CN104735899A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN104735899A CN104735899A CN201310701150.0A CN201310701150A CN104735899A CN 104735899 A CN104735899 A CN 104735899A CN 201310701150 A CN201310701150 A CN 201310701150A CN 104735899 A CN104735899 A CN 104735899A
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Abstract
The invention provides a flexible circuit board which comprises a flexible circuit substrate, a hard circuit substrate and a high-polymer material layer. The flexible circuit substrate comprises a substrate layer, a first conductive circuit layer formed on the substrate layer and a first covering layer formed on the first conductive circuit layer. The hard circuit substrate comprises a first hard substrate body. The first hard substrate body partially presses the first covering layer. The region, covered with the first hard substrate body, of the flexible circuit substrate is a hard region. The region, without being covered by the hard substrate body, of the flexible circuit substrate is a flexible region. The high-polymer material layer is formed on the first covering layer of the soft region. The invention further relates to a flexible circuit board manufacturing method.
Description
Technical field
The present invention relates to a kind of flexible circuit board and preparation method thereof.
Background technology
At present, after the multi-layer sheet pressing of multilayer soft board or Rigid Flex, outer boring, copper-plated making technology must be used, make the copper foil circuit conducting of outer field Copper Foil and internal layer.But for the Rigid Flex that the multilayer soft board of internal layer is exposed in local, because macromolecule polymer materials such as PI or LCP on exposed internal layer soft board surface out, the adhesion of the change layers of copper in its material surface and electroplating technology is more weak, therefore in electroless copper processing procedure, bottom easy shooting of generation liquid medicine layers of copper, and produce the bubble of protuberance, even there is fractionated layers of copper can peel off and pollute the phenomenon of other processing procedure tank liquors.
Summary of the invention
In view of this, the manufacture method that a kind of flexible circuit board solved the problem is provided is necessary.
In view of this, there is a need to provide a kind of flexible circuit board solved the problem.
A kind of flexible circuit board, comprises flexible circuit base board, the first cover layer that described flexible circuit board comprises a basalis, is formed at the first conductive circuit layer of basalis, is formed at the first conductive circuit layer; Rigid circuit substrate, described hard circuit board comprises the first rigid substrate, described first rigid substrate pressing portions is in described first cover layer, and the region that described flexible circuit base board is coated with the first rigid substrate is stiffened area, described flexible circuit base board is not soft region by the region that rigid substrate covers; And polymer material layer, described polymer material layer is formed on first cover layer in described soft region.
A kind of manufacture method of flexible circuit board, comprise step: provide a multilager base plate, described Mulitilayer circuit board comprises basalis, the first conductive circuit layer be formed on described basalis, be formed at the first cover layer in the first conductive circuit layer and be pressed on the first rigid substrate of the first cover layer subregion, wherein, the region first cover layer being coated with described first hard circuit board is stiffened area, and the described first cover layer region that the first hard circuit board does not cover is soft region; The first cover layer that described soft region is corresponding forms a conductive polymer layer; Described conductive polymer layer forms a conductor layer; Etch away the conductor layer be covered on described conductive polymer layer; And remove the conductivity of electric conducting material in conductive polymer layer, form a polymer material layer, thus form flexible circuit board.
Compared with prior art, a kind of conductive polymer layer is provided in the present embodiment, palladium particle in macromolecular material in described conductive polymer layer and described electroless copper process has good adhesion, also there is good adhesion with the first cover layer and the second tectal insulating material simultaneously, and on the first cover layer that described conductive polymer layer is formed at soft region and the second cover layer, carry out electroless copper processing procedure again, then can avoid occurring liquid medicine bubble when directly carrying out electroless copper on the first cover layer and the second cover layer or peeling off and pollute other processing procedure tank liquors.Flexible circuit board of the present invention can also be applicable to the circuit board of rigid-flexible combination.
Accompanying drawing explanation
Fig. 1 is the generalized section of the Mulitilayer circuit board that the present embodiment provides.
Fig. 2 is the generalized section first cover layer in soft region in FIG and the second cover layer being formed conductive polymer layer.
Fig. 3 is the generalized section of formationization layers of copper on Mulitilayer circuit board in fig. 2.
Fig. 4 is generalized section change layers of copper in figure 3 being formed conductor layer.
Fig. 5 is that conductor layer in etch figures(s) 4 forms the 3rd conductive circuit layer and the 4th conductive circuit layer and exposes the generalized section of described conductive polymer layer.
Fig. 6 be take out conductive polymer layer in Fig. 5 conductivity and form the generalized section of polymer material layer.
Main element symbol description
| Flexible circuit board | 10 |
| Mulitilayer circuit board | 11 |
| Flexible circuit base board | 12 |
| Rigid circuit substrate | 13 |
| Basalis | 110 |
| First conductive circuit layer | 111 |
| Second conductive circuit layer | 112 |
| First cover layer | 121 |
| Second cover layer | 122 |
| 3rd copper foil layer | 123 |
| 4th copper foil layer | 124 |
| Through hole | 125 |
| Via | 126 |
| Soft region | 101 |
| Stiffened area | 102 |
| First rigid substrate | 131 |
| Second rigid substrate | 132 |
| 3rd conductive circuit layer | 133 |
| 4th conductive circuit layer | 134 |
| Conductive polymer layer | 140 |
| Change layers of copper | 141 |
| Conductor layer | 142 |
| Polymer material layer | 150 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of flexible circuit board 10, comprises step:
The first step, refers to Fig. 1, provides a Mulitilayer circuit board 11.
In the present embodiment, described Mulitilayer circuit board 11 comprises flexible circuit board 12 and rigid circuit substrate 13, and described flexible circuit base board 12 comprises basalis 110, be arranged at basalis 110 first conductive circuit layer 111 of both sides and the second conductive circuit layer 112 and the first cover layer 121 and the second cover layer 122 of being formed respectively in this first conductive circuit layer 111 and the second conductive circuit layer 112 relatively.Described rigid circuit substrate 13 comprises the first rigid substrate 131 and the second rigid substrate 132, described first rigid substrate 131 and the second rigid substrate 132 are covered in described first cover layer 121 and the second cover layer 122 respectively, described first rigid substrate 131 comprises the 3rd copper foil layer 123, and described 3rd copper foil layer 123 is formed at described first rigid substrate 131 away from the first cover layer 121 side, described second rigid substrate 132 comprises the 4th copper foil layer 124, and described 4th copper foil layer 124 is formed at described second rigid substrate 132 away from the second cover layer 122 side.
Described first rigid substrate 131 and the second rigid substrate 132 are covered in described flexible circuit base board 12, and the region that described first cover layer 121 and the second cover layer 122 do not cover described rigid circuit substrate 13 is soft region 101, the region that described first cover layer 121 and the second cover layer 122 are coated with described rigid circuit substrate 13 is stiffened area 102.
Described Mulitilayer circuit board 11 also comprises a through hole, and described through hole runs through the first rigid substrate 131, flexible circuit base board 12 and the second rigid substrate 132 successively.
Be appreciated that the present embodiment is only the present invention one preferably embodiment, described Mulitilayer circuit board 11 can also comprise multilayer conductive circuit layer.
Second step, refers to Fig. 2, and first cover layer 121 and the second cover layer 122 in described soft region 101 form a conductive polymer layer 140.
Conducting polymer composite is coated described first cover layer 121 and the second cover layer 122, form conductive polymer layer 140.
In the present embodiment, the material of described first cover layer 121 and the second cover layer 122 is macromolecule polymer material.Described conducting polymer composite can adopt transparent conductive inkjet ink:IJ-1005 or other conducting high polymers thing material of PEDOT:PSS, AGFA company of German Hayes company.
3rd step, refers to Fig. 3 and Fig. 4, and described Mulitilayer circuit board 11 is formed a conductor layer 142.
Described 3rd copper foil layer 123, the 4th copper foil layer 124, conductive polymer layer 140 and through hole 125 hole wall carry out electroless copper process, forms one and change layers of copper 141.Heavy copper is also in described electroless copper process usually, it is a kind of redox reaction, namely on the first cover layer 121, second cover layer 122, through hole 125 hole wall and conductive polymer layer 140, the Metal Palladium particle of one deck activity is first covered by Treatment with activating agent, then, with palladium particle, copper ion is reduced to copper.
Then electroplate in describedization layers of copper 141, thus form conductor layer 142 on described 3rd copper foil layer 123, the 4th copper foil layer 124 and conductive polymer layer 140, and form continuous print conductor layer 142 to form a via 126 at through hole 125 hole wall.
Be appreciated that via 126 described in formation one in Mulitilayer circuit board 11, in order to be communicated with described flexible circuit base board 12 and the first rigid substrate 131 and the second rigid substrate 132.
4th step, refers to Fig. 5, etches away the conductor layer 142 be covered on described conductive polymer layer 140, and forms the 3rd conductive circuit layer 133 and the 4th conductive circuit layer 134.
Adopt micro-photographing process technology to etch described conductor layer 142 and form the 3rd conductive circuit layer 133 and the 4th conductive circuit layer 134.In the present embodiment, by described 3rd copper foil layer 123, the 4th copper foil layer 124 and be formed at described 3rd copper foil layer 123 obtain the 3rd conductive circuit layer 133 and the 4th conductive circuit layer 134 after dry film, exposure, development, etching and stripping process together with the conductor layer 142 on the 4th copper foil layer 124.Meanwhile, the conductor layer 142 be covered on described conductive polymer layer 140 is all etched away.
5th step, refers to Fig. 6, removes the conductivity of electric conducting material in conductive polymer layer 140, forms a polymer material layer 150, thus forms flexible circuit board 10.
In the present embodiment, by etching solution process, conductivity in described conductive polymer layer 140 is removed, its detailed process is: immerse in etching solution by the above-mentioned conductive polymer layer 140 covering oxidant layer that is formed, described etching solution, for eliminating the conductivity of the electric conducting material in conductive polymer layer 140, forms polymer material layer 150.In the present embodiment, described etching solution is the electroconductive polymer etching solution Clevios that German manufacturer Heraeus releases.
It should be noted that, in the end with etching solution, the conductivity of conductive polymer layer 140 is removed in manufacturing process, form a nonconducting polymer material layer 150, so, conductive polymer layer 140 pairs of flexible circuit board successive process can be avoided to impact, be equivalent to replace the first cover layer 121 and the second cover layer 122 with polymer material layer 150.
Refer to Fig. 6, a kind of flexible circuit board 10 is also provided in the present embodiment, it comprises flexible circuit base board 12 and rigid circuit substrate 13, described flexible circuit base board 12 comprises basalis 110, be arranged at basalis 110 relatively the first conductive circuit layer 111 of both sides and the second conductive circuit layer 112, be formed at the first cover layer 121 in described first conductive circuit layer 111 and the second conductive circuit layer 112 and the second cover layer 122 and polymer material layer 150 respectively.Described rigid circuit substrate 13 comprises the first rigid substrate 131 and the second rigid substrate 132, described first rigid substrate 131 comprises and is formed at three conductive circuit layer 133 of described first rigid substrate 131 away from the first cover layer 121 side, and described second rigid substrate 132 comprises and is formed at four conductive circuit layer 134 of described second rigid substrate 132 away from the second cover layer 122 side.Described first rigid substrate 131 and the second rigid substrate 132 are covered in described first cover layer 121 and the second cover layer 122 respectively, and the region that described first cover layer 121 and the second cover layer 122 do not cover described hard circuit board 13 is soft region 101, the region that described first cover layer 121 and the second cover layer 122 are coated with described rigid circuit substrate 13 is stiffened area 102, on the first cover layer 121 that described polymer material layer 150 is formed at described soft region 101 and the second cover layer 122.
Described flexible circuit board 10 also comprises a via 126, described via 126 runs through the first rigid substrate 131, flexible circuit base board 12 and the second rigid substrate 132 successively, and described via 126 is in order to the 4th conducting wire 134 of the 3rd conducting wire 133, second rigid substrate 132 of the first rigid substrate 131 described in conducting and flexible circuit base board 12.
It should be noted that, the flexible circuit board 10 provided in the present embodiment can be Rigid Flex can be also flexible circuit board, and namely polymer material layer goes for Rigid Flex, is also applicable to flexible circuit board.
Compared with prior art, a kind of conductive polymer layer 140 is provided in the present embodiment, palladium particle in macromolecular material in described conductive polymer layer 140 and described electroless copper process has good adhesion, also there is good adhesion with the insulating material of the first cover layer 121 and the second cover layer 122 simultaneously, and on the first cover layer 121 described conductive polymer layer 140 being formed at soft region 101 and the second cover layer 122, carry out electroless copper processing procedure again, then can avoid occurring liquid medicine bubble when directly carrying out electroless copper on the first cover layer 121 and the second cover layer 122 or peeling off and pollute other processing procedure tank liquors.
Claims (6)
1. a flexible circuit board, comprises
Flexible circuit base board, the first cover layer that described flexible circuit board comprises a basalis, is formed at the first conductive circuit layer of basalis, is formed at the first conductive circuit layer;
Rigid circuit substrate, described hard circuit board comprises the first rigid substrate, described first rigid substrate pressing portions is in described first cover layer, and the region that described flexible circuit base board is coated with the first rigid substrate is stiffened area, described flexible circuit base board is not soft region by the region that rigid substrate covers; And
Polymer material layer, described polymer material layer is formed on first cover layer in described soft region.
2. flexible circuit board as claimed in claim 1, it is characterized in that, described flexible circuit board comprises the second conductive circuit layer being formed at described basalis and the second cover layer being formed at described second conductive circuit layer.
3. flexible circuit board as claimed in claim 2, it is characterized in that, described rigid circuit substrate also comprises the second rigid substrate, and described second rigid substrate is pressed on described second cover layer.
4. flexible circuit board as claimed in claim 3, it is characterized in that, described first rigid substrate comprises the 3rd conductive circuit layer, and described second rigid substrate comprises the 4th conductive circuit layer.
5. flexible circuit board as claimed in claim 3, it is characterized in that, described flexible circuit board also comprises a via, in order to flexible circuit board described in conducting and the 3rd conductive circuit layer and the 4th conductive circuit layer.
6. a manufacture method for flexible circuit board, comprises step:
One multilager base plate is provided, described Mulitilayer circuit board comprises basalis, the first conductive circuit layer be formed on described basalis, be formed at the first cover layer in the first conductive circuit layer and be pressed on the first rigid substrate of the first cover layer subregion, wherein, the region first cover layer being coated with described first hard circuit board is stiffened area, and the described first cover layer region that the first hard circuit board does not cover is soft region;
The first cover layer that described soft region is corresponding forms a conductive polymer layer;
Described conductive polymer layer forms a conductor layer;
Etch away the conductor layer be covered on described conductive polymer layer; And
Remove the conductivity of electric conducting material in conductive polymer layer, form a polymer material layer, thus form flexible circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701150.0A CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
| TW102148600A TWI507098B (en) | 2013-12-19 | 2013-12-27 | The flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701150.0A CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104735899A true CN104735899A (en) | 2015-06-24 |
| CN104735899B CN104735899B (en) | 2017-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310701150.0A Active CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN104735899B (en) |
| TW (1) | TWI507098B (en) |
Cited By (2)
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|---|---|---|---|---|
| CN107046761A (en) * | 2016-01-11 | 2017-08-15 | 三星电机株式会社 | Printed circuit board (PCB) |
| JP7463654B2 (en) | 2019-03-04 | 2024-04-09 | サムソン エレクトロ－メカニックス カンパニーリミテッド． | Printed circuit board and its manufacturing method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3310137B1 (en) * | 2016-10-14 | 2019-02-27 | ATOTECH Deutschland GmbH | Method for manufacturing a printed circuit board |
| CN111003682A (en) * | 2018-10-08 | 2020-04-14 | 凤凰先驱股份有限公司 | Electronic package and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI507098B (en) | 2015-11-01 |
| TW201526728A (en) | 2015-07-01 |
| CN104735899B (en) | 2017-08-22 |
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Effective date of registration: 20170307 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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