CN102638946B - Manufacturing process of interlayer copper connector of printed circuit board - Google Patents
Manufacturing process of interlayer copper connector of printed circuit board Download PDFInfo
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- CN102638946B CN102638946B CN201210119506.5A CN201210119506A CN102638946B CN 102638946 B CN102638946 B CN 102638946B CN 201210119506 A CN201210119506 A CN 201210119506A CN 102638946 B CN102638946 B CN 102638946B
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Abstract
The invention discloses a manufacturing process of an interlayer copper connector of a printed circuit board. The manufacturing process comprises the following steps: coating a glue resin layer and sticking and pressing release paper on two sides of the outer surface of an insulation layer; forming pores and machining; removing the release paper on one side and coating a copper layer; filling holes with electric conductive colloid; removing the release paper on the other side and coating a copper layer; and pressing, fitting and curing. According to the invention, by adopting a simply and easily operated silk screen printing technology and by combining the electric conductive colloid with low liquidity, the chemical copper depositing and plating technology in the production technology of the traditional printed circuit board is replaced successfully, the conduction performance of the copper layer on performance can be achieved, zero emission and zero pollution in the environment protection aspect are achieved, the investment total amount in device input and plant input aspects is reduced, the investment hazard is reduced, and the conditions for rapid production and manufacturing cycle shortening are provided for the market demand of the printed circuit boards on the aspect of production efficiency.
Description
Technical field
The present invention relates to the manufacture craft that a kind of printed wiring board interlayer copper connects.
Background technology
Printed circuit board is important electronic unit, is the supporter of electronic devices and components, and its Main Function is to provide electrical connection for electronic devices and components.
Printed circuit board is as the basic fittings of electronics and IT products, and its market demand has reached considerable scale, and is further rapidly increasing.Benefit from the support of taking turns of terminal new product and new markets, global printed circuit board market growth is rapid.The products such as computer and Related product, communication class product and consumer electronics are the main applications of printed circuit board.
The traditional electric wire early of comparing connects to form the mode of circuit, printed circuit board major advantage be the mistake that greatly reduces wiring and assembling, improved the gentle labor productivity of Automated water.Its function realizes the main line design of plane layer that relies in conjunction with the hole metallization between longitudinal layer.
Hole metallization, traditional handicraft claims again chemistry heavy copper facing.PCB Hole Metallization technology is one of key of Manufacturing Technology for PCB.Traditional sense, hole metallization refers on the hole wall between top layer and bottom and with chemical reaction, thin one deck copper is plated on the inwall in hole, the top layer of printed circuit board is electrically connected mutually with bottom.
The heavy copper facing of chemistry is widely used in the production and processing of printed circuit board of through hole, and its process, for to deposit layer of copper by a series of chemical treatment methods on non-conductive substrate, makes it to reach the specific thicknesses of design then by follow-up electro-plating method thickening.
At printed circuit board industry, the essential flow process that the heavy copper facing flow process of chemistry realizes interlayer conduction as it, occupies extremely important status in the production process of printed circuit board, but in its process, has also produced suitable useless chemical medicinal liquid at present.Adopt conventional process flow to realize printed wiring board interlayer copper and connect, concrete technology flow process is shown in Fig. 1, and step is as follows:
1) draw materials: select the insulating barrier of being made by polyimides PI film, thickness of insulating layer is 12.5 μ m～200.0 μ m, the tacky resin layer that dual coating is made up of epoxy resin, the thickness of tacky resin layer is 10 μ m～100 μ m, and the copper layer thickness of outermost layer dual coating is 12～35 μ m.
2) pore-forming: use numerically controlled drill to get out in the circuit board through hole, to set up interconnecting channel between layers, the scope in aperture is set to 0.1～2.0mm.
3) electroless copper plating: whole hole-microetch-activation-reduction-acidleach-plating; As can be seen from Figure 1, experience altogether the discharge of five chemical medicinal liquids in electroless copper plating process, on plate hole madial wall, deposited the high density of thin layer and careful heavy copper layer (0.5～4.0 μ m) holing.
4) electro-coppering: then electroplated on above-mentioned heavy copper layer and obtained the thick copper plate of one deck 5～40 μ m by the method for electric plating of whole board, the copper between complete layer connects.
Recording average resistivity by traditional performance detection method is 0.0169 ohm of * square millimeter/rice.
In printed circuit board develop rapidly, the useless chemical medicinal liquid discharge producing in its process has caused huge pressure for environmental protection, conversely also because environmental protection restriction has produced resistance to further developing of industry.This wherein the heavy copper-plated discharging of waste liquid of chemistry occupied quite a few ratio, become printed circuit board further develop in a great problem urgently to be resolved hurrily.
Summary of the invention
The technical problem to be solved in the present invention is, the new manufacture craft that provides the printed circuit board interlayer copper of the heavy copper facing flow process of a kind of substituted chemistry to connect, ensureing that its product reaches under the precondition of traditional manufacturing technique performance, significantly shorten the production cycle, and greatly amplitude reduces chemical contamination and environmental pollution, meets the demand in the printed circuit board market developing rapidly.
The invention provides the manufacture craft that a kind of printed wiring board interlayer copper connects, comprise the steps:
Step 1: dual coating tacky resin layer and double-sided adhesive are pressed release liners outside insulating barrier;
Step 2: pore-forming processing;
Step 3: throw off one side release liners and at corresponding tacky resin layer outer surface coated copper layer;
Step 4: the hole wall that the coated copper layer of step 3 and pore-forming are processed to form surrounds the cylindrical structure of one end sealing, carries out the conductive rubber grout of low flowable state at cylindrical structure other end opening part;
Step 5: throw off another side release liners and at corresponding tacky resin layer outer surface coated copper layer;
Step 6: carry out pressing after dual coating copper layer, and make it curing, to complete the connection of printed wiring board interlayer copper.
Described conductive rubber is preferably the epoxy resin conductive rubber of low flowable state.
Described conductive rubber is the conducting resinl of U.S. CMI/TECHBOND more preferably.
The grout of described conductive rubber preferably adopts silk screen print method.
Described silk screen print method preferably adopts screen process press to carry out, and the operational factor of screen process press is as follows: pressure is 6.5kgf/cm, and speed is 4m/min, and scraper angle is 15 DEG C.
Described insulating barrier is preferably made up of glass fiber resin or polyimides PI film or polyester PET film.
Described tacky resin layer is preferably made up of acrylic size or acrylic resin modified glue or epoxide-resin glue.
Described pore-forming processing preferably adopts digital control hole drilling or die punching or laser drill.
In described step 3 and step 5, the thickness of coated copper layer is all preferably 12 μ m～180 μ m.
Described coated copper layer preferably adopts coating machine to carry out, and the speed of coating machine is 4m/min, and pressure is 6MPa, and drying tunnel temperature is 60 DEG C.
The present invention adopts the silk-screen printing technique of ease of Use, in conjunction with the epoxy resin conductive rubber (as the conducting resinl of U.S. TECHBOND) of low flowable state, successfully substitute the heavy copper-plating technique in traditional printed circuit board production technology, in performance, be equivalent to the conduction property of copper layer; Zero discharge and zero pollution aspect environmental protection, are accomplished; Aspect equipment investment and factory building input, reduce total investment, reduce investment risk; Aspect production efficiency, for the market demand aspect of following printed circuit board blowout formula provides quick production and shortened the condition of fabrication cycle.
Brief description of the drawings:
Fig. 1 is that the heavy copper facing of prior art chemistry realizes the fabrication processing figure that copper connects;
Fig. 2 is the fabrication processing figure that printed wiring board interlayer copper of the present invention connects;
Fig. 3 is that printed wiring board interlayer copper of the present invention connects the structure cutaway view of manufacture craft after raw material boring;
Fig. 4 is that printed wiring board interlayer copper connection manufacture craft one side of the present invention covers the structure cutaway view after copper;
Fig. 5 is that printed wiring board interlayer copper connection manufacture craft of the present invention is utilized the structure cutaway view after conductive rubber grout;
Fig. 6 is that the structure cutaway view of realizing after copper connects is made in printed wiring board interlayer copper connection of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention is further elaborated:
Embodiment 1
The manufacture craft that the present embodiment provides a kind of printed wiring board interlayer copper to connect, as shown in Figure 2, comprises the following steps:
Step 1: draw materials: at insulating barrier outer surface dual coating tacky resin layer, then press release liners at outermost external surface double-sided adhesive;
Get the insulating barrier 3 of being made by glass fiber resin, thickness is 12.5 μ m, apply at insulating barrier 3 outer surface one sides the tacky resin layer 2 of being made by acrylic size, the thickness of described tacky resin layer 2 is 10 μ m, coating machine speed is 4m/mi n, drying tunnel temperature is 60 DEG C, after the preliminary oven dry of drying tunnel, again apply at another side the tacky resin layer 2 that acrylic size is made, repeat last time to apply operation sequence, press release liners 1 at two-sided outermost external surface double-sided adhesive, pressure is 6MPa, 80 DEG C of temperature.
Step 2: pore-forming processing
Then hole, can produce in the circuit board one by boring and allow that subsequent handling completes the passage of the electrical property between the upper and lower layer of connection line plate, the mode of boring adopts digital control hole drilling, after boring, can obtain through hole 4, as Fig. 3, the diameter of through hole 4 is 0.60mm.
Step 3: one side covers copper
After pore-forming, throw off the release liners 1 of one side, utilize rolling roll extrusion section in coating machine corresponding tacky resin layer 2 outer surface to be carried out to the copper that covers of one side, its concrete grammar is to be 4m/min in the speed of coating machine, pressure is 6MPa, drying tunnel temperature is under 60 DEG C of conditions, thin copper coiled material is compound to the outer surface of tacky resin layer 2, as Fig. 4, make it to there is certain adhesion strength, cover copper layer 5 thickness be 12 μ m.
Step 4: the grout of conductive rubber
The hole wall forming in the coated copper layer 5 of described step 3 and step 2 surrounds the cylindrical structure of one end sealing, use epoxy resin conductive rubber 6 to carry out grout at cylindrical structure other end opening part with silk screen print method, if Fig. 5 is the cutaway view after grout.Described epoxy resin conductive rubber 6 is the conducting resinl of U.S. TECHBOND, and it has high temperature resistant, good conductivity, thermal diffusivity is high and adhesive strength is large feature, the electric connection of realizing interlayer that can be stable.Wherein silk screen printing adopts common screen process press, selects the contraposition printing of carrying out consent with the aluminium flake of corresponding pass, and the operational factor of screen process press is: pressure 6.5kgf/cm, speed 4m/min, 15 DEG C of scraper angles.
Step 5: another side covers copper
Via is filled with and is added after conductive rubber 6, throw off the release liners 1 of another side, utilize roll extrusion section in coating machine to corresponding tacky resin layer 2 outer surface coated copper layer 7, its concrete grammar is to be 4m/min in the speed of coating machine, and pressure is 6MPa, and drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of tacky resin, as Fig. 6, make it to there is certain adhesion strength, cover copper layer 7 thickness be 12 μ m.
Step 6: pressing is solidified
The product of above-mentioned double-sided copper-clad is formed to satisfactory size through cutting, size can be 500mm*250mm, adopt vacuum press to carry out two-sided pressing at the outer surface of coated copper layer, and make it curing, and connecting to complete printed wiring board interlayer copper, the traditional pressing curing process of employing is solidified in pressing, pressing is carried out with solidifying simultaneously, pressing and curing temperature are 180 DEG C, and pressing and curing time are 2 hours, and pressing pressure is 10Mpa.
Performance Detection:
After pressing is solidified, the double-edged copper layer of product is all etched into wire, specifically detects data as follows:
Table 1
As from the foregoing, tow sides conductor length altogether about 30mm (contains turning part, its length 0.033mm, pore size is 0.80mm), the cross section of wire is rectangle, and width is about 2mm, height 0.035mm, recording hybrid resistor value is 0.0062～0.0066 ohm, and amounting to average resistivity is 0.0151 ohm of * square millimeter/rice.
Embodiment 2
The manufacture craft that the present embodiment provides a kind of printed wiring board interlayer copper to connect, as shown in Figure 2, comprises the following steps:
Step 1: draw materials
Get the insulating barrier 3 of being made by polyimides PI film, thickness is 200 μ m, apply at insulating barrier 3 outer surface one sides the tacky resin layer 2 of being made by acrylic resin modified glue, the thickness of described tacky resin layer 2 is 100 μ m, coating machine speed is 4m/min, drying tunnel temperature is 60 DEG C, after the preliminary oven dry of drying tunnel, again apply at another side the tacky resin layer 2 that acrylic resin modified glue is made, repeat last time to apply operation sequence, press release liners 1 at two-sided outermost external surface double-sided adhesive, pressure is 6MPa, 80 DEG C of temperature.
Step 2: pore-forming processing;
Then carry out punching processing, can produce in the circuit board one by punching processing and allow that subsequent handling completes the passage of the electrical property between above and below or the middle line layer of connection line plate, punching mode adopts die punching, after punching, can obtain through hole 4, as Fig. 3, the diameter of through hole 4 is 1mm.
Step 3: one side covers copper
After pore-forming, throw off the release liners 1 of one side, utilize rolling roll extrusion section in coating machine at corresponding tacky resin layer outer surface coated copper layer, its concrete grammar is the speed 4m/min at coating machine, pressure is 6MPa, drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of the tacky resin of insulating barrier, as Fig. 4, make it to there is certain adhesion strength, cover copper layer 5 thickness be 180 μ m.
Step 4: the grout of conductive rubber
The hole wall forming in the coated copper layer of described step 3 and step 2 surrounds the cylindrical structure of one end sealing, uses epoxy resin conductive rubber 6 to carry out grout, as Fig. 5 at cylindrical structure other end opening part with silk screen print method.Described epoxy resin conductive rubber 6 is the conducting resinl of U.S. TECHBOND, and it has high temperature resistant, good conductivity, thermal diffusivity is high and adhesive strength is large feature, the electric connection of realizing interlayer that can be stable.Wherein silk screen printing adopts common screen process press, selects the contraposition printing of carrying out consent with the aluminium flake of corresponding pass, and the operational factor of screen process press is: pressure 6.5kgf/cm, speed 4m/min, 15 DEG C of scraper angles.
Step 5: another side covers copper
Via is filled with and is added after conductive rubber, throw off the release liners 1 of another side, utilize rolling roll extrusion section in coating machine at corresponding tacky resin layer 2 outer surface coated copper layer 7, its concrete grammar is to be 4m/min in the speed of coating machine, and pressure is 6MPa, and drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of tacky resin, as Fig. 6, make it to there is certain adhesion strength, cover copper layer 7 thickness be 180 μ m.
Step 6: pressing is solidified
The product of above-mentioned double-sided copper-clad is formed to satisfactory size through cutting, and size can be 500mm*250mm, adopts vacuum press to carry out two-sided pressing at the outer surface of coated copper layer, and makes it curing, connects to complete printed wiring board interlayer copper.Employing quick pressing technique is solidified in pressing, after first pressing, solidifies, and when pressing, pressing-in temp is 180 DEG C, and pressing time is 120S, and pressing pressure is 10MPa, and while solidifying, curing temperature is 160 DEG C, and be 90min curing time.
Performance Detection:
After pressing is solidified, the double-edged two bronze medal layers of product are all etched into wire, specifically detect data as follows:
Table 2
As seen from the above table, wire tow sides length altogether about 30mm (contains turning part, its length 0.400mm, pore size is 0.80mm), the cross section of wire is rectangle, and width is about 2mm, height 0.035mm, recording hybrid resistor value is 0.0062～0.0065 ohm, and amounting to average resistivity is 0.0149 ohm of * square millimeter/rice.
Embodiment 3
The manufacture craft that the present embodiment provides a kind of printed wiring board interlayer copper to connect, as shown in Figure 2, comprises the following steps:
Step 1: draw materials
Get the insulating barrier 3 of being made by polyester PET film, its thickness is 80 μ m, apply at insulating barrier 3 outer surface one sides the tacky resin layer 2 of being made up of epoxide-resin glue, the thickness of described tacky resin layer 2 is 50 μ m, and coating machine speed is 4m/min, drying tunnel temperature is 60 DEG C, after the preliminary oven dry of drying tunnel, again apply at another side the tacky resin layer 2 that epoxide-resin glue is made, repeat last time to apply operation sequence, press release liners 1 at two-sided outermost external surface double-sided adhesive, pressure is 6MPa, 80 DEG C of temperature.
Step 2: pore-forming processing;
Then hole, can produce in the circuit board one by boring and allow that subsequent handling completes the passage of the electrical property between above and below or the middle line layer of connection line plate, the mode of boring can adopt laser drill, after boring, can obtain through hole 4, as Fig. 3, the diameter of through hole 4 is 2mm.
Step 3: one side covers copper
After pore-forming, throw off the release liners 1 of one side, utilize rolling roll extrusion section in coating machine at corresponding tacky resin layer outer surface coated copper layer, its concrete grammar is the speed 4m/min at coating machine, pressure is 6MPa, drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of the tacky resin of insulating barrier, as Fig. 4, make it to there is certain adhesion strength, cover copper layer 5 thickness be 72 μ m.
Step 4: the grout of conductive rubber
The hole wall forming in the coated copper layer of described step 3 and step 2 surrounds the cylindrical structure of one end sealing, uses epoxy resin conductive rubber to carry out consent, as Fig. 5 at cylindrical structure other end opening part with silk screen print method.Described epoxy resin conductive rubber is the conducting resinl of U.S. TECHBOND, and it has high temperature resistant, good conductivity, thermal diffusivity is high and adhesive strength is large feature, the electric connection of realizing interlayer that can be stable.Wherein silk screen printing adopts common screen process press, selects the contraposition printing of carrying out consent with the aluminium flake of corresponding pass, and the operational factor of screen process press is: pressure 6.5kgf/cm, speed 4m/min, 15 DEG C of scraper angles.
Step 5: another side covers copper
Via is filled with and is added after conductive materials, throw off the release liners 1 of another side, utilize rolling roll extrusion section in coating machine at corresponding tacky resin layer 2 outer surface coated copper layer 7, its concrete grammar is to be 4m/min in the speed of coating machine, and pressure is 6MPa, and drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of the tacky resin of insulating barrier, as Fig. 6, make it to there is certain adhesion strength, cover copper layer 7 thickness be 72 μ m.
Step 6: pressing is solidified
The product of above-mentioned double-sided copper-clad is formed to satisfactory size through cutting, and size can be 500mm*250mm, adopts vacuum press to carry out two-sided pressing at the outer surface of coated copper layer, and makes it curing, connects to complete printed wiring board interlayer copper.The traditional pressing curing process of employing is solidified in pressing, and pressing is carried out with solidifying simultaneously, and pressing and curing temperature are 180 DEG C, and pressing and curing time are 2 hours, and pressing pressure is 10Mpa.
Performance Detection:
After pressing is solidified, the double-edged two bronze medal layers of product are all etched into wire, detect concrete data as follows:
Table 3
As seen from the above table, wire tow sides length altogether about 30mm (contains turning part, its length 0.180mm, pore size is 0.80mm), the cross section of wire is rectangle, and width is about 2mm, height 0.035mm, recording hybrid resistor value is 0.0062～0.065 ohm, and amounting to average resistivity is 0.0149 ohm of * square millimeter/rice.
Embodiment 4
The manufacture craft that the present embodiment provides a kind of printed wiring board interlayer copper to connect, as shown in Figure 2, comprises the following steps:
Step 1: draw materials
Get the insulating barrier 3 of being made by polyimides PI film, its thickness is 150 μ m, apply at insulating barrier 3 outer surface one sides the tacky resin layer 2 of being made by acrylic size, the thickness of described tacky resin layer 2 is 80 μ m, coating machine speed is 4m/min, drying tunnel temperature is 60 DEG C, after the preliminary oven dry of drying tunnel, again apply at another side the tacky resin layer 2 that acrylic size is made, repeat last time to apply operation sequence, press release liners 1 at two-sided outermost external surface double-sided adhesive, pressure is 6MPa, 80 DEG C of temperature.
Step 2: pore-forming processing;
Then hole, can produce in the circuit board one by boring and allow that subsequent handling completes the passage of the electrical property between above and below or the middle line layer of connection line plate, the mode of boring adopts die punching (also can adopt digital control hole drilling or laser drill), after boring, can obtain through hole 4, as Fig. 3, the diameter of through hole 4 is 4mm.
Step 3: one side covers copper
After pore-forming, throw off the release liners 1 of one side, utilize rolling roll extrusion section in coating machine at corresponding tacky resin layer outer surface coated copper layer, its concrete grammar is the speed 4m/min at coating machine, pressure is 6MPa, drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of the tacky resin of insulating barrier, as Fig. 4, make it to there is certain adhesion strength, cover copper layer 5 thickness be 108 μ m.
Step 4: the grout of conductive rubber
The hole wall forming in the coated copper layer of described step 3 and step 2 surrounds the cylindrical structure of one end sealing, uses epoxy resin conductive rubber to carry out consent, as Fig. 5 at cylindrical structure other end opening part with silk screen print method.Described epoxy resin conductive rubber is the conducting resinl of U.S. TECHBOND, and it has high temperature resistant, good conductivity, thermal diffusivity is high and adhesive strength is large feature, can be stable realize the upper and lower electric connection of interlayer.Wherein silk screen printing adopts common screen process press, selects the contraposition printing of carrying out consent with the aluminium flake of corresponding pass, and the operational factor of screen process press is: pressure 6.5kgf/cm, speed 4m/min, 15 DEG C of scraper angles.
Step 5: another side covers copper
Via is filled with and is added after conductive materials, throw off the release liners 1 of another side, utilize the rolling roll extrusion section in coating machine to cover copper at corresponding tacky resin layer outer surface, its concrete grammar is to be 4m/mi n in the speed of coating machine, and pressure is 6MPa, and drying tunnel temperature is at 60 DEG C, thin copper coiled material is compound to the outer surface of tacky resin 2, as Fig. 6, make it to there is certain adhesion strength, cover copper layer 7 thickness be 108 μ m.
Step 6: pressing is solidified
The product of above-mentioned double-sided copper-clad is formed to satisfactory size through cutting, size can be 500mm*250mm, adopts vacuum press to carry out two-sided pressing at the outer surface of coated copper layer, and makes it curing, connect to complete printed wiring board interlayer copper, employing quick pressing technique is solidified in pressing, after first pressing, solidifies, and when pressing, pressing-in temp is 180 DEG C, pressing time is 120S, pressing pressure is 10MPa, and while solidifying, curing temperature is 160 DEG C, and be 90min curing time.
Performance Detection:
After pressing is solidified, the double-edged two bronze medal layers of product are all etched into wire: concrete data are as follows:
Table 4
As seen from the above table, wire tow sides length altogether about 30mm (contains turning part, its length 0.310mm, pore size is 0.80mm), the cross section of wire is rectangle, and width is about 2mm, height 0.035mm, recording hybrid resistor value is 0.0062～0.0064 ohm, and amounting to average resistivity is 0.0148 ohm of * square millimeter/rice.
Can find out from test result, contrast traditional handicraft, the resistivity that the manufacture craft that the printed wiring board interlayer copper described in embodiment connects produces is slightly on the low side, and electric conductivity is not second to traditional handicraft product.It can also be seen that from embodiment and Fig. 1, Fig. 2, prior art has repeatedly liquid medicine discharge to cause repeated pollution simultaneously, and the present invention discharges without chemical medicinal liquid, and contamination-free produces; Prior art complex manufacturing, the production cycle is long, and manufacture craft of the present invention is simple, can greatly shorten the production cycle.
Claims (4)
1. the manufacture craft that printed wiring board interlayer copper connects, is characterized in that, comprises the steps:
Step 1: dual coating tacky resin layer and double-sided adhesive are pressed release liners outside insulating barrier;
Step 2: pore-forming processing;
Step 3: throw off one side release liners and at corresponding tacky resin layer outer surface coated copper layer;
Step 4: the hole wall that the coated copper layer of step 3 and pore-forming are processed to form surrounds the cylindrical structure of one end sealing, carries out the conductive rubber grout of low flowable state at cylindrical structure other end opening part;
Step 5: throw off another side release liners and at corresponding tacky resin layer outer surface coated copper layer;
Step 6: carry out pressing after dual coating copper layer, and make it curing, to complete the connection of printed wiring board interlayer copper;
Described conductive rubber is the epoxy resin conductive rubber of low flowable state;
The grout of described conductive rubber adopts silk screen print method;
Described silk screen print method adopts screen process press to carry out, and the operational factor of screen process press is as follows: pressure is 6.5kgf/cm, and speed is 4m/min, and scraper angle is 15 DEG C;
In described step 3 and step 5, the thickness of coated copper layer is 12 μ m～180 μ m;
Described coated copper layer adopts coating machine to carry out, and the speed of coating machine is 4m/min, and pressure is 6MPa, and drying tunnel temperature is 60 DEG C.
2. the manufacture craft that printed wiring board interlayer copper according to claim 1 connects, is characterized in that, described insulating barrier is made up of glass fiber resin or polyimides PI film or polyester PET film.
3. the manufacture craft that printed wiring board interlayer copper according to claim 1 and 2 connects, is characterized in that, described tacky resin layer is made up of acrylic size or acrylic resin modified glue or epoxide-resin glue.
4. the manufacture craft that printed wiring board interlayer copper according to claim 1 and 2 connects, is characterized in that, described pore-forming processing adopts digital control hole drilling or die punching or laser drill.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210119506.5A CN102638946B (en) | 2012-04-23 | 2012-04-23 | Manufacturing process of interlayer copper connector of printed circuit board |
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| CN201210119506.5A CN102638946B (en) | 2012-04-23 | 2012-04-23 | Manufacturing process of interlayer copper connector of printed circuit board |
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| CN102638946A CN102638946A (en) | 2012-08-15 |
| CN102638946B true CN102638946B (en) | 2014-07-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103596372B (en) * | 2013-11-29 | 2016-08-31 | 丁保美 | Pcb board ultrasound wave grout method |
| CN105205195B (en) * | 2014-06-25 | 2020-05-22 | 鸿合科技股份有限公司 | Connection method and device |
| CN108901139A (en) * | 2018-08-16 | 2018-11-27 | 鹤山市得润电子科技有限公司 | A kind of single-sided circuit board and its manufacturing method |
| CN111511120B (en) * | 2020-06-09 | 2021-05-25 | 胜宏科技（惠州）股份有限公司 | Raided Pad manufacturing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201383901Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Buried hole type circuit board |
| CN201383900Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Blind hole type circuit board |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201383901Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Buried hole type circuit board |
| CN201383900Y (en) * | 2009-02-18 | 2010-01-13 | 王定锋 | Blind hole type circuit board |
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