
Summary of the invention
According to the utility model, relate to a kind of novel process that comes production blind hole type printed on both sides wiring board with conducting resinl.Compare with the printed substrate structure with traditional technology, technology of the present utility model has not only shortened process cycle, reduced production cost, the reliability and the quality of technical process and final products have been improved, improved production efficiency greatly, and importantly, this technology is environmental protection, can avoid and eliminate the problem of environmental pollution that existing technology is brought basically.
According to one side of the present utility model, a kind of blind hole type printed on both sides wiring board is provided, comprise two-layer line layer and be clipped in insulating film layer between the described two-layer line layer, in the line layer of described insulating film layer and one side, be provided with one or more through holes, in described through hole, be filled with conducting resinl, thereby realize the conductive communication of described through hole, like this with regard to make two-layer line layer via the through hole that is filled with conducting resinl conductive communication.
According to a preferred embodiment of the present utility model, conducting resinl is selected from a kind of, the perhaps two or more mixture in elargol, copper glue and the graphite glue.
According to another preferred embodiment of the present utility model, above-mentioned blind hole type printed on both sides wiring board is a double-sided flexible printed circuit board.
According to another preferred embodiment of the present utility model, above-mentioned double-sided flexible printed circuit board is a continuous double-sided flexible printed.
According to another preferred embodiment of the present utility model, above-mentioned blind hole type printed on both sides wiring board is the rigidity printed substrate.
According to another preferred embodiment of the present utility model, above-mentioned line layer is a Copper Foil.
According to another preferred embodiment of the present utility model, need not through hole is carried out electroplating processes.And through hole is preferably filled up by conducting resinl.
According to another preferred embodiment of the present utility model, wherein line layer of not break-through of through hole blind hole type printed on both sides wiring board.
According to a kind of preferred implementation of the present utility model, in conjunction with being to adopt adhesive to carry out bonding.
Above-mentioned blind hole type printed on both sides wiring board can be double-sided flexible printed circuit board or rigidity printed substrate.
According to another preferred embodiment of the present utility model, the conducting resinl of above-mentioned blind hole type printed on both sides wiring board is selected from a kind of, the perhaps wherein two or more mixture in elargol, copper glue and the graphite glue.
According to another preferred embodiment of the present utility model, above-mentioned blind hole type printed on both sides wiring board is a double-sided flexible printed circuit board.
According to another preferred embodiment of the present utility model, the through hole of above-mentioned blind hole type printed on both sides wiring board is without electroplating processes.
According to another preferred embodiment of the present utility model, above-mentioned blind hole type printed on both sides wiring board is the rigidity printed substrate.
According to another preferred embodiment of the present utility model, the line layer of above-mentioned blind hole type printed on both sides wiring board is a Copper Foil.
In following description, will set forth one or more embodiments of the detail of the present utility model to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
Description of drawings
Fig. 1 is the partial section of the double-sided flexible printed circuit board of prior art, has shown to finish the through hole that the conductionization electroless copper is handled;
Fig. 2 has shown the state that insulating film layer is sticked one deck line layer, and wherein Fig. 2 has shown at one deck line layer finished and insulating film layer and drills through one or more vias;
Thereby Fig. 3 is the state that sticks other one deck line layer formation blind hole type wiring board subsequently at the another side of insulating film layer; With
Fig. 4 fills with the state after the processing of realization conductionization with conducting resinl through hole subsequently.
Embodiment
To be that specific embodiment comes the utility model is described in more detail below with the double-sided flexible printed circuit board.But, should be appreciated that the utility model is not only applicable to double-sided flexible printed circuit board, also be applicable to two-sided rigidity printed substrate (being also referred to as " hardboard " in the industry).
In the utility model, term " blind hole " refers to blind hole in the insulating barrier of final double-sided flexible printed circuit board finished product and does not resemble and also pass line layer traditional double-sided flexible printed circuit board and outside being exposed to.On the contrary, utilize through hole and incomplete feed-through road floor (as shown in Figure 4) and coming out in its insulating barrier of wiring board that blind hole manufacturing process of the present utility model forms, but a side through hole is embedded under one deck circuit, therefore be called " blind hole ".The structure of this blind hole and technology are one of important inventive concepts of the present utility model, by making the blind hole conductive communication, thereby make the line layer conductive communication of double-sided flexible printed circuit board both sides, and therefore this blind hole was also referred to as electric hole sometimes.
In the utility model, term " two-sided " refers on the two sides of printed substrate and all is provided with circuit (line layer).
In addition, term " double-sided flexible printed circuit board " refers on the two sides of this flexible print circuit board and all is provided with circuit.
Be described in further detail below in conjunction with the manufacturing process and the structure of drawings and Examples double-sided flexible printed circuit board of the present utility model.
The raw material volume of traditional double-sided flexible printed circuit board is also referred to as the coiled material of copper-clad plate.In the structure of this double-faced flexible printing, general structure is three layers, promptly, (modal be to adopt Copper Foil to two-layer line layer 5, can be described as again in the present embodiment and cover copper layer 5 or copper foil layer 5, these terms use sometimes interchangeably), and be clipped in insulating film layer 6 between this two-layer line layer 5.Insulating film layer 6 has formed the basal layer of flexible circuit.
The material of insulating film layer has many kinds, and wherein the most commonly used is polytetrafluoroethylene and polyimides and polyester material.Polyimide material has non-flammable, physical dimension is stable, has advantages of higher tensile strength, and the ability with the welding temperature of bearing, polyester is also referred to as PETG (being called for short PET), its physical property is similar to polyimides, have lower dielectric constant, the humidity of absorption is very little, but non-refractory.Polyester presents rigidity in cryogenic applications.These materials all can be used for forming insulating film layer.Certainly, it will be understood by those skilled in the art that and to adopt any other material well known in the art to make insulating film layer.
Copper Foil generally is suitable for being used as line layer 5 among flexible circuit, and it can adopt the mode of electro-deposition (ED), forging.Copper Foil is the material with compliance, can be made into many kinds of thickness and width.The Copper Foil of forging also has the level and smooth characteristics of hard except having pliability, it is suitable for being applied among the occasion that requires dynamic deflection.
The structure of traditional conductive through hole and the shortcoming of manufacturing process are, although technology comparative maturity, but owing to need deceive the processing of hole processing and electroless copper, so have manufacturing process complexity, process cycle is long, cost is high shortcoming, and manufacturing process also can cause environmental pollution.In addition, this technology can cause the quality instability of conduction processing, and the conductive layer of through-hole wall outer is easy to be subjected to the various chemistry of environment and the influence of physical factor owing to being exposed to, and may produce part and peel off, thereby cause the wiring board reliability of products to reduce.
Technology of the present utility model not only can overcome these shortcomings, and the wiring board of realizing structure is the blind hole type, be that conductive hole partly is embedded between the two-layer line layer and does not pass line layer and expose, therefore be not subjected to the harmful effect of extraneous factor, thereby electric conductivity is more reliable, and the wiring board product quality is also more reliable.
The more important thing is the feasible electroplating processes technology that can omit through hole of the utility model.
Particularly, in the raw material volume of traditional double-sided flexible printed circuit board, can respectively have a registration hole in its both sides, this location hole can be provided by the supplier of raw material volume, also can make in initial processing technology.Raw material are rolled up preferably three-layer structure, and promptly two-layer line layer (promptly covering the copper layer) 5 and be clipped in insulating film layer 6 between this two-layer line layer is for example shown in Figure 1.
For the sake of clarity, hereinafter put up with the line layer 5 that adopts copper foil material, and specifically describe how to make blind hole type printed on both sides wiring board of the present utility model in conjunction with the part of production of double-sided flexible printed circuit board.
A main design of the present utility model is, makes the method for through hole conductionization by the employing conducting resinl that adopts a kind of novelty, obtains a kind of blind hole type printed on both sides wiring board of novelty.Of the present utility model mainly is to utilize conducting resinl to replace black holeization and copper-plated technology, realizes the conductionization of blind hole.
Particularly, for example, at first will be with insulating film layer 6 and 5 combinations of ground floor copper foil layer, insulating film layer 6 can adopt polyimide film, and insulating film layer 6 has carried out double spread.Insulating film layer 6 and ground floor copper foil layer 5 to this combination carries out pore-forming afterwards, the method that forms through hole 3 can adopt modes such as die punching, boring, laser drilling, its processing method and corresponding processing unit (plant) are well known to those skilled in the art, and, for example can be referring to the content in another part Chinese patent application 200810066914.2 of the applicant, the full content of this Chinese patent application 200810066914.2 is incorporated among the application by reference.
Afterwards, on the opposite another side of the dielectric film 6 of structure shown in Figure 3, preferably adopt bonding mode in conjunction with last second layer copper foil layer 5.In order to ensure combination reliably and conductive communication, preferably in combination or afterwards,, adopt traditional press equipment for example approximately under 150-200 degree centigrade the temperature, the printed on both sides wiring board that is bonded with second layer copper foil layer is carried out pressing.Like this, just obtained blind hole type printed on both sides wiring board as shown in Figure 3.
Subsequently, to the 3 filled conductive glue 7 of the blind hole in the structure shown in Figure 3, can be described as seal conducting resinl (or dripping conducting resinl) in the art again.
The mode of filled conductive glue 7 can preferably adopt the mode of printing funnel, to realize the processed of automation.。In this operation, conducting resinl 7 can adopt commercially available on the market various conducting resinls, for example elargol, copper glue, graphite glue or the like.These conducting resinls not only can conduct electricity, and preferably also have certain viscosity, to guarantee the reliable conductive communication between the two-layer copper foil layer 5.In addition, should 7 fillings of through hole 3 usefulness conducting resinls are full.For example, conducting resinl 7 is filled to overflows blind hole 3 a little, schematically shown in Figure 3, to guarantee reliable conductive communication.Those skilled in the art can know, Fig. 3 only is schematic, in the technological operation of reality, the overflowing part and may on insulating film layer 6, sprawl and form and be similar to the such arc bizet of rivet head of conducting resinl 7, the part of overflowing of the straight shape shown in Fig. 3 only schematically illustrates, and does not play any restricted effect.
The structure that obtains after this operation of process as shown in Figure 4.
Then, structure shown in Figure 4 existing roasting plant with any adequate types is toasted, baking temperature is for example at 80-200 degree centigrade, preferably at 80-120 degree centigrade.
Subsequently, different according to concrete application scenario and structure can be carried out various follow-up PROCESS FOR TREATMENT to blind hole type printed on both sides wiring board shown in Figure 4, for example paste dry film; Exposure; Develop; Etching; Move back film; Pad pasting (or claiming to paste weld-proof membrane); Press mold; Solidify; Surface treatment (OSP); Character mark; Test; Cut, or the like.These technologies all are technology well known to those skilled in the art, give unnecessary details no longer one by one.
According to the difference of application scenario, can carry out aforesaid various subsequent machining technology.
Therefore, according to this technology to through hole 3 filled conductive glue 7 of the present utility model, because technology is simple, operation is short, therefore is particularly suitable for the continuous double-sided flexible printed of production overlength.
Particularly, therefore technology of the present utility model can overcome above-mentioned these shortcomings owing to do not adopt chemical plating and electroplating technology, and the more important thing is very environmental protection, can eliminate above-mentioned traditional chemical plating and electroplating technology pollution on the environment.In addition, technology of the present utility model is because technological process is simple, so cost is low, the efficient height, and do not have electrodeposited coating, so copper layer thickness is even.
Although do not describe in detail in this article, but those skilled in the art obviously are appreciated that, the utility model is not only applicable to double-sided flexible printed circuit board, and too applicable to two-sided rigidity printed substrate (hardboard), and can obtain aforesaid various beneficial technical effects equally.
Above by the agency of specific embodiment of the utility model.Yet should be appreciated that under the prerequisite that does not break away from spirit and scope of the present utility model, can carry out various modifications.For example be embodied as when the double-sided flexible printed circuit board of existing rigidity printed substrate or segmentation made when the utility model, no matter be for necessity or for for the purpose of the facility, all can keep the various details of the double-sided flexible printed circuit board structure of existing rigidity printed substrate or segmentation, and can not cause any bad negative effect.Therefore, other embodiment also belongs in the scope of claims.
Claims (6)
1. blind hole type printed on both sides wiring board, comprise two-layer line layer and be clipped in insulating film layer between the described two-layer line layer, in described insulating film layer, be provided with one or more through holes, wherein, described through hole break-through one deck line layer in the described two-layer line layer, and in described through hole, be filled with conducting resinl, thereby make described two-layer line layer realize conductive communication via the described through hole that is filled with conducting resinl.
2. blind hole type printed on both sides wiring board according to claim 1 is characterized in that described conducting resinl is selected from a kind of, the perhaps wherein two or more mixture in elargol, copper glue and the graphite glue.
3. blind hole type printed on both sides wiring board according to claim 1 and 2 is characterized in that, described blind hole type printed on both sides wiring board is a double-sided flexible printed circuit board.
4. blind hole type printed on both sides wiring board according to claim 3 is characterized in that described through hole is without electroplating processes.
5. blind hole type printed on both sides wiring board according to claim 1 is characterized in that, described blind hole type printed on both sides wiring board is the rigidity printed substrate.
6. blind hole type printed on both sides wiring board according to claim 1 is characterized in that described line layer is a Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920007377U CN201383900Y (en) | 2009-02-18 | 2009-02-18 | Blind hole type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920007377U CN201383900Y (en) | 2009-02-18 | 2009-02-18 | Blind hole type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201383900Y true CN201383900Y (en) | 2010-01-13 |
Family
ID=41527371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920007377U Expired - Lifetime CN201383900Y (en) | 2009-02-18 | 2009-02-18 | Blind hole type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201383900Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437109A (en) * | 2011-11-30 | 2012-05-02 | 日月光半导体制造股份有限公司 | Semiconductor structure and manufacturing method thereof |
| CN102638946A (en) * | 2012-04-23 | 2012-08-15 | 深圳市弘海电子材料技术有限公司 | Manufacturing process of interlayer copper connector of printed circuit board |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN102869206A (en) * | 2012-09-27 | 2013-01-09 | 电子科技大学 | Method for co-plating metallization of blind holes and through hole of printed circuit board |
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
| CN103025052A (en) * | 2012-12-20 | 2013-04-03 | 慈溪市三佩机械有限公司 | Fastener and circuit board thereof |
| CN114375097A (en) * | 2021-12-24 | 2022-04-19 | 江苏普诺威电子股份有限公司 | Processing technology of packaging substrate for sensor |
| CN114466531A (en) * | 2022-03-09 | 2022-05-10 | 江门市尚智电子材料有限公司 | Environment-friendly processing method of multilayer FPC flexible circuit board |
-
2009
- 2009-02-18 CN CN200920007377U patent/CN201383900Y/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
| CN102437109A (en) * | 2011-11-30 | 2012-05-02 | 日月光半导体制造股份有限公司 | Semiconductor structure and manufacturing method thereof |
| CN102638946A (en) * | 2012-04-23 | 2012-08-15 | 深圳市弘海电子材料技术有限公司 | Manufacturing process of interlayer copper connector of printed circuit board |
| CN102638946B (en) * | 2012-04-23 | 2014-07-23 | 深圳市弘海电子材料技术有限公司 | Manufacturing process of interlayer copper connector of printed circuit board |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN102869206A (en) * | 2012-09-27 | 2013-01-09 | 电子科技大学 | Method for co-plating metallization of blind holes and through hole of printed circuit board |
| CN102869206B (en) * | 2012-09-27 | 2015-04-15 | 电子科技大学 | Method for co-plating metallization of blind holes and through hole of printed circuit board |
| CN103025052A (en) * | 2012-12-20 | 2013-04-03 | 慈溪市三佩机械有限公司 | Fastener and circuit board thereof |
| CN103025052B (en) * | 2012-12-20 | 2015-09-30 | 慈溪市三佩机械有限公司 | The wiring board of dead lock and dead lock |
| CN114375097A (en) * | 2021-12-24 | 2022-04-19 | 江苏普诺威电子股份有限公司 | Processing technology of packaging substrate for sensor |
| CN114375097B (en) * | 2021-12-24 | 2023-08-22 | 江苏普诺威电子股份有限公司 | Processing technology of packaging substrate for sensor |
| CN114466531A (en) * | 2022-03-09 | 2022-05-10 | 江门市尚智电子材料有限公司 | Environment-friendly processing method of multilayer FPC flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100113 |
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| CX01 | Expiry of patent term |