JPH06232558A - Manufacture of multilayer printed wiring board - Google Patents

Manufacture of multilayer printed wiring board

Info

Publication number
JPH06232558A
JPH06232558A JP5017190A JP1719093A JPH06232558A JP H06232558 A JPH06232558 A JP H06232558A JP 5017190 A JP5017190 A JP 5017190A JP 1719093 A JP1719093 A JP 1719093A JP H06232558 A JPH06232558 A JP H06232558A
Authority
JP
Japan
Prior art keywords
hole
wiring board
printed wiring
multilayer printed
conductive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5017190A
Other languages
Japanese (ja)
Inventor
Kenji Sasaoka
賢司 笹岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5017190A priority Critical patent/JPH06232558A/en
Publication of JPH06232558A publication Critical patent/JPH06232558A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a multilayer printed wiring board wherein thermoplastic resin is used as insulating base material, and a through-hole connection excellent in reliability can be obtained by a method wherein a second concentric through- hole is bored in a region where conductive composition is filled into a first connection through-hole, and a metal plating layer is formed on the inner wall of the second concentric through-hole. CONSTITUTION:A first through-hole 2 is bored in a laminate, a conductive composition 4 is filled into the through-hole 2. On the other hand, a land pattern 3a is formed around the through-hole 2 and dried out. A second through-hole 5 is concentrically bored in a region where the conductive composition 4 is filled into the first through-hole 2. That is, the inner wall of the second through- hole 5 is turned electrically conductive as a whole, and the vicinity of the opening (end face) of the second through-hole 5 is electrically connected to the land pattern 3a. Thereafter, by electroless plating, a plating layer is deposited on the inner wall of the second through-hole 5 and the land pattern 3a around the opening (end face) for the formation of a multilayer printed wiring board.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は多層プリント配線板の製
造方法に係り、特に熱可塑性樹脂を絶縁基材とした挿入
型電子部品の実装に適する多層プリント配線板の製造方
法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly to a method for manufacturing a multilayer printed wiring board suitable for mounting an insertion type electronic component using a thermoplastic resin as an insulating base material.

【0002】[0002]

【従来の技術】近年、電子部品を搭載・実装して回路部
品の小形化、もしくは高機能化を図った実装回路装置が
注目されている。そして、このような実装回路装置の構
成には、一般的に、次のようにして製造された多層プリ
ント配線板が使用されている。すなわち、所要の回路
(導体)パターンが主面に形成された内層配線板を、た
とえばプリプレグ層を介して位置決め・積層する一方、
さらに最外側面にCu箔貼り板を配置・積層した後、加熱
・加圧して一体化する。その後、所定の位置に接続用貫
通(スルーホール)孔を穿設し、このスルーホール孔内
壁面に無電解メッキ層を被着形成して、さらに要すれば
スルーホールエッジの断線防止のため、電解メッキで厚
付けする。次いで、外側のCu箔面にドライフィルムを積
層配置し、このドライフィルムに選択・露光、アルカリ
現像を施してパターニングした後、前記Cu箔の選択エッ
チングおよびエッチングレジストを除去することにより
製造している。
2. Description of the Related Art In recent years, a mounting circuit device in which electronic parts are mounted and mounted to make the circuit parts compact or highly functional has been receiving attention. A multilayer printed wiring board manufactured as described below is generally used for the configuration of such a mounted circuit device. That is, while positioning and stacking the inner layer wiring board having the required circuit (conductor) pattern formed on the main surface through, for example, a prepreg layer,
Furthermore, after arranging and stacking a Cu foil pasting plate on the outermost surface, heating and pressing are integrated. After that, a through hole (through hole) for connection is formed at a predetermined position, an electroless plating layer is formed on the inner wall surface of the through hole, and if necessary, to prevent disconnection of the through hole edge, Thicken by electrolytic plating. Next, a dry film is laminated on the outer Cu foil surface, and the dry film is subjected to selective exposure, alkali development and patterning, and then the selective etching of the Cu foil and the etching resist are removed to produce the film. .

【0003】また、一般用の多層プリント配線板を得る
手段として、所要の回路パターン層間の接続用貫通孔を
穿設した熱可塑性樹脂フィルムの少なくとも一主面に、
たとえば銅箔を接着剤層を介して貼り合わせ、前記の場
合と同様にフォトエッチング処理などを施して所要の導
体(回路)パターンを形成した後、その回路素板の複数
枚を積層し、加熱・加圧成形(熱可塑性樹脂の融着作
用)により一体化して、所要の多層プリント配線板を得
る手段が知られている。
As a means for obtaining a general-purpose multilayer printed wiring board, at least one main surface of a thermoplastic resin film having through holes for connection between required circuit pattern layers is provided.
For example, copper foils are bonded together via an adhesive layer, and the same conductor (circuit) patterns are formed by photoetching as in the above case, and then multiple circuit base plates are laminated and heated. A means for obtaining a desired multilayer printed wiring board by integrating by pressure molding (fusing action of thermoplastic resin) is known.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記し
た多層プリント配線板の製造方法においては、次のよう
な不都合が認められる。すなわち、接続用の貫通孔内壁
面に被着・形成する金属層が一様な厚さでなかったり、
ときには不連続部分が発生したりするため、工程上煩雑
ないし複雑な(細かい)注意を要するので、コストアッ
プを招いたり、あるいは生産性がそこなわれ易いなどの
問題があるばかりでなく、信頼性の点でも問題がある。
つまり、スルーホール接続の形成において、スルーホー
ル孔内壁面に無電解メッキ層を、一様に被着形成するこ
とが事実上困難であるめ、信頼性の高い導電性接続を形
成し難いことが先ず挙げられる。また、スルーホール孔
内壁面に無電解メッキ層を被着形成した後、外側面の回
路パターニングを行う際、使用するアルカリ溶液によっ
て、前記被着形成されているスルーホール孔内壁面の無
電解メッキ層が犯される場合があり、結果的にスルーホ
ール部の接続信頼性が大幅に損なわれ易いという問題も
ある。
However, the following disadvantages are recognized in the above-mentioned method for manufacturing a multilayer printed wiring board. That is, the metal layer deposited / formed on the inner wall surface of the through hole for connection does not have a uniform thickness,
Occasionally, discontinuities occur, which requires complicated or complicated (detailed) attention in the process, which not only causes problems such as cost increase or productivity loss, but also reliability. There is also a problem.
That is, in forming a through-hole connection, it is practically difficult to uniformly deposit and form an electroless plating layer on the inner wall surface of the through-hole, and it is difficult to form a highly reliable conductive connection. First of all. Further, after the electroless plating layer is formed on the inner wall surface of the through hole, the electrolysis plating of the inner wall surface of the formed through hole is performed depending on the alkaline solution used when performing the circuit patterning on the outer surface. There is also a problem in that the layers may be violated, and as a result, the connection reliability of the through hole portion is likely to be significantly impaired.

【0005】本発明は上記事情に対処してなされたもの
で、熱可塑性樹脂を絶縁基材とし、かつ信頼性の高いス
ルーホール接続部を備え、挿入型電子部品の搭載・実装
用に適する多層プリント配線板を容易、かつ歩留まりよ
く製造し得る製造方法の提供を目的とする。
The present invention has been made in view of the above circumstances, and is a multilayered structure suitable for mounting / mounting insertion-type electronic components, using a thermoplastic resin as an insulating base material, and having a highly reliable through-hole connecting portion. An object of the present invention is to provide a manufacturing method capable of manufacturing a printed wiring board easily and with a high yield.

【0006】[0006]

【課題を解決するための手段】本発明の多層プリント配
線板の製造方法は、熱可塑性樹脂層の主面に所要の導体
パターンを形成する工程と、前記導体パターンを形成し
た熱可塑性樹脂層を位置合せ・積層して加熱・加圧成形
により一体化する工程と、前記一体化した積層体の所定
位置に第1の接続用貫通孔を穿設する工程と、前記穿設
した第1の接続用貫通孔内を導電性組成物で充填・埋設
する工程と、前記第1の接続用貫通孔内を充填・埋設し
た導電性組成物領域内に同心的な第2の貫通孔を穿設す
る工程と、前記穿設した第2の貫通孔内壁面に金属メッ
キ層を被着形成して貫通導体層を形成する工程とを具備
して成ることを特徴とする。
A method for manufacturing a multilayer printed wiring board according to the present invention comprises a step of forming a required conductor pattern on a main surface of a thermoplastic resin layer and a step of forming the thermoplastic resin layer on which the conductor pattern is formed. Steps of aligning / stacking and integrating by heating / pressure molding, drilling a first connecting through hole at a predetermined position of the integrated stacked body, and drilling the first connecting And filling the inside of the through hole for use with a conductive composition, and forming a concentric second through hole in the area of the conductive composition where the inside of the first through hole for connection is filled and buried. And a step of depositing a metal plating layer on the inner wall surface of the bored second through hole to form a through conductor layer.

【0007】[0007]

【作用】上記本発明に係る多層プリント配線板の製造方
法においては、多層配線(回路)層を加熱・加圧成形し
て一体化した後、所定位置に穿設した第1の接続用貫通
孔を導電性組成物で充填・埋設し、この充填・埋設した
導電性組成物領域内に、前記第1の接続用貫通孔と同心
円的に第2の接続用貫通孔を穿設し、その内壁面を成す
導電性組成物層上にメッキ層を形成する方式を採ってい
る。つまり、メッキ層は、緩衝材的な作用も併せて呈す
る緻密な導電性組成物層上に被着形成される形態を採る
ため、一様で信頼性の高い接続導電性層を高寸法精度
に、かつ確実に形成される。そして、メッキ形成された
接続導電性層は、電子部品のリードを挿入したときなど
も、良好な半田のり性を呈するので、コスト面や生産性
の改善・改良が併せて図られた実装回路装置の構成に適
する多層プリント配線板の製造方法といえる。
In the method for manufacturing a multilayer printed wiring board according to the present invention, the first connecting through hole is formed at a predetermined position after the multilayer wiring (circuit) layer is heated and pressure-molded to be integrated. Is filled / embedded with a conductive composition, and a second connection through hole is concentrically formed with the first connection through hole in the filled / embedded conductive composition region. A method of forming a plating layer on the conductive composition layer forming the wall surface is adopted. That is, since the plating layer has a form in which it is deposited on the dense conductive composition layer that also acts as a cushioning material, a uniform and highly reliable connection conductive layer can be formed with high dimensional accuracy. And reliably formed. The plated connection conductive layer exhibits good solderability even when the leads of the electronic component are inserted, so that the cost and productivity of the mounted circuit device are improved. It can be said that it is a method for manufacturing a multilayer printed wiring board suitable for the above configuration.

【0008】[0008]

【実施例】以下、図1〜図4を参照して本発明の実施例
を説明する。
Embodiments of the present invention will be described below with reference to FIGS.

【0009】先ず、熱可塑性樹脂フィルムとして、所要
の寸法にカットした厚さ75μm のポリフェニレンサルフ
ァイド樹脂フィルム複数枚を用意した。次いで、前記各
ポリフェニレンサルファイド樹脂フィルムの片面、もし
くは両面に導電性ペースト、たとえば粘度 200〜 350Ps
程度のAgペーストをスクリーン印刷して、厚さ10μm程
度の所要の導電パターン(回路パターン)をそれぞれ形
成した。その後、約170℃の温度で乾燥処理し、形成し
た回路パターンをそれぞれ乾燥させてから、それらポリ
フェニレンサルファイド樹脂フィルムを位置合わせし、
積層して加熱加圧型プレスにより、 300℃,4 kg/cm2
の条件で加熱加圧・一体化した。
First, as the thermoplastic resin film, a plurality of polyphenylene sulfide resin films each having a thickness of 75 μm and cut into required dimensions were prepared. Next, a conductive paste, for example, a viscosity of 200 to 350 Ps, is applied to one side or both sides of each polyphenylene sulfide resin film.
About Ag paste was screen-printed to form required conductive patterns (circuit patterns) each having a thickness of about 10 μm. After that, it is dried at a temperature of about 170 ° C., the formed circuit patterns are respectively dried, and then the polyphenylene sulfide resin films are aligned,
Laminate and press with heat and pressure type press at 300 ℃, 4 kg / cm 2
It was heated, pressurized and integrated under the conditions of.

【0010】次いで、図1に要部を断面的に示すごと
く、上記で形成した積層体1の所定位置に、パンチング
金型もしくはドリルなどの孔明け手段によって、たとえ
ば直径1.0〜 1.2mm程度の厚さ方向に貫通する第1の貫
通孔2を穿設した。なお、図1において、3は導電パタ
ーン(回路パターン)をそれぞれ示す。ここで、導電パ
ターン3の形成は、たとえば銅箔を選択エッチングして
得た所要の導電パターンをフィルム面に張り合わせても
よい。
Next, as shown in a sectional view of the main part in FIG. 1, at a predetermined position of the laminated body 1 formed as described above, a punching die or a drilling means such as a drill is used to form the laminated body 1 having a thickness of, for example, 1.0 to 1.2 mm. A first through hole 2 penetrating in the vertical direction was formed. In FIG. 1, 3 indicates a conductive pattern (circuit pattern), respectively. Here, the conductive pattern 3 may be formed by, for example, laminating a desired conductive pattern obtained by selectively etching a copper foil on the film surface.

【0011】その後、図2に要部を断面的に示すごと
く、前記孔明け加工した積層体1の第1の貫通孔2内に
導電性組成物4を充填・埋設する。たとえば、ポリスル
ホン樹脂をバインダーとする粘度 500〜 700Ps程度のAg
ペーストを、スクリーン印刷法によって積層体1の第1
の貫通孔2内に充填・埋設する一方、貫通孔2周辺部に
ランドパターン3aを形成した後、乾燥処理を施す。この
ようにして、第1の貫通孔2内を充填・埋設した導電性
組成物4の領域に、たとえばパンチング金型もしくはド
リルなどの孔明け手段によって、図3に要部を断面的に
示すごとく、前記第1の貫通孔2に対して同心円的に、
搭載・実装する電子部品のリード挿入用の貫通孔とし
て、直径 0.8〜 1.0mm程度の厚さ方向に貫通する第2の
貫通孔5を穿設した。つまり、内壁面が全体的に導電性
化し、かつ開口(端面)周辺部がランドパターン3aに電
気的に接続している第2の貫通孔5が穿設された。
After that, as shown in a sectional view of the main part in FIG. 2, the conductive composition 4 is filled and embedded in the first through hole 2 of the perforated laminate 1. For example, Ag with polysulfone resin as a binder and a viscosity of about 500 to 700 Ps
The paste is applied to the first layer of the laminate 1 by screen printing.
While being filled and buried in the through hole 2 of FIG. 1, the land pattern 3a is formed in the peripheral portion of the through hole 2 and then dried. In this way, in the region of the electrically conductive composition 4 which fills / embeds the inside of the first through hole 2, for example, by punching means such as a punching die or a drill, as shown in FIG. , Concentrically to the first through hole 2,
A second through hole 5 having a diameter of 0.8 to 1.0 mm and penetrating in the thickness direction was formed as a through hole for inserting a lead of an electronic component to be mounted and mounted. That is, the second through hole 5 is formed in which the inner wall surface is made entirely conductive and the peripheral portion of the opening (end surface) is electrically connected to the land pattern 3a.

【0012】上記したように、第2の貫通孔5を穿設し
てから、その積層体1を、たとえば浴温を60℃程度に設
定した化学Cuメッキ液(無電解Cuメッキ液)中に約 3時
間浸漬して、いわゆる無電解メッキ処理を施して、前記
第2の貫通孔5内壁面、およびその開口(端面)周辺部
のランドパターン3a面に、厚さ10μm 程度のCuメッキ層
6を選択的に被着形成することにより、図4に要部を断
面的に示すごとく構成された多層プリント配線板が得ら
れた。
As described above, after forming the second through hole 5, the laminated body 1 is immersed in a chemical Cu plating solution (electroless Cu plating solution) whose bath temperature is set to about 60 ° C., for example. After soaking for about 3 hours and subjecting to so-called electroless plating, a Cu plating layer 6 having a thickness of about 10 μm is formed on the inner wall surface of the second through hole 5 and the land pattern 3a surface around the opening (end surface). By selectively adhering and forming, a multi-layer printed wiring board having a main part shown in cross section in FIG. 4 was obtained.

【0013】なお、上記では、主たる絶縁体層(絶縁基
材)をなす熱可塑性樹脂フィルムとして、ポリフェニレ
ンサルファイド樹脂フィルムを用いた例を示したが、熱
可塑性樹脂としてはこれに限られず、たとえばポリスル
フォン樹脂、ポリカーボネート樹脂、ポリスチレン樹
脂、ポリエーテルスルホン樹脂、ポリアセタール樹脂、
ポリエーテルケトン樹脂、ポリエーテルイミド樹脂、ポ
リフェニレンオキサイド樹脂、アクリル樹脂、ポリエチ
レン樹脂、ABS樹脂、ポリアミド樹脂、ポリ塩化ビニ
ル樹脂、フッ素樹脂、ポリエーテルエーテルケトン樹脂
などのフィルムを使用することができる。また、その厚
さや多層化する層数なども、製造する多層回路基板の用
途などに応じて適宜選択設定することができる。
In the above, an example in which a polyphenylene sulfide resin film is used as the thermoplastic resin film forming the main insulator layer (insulating base material) has been shown, but the thermoplastic resin is not limited to this, and for example, a polyphenylene sulfide resin film may be used. Sulfone resin, polycarbonate resin, polystyrene resin, polyether sulfone resin, polyacetal resin,
Films of polyetherketone resin, polyetherimide resin, polyphenylene oxide resin, acrylic resin, polyethylene resin, ABS resin, polyamide resin, polyvinyl chloride resin, fluorine resin, polyetheretherketone resin and the like can be used. Also, the thickness and the number of layers to be multilayered can be appropriately selected and set according to the application of the multilayer circuit board to be manufactured.

【0014】一方、接続用の貫通孔を充填・埋設する導
電性ペーストも、上記例示したポリサルフォン樹脂をバ
インダーとしたAgペーストに限定されず、前記したよう
な他の熱可塑性樹脂、もしくは熱硬化性樹脂をバインダ
としてもよいし、さらに、たとえばAu、Cu,Ni、 W、S
n、Mo、Al、Ptなどの金属粉や、カーボン粉、 SiC粉、V
2 O 5 粉などの半導電性粉末を含有分散させたものを用
いてもよい。
On the other hand, the conductive paste for filling and burying the through-holes for connection is not limited to the Ag paste using the polysulfone resin exemplified above as a binder, but may be any other thermoplastic resin as described above, or a thermosetting resin. A resin may be used as a binder, and further, for example, Au, Cu, Ni, W, S
Metal powder such as n, Mo, Al, Pt, carbon powder, SiC powder, V
It is also possible to use a dispersion containing a semiconductive powder such as 2 O 5 powder.

【0015】[0015]

【発明の効果】以上説明したように本発明によれば、多
層配線(回路)層を加熱・加圧成形して一体化した後、
所定位置に穿設した接続用貫通孔内を、導電性組成物で
充填・埋設して硬化した導電性組成物領域とした後、再
び接続用貫通孔を穿設し、その内壁面にメッキ層を形成
する方式を採っている。つまり、メッキ層は導電性組成
物面上に被着形成される形態を採るため、高寸法精度
で、かつ信頼性の高い導電性層が確実に形成される。し
かも、前記導電性組成物層は比較的厚く、主たる絶縁体
層(絶縁基材)を成す熱可塑性樹脂に対し、挿入リード
の半田付け接続で緩衝材的に作用して、すぐれた耐衝撃
性を呈する一方、メッキ形成された接続導電性層は、電
子部品のリードを挿入したときなども、良好な半田のり
性を呈する。したがって、本発明に係る多層プリント配
線板の製造方法は、上記信頼性の高い実装・接続が可能
なこと、信頼性の高い機能を保持・発揮することなどに
基づき、コスト面や生産性(歩留まり)の改善・改良も
併せて図られた実装回路装置の構成に適する多層プリン
ト配線板の製造方法といえる。
As described above, according to the present invention, after the multilayer wiring (circuit) layers are heated and pressure-molded and integrated,
After the inside of the connecting through hole formed at a predetermined position is filled with a conductive composition and embedded to form a cured conductive composition region, the connecting through hole is again formed, and a plating layer is formed on the inner wall surface thereof. The method of forming is adopted. That is, since the plating layer has a form in which it is deposited on the surface of the conductive composition, the conductive layer can be reliably formed with high dimensional accuracy and high reliability. Moreover, the conductive composition layer is relatively thick and acts as a cushioning material on the thermoplastic resin forming the main insulator layer (insulating base material) by soldering the insertion lead, and has excellent impact resistance. On the other hand, the connection conductive layer formed by plating exhibits good solderability even when a lead of an electronic component is inserted. Therefore, the method for manufacturing a multilayer printed wiring board according to the present invention is based on the fact that the above-mentioned highly reliable mounting / connection can be performed and that the highly reliable function can be retained / executed. It can be said that the manufacturing method of the multilayer printed wiring board is suitable for the configuration of the mounted circuit device, which has also been improved and improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る多層プリント配線板の製造方法の
実施態様を模式的に示したもので、多層積層体(多層プ
リント配線板)の所定箇所に第1の接続用貫通孔を穿設
した状態の要部断面図。
FIG. 1 schematically shows an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention, in which a first connecting through hole is formed at a predetermined position of a multilayer laminate (multilayer printed wiring board). Sectional drawing of the principal part of the completed state.

【図2】本発明に係る多層プリント配線板の製造方法の
実施態様を模式的に示したもので、多層積層体(多層プ
リント配線板)の所定箇所に穿設した第1の接続用貫通
孔内を導電性組成物で充填・埋設した状態の要部断面
図。
FIG. 2 schematically shows an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention, in which a first through-hole for connection formed at a predetermined position of a multilayer laminate (multilayer printed wiring board). Sectional drawing of the principal part in the state where the inside was filled with the conductive composition and embedded.

【図3】本発明に係る多層プリント配線板の製造方法の
実施態様を模式的に示したもので、充填・埋設した第1
の接続用貫通孔内の導電性組成物領域に同心円的にに第
2の接続用貫通孔を穿設した状態の要部断面図。
FIG. 3 schematically shows an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention, in which the first filling and embedding is performed.
FIG. 4 is a cross-sectional view of an essential part of a state in which a second connecting through hole is concentrically formed in the conductive composition region in the connecting through hole.

【図4】本発明に係る多層プリント配線板の製造方法の
実施態様を模式的に示したもので、同心円的に穿設した
第2の接続用貫通孔内壁面に導電性メッキ層を形成した
状態の要部断面図。
FIG. 4 schematically shows an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention, in which a conductive plating layer is formed on the inner wall surface of a second through hole for connection which is concentrically formed. Sectional drawing of the principal part of a state.

【符号の説明】[Explanation of symbols]

1…多層配線積層体 2…第1の接続用貫通孔 3
…導電パターン(回路パターン) 4…導電性組成物
5…第2の接続用貫通孔 6…無電解Cuメッキ層
7…多層プリント配線板
DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring laminated body 2 ... 1st through-hole for connection 3
... Conductive pattern (circuit pattern) 4 ... Conductive composition 5 ... Second through-hole for connection 6 ... Electroless Cu plating layer 7 ... Multilayer printed wiring board

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 熱可塑性樹脂層の主面に所要の導体パタ
ーンを形成する工程と、前記導体パターンを形成した熱
可塑性樹脂層を位置合せ・積層して加熱・加圧成形によ
り一体化する工程と、前記一体化した積層体の所定位置
に第1の接続用貫通孔を穿設する工程と、前記穿設した
第1の接続用貫通孔内を導電性組成物で充填・埋設する
工程と、前記第1の接続用貫通孔内を充填・埋設した導
電性組成物領域内に同心的な第2の貫通孔を穿設する工
程と、前記穿設した第2の貫通孔内壁面に金属メッキ層
を被着形成して貫通導体層を形成する工程とを具備して
成ることを特徴とする多層プリント配線板の製造方法。
1. A step of forming a required conductor pattern on a main surface of a thermoplastic resin layer, and a step of aligning and stacking the thermoplastic resin layer having the conductor pattern and integrating them by heating and pressure molding. And a step of forming a first connecting through hole at a predetermined position of the integrated laminate, and a step of filling and burying the inside of the formed first connecting through hole with a conductive composition. A step of forming a concentric second through hole in the conductive composition region filling / embedded in the first connecting through hole, and a metal on the inner wall surface of the formed second through hole. A method of manufacturing a multilayer printed wiring board, comprising the steps of depositing a plating layer to form a through conductor layer.
JP5017190A 1993-02-04 1993-02-04 Manufacture of multilayer printed wiring board Withdrawn JPH06232558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5017190A JPH06232558A (en) 1993-02-04 1993-02-04 Manufacture of multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5017190A JPH06232558A (en) 1993-02-04 1993-02-04 Manufacture of multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPH06232558A true JPH06232558A (en) 1994-08-19

Family

ID=11937023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5017190A Withdrawn JPH06232558A (en) 1993-02-04 1993-02-04 Manufacture of multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPH06232558A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
US6768061B2 (en) 2001-07-06 2004-07-27 Denso Corporation Multilayer circuit board
US6818836B2 (en) 2001-06-13 2004-11-16 Denso Corporation Printed circuit board and its manufacturing method
JP2007235111A (en) * 2006-01-31 2007-09-13 Sony Corp Printed circuit board assembly and manufacturing method thereof
JP2015159205A (en) * 2014-02-25 2015-09-03 株式会社村田製作所 Manufacturing method of multilayer substrate
CN110933874A (en) * 2014-05-19 2020-03-27 塞拉电路公司 Through hole of printed circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509200A (en) * 1994-11-21 1996-04-23 International Business Machines Corporation Method of making laminar stackable circuit board structure
US6818836B2 (en) 2001-06-13 2004-11-16 Denso Corporation Printed circuit board and its manufacturing method
US7240429B2 (en) 2001-06-13 2007-07-10 Denso Corporation Manufacturing method for a printed circuit board
US6768061B2 (en) 2001-07-06 2004-07-27 Denso Corporation Multilayer circuit board
US7328505B2 (en) 2001-07-06 2008-02-12 Denso Corporation Method for manufacturing multilayer circuit board
JP2007235111A (en) * 2006-01-31 2007-09-13 Sony Corp Printed circuit board assembly and manufacturing method thereof
JP2015159205A (en) * 2014-02-25 2015-09-03 株式会社村田製作所 Manufacturing method of multilayer substrate
CN110933874A (en) * 2014-05-19 2020-03-27 塞拉电路公司 Through hole of printed circuit board

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