CN104735899B - Flexible circuit board and preparation method thereof - Google Patents
Flexible circuit board and preparation method thereof Download PDFInfo
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- CN104735899B CN104735899B CN201310701150.0A CN201310701150A CN104735899B CN 104735899 B CN104735899 B CN 104735899B CN 201310701150 A CN201310701150 A CN 201310701150A CN 104735899 B CN104735899 B CN 104735899B
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Abstract
A kind of flexible circuit board, including flexible circuit base board, the flexible circuit board include a basalis, are formed at the first conductive circuit layer of basalis, are formed at the first coating of the first conductive circuit layer；Rigid circuit substrate, the hard circuit board includes the first rigid substrate, the first rigid substrate pressing portions are in first coating, and region of the flexible circuit base board covered with the first rigid substrate is stiffened area, the region that the flexible circuit base board is not covered by rigid substrate is soft region；And polymer material layer, the polymer material layer is formed on first coating in the soft region.The invention further relates to a kind of preparation method of flexible circuit board.
Description
Technical field
The present invention relates to a kind of flexible circuit board and preparation method thereof.
Background technology
At present, after the multi-layer sheet pressing of multilayer soft board or Rigid Flex, outer layer drill, it is necessary to use copper-plated processing procedure
Technique, turn on the copper foil of outer layer and the copper foil circuit of internal layer.But for the soft or hard knot of the local multilayer soft board for exposing internal layer
For plywood, because exposing the macromolecule polymer materials such as the PI or LCP on internal layer soft board surface come, its material surface and electricity
The adhesion of change layers of copper in depositing process is weaker, therefore in electroless copper processing procedure, easily produces liquid medicine shooting layers of copper bottom, and
The bubble of protuberance is produced, or even has part layers of copper to peel off and pollute the phenomenon of other processing procedure tank liquors.
The content of the invention
In view of this, it is necessary to which a kind of preparation method of the flexible circuit board solved the above problems is provided.
In view of this, a kind of flexible circuit board solved the above problems of offer is provided.
A kind of flexible circuit board, including flexible circuit base board, the flexible circuit board include a basalis, are formed at base
First conductive circuit layer of bottom, the first coating for being formed at the first conductive circuit layer；Rigid circuit substrate, the hardness electricity
Road plate includes the first rigid substrate, and the first rigid substrate pressing portions are in first coating, and the flexible circuit
Region of the substrate covered with the first rigid substrate is stiffened area, the region that the flexible circuit base board is not covered by rigid substrate
For soft region；And polymer material layer, the polymer material layer is formed on first coating in the soft region.
A kind of preparation method of flexible circuit board, including step：One multilager base plate, the Mulitilayer circuit board bag are provided
The first conductive circuit layer for include basalis, being formed on the basalis, the first covering being formed in the first conductive circuit layer
Layer and the first rigid substrate for being pressed on the first coating subregion, wherein, it is hard covered with described first on the first coating
Property circuit board region be stiffened area, first coating the first hard circuit board covering region be soft region；
Conductive polymer layer is formed on corresponding first coating in the soft region；One is formed on conductive polymer layer
Conductor layer；Etch away the conductor layer being covered on the conductive polymer layer；And remove conductive material in conductive polymer layer
Electric conductivity, forms a polymer material layer, so as to form flexible circuit board.
Compared with prior art, the height in a kind of conductive polymer layer, the conductive polymer layer is provided in the present embodiment
Molecular material has good adhesion with the palladium particle during the electroless copper, while being covered with the first coating and second
The insulating materials of layer also has a good adhesion, and by conductive polymer layer be formed at soft region the first coating and
On second coating, then electroless copper processing procedure is carried out, then can avoid directly carrying out on the first coating and the second coating
Occur liquid medicine bubble during electroless copper or peel off and pollute other processing procedure tank liquors.Flexible circuit board of the present invention can also be fitted
Circuit board for rigid-flexible combination.
Brief description of the drawings
Fig. 1 is the diagrammatic cross-section for the Mulitilayer circuit board that the present embodiment is provided.
Fig. 2 is the section that conductive polymer layer is formed on first coating and the second coating in soft region in Fig. 1
Schematic diagram.
Fig. 3 is the diagrammatic cross-section of formationization layers of copper on Mulitilayer circuit board in fig. 2.
Fig. 4 is the diagrammatic cross-section that conductor layer is formed in change layers of copper in figure 3.
Fig. 5 is conductor layer the 3rd conductive circuit layer of formation and the 4th conductive circuit layer in etch figures(s) 4 and exposes the height
The diagrammatic cross-section of molecule conductive layer.
Fig. 6 is the electric conductivity of conductive polymer layer in taking-up Fig. 5 and forms the diagrammatic cross-section of polymer material layer.
Main element symbol description
| Flexible circuit board | 10 |
| Mulitilayer circuit board | 11 |
| Flexible circuit base board | 12 |
| Rigid circuit substrate | 13 |
| Basalis | 110 |
| First conductive circuit layer | 111 |
| Second conductive circuit layer | 112 |
| First coating | 121 |
| Second coating | 122 |
| 3rd copper foil layer | 123 |
| 4th copper foil layer | 124 |
| Through hole | 125 |
| Via hole | 126 |
| Soft region | 101 |
| Stiffened area | 102 |
| First rigid substrate | 131 |
| Second rigid substrate | 132 |
| 3rd conductive circuit layer | 133 |
| 4th conductive circuit layer | 134 |
| Conductive polymer layer | 140 |
| Change layers of copper | 141 |
| Conductor layer | 142 |
| Polymer material layer | 150 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
The embodiment of the present invention provides a kind of preparation method of flexible circuit board 10, including step：
The first step, referring to Fig. 1, providing a Mulitilayer circuit board 11.
In the present embodiment, the Mulitilayer circuit board 11 includes flexible circuit board 12 and rigid circuit substrate 13, described soft
Property circuit substrate 12 includes basalis 110, the first conductive circuit layer 111 and second for being arranged at the opposite sides of basalis 110 is led
Electric line layer 112 and the first coating formed respectively in the conductive circuit layer 112 of the first conductive circuit layer 111 and second
121 and second coating 122.The rigid circuit substrate 13 includes the first rigid substrate 131 and the second rigid substrate 132, institute
State the first rigid substrate 131 and the second rigid substrate 132 be covered each by the coating 122 of the first coating 121 and second,
First rigid substrate 131 includes the 3rd copper foil layer 123, and the 3rd copper foil layer 123 is formed at the described first rigid base
Plate 131 is away from the side of the first coating 121, and second rigid substrate 132 includes the 4th copper foil layer 124, and the 4th bronze medal
Layers of foil 124 is formed at second rigid substrate 132 away from the side of the second coating 122.
The rigid substrate 132 of first rigid substrate 131 and second is covered in the flexible circuit base board 12, and described
The region that one coating 121 and the second coating 122 do not cover the rigid circuit substrate 13 is soft region 101, described the
The region of one coating 121 and the second coating 122 covered with the rigid circuit substrate 13 is stiffened area 102.
The Mulitilayer circuit board 11 also includes a through hole, and the through hole sequentially passes through the first rigid substrate 131, soft electricity
The rigid substrate 132 of base board 12 and second.
It is appreciated that the present embodiment is only one preferably embodiment of the present invention, the Mulitilayer circuit board 11 can be with
Including multilayer conductive circuit layer.
Second step, referring to Fig. 2, the shape on first coating 121 and the second coating 122 in the soft region 101
Into conductive polymer layer 140.
Conducting polymer composite is coated on the coating 122 of the first coating 121 and second, conductive polymer is formed
Layer 140.
In the present embodiment, the material of the coating 122 of the first coating 121 and second is macromolecule polymer material.
The conducting polymer composite can use the PEDOT of German Hayes company：The transparent of PSS, AGFA company
conductive inkjet ink:IJ-1005 or other conducting high polymers thing materials.
3rd step, refers to Fig. 3 and Fig. 4, and a conductor layer 142 is formed on the Mulitilayer circuit board 11.
Carried out on the 3rd copper foil layer 123, the 4th copper foil layer 124, conductive polymer layer 140 and the hole wall of through hole 125
Electroless copper processing, forms one and changes layers of copper 141.Heavy copper is generally also in the electroless copper processing, is a kind of redox reaction,
Treatment with activating agent is first passed through in the first coating 121, the second coating 122, the hole wall of through hole 125 and conductive polymer layer 140
One layer of active Metal Palladium particle of upper covering, then, copper is reduced to palladium particle by copper ion.
Then electroplated in describedization layers of copper 141, thus the 3rd copper foil layer 123, the 4th copper foil layer 124 and
Conductor layer 142 is formed on conductive polymer layer 140, and forms continuous conductor layer 142 to constitute a conducting in the hole wall of through hole 125
Hole 126.
It is appreciated that via hole 126 described in one is formed in Mulitilayer circuit board 11, to connect the flexible circuit base
The rigid substrate 131 of plate 12 and first and the second rigid substrate 132.
4th step, referring to Fig. 5, etching away the conductor layer 142 being covered on the conductive polymer layer 140, and is formed
3rd conductive circuit layer 133 and the 4th conductive circuit layer 134.
The 3rd conductive circuit layer 133 of formation of conductor layer 142 and the 4th conducting wire are etched using micro-photographing process technology
Layer 134.In the present embodiment, by the 3rd copper foil layer 123, the 4th copper foil layer 124 and the and of the 3rd copper foil layer 123 is formed at
Conductor layer 142 on 4th copper foil layer 124 obtains the 3rd after dry film, exposure, development, etching and stripping process together and led
Electric line layer 133 and the 4th conductive circuit layer 134.Meanwhile, the conductor layer 142 on the conductive polymer layer 140 will be covered in
All etch away.
5th step, referring to Fig. 6, removing the electric conductivity of conductive material in conductive polymer layer 140, forms a macromolecule material
The bed of material 150, so as to form flexible circuit board 10.
In the present embodiment, handled, the electric conductivity in conductive polymer layer 140 is removed, its is specific by etching solution
Process is：The above-mentioned conductive polymer layer 140 for being formed with masking oxidant layer is immersed in etching solution, the etching solution is used to eliminate height
The electric conductivity of conductive material in molecule conductive layer 140, forms polymer material layer 150.In the present embodiment, the etching solution is
The electroconductive polymer etching solution Clevios that German manufacturer Heraeus is released.
It should be noted that the electric conductivity of conductive polymer layer 140 is removed with etching solution in last manufacturing process, shape
Into a nonconducting polymer material layer 150, in this way, the conductive polymer layer follow-up system of 140 pairs of flexible circuit boards can be avoided
Journey is impacted, and the first coating 121 and the second coating 122 are replaced equivalent to polymer material layer 150.
Referring to Fig. 6, also providing a kind of flexible circuit board 10 in the present embodiment, it includes flexible circuit base board 12 and hard
Property circuit substrate 13, the flexible circuit base board 12 includes basalis 110, is arranged at the first of the opposite sides of basalis 110 and leads
Electric line layer 111 and second conductive circuit layer 112, it is respectively formed in the conducting wire of the first conductive circuit layer 111 and second
The first coating 121 and the second coating 122 and polymer material layer 150 on layer 112.The rigid circuit substrate 13 includes
First rigid substrate 131 and the second rigid substrate 132, first rigid substrate 131 include being formed at the described first rigid base
Threeth conductive circuit layer 133 of the plate 131 away from the side of the first coating 121, second rigid substrate 132 includes being formed at institute
State fourth conductive circuit layer 134 of second rigid substrate 132 away from the side of the second coating 122.First rigid substrate 131
It is covered each by with the second rigid substrate 132 in the coating 122 of the first coating 121 and second, and first coating
121 and second coating 122 do not cover the hard circuit board 13 region be soft region 101, first coating 121
It is stiffened area 102, the polymer material layer with region of second coating 122 covered with the rigid circuit substrate 13
150 are formed on first coating 121 and the second coating 122 in the soft region 101.
The flexible circuit board 10 also includes a via hole 126, and the via hole 126 sequentially passes through the first rigid substrate
131st, the rigid substrate 132 of flexible circuit base board 12 and second, the via hole 126 is to turn on first rigid substrate 131
The 3rd conducting wire 133, the 4th conducting wire 134 of the second rigid substrate 132 and flexible circuit base board 12.
It should be noted that it can also be soft that the flexible circuit board 10 provided in the present embodiment, which can be Rigid Flex,
Property circuit board, i.e. polymer material layer go for Rigid Flex, also suitable for flexible circuit board.
Compared with prior art, a kind of conductive polymer layer 140, the conductive polymer layer 140 are provided in the present embodiment
In high polymer material and the electroless copper during palladium particle have good adhesion, while with the first coating 121
Also there is good adhesion with the insulating materials of the second coating 122, and the conductive polymer floor 140 is formed at soft area
On first coating 121 and the second coating 122 in domain 101, then electroless copper processing procedure is carried out, then can avoided directly first
Carry out occurring liquid medicine bubble during electroless copper on the coating 122 of coating 121 and second or peel off and pollute other processing procedure tank liquors.
Claims (6)
1. a kind of preparation method of flexible circuit board, including step：
A multilager base plate is provided, the Mulitilayer circuit board includes basalis, the first conductor wire being formed on the basalis
Road floor, the first coating being formed in the first conductive circuit layer and the first rigid base for being pressed on the first coating subregion
Plate, wherein, the region covered with first hard circuit board on the first coating is stiffened area, and first coating is not
The region covered by the first hard circuit board is soft region；
Conductive polymer layer is formed on corresponding first coating in the soft region；
A conductor layer is formed on conductive polymer layer；
Etch away the conductor layer being covered on the conductive polymer layer；And
The electric conductivity of conductive material in conductive polymer layer is removed, a polymer material layer is formed, so as to form bendable circuit
Plate.
2. the flexible circuit board that a kind of preparation method of flexible circuit board as described in claim 1 makes, including
Flexible circuit base board, the flexible circuit board includes a basalis, the first conductive circuit layer for being formed at basalis, formed
In the first coating of the first conductive circuit layer；
Rigid circuit substrate, the hard circuit board includes the first rigid substrate, and the first rigid substrate pressing portions are in institute
The first coating is stated, and region of the flexible circuit base board covered with the first rigid substrate is stiffened area, the soft electricity
The region that base board is not covered by rigid substrate is soft region；And
Polymer material layer, the polymer material layer is formed on first coating in the soft region.
3. flexible circuit board as claimed in claim 2, it is characterised in that the flexible circuit board includes being formed at the base
Second conductive circuit layer of bottom and the second coating for being formed at second conductive circuit layer.
4. flexible circuit board as claimed in claim 3, it is characterised in that the rigid circuit substrate also includes the second hardness
Substrate, second rigid substrate is pressed on second coating.
5. flexible circuit board as claimed in claim 4, it is characterised in that first rigid substrate includes the 3rd conductor wire
Road floor, second rigid substrate includes the 4th conductive circuit layer.
6. flexible circuit board as claimed in claim 4, it is characterised in that the flexible circuit board also includes a conducting
Hole, to turn on the flexible circuit board and the 3rd conductive circuit layer and the 4th conductive circuit layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701150.0A CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
| TW102148600A TWI507098B (en) | 2013-12-19 | 2013-12-27 | The flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310701150.0A CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104735899A CN104735899A (en) | 2015-06-24 |
| CN104735899B true CN104735899B (en) | 2017-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310701150.0A Active CN104735899B (en) | 2013-12-19 | 2013-12-19 | Flexible circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104735899B (en) |
| TW (1) | TWI507098B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102494343B1 (en) * | 2016-01-11 | 2023-02-01 | 삼성전기주식회사 | Printed circuit board |
| EP3310137B1 (en) * | 2016-10-14 | 2019-02-27 | ATOTECH Deutschland GmbH | Method for manufacturing a printed circuit board |
| CN111003682A (en) * | 2018-10-08 | 2020-04-14 | 凤凰先驱股份有限公司 | Electronic package and manufacturing method thereof |
| KR20200106342A (en) * | 2019-03-04 | 2020-09-14 | 삼성전기주식회사 | Printed Circuit Board and manufacturing method for the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200934341A (en) * | 2008-01-23 | 2009-08-01 | Unimicron Technology Corp | Flex-rigid circuit board and method for fabricating the same |
| CN101736328A (en) * | 2009-12-14 | 2010-06-16 | 安捷利（番禺）电子实业有限公司 | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |
| TW201034544A (en) * | 2008-12-29 | 2010-09-16 | Ibiden Co Ltd | Printed wiring board and method for manufacturing the same |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102469700A (en) * | 2010-11-12 | 2012-05-23 | 北大方正集团有限公司 | Method for manufacturing circuit board and circuit board |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI361208B (en) * | 2007-08-07 | 2012-04-01 | Univ Nat Defense | Process for forming a metal pattern on a substrate |
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2013
- 2013-12-19 CN CN201310701150.0A patent/CN104735899B/en active Active
- 2013-12-27 TW TW102148600A patent/TWI507098B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200934341A (en) * | 2008-01-23 | 2009-08-01 | Unimicron Technology Corp | Flex-rigid circuit board and method for fabricating the same |
| TW201034544A (en) * | 2008-12-29 | 2010-09-16 | Ibiden Co Ltd | Printed wiring board and method for manufacturing the same |
| CN101736328A (en) * | 2009-12-14 | 2010-06-16 | 安捷利（番禺）电子实业有限公司 | Pretreatment solution and process of electroless copper plating of flexible printed circuit board |
| CN102469700A (en) * | 2010-11-12 | 2012-05-23 | 北大方正集团有限公司 | Method for manufacturing circuit board and circuit board |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102595806A (en) * | 2012-02-20 | 2012-07-18 | 深圳崇达多层线路板有限公司 | Method for manufacturing rigid-flexible combined circuit board capable of protecting inner-layer soft board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201526728A (en) | 2015-07-01 |
| TWI507098B (en) | 2015-11-01 |
| CN104735899A (en) | 2015-06-24 |
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Effective date of registration: 20170307 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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