CN101686609B - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN101686609B CN101686609B CN2008103046726A CN200810304672A CN101686609B CN 101686609 B CN101686609 B CN 101686609B CN 2008103046726 A CN2008103046726 A CN 2008103046726A CN 200810304672 A CN200810304672 A CN 200810304672A CN 101686609 B CN101686609 B CN 101686609B
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- junction point
- conductive
- carbon nano
- tube
- conductive junction
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Abstract
The invention relates to a circuit board, which sequentially comprises a first conductive layer, a composite material layer and a second conductive layer, wherein the first conductive layer is provided with a first conductive circuit and a first conductive contact; the second conductive layer is provided with a second conductive circuit and a second conductive contact; the second conductive contact corresponds to the first conductive contact; the composite material layer comprises an insulating substrate and a carbon nanotube; the insulating substrate is used for separating the first conductive circuit and the second conductive circuit; the carbon nanotube is provided with a first end and a second end which are opposite; the first end is electrically connected with the first conductive contact; and the second end is electrically connected with the second conductive contact.
Description
Technical field
The present invention relates to circuit board technology, be electrically connected the high circuit board of reliability between especially a kind of each conductive layer.
Background technology
Along with the development of electronic product toward miniaturization, high speed direction, circuit board also develops toward multi-layered high-density circuit board direction from single face circuit board, double-sided PCB.The multi-layered high-density circuit board is meant the circuit board with multilayer conductive circuit, it has more wiring area, higher interconnect density, thereby be widely used, see also Takahashi, A. wait the people to be published in IEEE Trans.on Components in 1992, Packaging, the document High density multilayer printed circuit board for HITAC M-880 of and Manufacturing Technology.
Often realize being electrically connected between each conductive layer of multilayer circuit board by guide hole.Described guide hole is meant through hole, blind hole or the buried via hole that penetrates the resin bed between each layer conducting wire, and its hole wall has the electric conducting material that is used to be electrically connected each layer conducting wire.This electric conducting material can be electroplated by hole wall and form, and also can form by filled conductive material in the hole.Yet along with the increase of the circuit board number of plies, the degree of depth of circuit board apertures can increase, and the space can appear in the electric conducting material that is formed in the hole by the filled conductive material, and the electric conducting material that forms by plating mode also may not cover hole wall fully.Above situation makes the reliability of guide hole reduce greatly, and directly has influence on the electrical connection effect between each layer of circuit board conducting wire, and then influences the service behaviour of multilayer circuit board.
Therefore, be necessary to provide the high circuit board of electrical connection reliability between a kind of each conductive layer.
Summary of the invention
A kind of circuit board comprises first conductive layer, composite layer and second conductive layer successively.Described first conductive layer has first conducting wire and first conductive junction point, and described second conductive layer has second conducting wire and second conductive junction point, and described second conductive junction point is corresponding with first conductive junction point.Described composite layer comprises insulating body and carbon nano-tube.Described insulating body is used for first conducting wire and second conducting wire at interval.Described carbon nano-tube has the first relative end and second end.Described first end is electrically connected with first conductive junction point, and described second end is electrically connected with second conductive junction point.
The circuit board of the technical program comprises composite layer, described composite layer has insulating body and carbon nano-tube, insulating body is used for the conducting wire of different conductive layers at interval, carbon nano-tube is used for the conductive junction point of different conductive layers is electrically connected, thereby improves the electrical connection between each conductive layer of circuit board.Because carbon nano-tube has high conductivity and favorable mechanical performance, therefore, the electrical connection between each conductive layer of circuit board has high-reliability, in addition, because carbon nano-tube has high-termal conductivity, can make that also circuit board has good heat-conducting.
Description of drawings
Fig. 1 is the schematic diagram of the circuit board that provides of the technical program first embodiment.
Fig. 2 is the schematic diagram of the circuit board that provides of the technical program second embodiment.
Fig. 3 is the schematic diagram of the substrate that provides of the technical program second embodiment.
Fig. 4 is the schematic diagram after substrate grown that the technical program second embodiment provides goes out carbon nano-tube.
Fig. 5 is the schematic diagram of the composite layer of gained behind the curable dielectric material that provides of the technical program second embodiment.
Fig. 6 is the schematic diagram of the composite layer of gained after the removal substrate that provides of the technical program second embodiment.
Fig. 7 is the schematic diagram of the composite layer of gained behind the curable dielectric material once more that provides of the technical program second embodiment.
Fig. 8 is the schematic diagram after the composite layer boring that provides of the technical program second embodiment.
Fig. 9 is the schematic diagram after the composite layer hole conducting that provides of the technical program second embodiment.
Figure 10 is the schematic diagram of the circuit board that provides of the technical program the 3rd embodiment.
Embodiment
Below in conjunction with accompanying drawing and a plurality of embodiment, the circuit board of the technical program is described in further detail.
See also Fig. 1, the circuit board 10 of the technical program first embodiment comprise first conductive layer 11, second conductive layer 12 and be arranged at first conductive layer 11 and second conductive layer 12 between composite layer 13.
First conductive layer 11 has first conducting wire 110 and first conductive junction point 111.Second conductive layer 12 has second conducting wire 120 and second conductive junction point, 121, the second conductive junction points 121 are corresponding with first conductive junction point 111.First conducting wire 110 and second conducting wire 120 all are used to realize the transmission of signal, and first conductive junction point 111 and second conductive junction point 121 all are used for being connected with electronic component.
The manufacture method of circuit board 10 can may further comprise the steps:
The first step provides a substrate that is formed with catalyst film.
Second step, adopt chemical vapour deposition technique in described substrate, to grow carbon nano tube bundle with many carbon nano-tube 133, first end 134 of each carbon nano-tube 133 is connected with substrate, and second end 135 extends toward the direction away from substrate perpendicular to substrate.
The 3rd step made a plurality of carbon nano-tube 133 and insulating body 132 form one in modes such as pressing or castings, removed substrate again to obtain composite layer 13.Wherein, carbon nano tube bundle only is arranged at the precalculated position of composite layer 13, and first end 134 of carbon nano-tube 133 and second end 135 are exposed to the first surface 130 and the second surface 131 of composite layer 13 respectively.
The 4th step is at the first surface 130 and second surface 131 difference pressing first conductive layer 11 and second conductive layers 12 of composite layer 13.Wherein, first conductive layer 11 and second conductive layer 12 all can be Copper Foil, and combine with composite layer 13 by the mode of hot pressing.
The 5th step formed conductive pattern with first conductive layer 11, promptly formed first conducting wire 110 and first conductive junction point 111, and second conductive layer 12 is also formed conductive pattern, promptly formed second conducting wire 120 and second conductive junction point 121.Described first conductive junction point 111 is corresponding with first end 134, described second conductive junction point 121 is corresponding with second end 135, so that realize being electrically connected reliably by carbon nano-tube 133 between first conductive junction point 111 and second conductive junction point 121, thereby acquisition circuit board 10 as shown in Figure 1.
See also Fig. 2, the circuit board 10 that the circuit board 20 of the technical program second embodiment and first embodiment provide is roughly the same, and its difference is that many carbon nano-tube 233 disperse to be embedded in the insulating body 232 insulated from each otherly.That is, 233 one-tenth array-likes of a plurality of carbon nano-tube are evenly disperseed, and are filled with insulating body 232 between the adjacent carbon nano-tube 233.In the present embodiment, the length of each carbon nano-tube 233 is all less than the thickness of insulating body 232.Described first end 234 is embedded in the insulating body 232, is electrically connected with first conductive junction point 211 by first guide hole 236, and second end 235 is embedded in the insulating body 232, is electrically connected with second conductive junction point 221 by second guide hole 237.
Described first guide hole 236 is offered to first end 234 of carbon nano-tube 233 from first surface 230, fills full electric conducting material in it and is electrically connected with first the reliable of end 234 to realize first conductive junction point 211.Described second guide hole 237 is offered to second end 235 of carbon nano-tube 233 from second surface 231, also fills full electric conducting material in it and is electrically connected with second the reliable of end 235 to realize second conductive junction point 221.
This circuit board 20 can adopt following steps to make:
The first step provides a substrate 40 that is formed with catalyst film 41, as shown in Figure 3.
In second step, adopt chemical vapour deposition technique in described substrate 40, to grow many carbon nano-tube 233 of evenly disperseing to arrange, as shown in Figure 4.Second end 235 of each carbon nano-tube 233 is connected with the catalyst film 41 of substrate 40, and first end 234 extends toward the direction away from substrate 40 perpendicular to substrate 40.
In the 3rd step, form composite layer 23.
At first insulating material or its solution are put on many carbon nano-tube 233 in modes such as dip-coating, coating, pressing or castings, so that insulating material fully is filled in the space between the many carbon nano-tube 233, and coat first end 234 of each carbon nano-tube 233, and solidify described insulating material, as shown in Figure 5.
Secondly, see also Fig. 6, remove substrate 40.
Once more, apply one deck insulating material and solidify,, thereby obtain composite layer 23 as shown in Figure 7 so that insulating material coats second end 235 of each carbon nano-tube 233 at second end 235 of carbon nano-tube 233.
The 4th step, first hole 2360 is bored to expose first end 234 of carbon nano-tube 233 in precalculated position at the first surface 230 of composite layer 23, second hole 2370 is bored to expose second end 235 of carbon nano-tube 233, as shown in Figure 8 in the precalculated position on second surface 231.
Be appreciated that first hole 2360 and second hole 2370 can form by modes such as laser drill, machine drilling or chemical etchings.The degree of depth in first hole 2360 and second hole 2370 is as the criterion to expose carbon nanotube layer 231, in the present embodiment, for reduce the degree of depth in hole as far as possible, the degree of depth in first hole 2360 equals the distance between first end 234 of first surface 230 and carbon nano-tube 233, and the degree of depth in second hole 2370 equals the distance between second end 235 of second surface 231 and carbon nano-tube 233.
In the 5th step, respectively the hole conducting is carried out in described first hole 2360 and second hole 2370 and obtained first guide hole 236 and second guide hole 237.
Be appreciated that the hole conduction mode can be filling perforation conducting or plating hole conducting, adopts the filling perforation conduction mode in the present embodiment, promptly, to obtain first guide hole 236, the filled conductive materials are to obtain second guide hole 237, as shown in Figure 9 in past second hole 2370 toward first hole, 2360 interior filled conductive materials.Electric conducting material can be copper cream, silver paste, tin cream or conducting resinl etc.
The 6th step, first surface 230 and second surface 231 difference pressing first conductive layer 21 and second conductive layers 22 at composite layer 23, and with first conductive layer, 21 formation first conducting wires 210 and first conductive junction point, 211, the second conductive layers, 22 formation second conducting wire 220 and second conductive junction points 221.First conductive junction point 211 is corresponding with first guide hole 236, second conductive junction point 221 is corresponding with second guide hole 237, so that realize being electrically connected by first guide hole 236, carbon nano-tube 233 and second guide hole 237 successively between first conductive junction point 211 and second conductive junction point 221.Wherein, first conducting wire 210 and second conducting wire 220 can form by steps such as influence transfer, etchings.
See also Figure 10, circuit board 30 that the technical program the 3rd embodiment provides and the circuit board 20 of second embodiment are roughly the same, its difference is that composite layer 33 comprises first insulating barrier 330, carbon nano pipe array layer 331 and second insulating barrier 332 that stacks gradually.Carbon nano pipe array layer 331 comprises many equal in length and compact arranged carbon nano-tube 333.
Particularly, described first insulating barrier 330 has opposite first 3300 and second surface 3301, and wherein, second surface 3301 contacts with first end 334 of carbon nano-tube 333.Second insulating barrier 332 has the 3320 and the 4th surface 3321, relative the 3rd surface, and wherein, described the 3rd surface 3320 contacts with second end 335 of carbon nano-tube 333.First guide hole 336 is opened in first insulating barrier 330, and corresponding with first conductive junction point 311.First guide hole 336 runs through first surface 3300 and second surface 3301, fills full electric conducting material in it, is electrically connected with first the reliable of end 334 to realize first conductive junction point 311.Second guide hole 337 is opened in second insulating barrier 332, and corresponding with second conductive junction point 312.Second guide hole 337 runs through the 3320 and the 4th surface 3321, the 3rd surface, fills full electric conducting material in it, is electrically connected with second the reliable of end 335 to realize second conductive junction point 312.
The step of the manufacture method of this circuit board 30 and circuit board 20 roughly the same.In the present embodiment, composite layer 33 is first insulating barrier 330, carbon nano pipe array layer 331 and second insulating barrier 332 to be formed at one by the pressing mode obtain.
The circuit board of the technical program comprises composite layer, described composite layer has insulating body and carbon nano-tube, insulating body is used for the conducting wire of different conductive layers at interval, carbon nano-tube is used for the conductive junction point of different conductive layers is electrically connected, thereby improves the electrical connection between each conductive layer of circuit board.Because carbon nano-tube has high conductivity and favorable mechanical performance, therefore, the electrical connection between each conductive layer of circuit board has high-reliability, in addition, because carbon nano-tube has high-termal conductivity, can make that also circuit board has good heat-conducting.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (6)
1. circuit board, comprise first conductive layer successively, the composite layer and second conductive layer, described first conductive layer has first conducting wire and first conductive junction point, described second conductive layer has second conducting wire and second conductive junction point, described second conductive junction point is corresponding with first conductive junction point, described composite layer comprises insulating body and Duo Gen carbon nano-tube, described insulating body is used for first conducting wire and second conducting wire at interval, described many carbon nano-tube are closely arranged, constitute carbon nano tube bundle, described carbon nano tube bundle is corresponding with first conductive junction point and second conductive junction point, the length of every carbon nano-tube equates with insulating body thickness, every carbon nano-tube all has the first relative end and second end, described first end is electrically connected with first conductive junction point, and described second end is electrically connected with second conductive junction point.
2. circuit board as claimed in claim 1, it is characterized in that the material of described insulating body is to be selected from epoxy resin, glass cloth, polyimides, polyethylene terephthalate glycol, polytetrafluoroethylene, poly-thiamines, polymethyl methacrylate, Merlon and the polyimides-polyethylene-terephthaldehyde's ester copolymer one or more.
3. circuit board as claimed in claim 1 is characterized in that, the axis of every carbon nano-tube is all perpendicular to first conductive layer and second conductive layer.
4. circuit board, comprise first conductive layer successively, the composite layer and second conductive layer, described first conductive layer has first conducting wire and first conductive junction point, described second conductive layer has second conducting wire and second conductive junction point, described second conductive junction point is corresponding with first conductive junction point, described composite layer comprises insulating body and Duo Gen carbon nano-tube, described insulating body is used for first conducting wire and second conducting wire at interval, these many carbon nano-tube are embedded in the insulating body insulated from each otherly, every carbon nano-tube all has the first relative end and second end, described first end is electrically connected with first conductive junction point, described second end is electrically connected with second conductive junction point, and the length of every carbon nano-tube is all less than the thickness of insulating body.
5. circuit board as claimed in claim 4 is characterized in that, described first end is electrically connected with first conductive junction point by first guide hole, and described second end is electrically connected with second conductive junction point by second guide hole.
6. circuit board, comprise first conductive layer successively, the composite layer and second conductive layer, described first conductive layer has first conducting wire and first conductive junction point, described second conductive layer has second conducting wire and second conductive junction point, described second conductive junction point is corresponding with first conductive junction point, described composite layer comprises first insulating barrier of pressing successively, the carbon nano pipe array layer and second insulating barrier, first insulating barrier has first guide hole, second insulating barrier has second guide hole, described carbon nano pipe array layer is made of compact arranged carbon nano-tube, every carbon nano-tube all has the first relative end and second end, described first end is electrically connected with first conductive junction point by first guide hole, and described second end is electrically connected with second conductive junction point by second guide hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103046726A CN101686609B (en) | 2008-09-25 | 2008-09-25 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103046726A CN101686609B (en) | 2008-09-25 | 2008-09-25 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101686609A CN101686609A (en) | 2010-03-31 |
| CN101686609B true CN101686609B (en) | 2011-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008103046726A Expired - Fee Related CN101686609B (en) | 2008-09-25 | 2008-09-25 | Circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN101686609B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102143652B (en) * | 2010-01-30 | 2012-07-18 | 宏恒胜电子科技（淮安）有限公司 | Circuit board |
| SG11201909879QA (en) * | 2017-04-23 | 2019-11-28 | Fisher & Paykel Healthcare Ltd | Breathing assistance apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1044762C (en) * | 1993-09-22 | 1999-08-18 | 松下电器产业株式会社 | Printed circuit board and method of manufacturing the same |
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2008
- 2008-09-25 CN CN2008103046726A patent/CN101686609B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1044762C (en) * | 1993-09-22 | 1999-08-18 | 松下电器产业株式会社 | Printed circuit board and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN101686609A (en) | 2010-03-31 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161201 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 |